WO2003081734A1 - Module et procede optique d'assemblage de module optique - Google Patents
Module et procede optique d'assemblage de module optique Download PDFInfo
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- WO2003081734A1 WO2003081734A1 PCT/JP2003/003012 JP0303012W WO03081734A1 WO 2003081734 A1 WO2003081734 A1 WO 2003081734A1 JP 0303012 W JP0303012 W JP 0303012W WO 03081734 A1 WO03081734 A1 WO 03081734A1
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- Prior art keywords
- solder
- module
- optical module
- thermo
- package
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
Definitions
- the present invention relates to an optical module having an excellent coupling efficiency with an optical fiber and an assembling method of the optical module.
- an optical module having a semiconductor laser element or the like (referred to as a semiconductor laser module) is used as a signal light source for optical fiber communication, in particular, a trunk line or CATV, or an excitation light source for an optical fiber bump.
- a semiconductor laser module has a semiconductor laser device, a photo diode, and a photo diode mounted on a metal substrate mounted on a thermo module that can be controlled in temperature according to the magnitude and direction of the flowing current.
- Optical components such as diode chips and lenses, thermistor elements, etc. are arranged and fixed at desired positions.
- FIG. 8 is a diagram showing a conventional semiconductor laser module having a built-in thermo module. As shown in FIG.
- thermo module 103 is mounted on a bottom plate 102 of the package via a solder joint 110, and a thermo module is further mounted.
- a metal substrate (base substrate) 105 is mounted on 103.
- a carrier substrate 106, a semiconductor laser element 107, a condenser lens 108, and the like are mounted on the base substrate.
- Solder joints 110 and 111 are located between the thermo-module board 104 and the package bottom plate 102 and between the thermo-module board 104 a and the metal board 105. Is formed.
- thermo-module board 104a and the bottom plate 102 of the package is joined using a solder made of 63% by weight Sn—37% by weight—13 alloy, and the solder joint 1 1 0 is formed.
- solder joint 1 1 0 is formed between the thermo-module board 104a and the bottom plate 102 of the package.
- the semiconductor laser module 101 having a configuration without the thermo module 103 inside as shown in FIG. 1C.
- the conventional optical module has the following problems. That is, thermo When soldering the module 103 and the bottom plate 102 of the package, a load is applied while melting the solder.However, since the method of applying the load is not constant, for example, as shown in FIG. The solder thickness of the joint 110 was not uniform.
- the solder bonding layer 110 is deformed due to a temperature change in an environment in which the optical module is used or a temperature change applied at the time of manufacturing the optical module.
- the optical component (for example) 108 which is fixed in an optically coupled state with the optical fiber 109 via the optical fiber, is displaced.
- the optical axis shifts as shown by the dashed line, and the coupling efficiency of the optical fiber is reduced.
- the portions where the solder thickness is small for example, the portion indicated by 112
- the members to be joined in FIG.
- An object of the present invention is to provide a module assembling method. The inventor has made intensive studies to solve the above-mentioned conventional problems.
- thermo-module and the package are joined using a predetermined Sn-Ag solder or Sn-Zn-based solder
- the Au plating layer formed on the package surface and the bottom of the thermo module Au in Sn-Ag solder from Au layer on the surface of It was found that a substantially uniform phase was formed and that deformation cracks in the solder portion could be effectively suppressed, and that optical axis shift was unlikely to occur. That is, a lead-free Sn-Ag alloy is selected as the solder material to be used for joining between the thermo module and the package, and the amount of the alloy component metal is specified within a predetermined range.
- the solder will be solid at a substantially uniform height and at a desired temperature. Position becomes almost constant, and the positioning of the optical component mounting member (metal substrate) becomes easy. Furthermore, since the member displacement due to the thermal expansion of the solder at a high temperature, for example, at 70 ° C., is almost constant, the amount of optical axis displacement can be significantly reduced as compared with the conventional case, and the decrease in optical output can be reduced. It has been found that it can be suppressed.
- the present invention has been made based on the above research results, and a first aspect of the optical module according to the present invention is directed to an optical module having at least one optical component and a package containing the at least one optical component.
- a module wherein the package further contains Au in a range of 2.0 wt% to 20.0 wt%, and Sn further contains Ag in a range of 2.0 wt% to 5.0 wt%.
- An optical module characterized by having a junction formed of a system solder or a Sn—Zn system solder containing 6.0% by weight or more and 10.0% by weight or less of Zn.
- a second aspect of the optical module according to the present invention accommodates at least one optical component, a thermo module that controls the temperature of the at least one optical component, and the at least one optical component and the thermo module.
- An optical module comprising: According to a third aspect of the optical module of the present invention, at least one optical component, a thermo module for controlling the temperature of the at least one optical component, and the at least one optical component and the thermo module are housed.
- a fourth aspect of the optical module of the present invention is the optical module, wherein the Sn—Ag-based solder contains Cu of 3% by weight or less.
- a fifth aspect of the optical module of the invention the Sn_Ag system solder, 1.0 by weight 0/0 above 10.0 wt% or less of B i is characterized in that it further includes an optical Mogi Yunore It is.
- a seventh aspect of the optical module according to the present invention is the optical module, wherein the at least one optical component includes a semiconductor laser element.
- An eighth aspect of the optical module according to the present invention is an optical module characterized in that the thickness of the junction is not less than 5 ⁇ and not more than 100 / m.
- the thickness of the bonding portion is parallel to a direction (A1-A2) of emitting light of the package, and a front end portion of the thickness of the solder ( al) and the rear end (a 2) have a difference of 90 ⁇ or less, and ⁇ , or in the direction (B l- ⁇ 2) orthogonal to the direction in which the package emits light (A1-—2),
- the difference between one end (bl) and the other end (b2) of the solder thickness is 90 m is an optical module characterized by being equal to or less than m.
- the bonding portion includes an Au diffusion portion in which Au is dispersed in the solder, and the Au diffusion portion is a bonding surface of the package with the thermo module.
- An eleventh aspect of the optical module according to the present invention is characterized in that the Sn-Ag-based or Sn-Zn-based solder protrudes from the junction between the thermomodule and the package. Optical module.
- a carrier substrate on which a semiconductor laser is mounted a base substrate on which the carrier substrate is mounted via a solder joint (A), and a solder joint (B) on which the base substrate is mounted.
- a thermo-module comprising a Peltier element and an insulating substrate joined by a solder joint (C) and fixed thereon to control the temperature of the semiconductor laser; and connecting the thermo module through a solder joint (D).
- the melting point of the solder of the solder joints (A), (B), (C), and (D) is Tl, ⁇ 2, ⁇ 3, and ⁇ 4, ⁇ ⁇ ⁇ ⁇ ⁇ 1 ⁇ 2, and ⁇ 3 ⁇ 4 ⁇ 2, wherein the melting point of the solder is ⁇ 3 240 ° C and 280 ° C ⁇ T4 ⁇ 190 ° C.
- a thirteenth aspect of the optical module of the present invention, the solder forming the solder joint section (C) are optical module 80 weight 0 / oAu- 20 weight 0 / oS n.
- a fourteenth aspect of the optical module of the present invention is the optical module, wherein the solder forming the solder joint (C) is a Bi—Sb alloy.
- a first aspect of the method for assembling an optical module according to the present invention includes at least one optical component Temperature control, a thermo module provided with an Au layer on one side, and the at least one optical component containing the thermo module, and a thickness of 1 ⁇ m or more and 5 ⁇ or less on one side.
- a method for assembling an optical module comprising: a solder joining step of joining Au from the Au layer.
- a second aspect of the method for assembling an optical module according to the present invention includes a step of preparing a solder for joining the substrate of the thermo module and the bottom surface of the package with a Sn—Ag alloy or a Sn—Zn alloy.
- An optical module assembling method comprising: a solder joining step of joining a bottom surface of the base substrate and an upper surface of the thermomodule.
- the solder bonding step includes bonding using an Sn—Ag-based solder foil.
- An optical module assembling method wherein the thickness of the optical module is larger than the surface of the thermo module provided with the Au plating layer and has a thickness in a range of 5 im to 100 ⁇ .
- the bonding of the surface of the Sn—Ag-based solder foil is performed before bonding using the Sn—Ag-based solder foil.
- the method for erecting an optical module further comprising a pretreatment step of removing the dani coat.
- the Sn—Ag solder or the Sn— This is a method of assembling an optical module by pre-coating Zn-based solder.
- the time in which the Sn—Ag solder or the Sn—Zn solder is melted is 5 seconds or more.
- An optical module assembling method including a heating step of heating to 20 seconds or less.
- the surface provided with the Au layer of the package and the surface provided with the Au layer of the thermo module are formed by: . and carrying out while pressing each other in ⁇ X 1 0 4 P a less load, an assembly method of the optical module.
- FIG. 1 is a diagram illustrating an optical module according to the present invention.
- FIG. 1A is a schematic plan view
- FIG. 1B is a schematic sectional side view
- FIG. 1C is a schematic sectional side view of an optical module without a built-in thermo module.
- FIG. 2 is a diagram for explaining the thickness of a joint in a specific direction.
- FIG. 3 is a diagram illustrating a joint having an Au diffusion portion in which Au is uniformly dispersed in solder.
- FIG. 3A is a diagram showing the case of Sn—Ag solder.
- FIG. 3B is a diagram showing a case of Sn—Zn solder.
- FIG. 3C is a diagram showing a case of a conventional Sn—Pb solder.
- Fig. 4 is a diagram showing the relationship between the thermo-module board, solder, and the bottom of the package.
- FIG. 5 is a diagram for explaining a method of joining a thermo module to a package bottom plate by using a solder foil.
- FIG. 6 is a diagram for explaining a method of joining a base substrate to a thermo module.
- FIG. 7 is a diagram for explaining a method for joining another thermo module of the present invention.
- FIG. 8 is a diagram illustrating a conventional optical module in which the thickness of solder is not uniform.
- FIG. 1 is a diagram illustrating an optical module according to the present invention.
- FIG. 1A is a schematic plan view
- FIG. 1B is a schematic sectional side view
- FIG. 1C is a schematic sectional side view of an optical module without a built-in thermo module.
- a thermo module 3 is mounted on a bottom plate 2 of a package via a solder joint 10, and further, a metal substrate ( Base board) 5 is mounted.
- the carrier substrate 6 and the condenser lens 8 are mounted on the base substrate. Further, on the carrier substrate 6, a laser diode element 7, a thermistor, and the like are mounted.
- the thermo module 3 is composed of an insulating substrate 4 and a Peltier element 13.
- the solder joints 1 between the thermo module substrate 4 and the package bottom plate 2 and between the thermo module substrate 4 and the metal substrate 5 0 and 1 1 are formed.
- One embodiment of the optical module of the present invention is an optical module having at least one optical component and a package accommodating at least one optical component, wherein Ag is set to 2.0 at a part of the package. .% by weight or more 5 0 wt% or less, S n and the balance S n -..
- optical module having a joint formed by Zn-based solder.
- Another embodiment of the optical module according to the present invention includes at least one optical component, a thermo module that controls the temperature of at least one optical component, and at least one optical component.
- Ag is preferably used in an amount of 2.0% by weight or more and 5.0% by weight or less, more preferably 3.0% by weight or more and 3.5% by weight or less for joining optical components.
- Sn-Ag solder containing Zn or 6.0 wt% or more and 10.0 wt% or less, preferably 8.5 wt% Zn Since plastic deformation is unlikely to occur with respect to the strain applied to the joint, deformation of the solder joint layer due to a temperature change in the environment in which the optical module is used and a temperature change applied during the manufacturing of the optical module can be suppressed. It has been found that Sn-Ag solder and Sn-Zn solder have higher tensile strength than conventional Sn-Pb solder. In other words, plastic deformation is less likely to occur due to strain caused by changes in environmental temperature. In the optical module of the present invention, the Sn-Ag-based solder described above may contain 3% by weight or less of Cu.
- Cu has a function of lowering the melting point of solder.
- the Sn-Ag-based solder described above may further contain 10.0% by weight or less of Bi.
- the Sn-Zn-based solder described above may contain 5.0% by weight or less of Bi.
- Bi has a function of improving the wettability of the solder.
- Cu has a function of lowering the melting point of the solder, and Bi has a function of improving the wettability of the solder.
- the at least one optical component described above is an optical module including a semiconductor laser element. That is, it is necessary to align the semiconductor laser element and the optical axis of the optical fiber, and the deviation of the optical axis greatly affects the performance of the optical module. Therefore, for example, if the thickness of the solder is partially biased with respect to the temperature change, the optical axis shift will increase and the optical output will decrease.
- the present invention can be applied to a configuration in which the semiconductor laser module 1 does not include a thermo module as shown in FIG. 1C.
- the carrier substrate and the base substrate on which the condenser lens is mounted are directly fixed to the package bottom plate by soldering. That is, the solder joint 10 is formed between the base substrate and the package bottom plate.
- the thickness of the above-mentioned joint that is, the solder is 5 jum or more and 100 tm or less.
- the thickness of the solder part is thin and less than 5 ⁇ m, deformation distortion such as warpage or bending of the package bottom plate is concentrated, and there is a possibility that cracks may occur in the solder part.
- the thickness of the solder portion exceeds 100 / zm and is too thick, the solder is easily plastically deformed with a small distortion.
- FIG. 2 is a diagram for explaining the thickness of a joint in a specific direction. As shown in FIG. 2, the direction in which light is emitted from the package is defined as (Al- ⁇ 2), and the direction orthogonal to (Al- ⁇ 2) is defined as (B1-B2).
- the solder thickness just below the four ends of the thermo module board is indicated by the front end (a1) and the rear end (a2)
- the (Bl-B2) direction for example, the solder thickness just below the four ends of the thermoelectric circuit board is indicated by one end (bl) and the other end (b2).
- the solder thickness The measuring point of the height may be a fixed position from any place on the package.
- the thickness of the above-mentioned joint is parallel to the direction (A1-A2) of emitting light of the package, and the front end (al) of the thickness of the solder is In the case where the difference between the rear end (a 2) is 90 m or less and Z or the direction (B 1 -B 2) perpendicular to the light emitting direction (A 1 -A 2) of the package, the thickness of the solder is The difference between one end (b 1) and the other end (b 2) is 90 jum or less.
- the thickness of the solder including the B1—B2 direction of a1 and a2, and the A1—A2 direction of 131 and 1 ⁇ 2, their maximum and minimum values, or any number of points
- the average value of For the thickness of the solder, the maximum value, minimum value, or average value measured between the bottom surface of the thermo module substrate and the bottom surface of the package may be used (see Fig. 2B). That is, when the thickness of the joint is parallel to the direction of light emission of the package (A1-A2), the difference between the front end (al) and the rear end (a2) of the solder thickness is 90 im.
- the position of the thermo module can be kept almost constant even when the temperature becomes high. Therefore, the positioning of the optical component mounting member becomes easy, and even when the temperature becomes high, the displacement of the member due to the thermal expansion of the solder becomes constant. As a result, the amount of optical axis shift can be reduced, and a decrease in optical output can be reduced. Further, in the optical module of the present invention, the above-mentioned joint portion contains not less than 2.0% by weight and not more than 10.0% by weight of Au.
- the Sn—Ag based solder or the Sn—Zn based solder further contains Au in an amount of 2.0% by weight or more and 20.0% by weight or less.
- the compound of Au and Sn Sn 4 Au, etc.
- Au is uniformly dispersed, the ductility of the solder is reduced, and creep deformation due to thermal stress can be prevented.
- Au is less than 2.0% by weight, there is a problem that a sufficient effect of reducing ductility cannot be obtained.
- Au exceeds 20.0% by weight the melting point of the solder excessively rises, and the solder is fixed from the portion where the melting point has risen.
- the above-mentioned bonding portion has an Au diffusion portion in which Au is dispersed in the solder, and the Au diffusion portion has a bonding surface with the thermomodule of the package, and a thermoelectric module. It is formed by diffusion from an Au plating layer with a thickness of 1 Aim or more and 5 ⁇ or less formed on at least one of the bonding surfaces of the module and the package.
- FIG. 3 is a view for explaining a joint having an Au diffusion portion in which Au is dispersed in solder.
- FIG. 3A is a diagram showing the case of Sn—Ag solder.
- FIG. 3B is a diagram showing a case of Sn—Zn based solder.
- FIG. 3C is a diagram showing the case of a conventional Sn—Pb-based solder.
- the bonding portion of the present invention formed between the substrate of the thermo module and the bottom surface of the package includes an Au plating layer formed on the bottom surface of the thermo module substrate and the package.
- the Au—Sn compound (such as Sn 4 Au) is uniformly dispersed in the Sn—Ag alloy phase.
- a structure such as Sn 4 Au having a diameter of about 5 to 10 / zm is uniformly dispersed, and a uniform phase is formed in the entire joint.
- the Au_Sn compound is contained in the Sn—Zn alloy phase by diffusion from the Au plating layer formed on the substrate of the thermo module and the bottom surface of the package. Evenly dispersed.
- Au is uniformly dispersed, acts as reinforcement, and is less likely to be tallied, so that the optical axis of the module is less likely to be misaligned. Also, at least one of the bottom of the thermo module substrate and the package bottom, or the bottom of the base substrate on which the LD chip lens is mounted and the top of the thermo module.
- the Au plating layer may be as thin as 0.01 ⁇ m or more and 1 im or less, or at least the Au plating layer on the bottom surface of the base substrate may be eliminated to reduce the amount of Au diffusion into the solder alloy.
- the solder that joins the thermo-module board and the bottom of the package is Sn-Ag alloy or Sn-Zn alloy, and joins the bottom of the base board on which the LD chip and lens are mounted to the top of the thermo-module.
- the solder is Sn-Bi alloy
- at least one Au layer on the bottom surface of the base substrate and the upper surface of the thermo module is as thin as 0.01 ⁇ or more and 1 ⁇ or less, or at least A u on the bottom surface of the base substrate.
- the method for assembling an optical module according to the present invention includes a thermo module for controlling the temperature of at least one optical component, a thermo module having an Au layer on one surface, and containing the at least one optical component and the thermo module.
- thermo-module board in the range of 0 wt% or more 5.0 wt% or less 3 1 1 8 based solder, or, and a solder bonding step of bonding by S n-Zn-based solder containing Zn in the range of 6.0 wt% or more 10.0% by weight
- assembly of the optical module Is the way.
- Fig. 4 is a diagram showing the relationship between the thermo-module board, solder, and the bottom of the package. As shown in Fig. 4, for example, the package is 20% by weight.
- At least an Ni layer is formed on the surface of 11-80 wt% W, and a 1.5-2.0 ⁇ m Au layer is further formed on the Ni layer.
- Substrate of the thermo module alumina ( ⁇ 1 2 ⁇ 3) Ya least N i layer on an aluminum nitride (A 1 N) is formed, Au layer of 0. 3 tm on the N i layer is formed I have.
- the substrate and package of the above-mentioned thermo module are arranged so that each Au layer faces each other, and a solder foil having a thickness of 50 to 80 ⁇ is arranged between them.
- the thickness of the bonding surface of at least one of the bonding surface with the thermo module of the package, which is the member to be bonded, and at least one of the bonding surfaces with the package of the thermo module is determined in advance.
- An Au layer with a thickness of 5 ⁇ or less is formed so that during heating during solder bonding, Au diffuses from these Au plating layers into Sn-Ag solder or Sn-Zn solder.
- the soldering step described above includes joining using an Sn—Ag solder foil. It is larger than the surface provided with the u-plate layer and has a thickness in the range of 5111 to 100 ⁇ .
- the solder bonding step described above includes a step of treating a surface of the Sn—Ag solder foil before bonding using the Sn—Ag solder foil. Is further included. For example, by etching the surface of the Sn—Ag-based solder foil with an acid, the oxide film on the solder surface can be removed, and the wettability of the solder can be improved.
- the etching is not limited to the acid. Further, the oxide film may be removed by dry etching or mechanically, for example, by polishing.
- the surface of the thermo module provided with the Au layer is preliminarily coated with Sn—Ag solder or Sn—Zn solder. Done by
- the soldering step described above is performed so that the time during which the Sn—Ag solder or the Sn—Zn solder is melted is 5 seconds or more and 120 seconds or less.
- a heating step of heating is included. If the melting time of the solder is less than 5 seconds, the Au plating will not melt enough. Also, if the melting time of the solder exceeds 200 seconds, the molten solder cannot be prevented from spreading to the bottom of the package.
- the heating step described above includes the steps of: a surface of the package having the Au plating layer and a surface of the thermo module having the Au plating layer of 3.0 ⁇ 10 4 Pa Press against each other with the following load.
- the solder foil supplied in the solder bonding process is heated while pressing with a load of 3.0 ⁇ 10 4 Pa or less to melt the solder, and solder bonding is performed.
- the thickness of the Sn-Ag solder or Sn-Zn solder at the solder joint was changed to the supplied solder foil or pre-coated. Since the thickness can be substantially the same as that of the solder, the controllability of the thickness and its uniformity can be improved.
- the optical module according to the present invention includes a carrier substrate on which a semiconductor laser element is mounted, a base substrate on which the carrier substrate is mounted via a solder joint (A), and a base substrate on which the base substrate is mounted via a solder joint (B).
- thermo-module comprising a Peltier element and an insulating substrate joined by a solder joint (c), which is fixed on the semiconductor laser element to control the temperature of the semiconductor laser element; and the thermo-module is connected via a solder joint (D) If the melting point of the solder at the solder joints (A), (B), (C), and (D) is Tl, ⁇ 2, ⁇ 3, and ⁇ 4, ⁇ ⁇ ⁇ ⁇ ⁇ 1 ⁇ 2 And ⁇ 3 ⁇ 4 ⁇ 2, wherein the melting point of the solder is ⁇ 3 ⁇ 240 ° C and 2 80 ° C ⁇ T4 ⁇ 190.
- the solder forming the solder joint (C) may be 80% by weight Au—20% by weight Sn.
- the solder forming the solder joint (C) may be Bi—Sb. According to the above-described embodiment, by increasing the melting point of the solder inside the thermo module, it is possible to increase the melting point of the solder used for joining the thermo module and the package. Axis misalignment is reduced, and durability at high temperatures is significantly improved, and reliability can be improved.
- thermo-module with a package with a gold plating of 1.5 ⁇ ⁇ ⁇ on the bottom surface and a board with a size of 8 mm x 8 mm and a thickness of 2 mm was prepared.
- the surface of the thermo-module substrate is plated with gold with a thickness of 0.2 ⁇ .
- the composition was Sn-3.0% by weight Ag-0.5% by weight.
- Package 2 prepared by using approximately plate-shaped solder pellets 10 (also referred to as solder foil) of 12 mm X 8 mm X 0.05 mm consisting of 11, with the gold-plated surfaces facing each other 2
- the thermo module 3 were joined as follows. That is, immediately before soldering, the solder pellet was immersed in 3% hydrochloric acid for 10 minutes to remove the oxide film on the solder surface, and then thoroughly washed with water. After that, the package was placed on the stage, the solder foil was mounted in the center of the bottom plate of the package, and the thermo module was placed on the solder foil.
- thermo module a positioning jig (jig) weighing 5 g was placed at the top of the thermo module to prevent the thermo module from moving significantly due to the molten solder when the solder foil melted.
- the load applied to the solder by positioning jig of this 5 was 7. 7 X 10 2 P a. That is, since the jig load is less than a predetermined value, even when the solder is melted, Solder surface Even if a jig is used due to tension, the initial solder thickness is maintained.
- the atmosphere was replaced with nitrogen. For example, the package on the stage was heated after the oxygen concentration became 100 ppm or less.
- the peak temperature of the stage was set at 225 ° C, and the stage temperature was controlled so that the solder melting time of 3! 1 011 solder melting point 217 ° C or more was 20 seconds. Since the melting time of the solder is as short as 20 seconds and the thickness of the gold plating of the package is as large as 1.5 ⁇ , the amount of the solder protruding from the bottom of the package due to the melting of the solder could be extremely small. Therefore, the thickness of the solder at the joint was almost the same as that of the original solder pellet, and was 40 to 50 ⁇ . (If the time is long, the amount of solder protruding outside increases, the solder thickness becomes uneven, and voids are easily generated.)
- the atmosphere may be an inert gas such as nitrogen or a mixed gas, and may contain oxygen as little as possible.
- the content of gold dissolved in the solder was about 8.0%, and the ductility of the solder itself was reduced, making it difficult for tallip deformation due to thermal strain to occur.
- the base substrate 5 on which the photodiode 14, the LD chip 7, the lens 8, and the polarizer 15 were mounted was soldered on the thermo module 3.
- S ⁇ -Bi solder Place the Sn-Bi solder pellet 11 on the upper surface of the thermo-module 3, align the base substrate 5, and heat the package 2 to 17 5 The solder was melted and joined.
- an optical fiber was attached to the package, and the laser was focused on the optical fiber to complete the optical module.
- a temperature cycle test (repeating from 140 to 85 ° C) and a high-temperature storage test (85 ° C) were performed on an example of the optical module of the present invention thus assembled.
- the temperature cycle test (repeated from -40 ° C to 85 ° C)
- the deterioration of the light output after 1000 cycles in the case of conventional Sn-Pb solder was 8% on average, but the light output after 1000 cycles
- the output degradation was 4% on average, indicating that the optical axis shift was significantly reduced with temperature change.
- thermo module used was an internal Peltier element and upper and lower insulating thermo module substrates joined by a 80 n% 11-20 n% 3 n solder.
- Sn—57 weight. / oB i—1.0% by weight Ag solder was coated in advance so as to have a thickness of 100 ⁇ at the center.
- the lower surface (heating surface) of the thermo module was coated with Sn-7.5 weight% 211-3.0 weight% i solder to a thickness of 100 im at the center. The coating was performed by melting a predetermined amount of solder with a soldering iron while heating the thermo- module on a hot plate, and coating the substrate from high temperature Sn-Zn-Bi solder.
- the coating may use a solder paste.
- the thermo module was placed in the center of the bottom plate of the package and aligned with a 20 g jig. Thereafter, the package was placed in a reflow furnace in a nitrogen atmosphere, and the solder was heated and joined. The temperature of the furnace was set so that the ultimate temperature of the package was 210 ° C, and the transfer speed in the furnace was 100 cm / min. Therefore, the time at which the Sn—Zn—Bi solder melts at 190 ° C. or higher was set to 30 seconds. Next, a base substrate including a semiconductor laser element and a lens was bonded on the thermo module.
- the base substrate was moved to determine the proper position in the package. After replacing the package in a nitrogen atmosphere while holding the base substrate at that position, the stage was heated. The package was heated to 170 ° C, and only the SnBi-Ag solder on the top of the thermo module was melted and joined to the base substrate. A load was applied to the base substrate with a pressing force of 20 g to melt the solder for about 30 seconds. After that, the optical fiber was fixed to the package with the optical axis aligned, and the optical module was completed. A temperature cycle test (repeating from ⁇ 40 ° C.
- 28 joints between the carrier substrate and the base substrate are made up of 80% by weight of Au—20% by weight of 3n. It was formed by soldering at a temperature of C.
- the joint between the Peltier element and the upper and lower thermojudically insulating substrates was formed by soldering at a temperature of 280 ° C with 80 wt% Au-20 wt% Sn.
- the joint between the thermo module and the package was formed by soldering with Sn-3.0 wt% Ag-0.5 wt% Cu at a temperature of 217 ° C.
- the joint between the thermomodule and the base substrate was formed by soldering at a temperature of 138 ° C. with Sn—57% by weight Bi_1.0% by weight Ag.
- Example 4 The joint portion between the carrier substrate and the base substrate was formed by soldering at a temperature of 280 by using 11% to 20% by weight of 311 at 80% by weight.
- the joint between the Peltier device and the upper and lower thermo-module insulating substrates was formed by soldering at a temperature of 271 ° C using Bi-Sb.
- the joint between the thermo module and the package is Sn-2.0 weight 0 / oAg-0.5 weight. / oCu—formed by soldering at a temperature of 213 ° C with a weight of 0 / oBi.
- the junction between the thermo module and the base substrate was formed by soldering at a temperature of 157 ° C. with In.
- Example 5 The joint portion between the carrier substrate and the base substrate was formed by soldering at a temperature of 280 by using 11% to 20% by weight of 311 at 80% by weight.
- the joint between the Peltier device and the upper and lower thermo-module insulating substrates was formed
- the junction between the carrier substrate and the base substrate was formed by soldering at a temperature of 280 ° C. using 80% by weight 11-20% by weight 3n.
- the joint between the Peltier element and the upper and lower thermomodule insulating substrates was formed by soldering at 230 ° C. with Sn—5% by weight Sb.
- thermo-module and the base substrate formed by solder bonding at a temperature of about 138 ° C by S n-57 wt% B i- 1. 0 wt 0/0 A g.
- the optical axis deviation with respect to a temperature change is remarkably reduced, and the durability at high temperatures is also significantly improved, as compared with the conventional optical module.
- the trust 'I students were growing.
- the solder at the joint from a conventional Sn-Pb-based alloy to Sn-Ag or Sn-Zn alloy, the deformation of the joint can be reduced, and the optical axis can be reduced. Deviation can be made less likely.
- solder when the solder is melted, gold (Au) diffuses from the gold plating layer applied to the bottom surface of the package and the bottom surface of the thermo module substrate to the solder joint to form a uniform structure, so that the solder is less likely to creep. Furthermore, by setting the solder thickness in the range of 5 to 100 im, it was possible to suppress the generation of cracks due to thermal strain and to minimize the creep deformation. Control of the solder thickness, using a solder pellet, small load (3. 0X l 0 4 Pa or less) can be effectively controlled by adding.
- the size of the solder pellet By making the thermo module sufficiently larger than the substrate of the thermo module, when the thermo module is mounted on the package bottom plate, misalignment can be ignored and the thickness of the completed solder joint can be supplied. Since the thickness can be made substantially the same as the thickness of the solder pellet, the controllability of the solder joint thickness is improved, which is effective. Furthermore, since lead-free solder is used, it is environmentally preferable. Example 6
- thermo module 3 of this embodiment is provided with a solder or solder ball of Sn-7.5 wt% Zn-3.0 wt% Bi on one surface of the thermo module in advance.
- solder or solder ball of Sn-58.0 wt% Bi is formed on the other side.
- the volume of the solder to be formed and the solder balls were adjusted so that the average solder coating thickness was in the range of 5 to 100, depending on the size, the fixing interval and the number of each.
- the pressing load is reduced to 10 g in order to control the solder thickness to the specified value
- the solder that has partially protruded from the end of the thermo module is drawn to the solder joint by surface tension.
- the thickness of the solder can be increased. It is desirable to perform the soldering process by heating and cooling in a short time in order to suppress the precipitation of Bi in the Sn-Zn-Bi solder and the Sn-Bi solder.
- half of Sn—7.5% by weight 211—3.0% by weight 81 Heating and cooling were performed so that the melting time of the paddy was about 140 and 90 seconds.
- the base board is pressed with a load of 100 g, heated to the melting temperature of Sn-Bi solder or higher, and the base board is heated. They were rubbed and joined. At the time of joining, work was performed in an oxygen atmosphere controlled to an oxygen concentration of 100 ppm or less to prevent reoxidation of the solder.
- the deviation of the optical axis with respect to the temperature change is remarkably reduced, and the durability at a high temperature is significantly improved, and the reliability is increased.
- the reliability is increased.
- the use of lead-free solder suppresses the occurrence of deformation and cracks in the solder part, prevents optical axis misalignment, and provides excellent coupling efficiency with optical fibers.
- An optical module assembling method can be provided.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003579328A JP4101181B2 (ja) | 2002-03-27 | 2003-03-13 | 光モジュールおよび光モジュールの組立方法 |
EP03710340A EP1489706A4 (en) | 2002-03-27 | 2003-03-13 | OPTICAL MODULE ASSEMBLY OPTICAL MODULE AND METHOD |
US10/949,280 US6963676B2 (en) | 2002-03-27 | 2004-09-27 | Optical module and method of assembling the optical module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2002-089135 | 2002-03-27 | ||
JP2002089135 | 2002-03-27 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/949,280 Continuation US6963676B2 (en) | 2002-03-27 | 2004-09-27 | Optical module and method of assembling the optical module |
Publications (1)
Publication Number | Publication Date |
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WO2003081734A1 true WO2003081734A1 (fr) | 2003-10-02 |
Family
ID=28449489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2003/003012 WO2003081734A1 (fr) | 2002-03-27 | 2003-03-13 | Module et procede optique d'assemblage de module optique |
Country Status (4)
Country | Link |
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US (1) | US6963676B2 (ja) |
EP (1) | EP1489706A4 (ja) |
JP (1) | JP4101181B2 (ja) |
WO (1) | WO2003081734A1 (ja) |
Cited By (6)
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US6963676B2 (en) | 2002-03-27 | 2005-11-08 | The Furukawa Electric Co., Ltd. | Optical module and method of assembling the optical module |
JP2006032454A (ja) * | 2004-07-13 | 2006-02-02 | Nichia Chem Ind Ltd | 半導体レーザパッケージおよび半導体レーザパッケージの製造方法 |
JP2011215209A (ja) * | 2010-03-31 | 2011-10-27 | Kyocera Corp | 光ファイバ固定用フェルール及びそれを用いた光ファイバ固定具 |
JP2014022510A (ja) * | 2012-07-17 | 2014-02-03 | Japan Oclaro Inc | 光モジュール |
JPWO2020031944A1 (ja) * | 2018-08-09 | 2020-08-27 | パナソニックセミコンダクターソリューションズ株式会社 | 半導体発光装置 |
WO2021016735A1 (zh) * | 2019-07-26 | 2021-02-04 | 华为技术有限公司 | 一种光纤接续组件及其密封方法、光纤接续盒 |
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JP4143478B2 (ja) * | 2002-10-02 | 2008-09-03 | アルプス電気株式会社 | はんだ接続構造および電子部品のはんだ接続方法 |
KR101025844B1 (ko) * | 2003-10-01 | 2011-03-30 | 삼성전자주식회사 | SnAgAu 솔더범프, 이의 제조 방법 및 이 방법을이용한 발광소자 본딩 방법 |
JP2008197500A (ja) * | 2007-02-14 | 2008-08-28 | Nec Corp | 光モジュール |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6963676B2 (en) | 2002-03-27 | 2005-11-08 | The Furukawa Electric Co., Ltd. | Optical module and method of assembling the optical module |
JP2006032454A (ja) * | 2004-07-13 | 2006-02-02 | Nichia Chem Ind Ltd | 半導体レーザパッケージおよび半導体レーザパッケージの製造方法 |
JP2011215209A (ja) * | 2010-03-31 | 2011-10-27 | Kyocera Corp | 光ファイバ固定用フェルール及びそれを用いた光ファイバ固定具 |
JP2014022510A (ja) * | 2012-07-17 | 2014-02-03 | Japan Oclaro Inc | 光モジュール |
JPWO2020031944A1 (ja) * | 2018-08-09 | 2020-08-27 | パナソニックセミコンダクターソリューションズ株式会社 | 半導体発光装置 |
CN112438000A (zh) * | 2018-08-09 | 2021-03-02 | 新唐科技日本株式会社 | 半导体发光装置及半导体发光装置的制造方法 |
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WO2021016735A1 (zh) * | 2019-07-26 | 2021-02-04 | 华为技术有限公司 | 一种光纤接续组件及其密封方法、光纤接续盒 |
CN112567273A (zh) * | 2019-07-26 | 2021-03-26 | 华为技术有限公司 | 一种光纤接续组件及其密封方法、光纤接续盒 |
US11175468B2 (en) | 2019-07-26 | 2021-11-16 | Huawei Technologies Co., Ltd. | Optical fiber junction assembly and sealing method thereof, and optical fiber junction box |
Also Published As
Publication number | Publication date |
---|---|
JP4101181B2 (ja) | 2008-06-18 |
EP1489706A4 (en) | 2010-03-10 |
JPWO2003081734A1 (ja) | 2005-07-28 |
US6963676B2 (en) | 2005-11-08 |
EP1489706A1 (en) | 2004-12-22 |
US20050041934A1 (en) | 2005-02-24 |
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