WO2004025817A1 - 電圧検出回路およびこれを用いた内部電圧発生回路 - Google Patents
電圧検出回路およびこれを用いた内部電圧発生回路 Download PDFInfo
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- WO2004025817A1 WO2004025817A1 PCT/JP2002/009301 JP0209301W WO2004025817A1 WO 2004025817 A1 WO2004025817 A1 WO 2004025817A1 JP 0209301 W JP0209301 W JP 0209301W WO 2004025817 A1 WO2004025817 A1 WO 2004025817A1
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- 238000001514 detection method Methods 0.000 claims abstract description 85
- 230000005669 field effect Effects 0.000 claims abstract description 15
- 230000003252 repetitive effect Effects 0.000 claims description 33
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- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000007423 decrease Effects 0.000 abstract description 9
- 238000009413 insulation Methods 0.000 abstract 3
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- 239000006185 dispersion Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 14
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 229920005591 polysilicon Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
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- 230000003213 activating effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/06—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider
- H02M3/07—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
- H02M3/073—Charge pumps of the Schenkel-type
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/06—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider
- H02M3/07—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
- G01R19/16504—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values characterised by the components employed
- G01R19/16519—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values characterised by the components employed using FET's
Definitions
- the present invention relates to a voltage detection circuit for detecting whether a target voltage has reached a predetermined voltage level and an internal voltage generation circuit using the same.
- the present invention relates to an insulated gate field effect transistor as a voltage detection element.
- the present invention relates to a voltage detection circuit used and an internal voltage generation circuit using the same. More specifically, according to the present invention, the detection voltage level can be set to an arbitrary voltage level, and the voltage can be accurately determined without being affected by the threshold voltage of the insulated gate field effect transistor for detection.
- the present invention relates to a voltage detection circuit capable of detecting a level and an internal voltage generation circuit using the same. Background art
- an internal voltage having a voltage level different from the power supply voltage and the ground voltage is often used.
- Such internal voltages include a boosted voltage higher than the power supply voltage and a negative voltage lower than the ground voltage.
- a boost voltage is generally used to drive a selected word line, and a negative voltage biases the substrate of the memory array and causes the memory cell transistor to operate. Used to stabilize threshold voltage and reduce parasitic capacitance.
- negative voltages may also be used to keep unselected word lines unselected.
- the boosted voltage and the negative voltage are used for writing / erasing data.
- the nodes of the memory cell transistors to which these boosted voltage and negative voltage are applied differ depending on the write / erase method.
- these boosted voltages and negative voltages are used to drive the gates of the pixel transistors.
- FIG. 1 is a diagram illustrating an example of a configuration of a conventional internal voltage generating circuit that generates a negative voltage.
- the charge pump circuit 100 when the internal voltage generation circuit is activated, the charge pump circuit 100 generates a negative voltage by using the charge pump operation of the capacitive element, and the voltage level of the output node 9 of the charge pump circuit 100 And a charge pump for selectively activating the charge pump circuit 100 in accordance with an output signal of the voltage detection circuit 102.
- a charge pump circuit usually includes at least one capacitive element for a charge pump and at least two unidirectional elements (rectifying elements). At least two of these unidirectional elements have a rectifying function and supply electric charges only along the direction. At least two unidirectional elements are needed to extract charge from the output node and precharge the internal node for charge storage.
- charge pump circuit 100 is connected between node 4 and node 8
- capacitive element 5 is connected between node 8 and the ground node, and its gate is connected to node 8.
- An N-channel MOS transistor (insulated-gate field-effect transistor) 6 and an N-channel MOS transistor 7 connected between node 8 and output node 9 and having its gate connected to output node 9 are included. These MOS transistors 6 and 7 have their gates and drains interconnected and operate as diodes (unidirectional elements).
- the voltage detection circuit 102 is connected in series between the high-resistance resistor element 13 connected between the power supply node 2 and the node 14 and the output node 9 of the charge pump circuit 100 and the node 14 N-channel MOS transistors 10 and 12 included.
- the MOS transistor 100 has its one conduction node (source) connected to the output node 9 of the charge pump circuit 100 and its gate and drain connected to the node 11.
- MOS transistor 12 has its source connected to node 11, its drain connected to node 14, and its gate connected to the ground node.
- Charge pump control circuit 101 includes a two-input AND circuit 3 receiving repetition signal (pump clock signal) ⁇ applied to clock node 1 and a signal at node 14 of voltage detection circuit 102. From the AND circuit .3, a charge pump clock signal (repeated signal) is supplied to the charge pump circuit 100 via the node 4.
- FIG. 2 is a signal waveform diagram showing an operation of the internal voltage generation circuit shown in FIG.
- MOS transistors 6, 7, 10 and 12 have threshold voltage V TN.
- the AND circuit 3 in the charge pump control circuit 101 Operates as a buffer circuit, and transmits the return signal ⁇ applied to clock node 1 to node 4.
- Capacitive element 5 performs a charge pump operation in accordance with the repetitive signal applied to node 4, and changes the potential of node 8. That is, when the repetition signal ⁇ rises to the H level, the voltage level of the node 8 rises due to the charge pump operation of the capacitive element 5. When the voltage level at node 8 rises, MOS transistor 6 conducts, clamping the voltage level at node 8 to its threshold voltage V TN level. At this time, the voltage level of output node 9 of MOS transistor 7 is equal to or lower than the ground voltage level, and MOS transistor 7 maintains the off state.
- This charge pump circuit 100 has an ability to generate the following voltage V 9 at the output node 9.
- V9 -VDD + 2-VTN-(1)
- the MOS transistor 10 when the voltage difference between the voltage V9 of the node 9 and the voltage of the node 11 becomes equal to or higher than VTN, the MOS transistor 10 is turned on, and the MOS transistor 12 receives the ground voltage at its gate. Conducts when the voltage level is below one VTN. Therefore, when the voltage from the charge pump circuit 100 becomes 2 ⁇ ⁇ ⁇ , these MOS transistors 10 and 12 conduct, and the voltage level of the node 14 decreases. That is, in the voltage detection circuit 102, the MOS transistors 10 and 12 both become conductive when the following voltage conditions are satisfied.
- V19 VG12-VTN12-VTN10
- VTN10 and VTN12 denote the threshold voltages of MOS transistors 10 and 12, respectively, which are equal to voltage VTN.
- the voltage detection circuit 102 by using the MOS transistors 10 and 12 as the voltage level detection elements, the voltage detection circuit 102 can be selectively operated according to the voltage level of the output node 9 of the charge pump circuit 100.
- the charge pump circuit 100 can be activated, and the internal voltage V9 at a voltage level corresponding to the detection voltage level of the voltage level detection circuit 102 can be generated.
- the detection voltage level of the voltage V9 from the output node 9 is 1,2, VTN, which is lower than the threshold voltage of the MOS transistor. Is determined by Therefore, when the threshold voltage of these MOS transistors 10 and 12 fluctuates, the influence of the threshold voltage fluctuation on these MOS transistors 10 and 12 directly affects the detection voltage level. Appear. That is, when the threshold voltage of each of the MOS transistors 10 and 12 fluctuates in AV, the detected voltage level fluctuates by 2 ⁇ ⁇ . Therefore, in a circuit utilizing the internal voltage generated from this charge pump circuit 100, there arises a problem that the internal voltage level fluctuates and the operating margin is reduced.
- the detected voltage level is determined by an integer multiple of threshold voltage VTN of MOS transistors 10 and 12. Therefore, the voltage level of the internal voltage that can be generated becomes a threshold voltage step of the MOS transistor, and there is a problem that an internal voltage of a desired voltage level cannot be generated. Therefore, there is a case where an internal voltage having an absolute value larger than necessary is generated as the internal voltage, which causes a problem that the reliability of the device is reduced.
- the threshold voltage VTN is a voltage of about 0.6 V. In a low power supply voltage environment where the operating power supply voltage is as low as 1.8 V to 1.5 V, the effect on the device reliability is greater. Disclosure of the invention
- An object of the present invention is to provide a voltage detection circuit capable of stably detecting a desired voltage level.
- Another object of the present invention is to provide an internal voltage generating circuit capable of accurately generating an internal voltage of a desired voltage level.
- Still another object of the present invention is to provide a voltage detection method that can stably set a detection voltage level to a desired voltage level without being affected by a threshold voltage even when a MOS transistor is used as a detection element. Is to provide a circuit.
- Still another object of the present invention is to provide an internal circuit capable of accurately generating an internal voltage at a voltage level not specified by the threshold voltage of the detection MOS transistor even when a MOS transistor is used as the voltage level detection element.
- the purpose is to provide a voltage generation circuit.
- An internal voltage generating circuit includes: a charge pump circuit that performs a charge pump operation according to a return signal to generate an internal voltage at an output node; A voltage level detection circuit for detecting whether the internal voltage has reached a predetermined voltage level.
- the voltage level detection circuit includes a detection transistor formed of an insulated gate field effect transistor that receives at least a reference voltage at a gate and selectively conducts according to a difference between the reference voltage and an internal voltage.
- the internal voltage generating circuit further includes a reference voltage generator configured to at least cancel the influence of the threshold voltage of the detection transistor on detection of a difference between the reference voltage and the internal voltage. And a reference voltage generating circuit for generating the reference voltage.
- a voltage detection circuit includes a first resistance element connected between a first power supply node and an output node, and a second resistance element connected between the second power supply node and the output node. And a voltage level determination circuit for detecting whether the internal voltage has reached a predetermined voltage level according to the difference between the voltage of the output node and the internal voltage.
- the effect of the threshold voltage of this detection transistor is offset By generating the reference voltage in this way, even if the threshold voltage of the detection transistor and the value voltage fluctuate due to variations in manufacturing parameters and fluctuations in the operating environment, the level of the internal voltage can be accurately adjusted to the threshold voltage. Detection can be performed without receiving fluctuations, and a partial voltage of a desired voltage level can be generated.
- the effect of the threshold voltage is offset, and the level of this internal voltage can be set independently of the fluctuation of the threshold voltage, so that the internal voltage can be stably set to a desired voltage level. it can.
- the reference voltage is generated so as to cancel the threshold voltage itself, so that the voltage level of the internal voltage is set to a voltage level independent of the threshold voltage
- an internal voltage having a desired voltage level can be generated.
- the resistance element divides the voltages of the first and second power supply nodes by resistance to generate a reference voltage.
- a level reference voltage can be generated.
- the voltage level to be determined for the internal voltage can be set to a desired voltage level.
- an internal voltage of a desired voltage level can be generated.
- FIG. 1 is a diagram showing an example of a configuration of a conventional internal voltage generation circuit.
- FIG. 2 is a timing chart showing an operation of the internal voltage generation circuit shown in FIG.
- FIG. 3 shows a configuration of the internal voltage generating circuit according to the first embodiment of the present invention.
- FIG. 4 shows a structure of the internal voltage generating circuit according to the second embodiment of the present invention. You.
- FIG. 5 is a diagram showing a modification of the second embodiment of the present invention.
- FIG. 6 shows a structure of an internal voltage generating circuit according to the third embodiment of the present invention.
- FIG. 7 shows a configuration of the internal voltage generating circuit according to the fourth embodiment of the present invention.
- FIG. 8 is a diagram showing a modification of the fourth embodiment of the present invention.
- FIG. 9 shows a configuration of an internal voltage generating circuit according to the fifth embodiment of the present invention.
- FIG. 10 shows a structure of an internal voltage generating circuit according to the sixth embodiment of the present invention.
- FIG. 11 is a timing chart showing the operation of the power supply circuit of the internal voltage generation circuit shown in FIG.
- FIG. 12 shows a structure of the internal voltage generating circuit according to the seventh embodiment of the present invention.
- FIG. 13 is a diagram showing a modification of the seventh embodiment of the present invention.
- FIG. 14 shows a structure of an internal voltage generating circuit according to the eighth embodiment of the present invention. '
- FIG. 15 shows a structure of the internal voltage generating circuit according to the ninth embodiment of the present invention.
- FIG. 16 shows a structure of the internal voltage generating circuit according to the tenth embodiment of the present invention.
- FIG. 17 shows a structure of the internal voltage generating circuit according to the embodiment 11 of the present invention.
- FIG. 18 is a diagram showing a modification of the embodiment 11 of the present invention.
- FIG. 19 shows a structure of the internal voltage generating circuit according to the embodiment 12 of the present invention.
- FIG. 20 shows a structure of the internal voltage generating circuit according to the embodiment 13 of the present invention.
- FIG. 21 is a timing chart showing the operation of the power supply circuit of the internal voltage generation circuit shown in FIG.
- FIG. 22 is a diagram showing a modification of the embodiment 13 of the present invention.
- FIG. 23 shows a structure of the internal voltage generating circuit according to the embodiment 14 of the present invention.
- FIG. 24 shows a structure of the internal voltage generating circuit according to the embodiment 15 of the present invention.
- FIG. 25 is a diagram showing a configuration of a modified example of Embodiment 15 of the present invention.
- FIG. 26 shows a structure of the internal voltage generating circuit according to the embodiment 16 of the present invention.
- FIG. 27 is a diagram showing a modification of the embodiment 16 of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 3 shows a configuration of the internal voltage generating circuit according to the first embodiment of the present invention.
- an internal voltage generating circuit performs a charge pump operation at the time of activation to generate an internal voltage V 9 at an output node 9, and a first and second power supply node 2.
- Reference voltage generating circuit 110 that generates reference voltage V 25 from voltages V 1 + 2VTN and V 2 + 2VTN applied to 1 and 22 respectively, reference voltage V 25 and internal voltage V 9 and a voltage level determining circuit 1 12 for determining whether the voltage level of the internal voltage V 9 has reached a predetermined voltage level, and selectively according to the determination result of the voltage level determining circuit 1 12.
- a charge pump control circuit 101 for applying a return signal ⁇ applied to the clock input node 1 to the charge pump circuit 100.
- the charge pump circuit 100 like the conventional internal voltage generating circuit shown in FIG. 1, includes a capacitive element 5 for performing a charge pump operation, a diode-connected N-channel MOS transistor 6 for precharging an internal node 8, and a And a diode-connected N-channel MOS transistor 7 supplying a negative charge from internal node 8 to output node 9.
- Charge pump control circuit 101 includes an AND circuit 3 that receives determination result signal VI 4 of voltage level determination circuit 112 and repetition signal ⁇ . The output signal of the AND circuit 3 is supplied to the capacitor 5 of the charge pump circuit 100 via the node 4.
- Reference voltage generation circuit 110 includes a resistance element 23 connected between first power supply node 21 and node 25, and a resistance element 24 connected between second power supply node 22 and node 25. These resistance elements 23 and 24 have resistance values R 1 and R 2, respectively.
- the voltage level determination circuit 112 includes a high-resistance resistor 13 connected between the main power supply node 2 and the node 14, and a reference voltage V25 connected between the node 14 and the node 11 and receiving the reference voltage V25.
- a channel MOS transistor 12 and an N-channel MOS transistor 10 connected between the node 11 and the output node 9 of the charge pump circuit 100 and having its gate connected to the node 11 are included.
- MOS transistors 10 and 12 each have a threshold voltage VTN.
- First power supply node 21 is supplied with voltage V1 + 2 ⁇ VTN from power supply circuit 114
- second power supply node 22 is supplied with power supply voltage V2 + 2 ⁇ VTN from power supply circuit 116.
- the configuration of these power supply circuits 114 and 116 will be described later in detail.
- the voltage level determination circuit 112 when the difference between the reference voltage V25 and the output voltage V9 of the charge pump circuit 100 becomes 2VTN, both the MOS transistors 10 and 12 conduct, and the voltage drop in the resistance element 13 decreases.
- the output signal (voltage level determination result signal) VI 4 becomes L level. Accordingly, the output signal of AND circuit 3 of charge pump control circuit 101 is fixed at L level regardless of repetition signal cM, and pump operation of charge pump circuit 100 is stopped.
- the charge pump control circuit 101 When the difference between the reference voltage V25 and the output voltage V9 of the charge pump circuit 100 is smaller than 2VTN, at least one of the MOS transistors 10 and 12 is in a non-conductive state, and a voltage drop occurs in the resistance element 13. Voltage does not occur, The output signal V 14 of the signal judging circuit 112 becomes H level, and the charge pump control circuit 101 outputs the repetition signal ⁇ to the charge pump circuit 100.
- Reference voltage generation circuit 110 is a resistance voltage dividing circuit composed of resistance elements 23 and 24, and reference voltage V25 generated at node 25 is given by the following equation (3).
- the first term on the right side of the above equation (3) is equal to the sum of the threshold voltages of the MOS transistors 10 and 12. Therefore, when the threshold voltage of these MOS transistors 10 and 12 fluctuates, the voltage component 2-VTN included in reference voltage V 25 also changes, and the threshold voltage of these MOS transistors 10 and 12 changes. Voltage fluctuations cancel out. For example, when the threshold voltage VTN of the MOS transistors 10 and 12 increases, the first term on the right side of the above equation (3) also increases by the same value. In this case, the voltage of the gate electrodes of the M ⁇ S transistors 10 and 12 increases by the rise of the threshold voltage. Therefore, these MOS transistors 10 and 12 conduct when a potential difference of the threshold voltage (target threshold voltage) when the threshold voltage does not fluctuate occurs between the gate and the source. Voltage V 9 applied from charge pump circuit 100 to output node 9 is given by the following equation.
- V9 (R2-Vl + Rl-V2) / (R1 + R2) '' (4)
- the parameters that determine the voltage level of the internal voltage V9 do not include the threshold voltage components of the MOS transistors 10 and 12. That is, the internal voltage V 9 generated by the charge pump circuit 100 is determined by the resistance values R 1 and R 2 of the resistance elements 23 and 24 and the voltage components V 1 and V 2 generated by the power supply circuits 114 and 116. Level can be set. Normally, voltages VI and V2 are determined by the circuit configuration of power supply circuits 114 and 116 and external factors such as available power supply voltage levels. By adjusting resistance values R1 and R2 of resistance elements 23 and 24, internal voltage V9 can be set to a desired voltage level.
- the internal voltage V9 when used as a substrate bias voltage in, for example, a DRAM, the internal voltage V9 is more compared with a case where the voltage level of the substrate bias is determined by the threshold voltage step. It can be set to an optimal value. Also, in an image display circuit device using a TFT, the gate of the pixel transistor can be accurately driven.
- the reference voltage V25 only needs to be the ground voltage level.
- the resistance values R1 and R2 and the voltages V1 and V2 may be set so that 5) is satisfied.
- a voltage having a voltage level of Va can be generated, and the effect of the fluctuation of the value voltage VTN can be canceled to set the internal voltage V9 to a desired voltage level.
- a NAND circuit may be used instead of the AND circuit 3.
- an H-level signal is supplied to the capacitive element 5, so that the node 8 can be maintained in the reverse bias state with the output MOS transistor 7, and the negative charge supply operation can be reliably performed. Can be stopped.
- FIG. 4 shows a configuration of the internal voltage generating circuit according to the second embodiment of the present invention.
- in voltage level determination circuit 112 two diode-connected MOS transistors 10a and 10a are connected between MOS transistor 12 and output node 9 of charge pump circuit 100. 10 b are connected in series.
- Power circuits 114 and 116 are not shown, but supply voltages V1 + 3 ⁇ VTN and V2 + 3 ⁇ VTN to power nodes 21 and 22, respectively.
- the other configuration of the internal voltage generating circuit shown in FIG. 4 is the same as the configuration of the internal voltage generating circuit shown in FIG. 3, and corresponding portions are denoted by the same reference characters and detailed description thereof will not be repeated. .
- reference voltage V 25 is given by the following equation.
- MOS transistor 10b conducts when there is a voltage difference of threshold voltage VTN between node 11b and output node 9, and between MOS transistors 10a and 11b, Conducted when a voltage difference of threshold voltage VTN occurs.
- the MOS transistor 12 conducts when the voltage at the node 11a becomes V25-VTN.
- the voltage level of output voltage V9 output from charge pump circuit 100 can be stably set to a desired voltage level without receiving a change in threshold voltage.
- internal voltage V9 is expressed by the following equation (7).
- V9 V25-3VTN
- the internal voltage V9 is a voltage independent of the threshold voltage VTN. Therefore, internal voltage V9 can be stably set to a desired voltage level without being affected by fluctuations in threshold voltage.
- FIG. 5 is a diagram showing a configuration of an internal voltage generating circuit according to a modification of the second embodiment of the present invention.
- the internal voltage generation circuit shown in FIG. 5 in the voltage level determination circuit 112, between the node 11a and the output node 9 of the charge pump circuit 100,
- N-channel MOS transistors 10a-10n are connected in series You. These MOS transistors 10a to 10n have their gates and drains interconnected. These MOS transistors 10a-10n operate in the diode mode, respectively, and may generate a voltage drop of threshold voltage VTN when conducting, and may operate in the resistance mode when conducting, and A voltage drop may be caused by the on-resistance. It is sufficient that the voltage VI 4 from the node 14 is determined to be at the L level by the AND circuit 3 when all the MOS transistors 10 a to 10 ⁇ are turned on. Further, voltage Vl + n ⁇ VTN is applied to first power supply node 21 of reference voltage generating circuit 110, and voltage V2 + n′VTN is applied to second power supply node 22.
- the other configuration of the internal voltage generating circuit shown in FIG. 5 is the same as the configuration of the internal voltage generating circuit shown in FIG. 4, and corresponding portions are denoted by the same reference numerals and detailed description thereof will not be repeated.
- the reference voltage V 25 generated by the reference voltage generating circuit 110 is given by the following equation.
- V25 n ⁇ VTN + (R2 ⁇ V1 + R1 ⁇ V2) / (R1 + R2)... (8)
- the internal voltage V9 is equal to the voltage V25-1n. ⁇ Conducts when VTN is reached, lowers the voltage V14 at node 14, the output signal of AND circuit 3 goes low, and the pump operation of charge pump circuit 100 stops. Therefore, the internal voltage V 9 has a voltage level expressed by the following equation (9).
- V9 V25-nVTN
- This reference voltage V25 includes a voltage component n 'VTN. Therefore, even if the threshold voltages of MOS transistors 12 and 10a-10n change, the threshold voltages change. Is offset by the voltage component n ⁇ VTN included in the reference voltage V25, and the voltage level of the internal voltage V9 can be set to a desired voltage level without being affected by the fluctuation of the threshold voltage.
- the internal voltage V9 has a voltage level of 1 ⁇ VTN.
- a voltage including the threshold voltage components of the plurality of MOS transistors is generated as a reference voltage. This makes it possible to stably generate an internal voltage of a desired voltage level by offsetting the fluctuation of the threshold voltage.
- FIG. 6 shows a structure of the internal voltage generating circuit according to the third embodiment of the present invention.
- a P-channel MOS transistor 10c which is diode-connected or resistance-connected, is connected between nodes 11a and 11b.
- the first power supply node 21 is supplied with the voltage VI + 2 ⁇ VTN +
- the second power supply node 23 is supplied with the voltage V2 + 2 ⁇ VTN +
- VTP indicates a threshold voltage of the P-channel MOS transistor 10c.
- the other configuration of the internal voltage generating circuit shown in FIG. 6 is the same as the configuration of the internal voltage generating circuit shown in FIG. 4, and corresponding portions are denoted by the same reference characters and detailed description thereof will not be repeated.
- the MOS transistors 10b and 10b c both conduct.
- the MOS transistor 12 becomes conductive when the difference between the reference voltage V25 and the voltage of the node 11a becomes VTN.
- the output voltage V14 from the node 14 of the voltage level determination circuit 112 becomes L level, and the charge pump operation of the charge pump circuit 100 is stopped. Therefore, the internal voltage V9 has the voltage level expressed by the following equation (10).
- V9 V25-2-VTN +
- the reference voltage V25 is given by the following equation (11).
- V 25 2VTN + I VTP
- the threshold values of the MOS transistors 10 b and 10 c and 12 are When the voltages VTN and VTP fluctuate, The same fluctuations occur at the reference voltage V25. Therefore, even if the threshold voltage of MOS transistors 10b, 10c, and 12 for detecting the voltage level of internal voltage V9 fluctuates in voltage level determination circuit 112, the fluctuation is maintained at reference voltage V25. And the internal voltage V9 can be set to a voltage level that is independent of these threshold voltages VTP and VTN.
- these threshold voltages VTP and VTN can be set to individual voltage levels. Voltage level can be set. In particular, even when reference voltage V25 is set to the ground voltage level, desired voltage can be obtained by setting threshold voltages VTN and VTP of MOS transistors 10b and 10c to appropriate values. At this level, the voltage level of internal voltage V9 can be set.
- the total number of MOS transistors 10b and 12 is n
- the number of P-channel MOS transistors 10c is In the case of p
- the power supply nodes 21 and 22 are supplied with the voltages V 1 + n VTN + p
- the order of connection of the P and N channel MOS transistors used as voltage drop elements is arbitrary.
- MOS transistors of different conductivity types are used as voltage drop elements, and these threshold voltages can be set individually.
- the voltage level of the internal voltage can be set more finely.
- FIG. 7 shows a configuration of the internal voltage generating circuit according to the fourth embodiment of the present invention.
- the internal voltage generation circuit shown in FIG. 7 in the voltage level determination circuit 112, between the node 11 and the output node 9 of the charge pump circuit 100, d Diode elements 15 are connected in series.
- VF indicates a forward voltage drop of the diode element 15.
- the other configuration of the internal voltage generating circuit shown in FIG. 7 is the same as the configuration of the internal voltage generating circuit shown in FIG. 5, and corresponding portions are denoted by the same reference numerals and detailed description thereof will not be repeated.
- V9 V25-VTN-dVF
- the voltage level of the internal voltage V9 is given by one VTN-d ⁇ VF.
- the voltage level determination circuit 112 even when 15 diode elements are connected in series, even if the forward drop voltage of these diode elements and the threshold voltage of the MOS transistor 12 vary, Precisely, the variation of the threshold voltage can be compensated to maintain the internal voltage V9 at a desired voltage level.
- the diode element 15 is used as a voltage drop element in the voltage level determination circuit 112
- the occupied area can be reduced as compared with the MOS transistor.
- the MOS transistor 12 is formed of a TFT, it can be easily formed on the same node as the TFT (the polysilicon region is a P-type region and the source / drain regions are N-type regions).
- the number d of the diode element 15 is calculated by dividing the internal voltage V9 by What is necessary is just to determine suitably according to a voltage level. Also, the number of the diodes 15 may be appropriately determined according to the available voltage levels of the voltages VI and V2. Note that the voltage level determination circuit 112 shown in FIGS. 5 and 7 is combined to provide an (n ⁇ 1) N channel MOS transistor between the source node of the detection MOS transistor 12 and the output node 9 of the charge pump circuit 100.
- the first power supply node 21 is provided with the voltage V1 + n ⁇ VTN + d ⁇ VF
- the second power supply node 22 is provided with the voltage V 2 + nVTN + dVF
- FIG. 8 is a diagram showing a configuration of an internal voltage generating circuit according to a modification of the fourth embodiment of the present invention.
- a voltage drop element group 16 is provided between node 11 and output node 9 of charge pump circuit 100 in voltage level determining circuit 112.
- voltage drop element group 16 causes a voltage drop of voltage Vdrp between nodes 11 and 9.
- power supply node 21 is supplied with voltage VI + VTN + Vdrp
- power supply node 22 is supplied with voltage V2 + VTN + Vdrp.
- the voltage drop element group 16 is composed of a series connection of diode-connected MOS transistors and / or diode elements.
- FIG. 8 Other configurations of the internal voltage generation circuit shown in FIG. 8 are the same as the configurations of the internal voltage generation circuits shown in FIGS. 1 to 7, and corresponding parts are denoted by the same reference numerals and detailed description thereof. Is omitted.
- reference voltage V 25 is given by the following equation (13).
- V9 V25-VTN-Vd r p-(14)
- the reference voltage V 25 is a voltage component of the voltage drop V dr in the voltage drop element group 16. Included as Therefore, the voltage level of internal voltage V9 can be set to a voltage level determined by values of voltages VI and V2 and resistance values R1 and R2. Therefore, the voltage level of the internal voltage V 9 is roughly set by the voltage drop element group 16, and the voltage level of the internal voltage V 9 is finely adjusted using the resistance values R 1 and R 2. Thus, an internal voltage having a desired voltage level can be generated.
- the voltage drop elements included in the voltage drop element group 16 operate in a diode mode when conducting, and generate a voltage drop of a threshold voltage or a PN junction built-in voltage (forward drop voltage).
- the elements included in the voltage drop element group 16 conduct when a voltage difference between the threshold voltage and the forward drop voltage occurs, forming a path through which current flows.
- the voltage level may be different from the threshold voltage or the forward drop voltage. That is, the elements included in the voltage drop element group 16 may operate in the resistance mode.
- Embodiment 4 of the present invention even if an element other than the MOS transistor is used as the voltage drop element for detecting the voltage level of the internal voltage, By including the voltage drop component of the voltage drop element, it is possible to stably generate an internal voltage of a desired voltage level.
- FIG. 9 shows a configuration of an internal voltage generating circuit according to the fifth embodiment of the present invention.
- the number of diode-connected or resistor-connected N-channel MOS transistors 10 a to 10 n is 0,
- the configuration and operation of the charge pump circuit 100 and the charge pump control circuit 101 are the same as those of the first to fourth embodiments. Corresponding portions have the same reference characters allotted, and will be described in detail. Description is omitted.
- the power supply circuit 1 1 4 consists of a high-resistance resistor 3 1 connected between the main power supply node 2 and the node 3 3, and a diode connection connected in series between the node 3 3 and the ground node.
- N MOS transistors 30 and 29 connected to mains, source node 2 and power supply node 21 and their gates connected to node 33 Including N-channel MOS transistor 28.
- the ON resistances of the MOS transistors 29 and 30 are sufficiently smaller than the resistance value of the resistance element 31. Therefore, these MOS transistors 30 and 29 operate in the diode mode, causing a voltage drop of each threshold voltage VTN. Under this condition, the voltage at node 33 will be 2 'VTN.
- Power supply circuit 116 includes an N-channel MOS transistor 27 connected between negative potential supply node 26 and power supply node 22.
- N-channel MOS transistor 27 has its gate connected to second power supply node 22 and operates as a diode, causing a voltage drop of threshold voltage VTN. Accordingly, the second to the power supply node 2 2, the voltage V2 + VTN is supplied.
- negative voltage V 2 is applied to power supply node 26. This negative voltage V 2 may be externally applied or may be internally generated using another negative voltage generation circuit.
- the reference voltage V25 is given by the following equation (15).
- V25 2 ⁇ VTN + (R 1 ⁇ V2) / (R 1 + R 2)... (15)
- the voltage level of reference voltage V25 can be set to a desired voltage level by setting the values of resistance values R1 and R2 to appropriate values. Also, the voltage component VTN included in the reference voltage V25 is offset by the threshold voltage VTN of the MOS transistor 12 in the voltage level determination circuit 112, and the internal voltage V9 is reduced to the voltage R1-V2 / (R1 + R2) voltage level.
- the power supply voltage for the reference voltage generation circuit is generated using the voltage drop of the threshold voltage of the MOS transistor operating in the diode mode, The voltage including the threshold voltage component of the MOS transistor for detecting the partial voltage level can be accurately supplied as the power supply voltage to the reference voltage generation circuit.
- FIG. 10 shows a structure of an internal voltage generating circuit according to the sixth embodiment of the present invention.
- the internal voltage generating circuit shown in FIG. 10 has the same configuration as the internal voltage generating circuit shown in FIG. 9 except for the configuration of the power supply circuit 116.
- the power supply circuit 114 shown in FIG. In the voltage generation circuit 110, the voltage level determination circuit 112, the charge pump control circuit 101, and the charge pump circuit 100, the portions corresponding to the circuit configuration shown in FIG. The detailed description is omitted.
- power supply circuit 1 16 includes a capacitor 36 supplying charge to node 38 in accordance with repetition signal ⁇ A applied to node 34 and a repetition signal Z ⁇ A applied to node 35.
- a capacitor 39 supplying electric charge to the node 41 according to the following equation: a P-channel MOS transistor 37 connected between the node 38 and the ground node and having a gate connected to the node 41; P-channel MOS transistor 40 connected between node 1 and ground node and having its gate connected to node 38, and between second power supply node 22 and node 38 of reference voltage generating circuit 110 And a gate connected to the second power supply node 22 including an N channel MOS transistor 27.
- Repetitive signals ⁇ A and Z ⁇ A applied to nodes 34 and 35, respectively, are complementary signals having an amplitude of I V 2 I. ⁇
- FIG. 11 is a timing chart showing the operation of power supply circuit 116 shown in FIG.
- the repetitive signal ⁇ A rises to the H level
- the voltage level of the node 38 rises due to the charge pump operation of the capacitor 36.
- the repetitive signal ⁇ applied to node 35 falls to L level, so that charge is extracted from node 41 by capacitor 39, and the voltage level of node 41 decreases. Therefore, if the voltage level of node 38 is equal to or higher than the ground voltage, MOS transistor 40 is turned off, and MOS transistor 37 is turned on. This MOS transistor 37 causes node 38 to be grounded.
- the MOS transistor 27 is in a reverse bias state and maintains a non-conductive state.
- the MOS transistor 27 When the voltage level of the node 38 is lower than the voltage of the second power supply node by the threshold voltage VTN of the MOS transistor 27, the MOS transistor 27 conducts and the electrostatic charge from the second power supply node 22 is reduced. To the node 38 to lower the voltage level of the second power supply node 22.
- MOS transistor 27 transmits voltage V 2 + VTN to second power supply node 22 when the voltage level of node 37 is negative voltage V 2.
- the amplitude of the repetitive signals ⁇ A and Z ⁇ A is I V2 I.
- the external power supply voltage VDD is stepped down to generate the voltage I V2 I, and this stepped down voltage I V2 I is supplied to the buffer circuit receiving the repetitive signal ⁇ as the operation power supply voltage.
- the repetition signals ⁇ A and Z ⁇ A of amplitude I V2 I are converted from the repetition signal of amplitude VDD. Can be generated.
- the amplitude I V2 I is required to be lower than the power supply voltage VDD.
- an external clock signal may be used as the return signal ⁇ .
- repetitive signal ⁇ may be internally generated using an oscillation circuit.
- the configuration of the charge pump circuit that generates the negative voltage included in the power supply circuit 116 illustrated in FIG. 10 is merely an example, and a negative voltage generation circuit having another configuration may be used.
- the difference between the reference voltage and internal voltage V9 is set as threshold voltage VTN.
- power supply circuit 114 causes a voltage drop of voltage Vdrp between MOS transistor 29 and the ground node.
- the voltage drop circuit is connected in response to the voltage drop in the voltage level determination circuit 112. The generated voltage can be generated as a power supply voltage for the reference voltage generation circuit 110.
- negative voltage V2 is configured to be generated inside a circuit device, and voltage V2 at a desired voltage level can be generated.
- FIG. 12 shows a structure of the internal voltage generating circuit according to the seventh embodiment of the present invention.
- a P-channel MOS transistor connected in diode or resistance between MOS transistor 12 and output node 9 of charge pump circuit 100 is provided. 10c is connected.
- a diode-connected P-channel MOS transistor 45 is further provided between the MOS transistor 29 and the ground node by the connection of the MOS transistor 10c. Also, in the power supply circuit 116, A diode-connected P-channel MOS transistor 43 is provided between MOS transistor 27 and power supply node 22.
- the other configuration of the internal voltage generation circuit shown in FIG. 12 is the same as the configuration of the internal voltage generation circuit shown in FIG. 10. Corresponding components have the same reference characters allotted, and detailed description thereof will not be repeated.
- MOS transistor 10c conducts when the voltage between the gate and the source reaches VTP, and MOS transistors 45 and 43 generate a voltage drop of
- FIG. 13 is a diagram showing a modification of the seventh embodiment of the present invention.
- the internal voltage generating circuit shown in FIG. 13 differs from the internal voltage generating circuit shown in FIG. 10 in the configuration in the following points. That is, in the voltage level determination circuit 112, a voltage drop element group 46 for generating a voltage drop of the voltage Vd rp when conducting between the source node of the MOS transistor 12 and the output node 9 of the charge pump circuit 100 is provided.
- Can be In power supply circuit 114 similarly, a voltage drop element group 47 that causes a voltage drop of voltage Vdrp is connected between node 32 and the ground node.
- the power supply circuit 116 between the power supply nodes 22 and 38, when conducting, the voltage drop of the voltage V drp Are connected.
- Each of these voltage drop element groups 46, 47 and 49 includes a series connection of a diode-connected MOS transistor and a Z or diode element. These voltage drop element groups 46, 47 and 49 have the same circuit configuration except for the arrangement order
- the other configuration of the internal voltage generating circuit shown in FIG. 13 is the same as the configuration of the internal voltage generating circuit shown in FIG. 10, and corresponding portions are denoted by the same reference numerals and detailed description thereof will not be repeated.
- a voltage of 2 ⁇ VTN + Vdrp is generated at node 3.3, and a voltage of voltage VTN + Vdrp is generated at power supply node 21. Further, the voltage V2 + Vd rp is generated at the power supply node 22. Therefore, in the voltage level determination circuit 112, the voltage drop element group 46 is connected, and when a voltage drop of the voltage Vd rp is caused during conduction, a voltage drop element group 47 having the same configuration as the voltage drop element group 46. And 49, the effect of the fluctuation of the threshold voltage or the forward drop voltage of the voltage drop element included in the voltage drop element group 46 is suppressed, and the internal voltage V9 is reduced to the desired voltage. Can be set to level.
- the arrangement order of the MOS transistors and the voltage drop element groups is arbitrary.
- the voltage drop element group 46 in the voltage level determination circuit 112 becomes conductive when the voltage between the source node of the MOS transistor 12 and the output node 9 of the charge pump circuit 100 becomes Vd rp, and becomes the resistance mode. May work with
- the voltage level at the node 14 may be determined to be the L level by the AND circuit 3 when the voltage drop element group 46 and the MOS transistor 12 are all in a conductive state.
- the voltage drop circuit having the same configuration is arranged in the power supply circuit so that the same voltage drop as the voltage drop in the voltage level determination circuit 112 is generated. Regardless of the configuration of the circuit that causes a voltage drop in the voltage level determination circuit 112, the effect of the threshold voltage or the like can be accurately canceled to generate an internal voltage of a desired voltage level.
- FIG. 14 shows a structure of an internal voltage generating circuit according to the eighth embodiment of the present invention.
- the internal voltage generation circuit shown in FIG. 14 performs a charge pump operation in accordance with a repetitive signal applied to node 54 to generate a boosted voltage V 59 higher than power supply voltage VDD at output node 59, A reference voltage generating circuit 210 for generating voltage V75, and a voltage level determining circuit for determining whether the voltage level of boosted voltage V59 is equal to or higher than a predetermined voltage level according to the difference between reference voltage V75 and boosted voltage V59 212, and a charge pump control circuit 201 that selectively supplies a repetition signal ⁇ applied to the clock input node 1 to the charge pump circuit 200 via the node 54 according to the determination result of the voltage level determination circuit 212.
- Charge pump circuit 200 includes a capacitance element 55 connected between nodes 54 and 58, and a P-channel MOS transistor 56 connected between main power supply node 2 and node 58 and having its gate connected to node 58. And a P-channel MOS transistor 57 connected between node 58 and output node 59 and having its gate connected to output node 59.
- V59 2-VDD-2
- VTP -(16)
- Reference voltage generation circuit 210 includes resistance elements 73 and 74 connected in series between power supply nodes 71 and 72. Voltage V3—2 ⁇
- the power supply node 72 is supplied with the voltage PI and the voltage V4-2 ⁇ IVTPI.
- Resistance elements 73 and 74 have resistance values R 3 and R 4, respectively.
- a reference voltage V75 is generated from the connection node 75 between these resistance elements 7'3 and 74.
- This reference voltage generating circuit 210 generates a reference voltage V75 by dividing the voltage of power supply nodes 71 and 72 by resistance. Therefore, the reference voltage V 75 is expressed by the following equation (17).
- V75 -2-I VTP I + (R4 ⁇ V3 + R3-V4) / (R3 + R4)... (17)
- this reference voltage generating circuit 210 if the resistance values of resistance elements R3 and R4 of resistance elements 73 and 74 are set appropriately to the voltage levels of voltages V.1 and V2, the threshold voltage VT A reference voltage V75 of a desired voltage level not defined by P can be generated.
- the voltage level determination circuit 212 is connected between the output node of the charge pump circuit 200 and the node 61 and has its gate connected to the node 61, and is connected between the P-channel MOS transistor 60 and the nodes 61 and 64.
- P-channel MOS transistor 62 having its gate receiving reference voltage V75, and a high resistance element 63 connected between node 64 and the ground node.
- MOS transistors 60 and 62 each have a threshold voltage VTP.
- MOS transistors 60 and 62 The ON resistance of MOS transistors 60 and 62 is set to a value sufficiently smaller than the resistance value of resistance element 63. MOS transistor 60 operates in the diode mode, and when conducting, causes a voltage drop of voltage IVTPI.
- the ON resistance of MOS transistors 60 and 62 may be set relatively high, and MOS transistor 60 may operate in the resistance mode. Even when operating in this resistance mode, MOS transistors 60 and 62 have a gate-source voltage! / Conducts when the voltage drops below VTP.
- MOS transistor 62 conducts when the voltage at node 61 is higher than the reference voltage V75 by
- the charge pump control circuit 201 includes an OR circuit 53 receiving a return signal ⁇ applied to the clock input node 1 and a voltage V 64 on the node 64 from the voltage level determination circuit 211.
- the output signal of the OR circuit 53 is supplied to the capacitive element 55 of the charge pump circuit 200 via the node 54.
- Node 64 voltage V 64 1 Used as a boosted voltage level determination result indicating signal.
- the output signal of the voltage level determination circuit 212 (the voltage V64 at the node 64) becomes H level, Accordingly, the output signal of the OR circuit 53 is fixed at the H level. Therefore, the charge pump operation in charge pump circuit 200 is stopped.
- the charge pump circuit 200 when the voltage difference between the voltage of the node 58 and the boosted voltage V59 of the output node 59 is I VTP I, the MOS transistor 57 is turned off, and the operation of supplying the positive charge to the output node 59 is stopped. Stopped.
- the output signal of the voltage level determination circuit 212 (voltage V64) is at the L level when the boost voltage V 59 is less than the voltage V75 + 2 ⁇ I VTP
- the voltage is supplied to the capacitor 55 of the charge pump circuit 200 via the node 54.
- the internal voltage generation circuit shown in FIG. 14 generates a voltage level of voltage V75 + 2 ⁇ IVTPI as boosted voltage V59.
- the reference voltage V 75 includes a voltage component of 120 I VTP I as its voltage component. Therefore, boosted voltage V59 is set to a voltage level determined by resistance values R3 and R4 of resistors 73 and 74 and voltages V3 and V4 independently of threshold voltage VTP. That is, the voltage level of the boosted voltage V59 is expressed by the following equation (18).
- V59 (R4 ⁇ V3 + R 3-V4) / (R 3 + R4)... (1 8)
- the boosted voltage V higher than the power supply voltage VDD Even when generating the voltage 59, even if the MOS transistors 60 and 62 are used for detecting the voltage level, the boosted voltage V59 is maintained at a constant voltage level without being affected by the fluctuation of the threshold voltage. Can be maintained. Further, by setting resistance values R 3 and R 4 of resistance elements 73 and 74 to appropriate values, boosted voltage V 59 can be set to a desired voltage level. In particular, when this reference voltage V75 is set to the power supply voltage VDD level, the boosted voltage V59 can be accurately set to the voltage level of voltage 2 ⁇
- the output signal thereof may be fixed at the L level.
- a NOR circuit is used instead of the OR circuit 53.
- the tod 58 is set to the voltage VDD—I VTP I, and the positive voltage from the MOS transistor 57 to the output node 59 is set. The supply of charges can be prevented, and the boosting operation of the boosted voltage V59 can be reliably stopped.
- the MOS transistors 60 and 62 for detection are configured by TFTs when used in an image display circuit including this internal voltage generating circuit and a low-temperature polysilicon TFT circuit.
- FIG. 15 shows a structure of an internal voltage generating circuit according to the ninth embodiment of the present invention.
- the internal voltage generating circuit shown in FIG. 15 differs from the internal voltage generating circuit shown in FIG. 14 in the configuration in the following points. That is, in the voltage level determination circuit 212, a diode-connected or resistance-connected P-channel MOS transistor 60a-60p is connected in series between the source node 61 of the MOS transistor 62 and the output node 59 of the charge pump circuit 200. Is done. These MOS transistors 60a-60p are provided in total (p-1), and each have a threshold voltage VTP.
- the voltage V3—p ⁇ I VTPI is applied to the power supply node 71, and the power supply node 72 is supplied with the voltage V4—p ⁇ I VTP I.
- the other configuration of the internal voltage generation circuit shown in FIG. The configuration is the same as that of the road. Corresponding parts have the same reference characters allotted, and detailed description thereof will not be repeated.
- the boosted voltage V 59 becomes a voltage level of ⁇ ⁇ I VTP I or more higher than the reference voltage V 75
- all of the MOS transistors 60 a-60 p and 62 conduct,
- the signal at the node 64 becomes H level, and the charge pump circuit 200 stops the charge pump operation via the charge pump control circuit 201.
- the reference voltage V75 has a voltage level represented by the following equation (19).
- V75 -p-I VTP I + (R 3 ⁇ V4 + R4 ⁇ V 3) / (R 3 + R4)... (19)
- the voltage level of boosted voltage V59 can be set to the voltage level represented by the following equation (20), similarly to the internal voltage generating circuit shown in FIG.
- V59 (V3-V4 + R4-V3) / (R3 + R4)... (20)
- the threshold voltage VTP can be accurately determined without being affected by the fluctuation of the threshold voltage VTP.
- the voltage level of boosted voltage V59 can be set to a desired voltage level without depending on the voltage level of voltage VTP.
- the boost voltage V59 can be set to the voltage level of VDD + p.IVTPI.
- the fluctuation components of the threshold voltages of the MOS transistors 62 and 60a-60p have already been compensated by the reference voltage V75, so that it is possible to accurately generate a boosted voltage of a desired voltage level. it can.
- the desired value can be obtained by using the MOS transistor 60 a-60. After setting the boosted voltage level to a voltage level close to the voltage level, fine adjustment can be performed using resistance elements 73 and 74, and boosted voltage V59 can be accurately set to a desired voltage level.
- the number ( ⁇ -1) of MOS transistors 60a-60p connected in series may be any number as long as ⁇ is 1 or more, and may be an appropriate number according to the voltage level of the boosted voltage V59. Determined.
- the voltage drop component is similar to that of these MOS transistors for step-down.
- FIG. 16 shows a structure of the internal voltage generating circuit according to the tenth embodiment of the present invention.
- the internal voltage generating circuit shown in FIG. 16 differs from the internal voltage generating circuit shown in FIG. 14 in the configuration in the following points. That is, in the voltage level determination circuit 212, a diode-connected or resistance-connected N-channel MOS transistor 65 is further connected between the diode-connected or resistance-connected P-channel MOS transistor 60 and the output node 59 of the charge pump circuit 200. Is done.
- voltage V3—VTN—2 ⁇ I VTP I is applied to power supply node 71.
- power supply node 72 is supplied with voltage V4—VTN—2—I VTP I.
- the other configuration of the internal voltage generating circuit shown in FIG. 16 is the same as the configuration of the internal voltage generating circuit shown in FIG. 14, and corresponding portions are denoted by the same reference numerals and detailed description thereof will not be repeated.
- the voltage VTN + 2 'I VTP I is the lower voltage level from the voltage level obtained by dividing the voltages V3 and V4 by the resistance values R3 and R4 of the resistance elements 73 and 74.
- Generate This voltage VTN + 2 ⁇ I VTP I is equal to the voltage drop with respect to boosted voltage V 59 in voltage level determination circuit 212. Therefore, the boost voltage V 59 can be set to a voltage level obtained by dividing the voltages V 3 and V 4 by the resistance values R 3 and R 4, and the voltage is affected by the threshold voltage.
- the boosted voltage V59 can be set to a desired voltage level.
- the threshold voltages VTN and VTP can be individually set to their voltage levels, and when the voltages V3 and V4 and the resistance values R3 and R4 are limited by external factors, Also, a boosted voltage of a desired voltage level can be stably generated.
- the boosted voltage V59 is maintained at the voltage level of the voltage VDD + 2 ⁇ IVTPI + VTN.
- n diode-connected or resistor-connected N-channel MOS transistors are provided and (p-1) P-channel MOS transistors connected by diode or resistor are provided, the power supply nodes 71 and The voltage of 72 is given by the following equations (21) and (22), respectively.
- V7 l V3-n ⁇ VTN-p ⁇
- V72 V4-n ⁇ VTN-p ⁇
- the voltage level of the reference voltage V75 can be set to an optimum voltage level according to the amount of voltage drop between the output node 59 of the charge pump circuit 200 and the MOS transistor 62 for detection.
- the S transistor is connected in series for the voltage drop of the boosted voltage.
- the amount of voltage drop can be adjusted by each threshold voltage, and the voltage level of the boosted voltage is set accurately to the desired voltage level. be able to.
- the blocking voltage includes a voltage component corresponding to the amount of drop of the boosted voltage, and the fluctuation of the threshold voltage is accurately canceled to generate a boosted voltage of a desired voltage level. be able to.
- FIG. 17 shows a structure of an internal voltage generating circuit according to the eleventh embodiment of the present invention.
- the charge pump circuit 2 Between the output node 59 of 00 and the source node of the MOS transistor 62 of the voltage level determination circuit 212, d diode elements 66 are connected in series in the forward direction as viewed from the output node 59. Each of these diode elements 66 has a voltage drop VF in the ⁇ ! Direction.
- the voltage V3—I VTP I-d ⁇ is applied to the power supply node 71 of the reference voltage generation circuit 210.
- the other configuration of the internal voltage generating circuit shown in FIG. 17 is the same as the configuration of the internal voltage generating circuit shown in FIG. 16, and corresponding portions are denoted by the same reference numerals and detailed description thereof will not be repeated. .
- reference voltage V 75 is given by the following equation (23).
- V 75 -I VTP I1 dVF
- V59 V75 + I VTP
- this boost voltage V59 depends on the voltages V3 and V4 and the resistance values R3 and R4 of the resistance elements 73 and 74. Voltage level can be set. Therefore, even if the internal voltage generation circuit is formed of, for example, a TFT, and the variation of the threshold voltage is large, it is necessary to accurately and stably generate the boosted voltage V59 of a desired voltage level. Can be.
- FIG. 18 shows a structure of an internal voltage generating circuit according to a modification of the eleventh embodiment of the present invention.
- the voltage Vd rp is applied between the output node 59 of the charge pump circuit 200 and the source node 61 of the P-channel MOS transistor 62.
- a voltage drop element group 67 that conducts when a voltage drop occurs is connected.
- the voltage drop element group 67 is composed of a MOS transistor having a gate and a drain interconnected and a Z or diode element.
- the power supply node 71 is supplied with a voltage V3—Vdrp, and the power supply node 72 is supplied with a voltage V4—Vdrp.
- the other configuration of the internal voltage generating circuit shown in FIG. 18 is the same as the configuration of the internal voltage generating circuit shown in FIG. 17, and corresponding portions are denoted by the same reference numerals and detailed description thereof will not be repeated.
- reference voltage V 75 is given by the following equation (25).
- the boosted voltage V59 is a voltage level higher than the reference voltage V75 and higher than the voltage Vdrp +
- V59 (R3-V4 + R4-V3) / (R3 + R4) (26)
- boost voltage V59 is set to the voltage level of VDD + IVTPI + Vdrp. Therefore, also in the configuration shown in FIG. 18, the voltage level of boosted voltage V59 can be set to a desired voltage level, and MOS transistor in voltage level determination circuit 212 is constituted by, for example, a TFT. However, even when the variation in the threshold voltage is large, the voltage level of boosted voltage V59 can be accurately set to a desired voltage level.
- the drop voltage V drp in the voltage drop element group 67 is such that the voltage drop element group 67 has, for example, d diode elements, n diode-connected N channel MOS transistors, and (p ⁇ 1) diodes If it is composed of connected N-channel MOS transistors, it is given by the following equation (27).
- Vd rp d ⁇ VF + (p-1) ⁇
- the voltage level of the boost turret pressure V59 can be set.
- boost voltage V59 can be set to a desired voltage level by resistance values R3 and R4.
- FIG. 19 shows a structure of an internal voltage generating circuit according to a twelfth embodiment of the present invention.
- the voltage level determination circuit 2 the voltage level determination circuit 2
- a P-channel MOS transistor 62 having a gate receiving a reference voltage V 75 is connected between the output node of the charge pump circuit 200 and the voltage level determination result output node 64. Therefore, boost voltage V 59 is set to the voltage level of V75 +
- the configurations of the charge pump control circuit 201 and the charge pump circuit 200 are the same as those of the circuits described in the eighth to eleventh embodiments. Corresponding portions have the same reference characters allotted, and detailed description thereof will not be repeated.
- the power supply node 71 is supplied with the voltage V 3 ⁇ I VTP I from the power supply circuit 214, and the power supply node 72 is supplied with the voltage VDD ⁇ I VTP I from the power supply circuit 216.
- This reference voltage generation circuit 210 generates a reference voltage V75 from the voltage applied to power supply nodes 71 and 72 by resistance division by resistance elements 73 and 74.
- Power supply circuit 214 includes a P-channel MOS transistor 77 connected between boost node 76 and power supply node 71 and having a gate connected to power supply node 71.
- the MOS transistor 77 operates in the diode mode, and steps down the voltage applied to the boosting node 76 to the absolute value of the threshold voltage I VTP I to reduce the power supply node 7
- Power supply circuit 216 includes P-channel MOS transistors 79 and 80 connected in series between main power supply node 2 and node 83, each of which is diode-connected. It includes a high resistance element 81 connected between node 83 and the ground node, and a P-channel MOS transistor 78 connected between power supply node 72 and the ground node and having its gate connected to node 83. These MOS transistors 78-80 each have a threshold voltage VTP.
- the resistance element 81 has a resistance sufficiently larger than the on-resistance of the MOS transistors 79 and 80, and the MOS transistors 79 and 80 operate in the diode mode, and each has a voltage of I VTP I. Causes a descent. Therefore, a voltage of VDD ⁇ 2 ⁇ I VTP I is generated at node 83.
- MOS transistor 78 conducts if the voltage at power supply node 72 is higher than the voltage at node 83 by VTP1. Therefore, power supply node 72 is clamped to voltage VDD—I VTP I by MOS transistor 78.
- reference voltage V 75 is given by the following equation (28).
- the boosted voltage V59 is given by the following equation (29).
- V59 V75 + I VTP I
- the voltage level of voltage V3 is set to a desired voltage level by using, for example, another booster circuit, and the resistance values of resistance elements 73 and 74 are set to appropriate values.
- the level of boosted voltage V59 can be accurately set to a desired voltage level without being affected by fluctuations in the threshold voltage of MOS transistor 62.
- the variation of the threshold voltage of the MOS transistor of the power supply circuit 216 can be detected by the threshold of the MOS transistor for detecting the voltage level.
- the variation of the value voltage can be made the same, and the effect of the threshold voltage of the MOS transistor for detecting the voltage level can be accurately canceled.
- the voltage drop according to the voltage drop of the MOS transistor of Can be generated as a power supply voltage for the reference voltage generation circuit 212.
- FIG. 20 shows a structure of an internal voltage generating circuit according to a thirteenth embodiment of the present invention.
- the internal voltage generating circuit shown in FIG. 20 differs from the internal voltage generating circuit shown in FIG.
- Power supply circuit 214 is connected between main power supply node 2 and node 88 and connected to its gate node 91, and an N-channel MOS transistor 87 is connected between main power supply node 2 and node 91 and has its gate connected.
- N-channel MOS transistor 90 connected to node 88, capacitive element 86 transmitting repetitive signal ⁇ B applied to clock node 80 to node 88, and complementary repetitive signal ⁇ ⁇ applied to clock input node 85
- a diode-connected ⁇ -channel MOS transistor 77 connected between node 88 and power supply node 71 of reference voltage generating circuit 210 in the forward direction as viewed from node 88.
- the repetitive signals ⁇ and ⁇ are complementary to each other, and their amplitude is VB.
- the amplitude VB is a voltage level higher than the threshold voltage VTN.
- the voltage V3 is given by VDD + VB.
- the other configuration of the internal voltage generating circuit shown in FIG. 20 is the same as the configuration of the internal voltage generating circuit shown in FIG. 19, and corresponding portions are denoted by the same reference numerals and detailed description thereof will not be repeated.
- FIG. 21 is a signal waveform diagram representing an operation of power supply circuit 214 shown in FIG.
- the operation of the power supply circuit 214 shown in FIG. 20 will be described with reference to FIG.
- the return signals ⁇ and ⁇ ⁇ b have amplitude VB.
- the repetition signal ⁇ goes to the H level
- the voltage level increases due to the charge pump operation of the node 88 capacitive element 86.
- the repetitive signal Z ⁇ P falls to the L level
- the voltage level of the node 91 is reduced by the capacitive element 89.
- Node 88 is high, MOS transistor 90 conducts, and node 91 power supply voltage VDD Clamped to the level.
- amplitude VB of repetitive signals ⁇ B and Z ⁇ B is a voltage level higher than threshold voltage VTN. Therefore, when repetitive signal ⁇ rises, node 88 further rises in voltage VB from its precharge voltage VDD level, and the voltage level of node 88 becomes the voltage level of voltage VB + VDD.
- the MOS transistor 87 receives the power supply voltage VDD at its gate, and its source serves as a power supply node. In this state, the MOS transistor 87 maintains a non-conductive state.
- the voltage VB is higher than the threshold voltage VTN, and can reliably precharge the node 91 to the power supply voltage VDD level via the MOS transistor 90.
- MOS transistor 77 When the voltage level of node 88 becomes VDD + VB, when the voltage of power supply node 71 is equal to or lower than VDD + VB-I VTP I, MOS transistor 77 conducts and supplies a positive charge to power supply node 71. To rise.
- node 88 In steady state, node 88 varies between supply voltage VDD and voltage VB + VDD, and node 91 also varies between voltage VDD and voltage VDD + VB. Assuming that this voltage VB + VDD is voltage V3, the power supply node 71 of the reference voltage generating circuit 210 is supplied with the voltage of V3—IVTPI.
- Voltage VB may be at a voltage level at which MOS transistors 87 and 90 can be rendered conductive and internal nodes 88 and 91 can be precharged to the power supply voltage level. Therefore, this voltage VB is generated by stepping down the power supply voltage VDD and used as the power supply voltage of the circuit for generating the repetitive signals ⁇ B and Z ⁇ B, whereby the repetitive signals ⁇ B and Z of the amplitude VB are generated. ⁇ B can be generated.
- voltage V3-I VTP I can be generated inside the semiconductor device.
- the voltage level of the repetitive signal phi B and Z phi B amplitude Contact Yopi supply voltage VDD the voltage level of the voltage V 3 is limited.
- the reference voltage V75 can be set to a desired voltage level, and the voltage can be boosted accordingly.
- the voltage level of voltage V59 can be set to a desired voltage level.
- FIG. 22 is a diagram schematically showing a configuration of a modification of the thirteenth embodiment of the present invention.
- the internal voltage generating circuit shown in FIG. 22 differs from the internal voltage generating circuit shown in FIG. 19 in the following points in the configuration.
- voltage level determination circuit 212 determines whether boosted voltage V59 is at the voltage level of voltage V75 + 2 ⁇ IVTPI.
- Power supply circuit 214 has a P-channel MOS transistor 93 connected between main power supply node 2 and node 88 and having its gate connected to node 88, and a repetitive signal ⁇ applied to clock input node 80, and has a node And a ⁇ -channel MOS transistor 77 connected between node 88 and power supply node 71 of reference voltage generating circuit 210 and having its gate connected to power supply node 71.
- the repetition signal C has the amplitude VDD.
- the power supply circuit 216 is connected in series between the main power supply node 2 and the internal node 83, each of which is diode-connected ⁇ -channel MOS transistors 79a-79c, connected between the node 83 and the ground node, and Includes high-resistance element 81.
- the other structure of the internal voltage generating circuit shown in FIG. 22 is the same as the structure of the internal voltage generating circuit shown in FIG. 19, and corresponding portions are denoted by the same reference numerals and detailed description thereof will not be repeated.
- repetitive signal ⁇ C having amplitude VDD is applied to power supply circuit 214.
- the configuration of the power supply circuit 214 is the same as the configuration of the charge pump circuit 200.
- the lower limit voltage of the node 88 is clamped to the voltage VDD—IVTP
- the MOS transistors 79a-79c force S each of which has an ON resistance sufficiently smaller than the resistance value of the resistance element 81, operates as a diode element, and reduces the voltage drop of I VTP I, respectively.
- MOS transistor 78 operates in the source follower mode, voltage VDD-2 ⁇ IVTPI is transmitted to power supply node 72.
- reference voltage generation circuit 210 generates reference voltage V75 represented by the following equation (29).
- the detection level of the detection voltage is determined by the MOS transistors 60 and 62. Since the voltage 2 ⁇ I VTP I causes a voltage drop, the voltage level of the internal voltage V 59 is expressed by the following equation (30).
- V59 VDD (2 ⁇ R4 + R 3) / (R3 + R4)... (30)
- the internal voltage V 59 can be set to a desired voltage level. Can be set to
- Internal voltage V59 can be set to a voltage level of 3 ′ VDD / 2.
- a voltage that is 1.5 times the memory array power supply voltage is generally used as a boosted voltage when driving a word line in a DRAM. Therefore, in a boosted word line drive type DRAM, a read line that drives a selected read line is used. To generate the drive signal, the boosted voltage V59 can be used.
- the power supply voltage for the reference voltage generating circuit is internally generated in consideration of the voltage drop of the voltage detection, and the desired voltage level is stably obtained.
- a reference voltage can be generated, and a boosted voltage can be stably generated accordingly.
- FIG. 23 shows a structure of an internal voltage generating circuit according to Embodiment 1.4 of the present invention.
- the internal voltage generation circuit shown in FIG. 23 is the same as the internal voltage generation circuit shown in FIG. And the configuration is different in the following points.
- diode-connected N-channel MOS transistor 96 is connected between P-channel MOS transistor 62 and output node 59 of charge pump circuit 200.
- This N-channel / MOS transistor 96 has an on-resistance that is sufficiently smaller than the resistance value of the resistance element 63, operates in the diode mode when conducting, and decreases the voltage VTN with respect to the boosted voltage V59. And transfer it to the source of MOS transistor 62.
- an N-channel MOS transistor 94 that is diode-connected is connected between the P-channel MOS transistor 77 and the power supply node 71 of the reference voltage generation circuit 210.
- N-channel MOS transistor 94 operates in a diode mode when conducting, and causes a voltage drop of VTN from MOS transistor 77 to power supply node 71.
- diode-connected N-channel MOS transistor 95 is connected between main power supply node 2 and P-channel MOS transistor 79a.
- N-channel MOS transistor 95 has its gate and drain connected to main power supply node 2, operates in diode mode, and causes voltage VTN to drop.
- the other configuration of the internal voltage generating circuit shown in FIG. 23 is the same as the configuration of the internal voltage generating circuit shown in FIG. 20, and corresponding portions are denoted by the same reference characters and detailed description thereof will not be repeated.
- repetitive signals ⁇ and Z ⁇ are signals of amplitude VB, and node 88 changes between power supply voltage VDD and voltage VB + VDD. Therefore, in reference voltage generating circuit 210, a voltage of voltage VB + VDD—VTN—I VTP
- V3—VTN—
- VTN voltage drop due to the MOS transistor 95 and a voltage drop 2 ⁇
- the reference voltage V 75 is given by the following equation (31).
- V75 -VTN- I VTP I
- the MOS transistors 62 and 96 cause a voltage drop VTN + I VTP I. Therefore, the first and second terms on the right side of the above equation (31) cancel each other, and the voltage level of the boosted voltage V59 is adjusted to the desired level by the voltages V3, VDD, and the resistance values R3 and R4. Can be set to In the configuration of the internal voltage generating circuit shown in FIG. 23, the connection order of MOS transistors 95 and 79a and 79b in power supply circuit 216 is arbitrary. —Similarly, in the power supply circuit 214, the positions of the MOS transistors 77 and 94 may be exchanged.
- the amplitude VB of the repetitive signals ⁇ B and Z ⁇ B only needs to be equal to or higher than the voltage VTN.
- the voltage at nodes 88 and 91 rises due to the precharge operation of MOS transistors 87 and 90, even if the voltage at nodes 88 and 91 is lower than the power supply voltage VDD.
- the voltage levels at nodes 88 and 91 are charged to VB + VDD-VTN, after which the precharge voltage levels at nodes 88 and 91 become the supply voltage V DD. From this point on, nodes 88 and 91 change between voltage VDD and voltage VDD + VB. Therefore, in this state, MOS transistors 77 and 94 are both turned on, and a voltage of a desired voltage level can be supplied to power supply node 71 of reference voltage generation circuit 210.
- the configuration of power supply circuits 214 and 216 is such that the effect of the threshold voltage of the MOS transistor for voltage drop of voltage level determination circuit 212 is offset from the effect of the voltage level of internal voltage V59. With such a configuration, the configuration of the internal circuit in Embodiments 7 to 12 can be used.
- the amplitude is controlled in the power supply circuit using the same configuration as these voltage level detection transistors.
- a desired voltage level by generating a power supply voltage for the reference voltage generation circuit using the repeated signal The voltage can be generated accurately.
- FIG. 24 shows a structure of an internal voltage generating circuit according to the fifteenth embodiment of the present invention.
- the internal voltage generating circuit shown in FIG. 24 corresponds to the configuration of the internal voltage generating circuit shown in FIG. 6, but differs from the configuration of the internal voltage generating circuit shown in FIG. 6 in the following points. That is, to charge pump circuit 100, repetitive signal ⁇ is always applied to capacitive element 5 from clock input node 1 through node 4. Therefore, the charge pump circuit 100 always performs the charge pump operation.
- voltage level determination circuit 112 drain node 14 of N-channel MOS transistor 12 for detecting a voltage level is coupled to main power supply node 2.
- the source node 11a of the MOS transistor 12 is connected to a diode-connected P-channel MOS transistor 10c.
- a diode-connected MOS transistor 10b is connected between the MOS transistor 10c and the output node of the charge pump circuit 100.
- M.OS transistors 10b and 10c conduct, a voltage drop of VTN +
- the other configuration of the internal voltage generating circuit shown in FIG. 24 is the same as that of the internal voltage stabilizing circuit shown in FIG. 6, and the corresponding parts are denoted by the same reference numerals and detailed description thereof will be omitted. ? Oo
- the lower limit voltage level of the output voltage V 9 of the charge pump circuit 100 can be clamped, and the voltage fluctuation of the internal voltage V 9 can be suppressed. Can be. Therefore, in applications where the charge pump circuit 100 operates constantly and low power consumption is not so required, it is possible to supply the internal voltage V9 of a stable voltage level.
- the internal voltage V9 can be set to a desired voltage level.
- FIG. 25 is a diagram showing a configuration of a modified example of Embodiment 15 of the present invention.
- the configuration of the internal voltage generation circuit shown in FIG. 25J corresponds to the configuration of the internal voltage generation circuit shown in FIG.
- Charge pump circuit 200 is constantly supplied with repetitive signal ⁇ from clock input node 1 via node 4.
- drain node 14 of detection MOS transistor 12 is coupled to main power supply node 2, as in the configuration shown in FIG.
- a voltage drop element group 46 for generating a voltage drop of the voltage Vdrp when conducting is provided.
- the voltage drop elements connected in series are composed of MOS transistors or diodes operating in the diode mode.
- any of the configurations of the first to sixth embodiments may be used.
- the voltage V 1 + VTN + V drp is supplied from the power supply circuit 114 to the power supply node 21, and the power supply circuit 111 is supplied to the power supply node 22. From the six forces, a voltage V 2 + V TN + V drp is provided.
- the other configuration of the internal voltage generating circuit shown in FIG. 25 is the same as the configuration of the internal voltage generating circuit shown in FIG. 24, and corresponding portions are denoted by the same reference numerals and detailed description thereof will not be repeated. I do. In the configuration of the internal voltage generating circuit shown in FIG.
- the power supply circuits 114 and 116 are respectively connected to these voltages so as to cancel the effects of the threshold voltage and Z or the forward drop voltage of the voltage drop elements included in the voltage drop element group 46. It has a circuit portion with the same connection as the falling element group 46 and the MOS transistor 12 (see FIG. 13). Therefore, even in the configuration shown in FIG. 25, even if the threshold voltage Z forward drop voltage of the voltage drop element group 46 and the threshold voltage of the MOS transistor 12 change, In addition, the voltage level of internal voltage V 9 can be maintained at a predetermined voltage level, and the fluctuation of the voltage level of internal voltage V 9 can be suppressed.
- FIG. 26 shows a structure of the internal voltage generating circuit according to the embodiment 16 of the present invention.
- the configuration of the internal voltage generation circuit shown in FIG. 26 corresponds to the configuration of the internal voltage generation circuit shown in FIG.
- Charge pump circuit 200 always receives repetitive signal ⁇ via clock input node 1 and performs a charge pump operation to generate internal voltage V59.
- the configuration of the charge pump circuit 200 is the same as the configuration of the charge pump circuit 200 shown in FIG. 16. Corresponding portions are allotted with the same reference numerals, and description thereof is not repeated.
- the drain node 64 of P channel MOS transistor 62 for detecting the voltage level is coupled to the ground node.
- MOS transistors 65 and 60 which are respectively diode-connected, are connected in series. These MOS transistors 65 and 60 are an N-channel MOS transistor and a P-channel MOS transistor, respectively, and generate a voltage drop of voltage VTN and IVTPI when conducting.
- the reference voltage generation circuit 210 has the same configuration as that shown in FIG. VTP— and V4-VTN-2 .
- I VTP I is divided by resistors 73 and 74 to generate a reference voltage V75.
- the upper limit of the boost voltage V59 can be clamped to the voltage level of (V3 ⁇ R4 + V4 ⁇ R3) / (R3 + R4), thereby suppressing the voltage fluctuation of the boost voltage V59. can do. Therefore, in applications in which charge pump circuit 200 operates constantly and low power consumption characteristics are not required, boosted voltage V59 can be stably maintained at a desired voltage level.
- the influence of the threshold voltages of MOS transistors 65, 60, and 62 is such that the power supply voltage to reference voltage 210 is reduced so that the effects are offset in the power supply circuit that supplies the voltages to power supply nodes 71 and 72, respectively.
- the boosted voltage V59 that has been generated can be maintained at a desired voltage level without being affected by the fluctuation of the threshold voltage.
- FIG. 27 shows a modification of the sixteenth embodiment of the present invention.
- the internal voltage generating circuit shown in FIG. 27 corresponds to the configuration of the internal voltage generating circuit shown in FIG.
- the internal voltage generating circuit shown in FIG. 27 differs from the internal voltage generating circuit shown in FIG. 18 in the following points.
- charge pump circuit 200 is constantly supplied with repetitive signal ⁇ from clock input node 1, performs a charge pump operation, and generates internal voltage V59.
- the voltage of the MOS transistor 62 for detection is Rain node 64 is directly coupled to the ground node.
- the source of the MOS transistor 62 is coupled to the output node 59 of the charge pump circuit 200 via the voltage drop element group 67. Similar to the configuration shown in FIG. 18, this oven pressure drop element group 67 is composed of a diode element or a diode-connected MOS transistor, and when conducting, causes a drop in voltage V drp.
- the other configuration of the internal voltage generating circuit shown in FIG. 27 is the same as the configuration of the internal voltage generating circuit shown in FIG. 18. Corresponding portions have the same reference characters allotted, and detailed description thereof will not be repeated. .
- charge pump circuit 20 ⁇ always performs a charge pump operation to generate boosted voltage V59.
- this boosted voltage V5 9 becomes higher than the reference voltage V75 from the reference voltage generating circuit 210 by
- VTPI + Vdrp all the voltage drop elements in the voltage drop element group 67 are conducted, and Transistor 62 also conducts, current flows from the output node of charge pump circuit 59 to the ground node, and the voltage level of boosted voltage V59 decreases.
- the difference between the boost voltage V59 and the reference voltage V75 is smaller than IVTPI + Vdrp, at least one voltage drop occurs in the voltage drop element group 67 and the MOS transistor 62. The element is non-conductive, and the current path from charge pump circuit 59 to the ground node is cut off.
- the reference voltage V 75 includes the threshold voltage and the forward drop voltage of the voltage drop element group 67 and the MOS transistor 62 for detection. Voltage components are included, and even if these voltage components fluctuate, their effects are canceled out, and the boosted voltage V59 can be accurately set to a desired voltage level.
- the charge pump circuit includes one charge pump capacitance element and two diode-connected MOS transistors.
- the present invention is applicable to any circuit that generates an internal voltage by using a charge pump operation of a capacitor.
- the configuration of the voltage level determination circuit, the reference voltage generation circuit, and the power supply circuit of the present invention can be applied to a voltage detection circuit that detects the voltage level of the internal voltage without being limited to the internal voltage generation circuit. . That is, the present invention can be provided for a circuit that detects the difference between the reference voltage and the target voltage by using the voltage drop characteristic of the semiconductor element to detect the level of the target voltage.
- the present invention can be applied to a word line drive voltage generation circuit in a DRAM, a substrate bias voltage generation circuit of a memory array, and a negative voltage generation circuit.
- the present invention is applicable to a circuit that generates a write / erase voltage in a nonvolatile semiconductor memory device such as a flash memory.
- the present invention is applicable to a circuit that generates a gate drive voltage for driving a TFT pixel drive transistor in a TFT active matrix circuit.
- the present invention can be generally applied to an internal voltage generation circuit and a voltage detection circuit of a semiconductor device that includes a MOS transistor as a component and internally generates a voltage different from the power supply voltage level. .
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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CNB028202600A CN100382419C (zh) | 2002-09-11 | 2002-09-11 | 电压检测电路和使用它的内部电压发生电路 |
KR1020047005775A KR100616337B1 (ko) | 2002-09-11 | 2002-09-11 | 전압검출회로 및 이것을 사용한 내부전압 발생회로 |
DE10297335T DE10297335T5 (de) | 2002-09-11 | 2002-09-11 | Spannungserfassungsschaltung und dieselbe benutzende Erzeugungsschaltung für interne Spannung |
PCT/JP2002/009301 WO2004025817A1 (ja) | 2002-09-11 | 2002-09-11 | 電圧検出回路およびこれを用いた内部電圧発生回路 |
US10/489,106 US7030682B2 (en) | 2002-09-11 | 2002-09-11 | Voltage detection circuit and internal voltage generating circuit comprising it |
JP2004535835A JP4381305B2 (ja) | 2002-09-11 | 2002-09-11 | 電圧検出回路およびこれを用いた内部電圧発生回路 |
TW091120837A TWI283516B (en) | 2002-09-11 | 2002-09-12 | Internal voltage generation circuit and voltage detection circuit |
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PCT/JP2002/009301 WO2004025817A1 (ja) | 2002-09-11 | 2002-09-11 | 電圧検出回路およびこれを用いた内部電圧発生回路 |
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PCT/JP2002/009301 WO2004025817A1 (ja) | 2002-09-11 | 2002-09-11 | 電圧検出回路およびこれを用いた内部電圧発生回路 |
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US (1) | US7030682B2 (ja) |
JP (1) | JP4381305B2 (ja) |
KR (1) | KR100616337B1 (ja) |
CN (1) | CN100382419C (ja) |
DE (1) | DE10297335T5 (ja) |
TW (1) | TWI283516B (ja) |
WO (1) | WO2004025817A1 (ja) |
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JP2005353221A (ja) * | 2004-06-14 | 2005-12-22 | Renesas Technology Corp | 半導体集積回路装置 |
KR100751649B1 (ko) | 2004-06-29 | 2007-08-22 | 주식회사 하이닉스반도체 | 반도체 장치의 내부전압 발생회로 |
JP2009110175A (ja) * | 2007-10-29 | 2009-05-21 | Elpida Memory Inc | 電圧検知回路及びこれを備える半導体装置 |
JP2009151847A (ja) * | 2007-12-19 | 2009-07-09 | Panasonic Corp | 半導体記憶装置 |
JP2010020846A (ja) * | 2008-07-11 | 2010-01-28 | Sanyo Electric Co Ltd | 半導体記憶装置の読み出し回路 |
JP2011223829A (ja) * | 2010-04-14 | 2011-11-04 | Rohm Co Ltd | 負電圧チャージポンプ回路の制御回路および負電圧チャージポンプ回路、ならびにそれらを用いた電子機器およびオーディオシステム |
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JP2010020846A (ja) * | 2008-07-11 | 2010-01-28 | Sanyo Electric Co Ltd | 半導体記憶装置の読み出し回路 |
JP2011223829A (ja) * | 2010-04-14 | 2011-11-04 | Rohm Co Ltd | 負電圧チャージポンプ回路の制御回路および負電圧チャージポンプ回路、ならびにそれらを用いた電子機器およびオーディオシステム |
US8742834B2 (en) | 2010-04-14 | 2014-06-03 | Rohm Co., Ltd. | Negative-voltage charge pump circuit |
JP2019087292A (ja) * | 2017-11-09 | 2019-06-06 | ローム株式会社 | 半導体記憶装置 |
JP7082473B2 (ja) | 2017-11-09 | 2022-06-08 | ローム株式会社 | 半導体記憶装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4381305B2 (ja) | 2009-12-09 |
DE10297335T5 (de) | 2004-11-18 |
CN100382419C (zh) | 2008-04-16 |
JPWO2004025817A1 (ja) | 2006-01-12 |
TWI283516B (en) | 2007-07-01 |
US20040257148A1 (en) | 2004-12-23 |
KR20040058209A (ko) | 2004-07-03 |
KR100616337B1 (ko) | 2006-08-29 |
CN1568569A (zh) | 2005-01-19 |
US7030682B2 (en) | 2006-04-18 |
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