WO2003085029A1 - Composition de resine pour reflecteurs a diodes electroluminescentes - Google Patents

Composition de resine pour reflecteurs a diodes electroluminescentes Download PDF

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Publication number
WO2003085029A1
WO2003085029A1 PCT/JP2003/004361 JP0304361W WO03085029A1 WO 2003085029 A1 WO2003085029 A1 WO 2003085029A1 JP 0304361 W JP0304361 W JP 0304361W WO 03085029 A1 WO03085029 A1 WO 03085029A1
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Prior art keywords
derived
mole
dicarboxylic acid
aliphatic
mol
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PCT/JP2003/004361
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English (en)
Japanese (ja)
Inventor
Kunihiro Ouchi
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Mitsui Chemicals, Inc.
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Priority to JP2003582215A priority Critical patent/JPWO2003085029A1/ja
Priority to AU2003236271A priority patent/AU2003236271A1/en
Publication of WO2003085029A1 publication Critical patent/WO2003085029A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function

Definitions

  • the present invention relates to a polyimide resin composition suitable for a molded article material of a light-emitting diode reflector, having low water absorption and excellent heat resistance, and a molded article thereof.
  • Light-emitting diodes are broadly divided into two types: a shell type made of epoxy resin and a resin reflector. The latter light-emitting diode is manufactured by installing a light-emitting diode on a reflector formed of resin and sealing it with epoxy.
  • the resin used to mold this light-emitting diode reflector must have performance such as high light reflectance, high light resistance, high adhesion to the epoxy encapsulant, and heat resistance that does not easily discolor at the curing temperature of the epoxy encapsulation process. .
  • LCP liquid crystal polymer
  • heat-resistant polyamide have been used.
  • LCP is excellent in heat resistance and light resistance, but has the drawback that adhesion to an epoxy sealing material is very poor.
  • the heat-resistant polyamide produced by the conventional technology has good adhesion to the epoxy encapsulant, but has problems such as peeling off of the epoxy encapsulant and bubbles during curing of the epoxy encapsulant. .
  • the heat-resistant polyamide according to the conventional technique removes water that was previously naturally contained in the heat-resistant polyamide. If the pre-drying operation is not performed (preliminary drying operation such as heating operation), the pre-drying operation is not necessary in view of the problem of the conventional technology that peeling and bubbles occur during epoxy bonding and epoxy sealing.
  • Another object of the present invention is to provide a light-emitting diode reflector and a heat-resistant polyamide.
  • One of the problems to be solved by the present invention is that peeling and bubbles are generated during epoxy bonding or epoxy sealing without a special drying operation such as a heating operation during manufacturing. It is another object of the present invention to provide a light-emitting diode reflector including the resin composition.
  • the problem to be solved by the present invention is to solve the problems in the conventional technology as described above, and is suitable for a molded article material of a light emitting diode reflector, low water absorption and heat resistance. It is an object of the present invention to provide a polyamide resin composition having excellent properties, a light-emitting diode reflector including the resin, and a light-emitting diode reflector formed by molding the resin.
  • DISCLOSURE OF THE INVENTION In order to overcome the above-mentioned problems, the present inventors have studied the components constituting the polyamide resin in more detail, and as a result, have found a resin having low water absorption and further excellent heat resistance.
  • the present invention 1, 9 - and Diaminononane 5 0-1 0 0 mole 0/0, fats having linear aliphatic Jiamin a carbon number of 6 to 1 2, and Z or the side chain of 6-1 2 carbon atoms family Jiamin 0-5 0 mole% derived from Jiamin derived constituent unit - and (a 1), and terephthalic acid 6 0-1 0 0 mole 0/0, other than terephthalic acid
  • 2 meds were baked (heat treated) before processing.
  • the present inventors have reported that the conventional heat-resistant polyamide, if not baked (heat-treated) before processing, would cause the epoxy encapsulant to peel off or generate bubbles when the epoxy encapsulant is cured. Since the heat-resistant polyamide is water-absorbing, the moisture that the heat-resistant polyamide naturally occupies may cause peeling of the epoxy encapsulant and bubbles during curing of the epoxy encapsulant. We made a working hypothesis that it might As a result, when the “water absorption” described later in the “Examples” section of the present application specification was adopted as the evaluation scale, the water absorption of the heat-resistant polyamide according to the conventional technology was approximately 3.9%. That was all.
  • the heat-resistant polyamide has a moisture content in a range of 0 to 3.9% of moisture content that does not cause peeling of the epoxy sealing material or generation of bubbles when the epoxy sealing material is cured.
  • the critical value threshold value
  • the epoxy absorption was found to be 3.5% or less, preferably 3.0% or less, more preferably 2.5% or less, and even more preferably 2.0% or less. It has been found that neither exfoliation nor bubbles occur.
  • a heat-resistant polyamide having a water absorption of 3.5% or less preferably a heat-resistant polyimide having a water absorption of 3.0% or less, and more preferably a heat-resistant polyamide having a water absorption of 2.5% or less. If a heat-resistant polyamide of 2.0% or less is applied to the light-emitting diode reflector, epoxy bonding can be performed without performing a preliminary drying operation such as a heating operation required in the conventional technology. The idea was that there would be no delamination or bubbles when sealing with epoxy or epoxy.
  • the heat-resistant polyamide obtained by the conventional technology uses an operation (such as a heating operation) for previously removing moisture that was naturally contained in the heat-resistant polyamide. If the pre-drying operation is not performed, heat-resistant polyamides that do not require a pre-drying operation will be generated in view of the problems of the conventional technology that peeling and bubbles will occur during epoxy bonding and epoxy sealing.
  • epoxy bonding and epoxy encapsulation can be performed without the need for preliminary drying operations such as heating operations, which were required in conventional technologies.
  • Aromatic dicarboxylic acids, and Z or aliphatic dicarboxylic acid having a carbon atom number of 4-2 0 0-4 0 mole 0/0 derived from dicarboxylic acid-derived constituent unit - a made of Polyamide with (a 2) in the molecule Provided is a polyamide resin used for a light-emitting diode reflector, characterized by comprising:
  • the polyamide resin composition for a light-emitting diode reflector according to the present invention comprises, as component (A), 1,9-diaminononane 50-: L 0 0 mol%, and a straight-chain aliphatic having 6-12 carbon atoms.
  • the inorganic filler of the component (B) of the present invention is a group consisting of glass fiber, talc, wollastonite, potassium titanate, zinc oxide, titanium dioxide, calcium carbonate, barium sulfate, and calcined kaolin clay. Including at least one inorganic filler selected from among the following is one of preferred embodiments of the present invention.
  • the present invention provides a light-emitting diode reflector including the above-described polyamide resin.
  • the present invention provides a light-emitting diode reflector comprising the above-described polyamide resin composition.
  • the present invention relates to a 1,9-diaminononane of 50 to 100 mol%, a linear aliphatic diamine having 6 to 12 carbon atoms, and an aliphatic group having Z or a side chain having 6 to 12 carbon atoms.
  • Diamin-derived structural unit (a-1) derived from 0 to 50 mol% of diamin, and terephthalic acid 60 to: L 00 mol 0 /.
  • an aromatic dicarboxylic acid other than terephthalic acid and a dicarboxylic acid-derived structural unit (a-2) derived from 0 to 40 mol% of Z or an aliphatic dicarboxylic acid having 4 to 20 carbon atoms in the molecule.
  • An epoxy characterized by comprising a polyamide
  • a resin composition for a molded product for resin bonding is provided.
  • Epoxy resin bonding molded article resin composition of the present invention as the component (A), 1, 9 - diamine Nononan 5 0: 1 0 0 mole 0/0, 6-1 2 carbon atoms linear aliphatic Jiami down, and Roh or aliphatic Jiamin 0-5 0 mole 0/0 derived Jiamin derived structural units have a side chain with carbon number 6 ⁇ 1 2 (a _ 1) , terephthalic acid 6 0-1 0 0 mole 0/0, the aromatic dicarboxylic acid other than terephthalic acid, and / or carbon atoms 4-2 0 aliphatic dicarboxylic acids 0-4 0 mole% derived from dicarboxylic acid-derived constituent unit It is preferable to include 100 parts by weight of a polyamide having (a-2) in a molecule, and 1 to 200 parts by weight of an inorganic filler as the component (B).
  • the term “light-emitting diode reflector” used in the present application uses the Chinese character “plate”, the concept of this word is limited to only those having a “plate” shape. At least, the casing in the direction of emitting light is open or not open.Cases including housing in general, more specifically those having a box-like or box-like shape, funnel-like Plates (planes) such as those having a shape, those having a bowl shape, those having a parabona shape, those having a columnar shape, those having a conical shape, those having a honeycomb shape, etc. , A spherical surface, a curved surface, or the like) as a surface for reflecting light.
  • the light-emitting diode reflector is generally formed by injection molding, melt molding, extrusion molding, or inflation molding of polyamide resin or a resin composition containing polyamide resin and an inorganic filler. It is formed into a desired shape by heat molding such as blow molding.
  • the light emitting diode reflector is usually a light emitting diode. Encapsulation, bonding, bonding, etc. are performed with a chip element and other components and epoxy resin.
  • polyamide resin As the polyamide resin, the following polyamide resin (component (A)) is used.
  • the polyamide resin (component (A)) is polymerized from a diamine-derived structural unit (a-1) and a dicarboxylic acid-derived structural unit (a-2).
  • Polyamide resin (component (A)) is a heat-resistant polyamide resin having a water absorption of 3.5% or less, when "water absorption” described later in the section of "Examples” is adopted as an evaluation scale. Is a heat-resistant polyamide resin of 3.0% or less, more preferably a heat-resistant polyamide resin of 2.5 ° / 0 or less, and more preferably a polyamide resin of 2.0% or less.
  • Polyamide resin (component (A)) generally has a water absorption of 1.5 to 3.5% when the “water absorption” described later in the section of “Examples” is adopted as a scale of evaluation.
  • Heat-resistant polyamide resin preferably 1.5 to 3.0% heat-resistant polyamide resin, more preferably 1.5 to 2.5% heat-resistant polyamide resin, and still more preferably 1.5 to 2.5% It is a polyamide resin of 2.0 or less.
  • the structural unit ( a -1) derived from the diamine constituting the polyamide resin (component (A)) used in the present invention is composed of 1,9-diaminononane and a linear or Z- or side-chain carbon atom having 6 or more carbon atoms. derived from ⁇ 1 2 aliphatic Jiamin, 1, 9 Jiamino nonane 5 0-1 0 0 mole 0 /. It is preferable to synthesize from a diamine-derived structural unit containing 0 to 50 mol% of an aliphatic diamine having 6 to 12 carbon atoms having a straight chain, Z or a side chain.
  • linear aliphatic diamine component constituting the diamine-derived structural unit (a-1) together with 1,9-diaminononane include 1,6-diaminohexane, 1,7- Diaminoheptane, 1,8-diaminooctane, 1,9 diaminononane, 1,10-diaminodecane, 1,11-diaminopendecane, and 1,12-diaminododecane You. Among these, 1,6-diaminohexane is particularly preferred.
  • the aliphatic diamine component having 6 to 12 carbon atoms and having a side chain which constitutes the diamine-derived structural unit (a-1) together with 1,9-diaminononane is particularly an aliphatic diamine having a side chain alkyl group.
  • specific examples include 2-methyl-1,5-diaminopentane, 2-methyl-1,6-diaminohexane, 2-methyl-1,7-diaminoheptane, 2-methyl-1, 8-diaminooctane, 2-methyl-1, 9 diamino nononane, 2-methinolate 1, 10-diaminodecane, 2-methinole 1, 1 1 1 diamino undecane and the like.
  • structural units derived from 2-methyl-1,7-diaminoheptane, 2-methyl-1,8-diaminooctane, and 2_methyl-1,9-diaminononane are preferred, and particularly, 2— Methyl 1,8-diaminooctane is preferred.
  • the above diamine component, which is formed together with 1,9-diaminononane can be used by mixing a linear aliphatic diamine component and an aliphatic diamine component having a side chain alkyl group at an arbitrary ratio. It is preferred to use the component alone or the aliphatic diamine component having a side chain alkyl group alone.
  • the dicarboxylic acid-derived structural unit (a-2) constituting the polyamide resin (component (A)) used in the present invention has a terephthalic acid-derived structural unit of 60 to 100 mol%, and an aromatic other than terephthalic acid. It is preferable to polymerize from 0 to 40 mol% of a dicarboxylic acid-derived structural unit, and from 0 to 40 mol% of a dicarboxylic acid-derived structural unit having 4 to 20 carbon atoms.
  • examples of the structural unit derived from an aromatic dicarboxylic acid other than terephthalic acid include isophthalic acid, 2-methylterephthalic acid, naphthalenedicarboxylic acid, and combinations thereof.
  • the structural unit derived from an aliphatic dicarboxylic acid particularly limits the number of carbon atoms. It is preferably, but not exclusively, derived from 4-20, more preferably 6-12 aliphatic dicarboxylic acids.
  • the aliphatic dicarboxylic acid used to derive such an aliphatic dicarboxylic acid-derived structural unit include, for example, adipic acid, suberic acid, azelaic acid, sebacic acid, decanedicarboxylic acid, pendecanediene Force olevonic acid, dodecanedicarboxylic acid and the like. Of these, adipic acid is particularly preferred.
  • the structural unit derived from terephthalic acid-derived structural unit is 60 to 1 0 0 mole 0/0, preferably 8 0-1 0 0 mole 0/0 is contained in an amount of a structural unit derived from an aromatic dicarboxylic acid-derived constituent units other than terephthalic Le acid
  • 0-4 0 mole 0/0 preferably be contained in an amount of 0-2 0 mole 0/0, and / 'or a carbon atom number 4 2 0, preferably 4 to from 1 2 aliphatic dicarboxylic acid constitutional
  • the structural unit derived from the unit is contained in an amount of 0 to 40 mol%, preferably 0 to 20 mol% .
  • the dicarboxylic acid-derived structural unit (a-2) a small amount, for example, about 10 mol% or less of a polyvalent carboxylic acid-derived structural unit may be contained together with the terephthalic acid-derived structural unit and the aliphatic dicarboxylic acid-derived structural unit as described above.
  • Specific examples of such a polycarboxylic acid-derived structural unit include tribasic acids and polybasic acids such as trimellitic acid and pyromellitic acid.
  • the diamine-derived structural unit (a-1) and the dicarboxylic acid-derived structural unit (a-2) as described above are added. It can be produced by heating in the presence of a catalyst. In this reaction, it is preferable that the total number of moles of the diamine-derived structural unit (a-1) is larger than the total number of moles of the dicarboxylic acid-derived structural unit (a-2).
  • the structural unit derived from dicarboxylic acid is 100 mol%
  • the total structural unit derived from diamine is 100 to 100 mol%. It is 120 mol%.
  • This reaction is usually performed in an inert gas atmosphere, and the inside of the reaction vessel is generally replaced with an inert gas such as nitrogen gas.
  • an inert gas such as nitrogen gas.
  • Catalysts that can be used to produce the polyamide resin (component (A)) used in the present invention include: phosphoric acid, salts thereof and ester compounds of phosphoric acid; And its salt and ester compounds; and hypophosphorous acid and its salt and ester compounds.
  • phosphoric acid, sodium phosphate, sodium phosphite, potassium hypophosphite, sodium hypophosphite and the like are preferable.
  • These phosphoric acid compounds can be used alone or in combination.
  • the dicarboxylic acids such as described above, typically 0.0 0 1-5 mole 0/0, preferably used in a ratio of 0.0 0 2-2 mol 0/0.
  • a terminal blocking agent As the terminal blocking agent, benzoic acid, an alkali metal salt of benzoic acid, acetic acid and the like can be used. Such an end capping agent is generally used in an amount of 0.01 to 5 mol, preferably 0.01 to 2 mol, per 1 mol of the dicarboxylic acid.
  • the limiting viscosity [ ⁇ ] of the resulting polycondensate can be controlled by adjusting the amount of the terminal blocking agent used.
  • the reaction conditions for preparing such a polycondensate are, specifically, a reaction temperature of usually 200 to 290, preferably 220 to 280, and a reaction time of usually 0.5. 55 hours, preferably 1-3 hours. Further, this reaction can be carried out under any conditions from normal pressure to pressurization, but it is preferable to carry out the reaction under pressurized conditions, and the reaction pressure is usually 20 to 60 kg / cm 2, preferably 2 to 60 kg / cm 2. Set within the range of 5 to 50 [kg] / cm2.
  • the intrinsic viscosity [] measured in concentrated sulfuric acid at 30 ° C. is usually 0.05 to 0.6 dlZg, preferably 0.08 dlZg.
  • a low-order condensate within the range of 0.3 dl / g can be obtained.
  • the polyamide low-order condensate thus formed in the aqueous medium is separated from the reaction solution.
  • a method such as filtration or centrifugation can be employed.However, the reaction solution containing the low-condensation product of the generated semi-aromatic polyamide can be used. The method of performing solid-liquid separation by flushing into the atmosphere through a nozzle is efficient.
  • post-polymerization is performed using the polyamide low-order condensate obtained as described above.
  • the post-polymerization is preferably carried out by drying the polyamide low-order condensate, heating it to a molten state, and applying a shear stress to the melt.
  • the mixture is heated to a temperature at which the dried polyamide low-order condensate at least melts.
  • it is heated to a temperature equal to or higher than the melting point of the low-density condensate of the dried polyamide, and preferably 10 to 60 ° C higher than this melting point.
  • the shear stress can be applied to the melt by using, for example, a twin-screw extruder with a vent or a kneader. It is considered that by applying shear stress to the melt in this way, the low-order condensate of the dried polyamide in the molten state is polycondensed with each other, and the polycondensation reaction of the condensate also proceeds.
  • the above polyamide low-order condensate is subjected to solid-state polymerization by a generally known method, and the intrinsic viscosity [] is reduced to 0.1. Polyamides in the range of 5 to 2.0 [d1 / g] can be prepared.
  • solid-state polymerization of the above polyamide low-order condensate is carried out by a generally known method to obtain an intrinsic viscosity. [7?] Was prepared in the range of 0.5 to 1.5 [d1 / g].
  • the polyamide resin (component (A)) used in the present invention can be heated to a temperature not lower than the melting point of the polyamide and lower than the decomposition temperature, and can be molded into a desired shape using a usual molding apparatus. .
  • the light-emitting diode reflector can be efficiently formed by injection molding.
  • the polyamide resin (component (A)) having the above composition range can have excellent moldability, low water absorption, and heat resistance.
  • the polyamide resin used in the present invention has an intrinsic viscosity of 0.5 to 3.0 [ £ 11], preferably 0.5 to 2.5 [dl Zg], particularly 0.6 to 2.0, measured in 96.5% sulfuric acid at 25 ° C. [d 1 / g] is preferable. In such a range, the moldability and the strength properties of the molded product are excellent.
  • the polyamide resin (component (A)) used in the present invention has a melting point measured by DSC of 260 ° C. or more and less than 330 ° C., and particularly, from 27 ° C. to 320 ° C.
  • the melting point was measured by using a DSC (differential scanning calorimeter) once at 330 ° C for 5 minutes, then cooled down to 23 ° C at a rate of 10 ° C, then cooled down. The heating was performed at 10 [° CZ min]. The endothermic peak based on the melting at this time was defined as the melting point (Tm).
  • the inorganic filler inorganic filler
  • the following inorganic fillers are preferably used.
  • the following fillers are added in an amount of 1 to 200 parts by weight based on 100 parts by weight of the polyamide resin (component (A)) as long as the effects of the present invention are not impaired.
  • Fibrous fillers especially glass fibers, aramide fibers, carbon fibers, etc.
  • powdered, granular, plate-like and needle-like fillers especially silica, alumina, calcium carbonate, titanium dioxide, talc, wollastonite
  • Caso earth especially silica, alumina, calcium carbonate, titanium dioxide, talc, wollastonite
  • Caso earth brewing power Orinkley, clay, kaolin, spherical glass, My power, magnesium oxide, calcium carbonate, barium sulfate, zinc oxide, potassium titanate, whisker, etc.
  • Glass fiber, talc, ⁇ Olastonite, potassium titanate, zinc oxide, titanium oxide, calcium carbonate, barium sulfate, and calcined kaolin clay are preferred, and include at least one or more inorganic fillers selected from these.
  • additives ie, antioxidants (hindered phenols), heat stabilizers (phosphorus compounds, lactones) are used according to the intended use within a range that does not impair the effects of the present invention.
  • Other polymers olefins, modified polyolefins, ethylene 'propylene copolymer, ethylene.
  • each component is mixed by various known methods, for example, a Hensile mixer, a V-blender, a ribbon blender, a tumbler blender, etc. Alternatively, a method of melt-kneading with a single-screw extruder, a multi-screw extruder, a kneader, a Banbury mixer or the like after mixing, and then granulating or pulverizing may be adopted.
  • the polyamide composition according to the present invention comprises an inorganic filler as a component (B) while heating and maintaining the polyamide (A) in a molten state, for example, at 280 to 360 ° C.
  • the polyamide resin (component (A)) composition prepared as described above may be formed into a powder, pellet, or other shape by compression molding, injection molding, extrusion molding, or the like. By using it, it can be made into various molded products.
  • Intrinsic viscosity Dissolve 0.5 [g] of polyamide resin in 50 [ml] of 96.5% sulfuric acid solution, and use an Ubbelohde viscometer to sample under the condition of 25.0 ⁇ 0.05 ° C. The number of seconds for the solution to flow was measured, and calculated based on the following equation.
  • NMDA 1,9-S ', aminononane
  • MODA 2-Methyl-1,8-S'aminooctane
  • HMDA 1,6-S
  • Aminohexane TA Terephthal
  • AA V / H. 0.06 [kg] (0.6 mol) of sodium hypophosphite monohydrate and 27.4 [kg] of distilled water were placed in an autoclave, and the inside of the reactor was sufficiently replaced with nitrogen. While stirring, the internal temperature was raised to 250 ° C over 4 hours. The reaction was continued for 1 hour as it was to obtain a polyamide low-order condensate. This polyamide low-order condensate was subjected to solid-state polymerization at 190 ° C. for 12 hours under vacuum. Then
  • Example 1 The molar ratio of diamine-derived structural units and dicarboxylic acid component shown in the table Thus, a polyamide resin was obtained in the same manner as in Example 1. A polyamide resin composition was obtained in the same manner as in Example 1. These were evaluated in the same manner as in Example 1, and the results are shown in the table.
  • Example 1 In the same manner as in Example 1, except that the type of diamine was changed to 1,6-diaminohexane, the molar ratio of the diamine-derived structural unit and dicarboxylic acid component shown in the table was used. A polyamide resin and a polyamide resin composition were obtained by the above method. As a result of evaluating these in the same manner as in Example 1, the water absorption was high. Industrial Applicability One of the effects of the present invention is that, based on the knowledge obtained by the present inventors, in the heat-resistant polyamide according to the conventional technology, the moisture that the heat-resistant polyamide naturally contained in advance is removed.
  • the removal operation (preliminary drying operation such as heating operation) is not performed, the preliminary drying operation is not performed in consideration of the problem of the conventional technology that peeling and bubbles are generated during epoxy bonding and epoxy sealing.
  • An unnecessary heat-resistant polyamide for a light emitting diode reflector can be provided.
  • One of the effects of the present invention is that peeling and bubbles are not generated during epoxy bonding or epoxy sealing without a special drying operation such as a heating operation during manufacturing. It is possible to provide a light-emitting diode reflecting plate including the resin composition.
  • the effect of the present invention is to solve the problems in the prior art, and is a polyamide resin composition suitable for a molded article material of a light emitting diode reflector, which is excellent in low water absorption and heat resistance.
  • An object, a light-emitting diode reflector including the resin, and a light-emitting diode reflector formed by molding the resin can be provided.

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  • Health & Medical Sciences (AREA)
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Abstract

Cette invention se rapporte à une composition de résine qui est utile dans la production de réflecteurs à diodes électroluminescentes et qui permet de supprimer le délaminage ou le bullage lors d'opérations de collage par époxyde ou d'opérations de scellement par époxyde, même lorsqu'un séchage préliminaire par exemple par chauffage n'est pas effectué. Cette composition de résine se caractérise en ce qu'elle comprend 100 parties en poids d'une résine de polyamide et 1 à 200 parties en poids d'une charge inorganique (B). Cette résine de polyamide comprend des unités de diamine constituées par 50 à 100 % en mole de 1,9-diaminononane et par 0 à 50 % en mole d'une diamine aliphatique linéaire ayant 6 à 12 atomes de carbone et/ou d'une diamine aliphatique ayant une chaîne latérale C6-12, ainsi que des unités d'acide dicarboxylique constituées par 60 à 100 % en mole d'acide téréphtalique et par 0 à 40 % en mole d'un acide dicarboxylique aromatique, à l'exception de l'acide téréphtalique, et/ou d'un acide dicarboxylique aliphatique ayant 4 à 20 atomes de carbone.
PCT/JP2003/004361 2002-04-05 2003-04-04 Composition de resine pour reflecteurs a diodes electroluminescentes WO2003085029A1 (fr)

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JP2003582215A JPWO2003085029A1 (ja) 2002-04-05 2003-04-04 発光ダイオード反射板用樹脂組成物
AU2003236271A AU2003236271A1 (en) 2002-04-05 2003-04-04 Resin composition for light emitting diode reflectors

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JP2002104063 2002-04-05

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Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005194513A (ja) * 2003-12-09 2005-07-21 Mitsui Chemicals Inc 反射板用樹脂組成物および反射板
WO2006112300A1 (fr) * 2005-04-15 2006-10-26 Mitsui Chemicals, Inc. Composition de resine pour reflecteur et miroir
WO2006135840A1 (fr) * 2005-06-10 2006-12-21 E. I. Du Pont De Nemours And Company Composants thermoconducteurs a base de polyamide utilises dans des reflecteurs a diodes electroluminescentes
WO2006135841A1 (fr) * 2005-06-10 2006-12-21 E. I. Du Pont De Nemours And Company Boitier pour ensemble de diodes electroluminescentes comprenant des compositions de polyamide a haute temperature
WO2007037355A1 (fr) * 2005-09-30 2007-04-05 Nichia Corporation Dispositif élecroluminescent et unité rétro-eclairante utilisant ledit dispositif électroluminescent
JP2007161863A (ja) * 2005-12-13 2007-06-28 Mitsui Chemicals Inc ポリアミド用光硬化型塗料
JP2008543992A (ja) * 2005-06-10 2008-12-04 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ポリアミド樹脂から製造され、ｌｅｄリフレクターの用途に適切な製造物品
EP2471867A1 (fr) 2010-12-28 2012-07-04 Cheil Industries Inc. Composition de résine polyamide
EP2471866A1 (fr) 2010-12-28 2012-07-04 Cheil Industries Inc. Composition de résine polyamide
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US10131785B2 (en) 2015-06-30 2018-11-20 Lotte Advanced Materials Co., Ltd. Polyester resin composition with excellent impact resistance and light reliability and molded article using the same
US10301449B2 (en) 2013-11-29 2019-05-28 Lotte Advanced Materials Co., Ltd. Thermoplastic resin composition having excellent light stability at high temperature
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US10508190B2 (en) 2014-12-17 2019-12-17 Lotte Advanced Materials Co., Ltd. Polyester resin composition and molded article manufactured therefrom
US10636951B2 (en) 2014-06-27 2020-04-28 Lotte Advanced Materials Co., Ltd. Thermoplastic resin composition having excellent reflectivity
US10822490B2 (en) 2013-12-30 2020-11-03 Lotte Advanced Materials Co., Ltd. Thermoplastic resin composition having excellent shock resistance and light resistance
WO2022014390A1 (fr) 2020-07-16 2022-01-20 三井化学株式会社 Résine de polyamide cristalline, composition de résine et article moulé
WO2022196711A1 (fr) 2021-03-16 2022-09-22 三井化学株式会社 Composition de résine polyamide et article moulé en polyamide
WO2022196715A1 (fr) 2021-03-18 2022-09-22 三井化学株式会社 Composition de résine polyamide et article moulé en polyamide
WO2022210019A1 (fr) 2021-03-30 2022-10-06 三井化学株式会社 Composition de résine polyamide et corps moulé en polyamide
WO2024004933A1 (fr) * 2022-06-30 2024-01-04 大塚化学株式会社 Composition de résine de polyamide pour plaque réfléchissante, et plaque réfléchissante

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CN105367785B (zh) * 2015-11-26 2017-12-22 东华大学 一种透明尼龙及其制备方法

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JP2005194513A (ja) * 2003-12-09 2005-07-21 Mitsui Chemicals Inc 反射板用樹脂組成物および反射板
JP4913051B2 (ja) * 2005-04-15 2012-04-11 三井化学株式会社 反射板用樹脂組成物および反射板
WO2006112300A1 (fr) * 2005-04-15 2006-10-26 Mitsui Chemicals, Inc. Composition de resine pour reflecteur et miroir
US8426549B2 (en) 2005-04-15 2013-04-23 Mitsui Chemicals, Inc. Resin composition for reflector, and reflector
JPWO2006112300A1 (ja) * 2005-04-15 2008-12-11 三井化学株式会社 反射板用樹脂組成物および反射板
KR100886524B1 (ko) 2005-04-15 2009-03-02 미쓰이 가가쿠 가부시키가이샤 반사판용 수지 조성물 및 반사판
WO2006135840A1 (fr) * 2005-06-10 2006-12-21 E. I. Du Pont De Nemours And Company Composants thermoconducteurs a base de polyamide utilises dans des reflecteurs a diodes electroluminescentes
WO2006135841A1 (fr) * 2005-06-10 2006-12-21 E. I. Du Pont De Nemours And Company Boitier pour ensemble de diodes electroluminescentes comprenant des compositions de polyamide a haute temperature
JP2008543992A (ja) * 2005-06-10 2008-12-04 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ポリアミド樹脂から製造され、ｌｅｄリフレクターの用途に適切な製造物品
EP2472603A1 (fr) 2005-09-14 2012-07-04 Ticona LLC Compositions de poly(cyclohexanediméthanol téréphtalate)
WO2007037355A1 (fr) * 2005-09-30 2007-04-05 Nichia Corporation Dispositif élecroluminescent et unité rétro-eclairante utilisant ledit dispositif électroluminescent
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US8426879B2 (en) 2005-09-30 2013-04-23 Nichia Corporation Light emitting device and backlight unit using the same
JP2007161863A (ja) * 2005-12-13 2007-06-28 Mitsui Chemicals Inc ポリアミド用光硬化型塗料
US9403980B2 (en) 2010-09-28 2016-08-02 Cheil Industries Inc. Polyamide composition having surface reflectance and heat resistance
US8957146B2 (en) 2010-12-15 2015-02-17 Cheil Industries Inc. Polyamide resin composition with excellent reflectivity, heat resistance, and water resistance
EP2471866A1 (fr) 2010-12-28 2012-07-04 Cheil Industries Inc. Composition de résine polyamide
US8431636B2 (en) 2010-12-28 2013-04-30 Cheil Industries Inc. Polyamide resin composition
EP2471867A1 (fr) 2010-12-28 2012-07-04 Cheil Industries Inc. Composition de résine polyamide
US8480254B2 (en) 2011-04-14 2013-07-09 Ticona, Llc Molded reflective structures for light-emitting diodes
US9346933B2 (en) 2011-04-14 2016-05-24 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
US9062198B2 (en) 2011-04-14 2015-06-23 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
US9284448B2 (en) 2011-04-14 2016-03-15 Ticona Llc Molded reflectors for light-emitting diode assemblies
US9562666B2 (en) 2011-04-14 2017-02-07 Ticona Llc Molded reflectors for light-emitting diode assemblies
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US20140209969A1 (en) * 2011-08-19 2014-07-31 Solvay Speciality Polymers Usa, Llc Polyamide compositions for led applications
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WO2013053086A1 (fr) 2011-10-10 2013-04-18 金发科技股份有限公司 Composition de polyamide résistante à la chaleur et son application
US8865807B2 (en) 2011-12-29 2014-10-21 Cheil Industries Inc. Polyamide resin composition having improved physical properties including thin-wall moldability
US9187621B2 (en) 2011-12-30 2015-11-17 Ticona Llc Reflector for light-emitting devices
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US9018296B2 (en) 2012-12-31 2015-04-28 Cheil Industries Inc. Thermoplastic resin composition having excellent surface gloss, reflectance, anti-yellowing property and moldability
US8957142B2 (en) 2013-02-01 2015-02-17 Cheil Industries Inc. Polyamide resin composition having excellent photostability and discoloration resistance
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US9732223B2 (en) 2013-07-26 2017-08-15 Mitsui Chemicals, Inc. Semi-aromatic polyamide resin composition and molded article containing same
US10301449B2 (en) 2013-11-29 2019-05-28 Lotte Advanced Materials Co., Ltd. Thermoplastic resin composition having excellent light stability at high temperature
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US10253182B2 (en) 2013-12-20 2019-04-09 Mitsui Chemicals, Inc. Semi-aromatic polyamide resin composition and molded article of same
US10822490B2 (en) 2013-12-30 2020-11-03 Lotte Advanced Materials Co., Ltd. Thermoplastic resin composition having excellent shock resistance and light resistance
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US10131785B2 (en) 2015-06-30 2018-11-20 Lotte Advanced Materials Co., Ltd. Polyester resin composition with excellent impact resistance and light reliability and molded article using the same
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WO2022196711A1 (fr) 2021-03-16 2022-09-22 三井化学株式会社 Composition de résine polyamide et article moulé en polyamide
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