WO2003083032A1 - Composition de diluant pour elimination de resine photosensible - Google Patents
Composition de diluant pour elimination de resine photosensible Download PDFInfo
- Publication number
- WO2003083032A1 WO2003083032A1 PCT/KR2003/000632 KR0300632W WO03083032A1 WO 2003083032 A1 WO2003083032 A1 WO 2003083032A1 KR 0300632 W KR0300632 W KR 0300632W WO 03083032 A1 WO03083032 A1 WO 03083032A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- propyleneglycol
- thinner composition
- ether acetate
- thinner
- weight part
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 67
- 239000011347 resin Substances 0.000 title claims abstract description 24
- 229920005989 resin Polymers 0.000 title claims abstract description 24
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims abstract description 56
- -1 polyethylene Polymers 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 26
- 229960004063 propylene glycol Drugs 0.000 claims abstract description 20
- 235000013772 propylene glycol Nutrition 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims abstract description 14
- 239000004698 Polyethylene Substances 0.000 claims abstract description 9
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 9
- 229920000573 polyethylene Polymers 0.000 claims abstract description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 8
- 150000001346 alkyl aryl ethers Chemical class 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 7
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000049 pigment Substances 0.000 claims description 3
- FUWDFGKRNIDKAE-UHFFFAOYSA-N 1-butoxypropan-2-yl acetate Chemical compound CCCCOCC(C)OC(C)=O FUWDFGKRNIDKAE-UHFFFAOYSA-N 0.000 claims description 2
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims description 2
- CGZZMOTZOONQIA-UHFFFAOYSA-N cycloheptanone Chemical compound O=C1CCCCCC1 CGZZMOTZOONQIA-UHFFFAOYSA-N 0.000 claims description 2
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 claims 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 44
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 18
- 238000004090 dissolution Methods 0.000 description 14
- 239000002904 solvent Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 10
- 229940116333 ethyl lactate Drugs 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 8
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 5
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000005404 monopole Effects 0.000 description 3
- 239000011877 solvent mixture Substances 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- FNRRHKQTVNDRSJ-UHFFFAOYSA-N 2,3-bis(6-methylheptyl)phenol Chemical compound CC(C)CCCCCC1=CC=CC(O)=C1CCCCCC(C)C FNRRHKQTVNDRSJ-UHFFFAOYSA-N 0.000 description 1
- FXNDIJDIPNCZQJ-UHFFFAOYSA-N 2,4,4-trimethylpent-1-ene Chemical group CC(=C)CC(C)(C)C FXNDIJDIPNCZQJ-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- CYEJMVLDXAUOPN-UHFFFAOYSA-N 2-dodecylphenol Chemical compound CCCCCCCCCCCCC1=CC=CC=C1O CYEJMVLDXAUOPN-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- 125000006539 C12 alkyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- LCTONWCANYUPML-UHFFFAOYSA-M Pyruvate Chemical compound CC(=O)C([O-])=O LCTONWCANYUPML-UHFFFAOYSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 206010000210 abortion Diseases 0.000 description 1
- 231100000176 abortion Toxicity 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 231100000636 lethal dose Toxicity 0.000 description 1
- 201000002364 leukopenia Diseases 0.000 description 1
- 231100001022 leukopenia Toxicity 0.000 description 1
- 230000004060 metabolic process Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
- C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Definitions
- the present invention relates to a thinner composition for removing
- crystal display devices particularly to a thinner composition for removing
- Photolithography is a process of coating a photosensitive film on a
- This photolithography process comprises:
- composition on a substrate
- a light source such as UV
- substrate may cause many problems in the following processes, such as
- substances may be peeled during transferring of the substrate to cause
- Efficiency of a thinner composition is determined by dissolution rate
- the dissolution rate of a thinner composition means
- dissolution rate is appropriate. If the dissolution rate is too high, there may be
- the thinner solution may bound
- the thinner composition should readily evaporate and should not
- volatility of the is so low that the thinner remains on the substrate, it may be a
- the conventional thinner compositions are as follows.
- Japan Patent Publication No. Sho 63-69563 discloses a method for
- Japan Patent Publication No. Hei 4-49938 E. uses
- Japan Patent Publication No. Hei 4-42523 discloses a method of using alkyl alkoxy propionate as a thinner.
- ethyl lactate has high viscosity and low dissolution rate, so
- Hei 4-130715 uses a mixture solvent comprising alkyl pyruvate and methyl
- Japan Patent Publication No. Hei 7-146562 discloses
- a thinner composition comprising a mixture of propyleneglycol alkyl ether and
- Japan Patent Publication No. Hei 7-128867 uses a
- thinner composition comprising a mixture of propyleneglycol alkyl ether, butyl
- solvent mixture comprising propyleneglycol alkyl ether acetate
- 4,886,728 uses a mixture comprising ethyl lactate and methyl ethyl ketone as a
- lactate and methyl ethyl ketone is used rinsing ability on the edge side of the
- An object of the present invention is to provide a thinner composition
- Another object of the present invention is to provide a thinner
- composition for removing photosensitive resin capable of preventing
- Still another object of the present invention is to provide a thinner
- composition for removing photosensitive resin capable of completely removing
- Still another object of the present invention is to provide a thinner
- composition for removing photosensitive resin having superior dissolution rate
- Still another object of the present invention is to provide a thinner
- composition for removing photosensitive resin having good pigment
- Still another object of the present invention is to provide a thinner
- composition for removing photosensitive resin having superior spreadability when contacting with interface of photosensitive solution, and thereby capable
- Still another object of the present invention is to provide a thinner
- the present invention provides a thinner
- composition for rinsing used in manufacture of semiconductor devices
- liquid crystal display devices which comprises:
- the thinner composition comprises:
- the present invention is based on the finding that a thinner composition for removing photosensitive solution has superior ability when the
- the alkyl group may
- cycloketone cyclopentanone, cyclohexanone, cycloheptanone
- the polyethylene based condensate functions as nonionic surfactant.
- polyethylene condensate of alkyl phenol can be used.
- the alkyl phenol may be derived from polymerized propylene,
- diisobutylene, octene or nonene examples of such compounds are
- nonylphenol obtained by condensing 1 mol of phenol with about 9.5 mol of
- the fluorinated acrylic copolymer is highly soluble in water and other.
- this copolymer is below 0.001 weight part, dissolution ability to the
- Propyleneglycol monomethyl ether acetate is known to be safe to
- Hexanone is a cycloketone that dissolves a variety of resins well.
- Butyl acetate is an alkyl acetate that has low surface tension, is highly
- the present invention combines above four components and coats the
- photosensitive substances formed on the edge and side of the substrate are
- thinner composition can be controlled depending on the kind of photosensitive resin
- a minute circuit pattern can be formed by a
- Substrate sample to be used in Examples was prepared as follows.
- PGMEA stands for propyleneglycol monomethyl ether acetate
- NP-1019 is Dongnam Chemical Industries' Monopol NP-1019, which is
- OP-1015 is Dongnam Chemical Industries' Monopol OP-1015, which is
- R-08 is Dainippon Inc And Chemicals' R-08, which is a fluorinated
- Photosensitive film composition was coated on each 8-inch silicon
- the thinner composition shown in Table 1 was injected through an
- compositions are more stable in change of process conditions than the
- Thinner compositions according to the present invention can remove a
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Detergent Compositions (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
L'invention concerne une composition de diluant, destinée à l'élimination de résine photosensible utilisée dans les procédés de fabrication de dispositifs semi-conducteurs et de dispositifs d'affichage à cristaux liquides. Cette composition comprend un monoalkylétheracétate de propylèneglycol, une cyclocétone, un condensat à base de polyéthylène et un copolymère acrylique fluoré.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2003214682A AU2003214682A1 (en) | 2002-03-29 | 2003-03-28 | Thinner composition for removing photosensitive resin |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0017385A KR100503967B1 (ko) | 2002-03-29 | 2002-03-29 | 감광성 수지 제거용 씬너 조성물 |
| KR10-2002-0017385 | 2002-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003083032A1 true WO2003083032A1 (fr) | 2003-10-09 |
Family
ID=28673037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2003/000632 WO2003083032A1 (fr) | 2002-03-29 | 2003-03-28 | Composition de diluant pour elimination de resine photosensible |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100503967B1 (fr) |
| AU (1) | AU2003214682A1 (fr) |
| TW (1) | TWI226978B (fr) |
| WO (1) | WO2003083032A1 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006104340A1 (fr) * | 2005-03-31 | 2006-10-05 | Dongjin Semichem Co., Ltd. | Composition de diluant pour retirer du photoresist |
| JP2007531898A (ja) * | 2003-06-03 | 2007-11-08 | ドウジン セミケム カンパニー リミテッド | 感光性樹脂除去用シンナー組成物 |
| CN1987663B (zh) * | 2005-12-23 | 2010-12-01 | 新应材股份有限公司 | 光阻清洗剂 |
| WO2012056311A2 (fr) * | 2010-10-29 | 2012-05-03 | Az Electronic Materials Usa Corp. | Décapant pour élimination de surépaisseurs périphériques de revêtements |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100718639B1 (ko) * | 2004-10-27 | 2007-05-16 | 주식회사 이엔에프테크놀로지 | 안료 분산형 감광제 제거용 세정제 조성물 |
| JP2007163983A (ja) * | 2005-12-15 | 2007-06-28 | Tokyo Ohka Kogyo Co Ltd | 洗浄剤 |
| KR100812085B1 (ko) * | 2006-12-22 | 2008-03-07 | 동부일렉트로닉스 주식회사 | 반도체 소자의 개별화 방법 |
| KR102347910B1 (ko) | 2016-11-07 | 2022-01-06 | 동우 화인켐 주식회사 | 감광성 수지 및 반사방지막의 도포성 향상 및 제거용 신너 조성물 |
| KR102652985B1 (ko) | 2016-11-07 | 2024-03-29 | 동우 화인켐 주식회사 | 감광성 수지 및 반사방지막의 도포성 향상 및 제거용 신너 조성물 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58105182A (ja) * | 1981-12-18 | 1983-06-22 | Olympus Optical Co Ltd | 感光体再生方法 |
| US4948697A (en) * | 1985-10-28 | 1990-08-14 | Hoechst Celanese Corporation | Positive photoresist with a solvent mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate |
| US4983490A (en) * | 1985-10-28 | 1991-01-08 | Hoechst Celanese Corporation | Photoresist treating composition consisting of a mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate |
| WO2001048555A1 (fr) * | 1999-12-24 | 2001-07-05 | Samsung Electronics Co., Ltd. | Diluant pour le rinçage de la photoresine et procede de traitement d'une couche de photoresine |
-
2002
- 2002-03-29 KR KR10-2002-0017385A patent/KR100503967B1/ko active IP Right Grant
-
2003
- 2003-03-28 WO PCT/KR2003/000632 patent/WO2003083032A1/fr not_active Application Discontinuation
- 2003-03-28 AU AU2003214682A patent/AU2003214682A1/en not_active Abandoned
- 2003-03-28 TW TW092107202A patent/TWI226978B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58105182A (ja) * | 1981-12-18 | 1983-06-22 | Olympus Optical Co Ltd | 感光体再生方法 |
| US4948697A (en) * | 1985-10-28 | 1990-08-14 | Hoechst Celanese Corporation | Positive photoresist with a solvent mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate |
| US4983490A (en) * | 1985-10-28 | 1991-01-08 | Hoechst Celanese Corporation | Photoresist treating composition consisting of a mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate |
| WO2001048555A1 (fr) * | 1999-12-24 | 2001-07-05 | Samsung Electronics Co., Ltd. | Diluant pour le rinçage de la photoresine et procede de traitement d'une couche de photoresine |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007531898A (ja) * | 2003-06-03 | 2007-11-08 | ドウジン セミケム カンパニー リミテッド | 感光性樹脂除去用シンナー組成物 |
| WO2006104340A1 (fr) * | 2005-03-31 | 2006-10-05 | Dongjin Semichem Co., Ltd. | Composition de diluant pour retirer du photoresist |
| CN1987663B (zh) * | 2005-12-23 | 2010-12-01 | 新应材股份有限公司 | 光阻清洗剂 |
| WO2012056311A2 (fr) * | 2010-10-29 | 2012-05-03 | Az Electronic Materials Usa Corp. | Décapant pour élimination de surépaisseurs périphériques de revêtements |
| WO2012056311A3 (fr) * | 2010-10-29 | 2012-08-02 | Az Electronic Materials Usa Corp. | Décapant pour élimination de surépaisseurs périphériques de revêtements |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI226978B (en) | 2005-01-21 |
| KR100503967B1 (ko) | 2005-07-26 |
| KR20030078374A (ko) | 2003-10-08 |
| AU2003214682A1 (en) | 2003-10-13 |
| TW200304585A (en) | 2003-10-01 |
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