WO2004035875A3 - Verfahren zur galvanischen abscheidungvon bronzen - Google Patents

Verfahren zur galvanischen abscheidungvon bronzen Download PDF

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Publication number
WO2004035875A3
WO2004035875A3 PCT/EP2003/011229 EP0311229W WO2004035875A3 WO 2004035875 A3 WO2004035875 A3 WO 2004035875A3 EP 0311229 W EP0311229 W EP 0311229W WO 2004035875 A3 WO2004035875 A3 WO 2004035875A3
Authority
WO
WIPO (PCT)
Prior art keywords
bronze
coating
wetting agent
galvanic coating
acid electrolyte
Prior art date
Application number
PCT/EP2003/011229
Other languages
English (en)
French (fr)
Other versions
WO2004035875A2 (de
Inventor
Katrin Zschintzsch
Joachim Heyer
Marlies Kleinfeld
Stefan Schaefer
Ortrud Steinius
Original Assignee
Enthone
Katrin Zschintzsch
Joachim Heyer
Marlies Kleinfeld
Stefan Schaefer
Ortrud Steinius
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32010957&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2004035875(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Enthone, Katrin Zschintzsch, Joachim Heyer, Marlies Kleinfeld, Stefan Schaefer, Ortrud Steinius filed Critical Enthone
Priority to US10/531,142 priority Critical patent/US20060137991A1/en
Priority to CN2003801012538A priority patent/CN1703540B/zh
Priority to JP2004544134A priority patent/JP4675626B2/ja
Publication of WO2004035875A2 publication Critical patent/WO2004035875A2/de
Publication of WO2004035875A3 publication Critical patent/WO2004035875A3/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Die vorliegende Erfindung betrifft ein Verfahren zur galvanischen Abscheidung von Bronzen, mit welchem das zu beschichtende Substrat in einem sauren Elektrolyten, der zumindest Zinn- und Kupferionen, eine Alkylsulfonsäure und ein Netzmittel aufweist, metallisiert wird. Mit Hilfe eines derartigen Verfahrens sollen wesentlich höheren Abscheidegeschwindigkeiten erreicht werden und haftfeste sowie porenfreie Bronzeüberzüge mit hohen Kupfergehalten und unterschiedlichen dekorativen und mechanischen Eigenschaften abgeschieden werden, wobei dieses erfindungsgemäss dadurch erreicht wird, dass dem Elektrolyten ein aromatisches, nichtionisches Netzmittel zugegeben wird. Weiterhin wird ein saurer Elektrolyt zur Abscheidung von Bronzen bereitgestellt.
PCT/EP2003/011229 2002-10-11 2003-10-10 Verfahren zur galvanischen abscheidungvon bronzen WO2004035875A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/531,142 US20060137991A1 (en) 2002-10-11 2003-10-10 Method for bronze galvanic coating
CN2003801012538A CN1703540B (zh) 2002-10-11 2003-10-10 电沉积青铜的方法
JP2004544134A JP4675626B2 (ja) 2002-10-11 2003-10-10 ブロンズ電析法及び電解質

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02022718.7 2002-10-11
EP02022718.7A EP1408141B1 (de) 2002-10-11 2002-10-11 Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen

Publications (2)

Publication Number Publication Date
WO2004035875A2 WO2004035875A2 (de) 2004-04-29
WO2004035875A3 true WO2004035875A3 (de) 2005-04-14

Family

ID=32010957

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/011229 WO2004035875A2 (de) 2002-10-11 2003-10-10 Verfahren zur galvanischen abscheidungvon bronzen

Country Status (7)

Country Link
US (1) US20060137991A1 (de)
EP (1) EP1408141B1 (de)
JP (1) JP4675626B2 (de)
KR (1) KR100684818B1 (de)
CN (1) CN1703540B (de)
ES (1) ES2531163T3 (de)
WO (1) WO2004035875A2 (de)

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DE102004041701A1 (de) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Verfahren zur elektrolytischen Abscheidung von Metallen
WO2006036479A1 (en) * 2004-09-24 2006-04-06 Jarden Zinc Products, Inc. Electroplated metals with silvery-white appearance and method of making
US7296370B2 (en) * 2004-09-24 2007-11-20 Jarden Zinc Products, Inc. Electroplated metals with silvery-white appearance and method of making
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
CN100368924C (zh) * 2005-05-31 2008-02-13 西北工业大学 一种非周期性红外波段负磁导率材料
ES2698205T3 (es) 2005-11-25 2019-02-01 Macdermid Enthone Inc Procedimiento y dispositivo para la purificación de soluciones de proceso
WO2007134843A2 (en) * 2006-05-24 2007-11-29 Atotech Deutschland Gmbh Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell
ATE453740T1 (de) 2007-02-14 2010-01-15 Umicore Galvanotechnik Gmbh Kupfer-zinn-elektrolyt und verfahren zur abscheidung von bronzeschichten
JP5642928B2 (ja) 2007-12-12 2014-12-17 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 青銅の電気めっき
ATE486157T1 (de) 2008-05-08 2010-11-15 Umicore Galvanotechnik Gmbh Modifizierter kupfer-zinn-elektrolyt und verfahren zur abscheidung von bronzeschichten
DE102008032398A1 (de) * 2008-07-10 2010-01-14 Umicore Galvanotechnik Gmbh Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
DE102011008836B4 (de) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
US8426241B2 (en) 2010-09-09 2013-04-23 International Business Machines Corporation Structure and method of fabricating a CZTS photovoltaic device by electrodeposition
EP2738290A1 (de) * 2011-08-30 2014-06-04 Rohm and Haas Electronic Materials LLC Haftungsförderung von cyanidfreier weißer Bronze
CN102605394B (zh) * 2012-03-07 2015-02-18 深圳市华傲创表面技术有限公司 一种无氰酸性白铜锡电镀液
JP6101510B2 (ja) * 2013-02-18 2017-03-22 株式会社シミズ 非シアン銅−錫合金めっき浴
CA2957587C (en) * 2014-08-08 2019-03-05 Okuno Chemical Industries Co., Ltd. Copper-tin alloy plating bath
US11597637B2 (en) 2018-02-22 2023-03-07 Vis, Llc Under hoist support stand
EP3540097A1 (de) 2018-03-13 2019-09-18 COVENTYA S.p.A. Elektroplattierte produkte und elektroplattierungsbad zur bereitstellung solcher produkte
US10906789B2 (en) * 2018-09-05 2021-02-02 Vis, Llc Power unit for a floor jack

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Publication number Priority date Publication date Assignee Title
US4565608A (en) * 1983-11-02 1986-01-21 Degussa Aktiengesellschaft Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
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JPH0813185A (ja) * 1994-06-28 1996-01-16 Ebara Yuujiraito Kk 低融点錫合金めっき浴
JPH11181589A (ja) * 1997-12-18 1999-07-06 Japan Energy Corp 錫合金電気めっき液およびめっき方法
EP1001054A2 (de) * 1998-11-05 2000-05-17 C. Uyemura & Co, Ltd Zinn-Kupfer-Legierung Elektroplattierungsbad und Plattierungsverfahren mit diesem Bad
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
EP1091023A2 (de) * 1999-10-08 2001-04-11 Shipley Company LLC Legierungszusammensetzung und Plattierungsverfahren
EP1111097A2 (de) * 1999-12-22 2001-06-27 Nippon MacDermid Co., Ltd. Lösung für das Elektroplattieren einer glänzenden Zinn-Kupfer-Legierung
DE10046600A1 (de) * 2000-09-20 2002-04-25 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten
US6458264B1 (en) * 1999-10-07 2002-10-01 Ebara-Udylite Co., Ltd. Sn-Cu alloy plating bath

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DE60226196T2 (de) * 2001-05-24 2009-05-14 Shipley Co., L.L.C., Marlborough Zinn-Plattieren
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565608A (en) * 1983-11-02 1986-01-21 Degussa Aktiengesellschaft Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings
US5443714A (en) * 1989-10-19 1995-08-22 Blasberg Oberflachentechnik, Gmbh Process and electrolyte for depositing lead and lead-containing layers
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
JPH0813185A (ja) * 1994-06-28 1996-01-16 Ebara Yuujiraito Kk 低融点錫合金めっき浴
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
JPH11181589A (ja) * 1997-12-18 1999-07-06 Japan Energy Corp 錫合金電気めっき液およびめっき方法
EP1001054A2 (de) * 1998-11-05 2000-05-17 C. Uyemura & Co, Ltd Zinn-Kupfer-Legierung Elektroplattierungsbad und Plattierungsverfahren mit diesem Bad
US6458264B1 (en) * 1999-10-07 2002-10-01 Ebara-Udylite Co., Ltd. Sn-Cu alloy plating bath
EP1091023A2 (de) * 1999-10-08 2001-04-11 Shipley Company LLC Legierungszusammensetzung und Plattierungsverfahren
EP1111097A2 (de) * 1999-12-22 2001-06-27 Nippon MacDermid Co., Ltd. Lösung für das Elektroplattieren einer glänzenden Zinn-Kupfer-Legierung
DE10046600A1 (de) * 2000-09-20 2002-04-25 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten

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PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12 29 October 1999 (1999-10-29) *

Also Published As

Publication number Publication date
KR20050059174A (ko) 2005-06-17
CN1703540B (zh) 2010-10-06
EP1408141B1 (de) 2014-12-17
EP1408141A1 (de) 2004-04-14
CN1703540A (zh) 2005-11-30
JP4675626B2 (ja) 2011-04-27
ES2531163T3 (es) 2015-03-11
KR100684818B1 (ko) 2007-02-22
US20060137991A1 (en) 2006-06-29
JP2005537394A (ja) 2005-12-08
WO2004035875A2 (de) 2004-04-29

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