WO2004015763A1 - ウエハ回転装置とこれを有する端部傷検査装置 - Google Patents
ウエハ回転装置とこれを有する端部傷検査装置 Download PDFInfo
- Publication number
- WO2004015763A1 WO2004015763A1 PCT/JP2003/010166 JP0310166W WO2004015763A1 WO 2004015763 A1 WO2004015763 A1 WO 2004015763A1 JP 0310166 W JP0310166 W JP 0310166W WO 2004015763 A1 WO2004015763 A1 WO 2004015763A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- roller
- rollers
- rotating device
- silicon wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Definitions
- the present invention particularly relates to a wafer rotating device for rotating a disc-shaped component such as a silicon wafer or a semiconductor wafer, and an edge flaw inspection device having the same.
- This apparatus includes a rotary table that horizontally rotates by sucking the vicinity of the center position of the back surface of the silicon wafer. By irradiating the end surface of the silicon wafer horizontally rotated by this rotary table with light, and detecting and analyzing the light reflected on the end surface, the type of defect at the end portion or the surface roughness can be detected. I do.
- the present invention has been made in view of the above-mentioned circumstances, and provides a wafer rotation device capable of rotating a silicon wafer without contacting the front and back surfaces of the silicon wafer, and an edge flaw inspection apparatus having the same. It is intended to be. Disclosure of the invention
- the wafer rotating device is provided so as to be rotatable around axes arranged at parallel intervals, and at least three rollers rolling on the circumferential surface of the disk-shaped wafer;
- a load control device for controlling the load applied to the vehicle.
- the interval dimension of the rollers is adjusted by operating the interval adjusting mechanism in a state where the disc-shaped wafer is arranged between the rollers, so that the wafer is sandwiched between the rollers. Since at least three rollers are provided around the wafer, when the wafer is sandwiched by the rollers, the wafer is held in a fixed radial position.
- the load applied from the roller to the wafer in the radial direction of the wafer is controlled by operating the load control device. Therefore, even if the outer diameter of the wafer varies, the distance between the roller and the wafer can be reduced. The distance between the rollers is adjusted so that the contact pressure becomes constant, and variations in the outer diameter of the wafer are absorbed.
- the rotary drive mechanism is operated in this state, at least one roller is driven to rotate, and the wafer is rotated around its axis by friction between the peripheral surface of the roller and the peripheral surface of the wafer. Turned.
- the load applied to the roller along the direction of movement of the roller is detected by the mouth cell, and the interval adjusting mechanism is controlled by operating the load control device so that the load becomes constant. Therefore, even during the rotation of the wafer, the contact pressure between the wafer and the roller is maintained so as to be always constant, and a constant torque is transmitted from the roller to the wafer, thereby achieving a stable rotation of the wafer.
- the roller is provided so as to be rotatable about an axis disposed in a substantially vertical direction, and further includes a flange portion having a larger diameter than the peripheral surface below a peripheral surface sandwiching the wafer.
- the upper surface may be constituted by an inclined surface that becomes gradually lower radially outward.
- the radius of the inscribed circle on the peripheral surface of the roller is slightly larger than the outer diameter of the wafer.
- the radius of the inscribed circle of the roller flange can be made smaller than the outer diameter of the wafer.
- the distance between the other two rollers adjacent on both sides of said roller may be smaller than 180 °. If a large scratch or notch is formed on the circumferential surface of the wafer and the scratch or the like is located at the contact position with one roller, the contact pressure between the roller and the wafer will fluctuate rapidly. The wafer tries to move in the direction of the rollers. However, in this configuration, a force is applied in a direction to suppress the movement of the wafer by the rollers arranged on both sides, and the roller is held so as not to cause a misalignment during rotation.
- a pair of two rollers may be arranged at three or more places at intervals in the circumferential direction of the wafer. In this case, by pressing the circumferential surface of the wafer inward in the radial direction from approximately the same direction with a pair of two rollers, even if a large scratch or notch of the wafer matches one of the rollers, the other roller is used. It is supported so that the center position of the wafer does not change.
- An edge flaw inspection apparatus includes: any one of the wafer rotating devices; a light source that emits light to a circumferential surface of a wafer supported by the wafer rotating device; and a light source that emits light from the light source. And a photodetector for detecting light reflected on the circumferential surface of the wafer.
- the wafer is rotated while being supported only by its circumferential surface by the operation of the wafer rotating device. Therefore, while the wafer is being rotated, the light emitted from the light source and reflected on the circumferential surface of the wafer is detected by the photodetection unit, so that the light detecting unit detects the light without contacting the surface of the wafer. All around Can be inspected for edge flaws.
- FIG. 1 is a front view showing a wafer rotating device according to one embodiment of the present invention.
- FIG. 2 is a plan view showing the wafer rotating device of FIG.
- FIG. 3 is a plan view showing an interval adjusting mechanism of the wafer rotating device of FIG.
- FIG. 4 is a front view showing a roller shape of the wafer rotating device of FIG.
- FIG. 5 is a front view showing a state where the wafer moves on the rollers of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- the wafer rotation device 1 of this embodiment adjusts the distance between eight rollers 2, a rotation drive mechanism 3 for rotating these rollers 2, and the distance between the rollers 2.
- An interval adjustment mechanism 4 for adjusting the load and a load control device 6 for controlling the load applied from the opening 2 to the silicon wafer 5 sandwiched between the rollers 2 are provided.
- each roller 2 includes a cylindrical surface 8 that contacts the circumferential surface of the silicon wafer 5, and a flange 9 that is adjacent to one of the cylindrical surfaces 8 in the axial direction.
- the flange 9 has a larger diameter than the cylindrical surface 8 and is formed over the entire circumference.
- the flange 9 is formed as an inclined surface 10 that gradually widens outward in the radial direction as the end surface adjacent to the cylindrical surface 8 moves away from the cylindrical surface 8 along the axial direction.
- the holding portion 11 formed adjacent to the other side of the cylindrical surface 8 in the axial direction has a diameter slightly larger than that of the cylindrical surface 8 and prevents the silicon wafer 5 from coming off.
- rollers 2 are rotatably mounted on the bracket with the rotation axes of the rollers 2 being parallel.
- a pulley 12 is fixed to an end of each roller 2.
- the bracket 7 is fixed to a slider, which will be described later, so as to be disposed below the cylindrical portion 8 of the roller 2.
- the rotation drive mechanism 3 includes, for example, a motor 13 and various pulleys and belts for transmitting the rotation torque of the motor 13 as shown in FIGS.
- the rotation drive mechanism 3 includes a motor 13, a drive pulley 14 fixed to an output shaft of the motor 13, and brackets 7, which are arranged around an axis parallel to the rotation axis of the roller 2.
- a main pulley 15 rotatably mounted, a main drive pulley 15 a fixed to a rotating shaft 17 of each main pulley 15, and a pulley 12 of two rollers 2 provided on a bracket 7 thereof.
- the first belt 16 spanned between them, the connecting pulley 18 fixed to the rotating shaft 17 of the main pulley 15, and the connecting pulley 18 of the four brackets 7 And a second to fourth belts 19 to 21.
- Reference numeral 22 in the figure denotes a tensioner that is displaced when a slider 23 described later moves and adjusts the tension of the third belt 20 to be constant.
- the spacing adjustment mechanism 4 includes a pair of sliders 23 each having two brackets fixed thereto, a linear guide 24 for guiding the sliders 23 toward and away from each other, and a linear guide for the sliders 23.
- a linear motion mechanism 25 for moving along 24 is provided.
- reference numeral 24 a denotes a nut that moves on the linear guide 24.
- the bracket 7 When the distance between the two sliders 23 is adjusted to a predetermined position, the bracket 7 simultaneously comes into contact with an inscribed circle that matches the outer diameter of the silicon wafer 5 to be handled.
- the slider 23 is fixed to the slider 23 at a certain inclination angle.
- the linear motion mechanism 25 is engaged with a motor 26, a ball screw 27 rotationally driven by the motor 26, the ball screw 27, and attached to the slider 23.
- the nut 28 is provided.
- the ball screw 27 has a reverse screw formed on both sides of the center of the ball screw 27, and two nuts 28 for two sliders 23 are engaged with the respective screw portions 27a and 27b. ing.
- the load control device 6 includes a mouth cell 29 disposed between one of the nuts 28 and the slider 23, and a module of the distance adjusting mechanism 4 according to an output signal from the mouth cell 29. And a control device (not shown) for controlling the output of 26.
- a control device (not shown) for controlling the output of 26.
- the interval adjusting mechanism 4 operates to increase the interval between the sliders 23, thereby increasing the interval between the rollers 2.
- a silicon wafer 5 transferred by a handling robot (not shown) It is inserted between the rollers 2 from above.
- a flange 9 having a diameter larger than that of the cylindrical surface 8 of the roller 2 is provided, so that the silicon wafer 5 inserted from above the roller 2 as shown by a chain line in FIG.
- the wafer is transferred from the handling robot to the wafer rotating device 1 so as to be placed on the flange 9. Since the upper surface of the flange 9 is constituted by the inclined surface 10, the silicon wafer 5 is placed on the roller 2 with the lower edge of the circumferential surface thereof in contact with the inclined surface 10 of the flange 9. .
- the sliders 23 are moved in a direction approaching each other, and the interval between the rollers 2 is reduced. Then, the silicon wafer 5 rises as shown by the arrow in FIG. 5 along the inclined surface 10 formed on the upper surface of the flange 9 of the mouth 2 to the position where it is sandwiched by the cylindrical surface 8 of the roller 2. You will be guided.
- the silicon wafer 5 is stably maintained at any height position on the cylindrical surface 8 by balancing gravity and frictional force.
- the silicon wafer 5 can be rotated without touching the front and back surfaces of the silicon wafer 5.
- the load generated between the roller 2 and the silicon wafer 5 when the circumferential surface of the silicon wafer 5 is pressed by the roller 2 is controlled, so that the silicon Even when the outer diameter of the wafer 5 varies, the silicon wafer 5 can be properly held and rotated.
- the rotational torque is transmitted from the roller 2 to the circumferential surface of the silicon wafer 5 to rotate the silicon wafer 5, the work of determining the center of rotation of the silicon wafer 5 becomes unnecessary.
- the eccentricity is calculated to change the suction position by the turntable. The work of indexing the center of rotation and the work of changing the holding position become unnecessary. Can be greatly reduced.
- the wafer rotating device 1 since all the eight rollers 2 simultaneously contacting the circumferential surface of the silicon wafer 5 are rotationally driven by the operation of the rotational driving mechanism 3, the silicon wafer 5 The silicon wafer 5 can be rotated at a relatively high speed while the angle accuracy can be improved without causing slippage between the roller 2 and the roller 2.
- the edge flaw inspection device using the above-described wafer rotating device 1 includes a light source that irradiates parallel light to the outside of the wafer rotating device 1 from the radial outside of the silicon wafer 5, And a photodetector for detecting the reflected light. According to the edge flaw inspection apparatus, since the front and rear surfaces of the silicon wafer 5 are not contacted, the edge flaw inspection can be performed even after the front and rear surfaces of the silicon wafer 5 are polished.
- the inspection process can be shortened and the yield can be improved. Furthermore, when the silicon wafer is rotated at a high speed, slippage between the roller and the silicon wafer is reduced, and the silicon wafer is rotated with high angular accuracy, so that the position of the end flaw can be accurately detected.
- the rotation drive mechanism 3 the rotation torque of the motor 13 is controlled by the pulleys 12, 14, 15, 15 a, 18 a and the belts 16, 19 to 21.
- another transmission mechanism such as a gear may be used instead.
- the ball screw 27 is used as the linear motion mechanism, another arbitrary mechanism such as a cylinder may be used instead.
- Two pairs of rollers 2 are arranged in four places, but instead of this, the brackets fixed to one slider 23 are made one place, and three places in the circumferential direction of the silicon wafer 5 are used. Two pairs of rollers 2 may be arranged. If a larger number of mouthpieces 2 are used, they can be arranged one by one instead of two pairs. Industrial applicability.
- a wafer can be rotated by contacting the circumferential surface of a wafer, without adsorbing the front and back surfaces of a wafer.
- the wafer can be Since the wafer is sandwiched between the wafers, the wafer can be properly gripped and rotated even if the outer diameter of the wafer varies.
- the edge flaw inspection apparatus provided with this wafer rotating device, it is possible to inspect the flaw formed on the circumferential surface even after polishing the front and back surfaces of the wafer. Therefore, any damage that grows or becomes apparent during wafer polishing can be detected by subsequent inspection.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/523,844 US7255719B2 (en) | 2002-08-09 | 2003-08-08 | Wafer rotation device and edge flaw inspection apparataus having the device |
EP03784628A EP1544910A1 (en) | 2002-08-09 | 2003-08-08 | Wafer rotating device and edge flaw inspection device rpovided therewith |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002234077A JP2004079587A (ja) | 2002-08-09 | 2002-08-09 | ウエハ回転装置とこれを有する端部傷検査装置 |
JP2002-234077 | 2002-08-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004015763A1 true WO2004015763A1 (ja) | 2004-02-19 |
Family
ID=31711887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/010166 WO2004015763A1 (ja) | 2002-08-09 | 2003-08-08 | ウエハ回転装置とこれを有する端部傷検査装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7255719B2 (ja) |
EP (1) | EP1544910A1 (ja) |
JP (1) | JP2004079587A (ja) |
WO (1) | WO2004015763A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI838117B (zh) * | 2022-06-27 | 2024-04-01 | 大陸商杭州眾硅電子科技有限公司 | 一種晶圓旋轉機構、晶圓旋轉夾持機構及晶圓清洗乾燥系統 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3629244B2 (ja) * | 2002-02-19 | 2005-03-16 | 本多エレクトロン株式会社 | ウエーハ用検査装置 |
KR100719367B1 (ko) * | 2005-06-24 | 2007-05-17 | 삼성전자주식회사 | 반도체 제조 장치 및 웨이퍼 가공 방법 |
DE102005034120B4 (de) * | 2005-07-21 | 2013-02-07 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
KR101356400B1 (ko) * | 2010-06-01 | 2014-01-28 | 가부시키가이샤 사무코 | 웨이퍼의 오염 방지 방법, 검사 방법 및 제조 방법 |
US9433070B2 (en) | 2013-12-13 | 2016-08-30 | Kla-Tencor Corporation | Plasma cell with floating flange |
KR102596608B1 (ko) * | 2016-07-26 | 2023-11-01 | 주식회사 케이씨텍 | 기판 스피닝 장치 및 그 제어방법 |
CN106449509B (zh) * | 2016-11-25 | 2023-07-14 | 无锡奥特维科技股份有限公司 | 一种升降旋转装置 |
CN109142389A (zh) * | 2018-08-31 | 2019-01-04 | 江苏英锐半导体有限公司 | 一种晶圆流片表面缺陷检测装置 |
JP7356811B2 (ja) * | 2019-04-02 | 2023-10-05 | 株式会社荏原製作所 | 基板支持装置及び基板支持装置の制御方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06310485A (ja) * | 1993-04-23 | 1994-11-04 | Hitachi Ltd | 無発塵ウエハクランプ方法 |
JPH07297155A (ja) * | 1994-04-26 | 1995-11-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH09269298A (ja) * | 1996-03-29 | 1997-10-14 | Sumitomo Sitix Corp | 端部欠陥検査方法とその装置 |
JPH10294304A (ja) * | 1997-04-21 | 1998-11-04 | Dainippon Screen Mfg Co Ltd | 基板保持装置およびこれを利用した基板処理装置 |
US5933902A (en) | 1997-11-18 | 1999-08-10 | Frey; Bernhard M. | Wafer cleaning system |
JP2000164681A (ja) * | 1998-12-01 | 2000-06-16 | Sony Corp | 円形基板部材の保持装置及びその使用方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5113565A (en) * | 1990-07-06 | 1992-05-19 | International Business Machines Corp. | Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames |
US6336845B1 (en) * | 1997-11-12 | 2002-01-08 | Lam Research Corporation | Method and apparatus for polishing semiconductor wafers |
US7042238B2 (en) * | 2001-12-28 | 2006-05-09 | Nhk Spring Co., Ltd. | Socket for inspection |
JP4466560B2 (ja) * | 2002-10-30 | 2010-05-26 | 凸版印刷株式会社 | 配線パターンの検査装置、検査方法、検出装置および検出方法 |
-
2002
- 2002-08-09 JP JP2002234077A patent/JP2004079587A/ja active Pending
-
2003
- 2003-08-08 WO PCT/JP2003/010166 patent/WO2004015763A1/ja active Application Filing
- 2003-08-08 US US10/523,844 patent/US7255719B2/en not_active Expired - Lifetime
- 2003-08-08 EP EP03784628A patent/EP1544910A1/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06310485A (ja) * | 1993-04-23 | 1994-11-04 | Hitachi Ltd | 無発塵ウエハクランプ方法 |
JPH07297155A (ja) * | 1994-04-26 | 1995-11-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH09269298A (ja) * | 1996-03-29 | 1997-10-14 | Sumitomo Sitix Corp | 端部欠陥検査方法とその装置 |
JPH10294304A (ja) * | 1997-04-21 | 1998-11-04 | Dainippon Screen Mfg Co Ltd | 基板保持装置およびこれを利用した基板処理装置 |
US5933902A (en) | 1997-11-18 | 1999-08-10 | Frey; Bernhard M. | Wafer cleaning system |
JP2000164681A (ja) * | 1998-12-01 | 2000-06-16 | Sony Corp | 円形基板部材の保持装置及びその使用方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI838117B (zh) * | 2022-06-27 | 2024-04-01 | 大陸商杭州眾硅電子科技有限公司 | 一種晶圓旋轉機構、晶圓旋轉夾持機構及晶圓清洗乾燥系統 |
Also Published As
Publication number | Publication date |
---|---|
US7255719B2 (en) | 2007-08-14 |
JP2004079587A (ja) | 2004-03-11 |
US20050237529A1 (en) | 2005-10-27 |
EP1544910A1 (en) | 2005-06-22 |
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