WO2003076515A1 - Composition de resine thermodurcissable, produits stratifies et substrats pour carte de circuits imprimes fabriques a l'aide de ceux-ci - Google Patents

Composition de resine thermodurcissable, produits stratifies et substrats pour carte de circuits imprimes fabriques a l'aide de ceux-ci Download PDF

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Publication number
WO2003076515A1
WO2003076515A1 PCT/JP2003/002626 JP0302626W WO03076515A1 WO 2003076515 A1 WO2003076515 A1 WO 2003076515A1 JP 0302626 W JP0302626 W JP 0302626W WO 03076515 A1 WO03076515 A1 WO 03076515A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
laminates
thermosetting resin
circuit board
same
Prior art date
Application number
PCT/JP2003/002626
Other languages
English (en)
French (fr)
Inventor
Shigeru Tanaka
Kanji Shimo-Ohsako
Takashi Itoh
Mutsuaki Murakami
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to US10/505,727 priority Critical patent/US20050119381A1/en
Priority to JP2003574727A priority patent/JPWO2003076515A1/ja
Priority to KR1020037011647A priority patent/KR100960174B1/ko
Publication of WO2003076515A1 publication Critical patent/WO2003076515A1/ja
Priority to US12/033,748 priority patent/US20080312383A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2003/002626 2002-03-08 2003-03-06 Composition de resine thermodurcissable, produits stratifies et substrats pour carte de circuits imprimes fabriques a l'aide de ceux-ci WO2003076515A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US10/505,727 US20050119381A1 (en) 2002-03-08 2003-03-06 Thermosetting resin composition and laminates and circuit board substrates made by using the same
JP2003574727A JPWO2003076515A1 (ja) 2002-03-08 2003-03-06 熱硬化性樹脂組成物、それを用いてなる積層体および回路基板
KR1020037011647A KR100960174B1 (ko) 2002-03-08 2003-03-06 열경화성 수지 조성물, 이를 이용한 적층체 및 회로 기판
US12/033,748 US20080312383A1 (en) 2002-03-08 2008-02-19 Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2002064203 2002-03-08
JP2002/64203 2002-03-08
JP2002200576 2002-07-09
JP2002/200576 2002-07-09
JP2002/203333 2002-07-11
JP2002203333 2002-07-11
JP2002321523 2002-11-05
JP2002/321523 2002-11-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/033,748 Division US20080312383A1 (en) 2002-03-08 2008-02-19 Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same

Publications (1)

Publication Number Publication Date
WO2003076515A1 true WO2003076515A1 (fr) 2003-09-18

Family

ID=27808727

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/002626 WO2003076515A1 (fr) 2002-03-08 2003-03-06 Composition de resine thermodurcissable, produits stratifies et substrats pour carte de circuits imprimes fabriques a l'aide de ceux-ci

Country Status (6)

Country Link
US (2) US20050119381A1 (ja)
JP (1) JPWO2003076515A1 (ja)
KR (1) KR100960174B1 (ja)
CN (1) CN1309786C (ja)
TW (1) TWI290569B (ja)
WO (1) WO2003076515A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006335843A (ja) * 2005-06-01 2006-12-14 Kaneka Corp 熱硬化性樹脂組成物およびその利用
JP2020196876A (ja) * 2019-05-31 2020-12-10 荒川化学工業株式会社 組成物、反応物、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
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JP4790297B2 (ja) * 2005-04-06 2011-10-12 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
EP1801142B1 (en) * 2005-12-16 2016-02-24 Canon Kabushiki Kaisha Resin composition,resin cured product, and liquid discharge head
CN100410325C (zh) * 2006-01-26 2008-08-13 广东生益科技股份有限公司 一种树脂组合物及其在粘结片和覆铜板中的应用
KR101330385B1 (ko) * 2006-05-04 2013-11-15 코오롱인더스트리 주식회사 열경화성 수지 조성물
JP2008091639A (ja) * 2006-10-02 2008-04-17 Nec Electronics Corp 電子装置およびその製造方法
US20090130468A1 (en) * 2007-11-16 2009-05-21 Li-Hua Wang Polyamic acid composition, method for preparing the same, method for preparing polyimide and polyimide flexible metal-clad laminates
JP4897932B1 (ja) * 2011-05-25 2012-03-14 ハリマ化成株式会社 はんだペースト用フラックスおよびはんだペースト
KR101252063B1 (ko) 2011-08-25 2013-04-12 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도
WO2014115637A1 (ja) * 2013-01-22 2014-07-31 東レ株式会社 接着剤組成物、接着剤シートならびにこれらを用いた硬化物および半導体装置
JP6287840B2 (ja) * 2013-04-16 2018-03-07 東洋紡株式会社 金属箔積層体
US20150187681A1 (en) * 2013-12-26 2015-07-02 Ravi V. Mahajan Flexible microelectronic assembly and method
CN108314782A (zh) * 2017-01-16 2018-07-24 臻鼎科技股份有限公司 树脂组合物及应用该树脂组合物的聚酰亚胺膜及电路板
TWI630234B (zh) 2017-01-16 2018-07-21 臻鼎科技股份有限公司 樹脂組合物及應用該樹脂組合物的聚醯亞胺膜及電路板
KR20200013649A (ko) * 2017-05-31 2020-02-07 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 경화물, 접착제, 접착 필름, 커버레이 필름, 및, 프린트 배선판
CN108012414A (zh) * 2018-01-08 2018-05-08 昆山雅森电子材料科技有限公司 具有frcc的高频高传输fpc及制备方法
JP2020132676A (ja) * 2019-02-13 2020-08-31 味の素株式会社 樹脂組成物
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체
CN111642068A (zh) * 2020-06-10 2020-09-08 浙江福斯特新材料研究院有限公司 Rcc基板及多层叠置软板
JP2022065507A (ja) * 2020-10-15 2022-04-27 味の素株式会社 樹脂組成物、硬化物、シート状積層材料、樹脂シート、プリント配線板及び半導体装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330658A (en) * 1979-12-24 1982-05-18 Mitsubishi Gas Chemical Company, Inc. Curable resin composition
US4330669A (en) * 1979-12-24 1982-05-18 Mitsubishi Gas Chemical Company, Inc. Curable resin composition
JPH08193139A (ja) * 1995-01-17 1996-07-30 Nippon Steel Chem Co Ltd プリント配線板用プリプレグ及びそれを用いた金属張積層板
JPH08225667A (ja) * 1994-12-02 1996-09-03 Toray Ind Inc プリプレグおよび繊維強化複合材料
JPH0948915A (ja) * 1995-08-04 1997-02-18 Sumitomo Electric Ind Ltd 硬化性樹脂組成物とそれを用いた成形体およびその製造方法
JP2000109645A (ja) * 1998-10-05 2000-04-18 Kanegafuchi Chem Ind Co Ltd 樹脂組成物
JP2001200157A (ja) * 2000-01-14 2001-07-24 Mitsubishi Gas Chem Co Inc 熱硬化性樹脂組成物
JP2003128753A (ja) * 2001-10-19 2003-05-08 Hitachi Chem Co Ltd 難燃性熱硬化樹脂組成物、プリプレグ、積層板、絶縁フィルム、樹脂付き金属箔及び多層配線板とその製造方法

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JP3950560B2 (ja) * 1998-08-14 2007-08-01 株式会社巴川製紙所 電子部品用接着剤および電子部品用接着テープ
DE60016217T2 (de) * 1999-04-09 2005-04-07 Kaneka Corp. Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
TW567198B (en) * 1999-12-28 2003-12-21 Kaneka Corp Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide
US6645632B2 (en) * 2000-03-15 2003-11-11 Shin-Etsu Chemical Co., Ltd. Film-type adhesive for electronic components, and electronic components bonded therewith
US6632523B1 (en) * 2000-09-28 2003-10-14 Sumitomo Bakelite Company Limited Low temperature bonding adhesive composition
JP4717268B2 (ja) * 2001-01-12 2011-07-06 富士通株式会社 絶縁樹脂組成物及びそれから形成した絶縁層を含む多層回路基板
CN1247698C (zh) * 2001-07-09 2006-03-29 钟渊化学工业株式会社 树脂组合物
KR100797689B1 (ko) * 2003-04-18 2008-01-23 가부시키가이샤 가네카 열경화성 수지 조성물, 이를 이용한 적층체 및 회로 기판
JP5019874B2 (ja) * 2004-04-19 2012-09-05 株式会社カネカ 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330658A (en) * 1979-12-24 1982-05-18 Mitsubishi Gas Chemical Company, Inc. Curable resin composition
US4330669A (en) * 1979-12-24 1982-05-18 Mitsubishi Gas Chemical Company, Inc. Curable resin composition
JPH08225667A (ja) * 1994-12-02 1996-09-03 Toray Ind Inc プリプレグおよび繊維強化複合材料
JPH08193139A (ja) * 1995-01-17 1996-07-30 Nippon Steel Chem Co Ltd プリント配線板用プリプレグ及びそれを用いた金属張積層板
JPH0948915A (ja) * 1995-08-04 1997-02-18 Sumitomo Electric Ind Ltd 硬化性樹脂組成物とそれを用いた成形体およびその製造方法
JP2000109645A (ja) * 1998-10-05 2000-04-18 Kanegafuchi Chem Ind Co Ltd 樹脂組成物
JP2001200157A (ja) * 2000-01-14 2001-07-24 Mitsubishi Gas Chem Co Inc 熱硬化性樹脂組成物
JP2003128753A (ja) * 2001-10-19 2003-05-08 Hitachi Chem Co Ltd 難燃性熱硬化樹脂組成物、プリプレグ、積層板、絶縁フィルム、樹脂付き金属箔及び多層配線板とその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006335843A (ja) * 2005-06-01 2006-12-14 Kaneka Corp 熱硬化性樹脂組成物およびその利用
JP2020196876A (ja) * 2019-05-31 2020-12-10 荒川化学工業株式会社 組成物、反応物、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
JP7283441B2 (ja) 2019-05-31 2023-05-30 荒川化学工業株式会社 組成物、反応物、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法

Also Published As

Publication number Publication date
KR20040090387A (ko) 2004-10-22
US20080312383A1 (en) 2008-12-18
US20050119381A1 (en) 2005-06-02
CN1309786C (zh) 2007-04-11
TW200401000A (en) 2004-01-16
KR100960174B1 (ko) 2010-05-26
CN1509317A (zh) 2004-06-30
JPWO2003076515A1 (ja) 2005-07-07
TWI290569B (en) 2007-12-01

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