WO2003060979A3 - Compositions organiques - Google Patents
Compositions organiques Download PDFInfo
- Publication number
- WO2003060979A3 WO2003060979A3 PCT/US2003/000948 US0300948W WO03060979A3 WO 2003060979 A3 WO2003060979 A3 WO 2003060979A3 US 0300948 W US0300948 W US 0300948W WO 03060979 A3 WO03060979 A3 WO 03060979A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- porogen
- set forth
- forth below
- aromatic rings
- polyacenaphthylene
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003560974A JP2005516382A (ja) | 2002-01-15 | 2003-01-14 | 有機組成物 |
AU2003210504A AU2003210504A1 (en) | 2002-01-15 | 2003-01-14 | Organic compositions for low dielectric constant materials |
EP03729654A EP1466356A2 (fr) | 2002-01-15 | 2003-01-14 | Compositions organiques |
KR10-2004-7010994A KR20040104454A (ko) | 2002-01-15 | 2003-01-14 | 유기 조성물 |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35018702P | 2002-01-15 | 2002-01-15 | |
US60/350,187 | 2002-01-15 | ||
US35055702P | 2002-01-22 | 2002-01-22 | |
US60/350,557 | 2002-01-22 | ||
US35301102P | 2002-01-30 | 2002-01-30 | |
US60/353,011 | 2002-01-30 | ||
US37621902P | 2002-04-29 | 2002-04-29 | |
US60/376,219 | 2002-04-29 | ||
US37842402P | 2002-05-07 | 2002-05-07 | |
US60/378,424 | 2002-05-07 | ||
US10/158,513 | 2002-05-30 | ||
US10/158,513 US7141188B2 (en) | 2001-05-30 | 2002-05-30 | Organic compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003060979A2 WO2003060979A2 (fr) | 2003-07-24 |
WO2003060979A3 true WO2003060979A3 (fr) | 2004-07-15 |
Family
ID=27558468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/000948 WO2003060979A2 (fr) | 2002-01-15 | 2003-01-14 | Compositions organiques |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1466356A2 (fr) |
JP (1) | JP2005516382A (fr) |
KR (1) | KR20040104454A (fr) |
CN (1) | CN1643669A (fr) |
AU (1) | AU2003210504A1 (fr) |
WO (1) | WO2003060979A2 (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4878779B2 (ja) * | 2004-06-10 | 2012-02-15 | 富士フイルム株式会社 | 膜形成用組成物、絶縁膜及び電子デバイス |
US7491658B2 (en) * | 2004-10-13 | 2009-02-17 | International Business Machines Corporation | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality |
US7531209B2 (en) | 2005-02-24 | 2009-05-12 | Michael Raymond Ayers | Porous films and bodies with enhanced mechanical strength |
JP4659486B2 (ja) * | 2005-03-01 | 2011-03-30 | 富士フイルム株式会社 | 電子デバイス用絶縁膜、電子デバイス及び電子デバイス用絶縁膜の製造方法 |
JP2006257212A (ja) * | 2005-03-16 | 2006-09-28 | Fuji Photo Film Co Ltd | 膜形成用組成物、それを用いた絶縁膜および電子デバイス |
JP2007031663A (ja) * | 2005-07-29 | 2007-02-08 | Fujifilm Corp | 膜形成用組成物、それを用いて形成された絶縁膜及び電子デバイス |
JP2007314778A (ja) * | 2006-04-26 | 2007-12-06 | Fujifilm Corp | 膜形成用組成物、該組成物を用いて形成した絶縁膜及び電子デバイス |
US7883742B2 (en) | 2006-05-31 | 2011-02-08 | Roskilde Semiconductor Llc | Porous materials derived from polymer composites |
WO2007143025A2 (fr) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | Solides inorganiques poreux pour utilisation comme matÉriaux À faible constante diÉlectrique |
US7919188B2 (en) | 2006-05-31 | 2011-04-05 | Roskilde Semiconductor Llc | Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials |
WO2007143028A2 (fr) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | MatÉriaux À faible constante diÉlectrique prÉparÉs À partir d'agrÉgats de fullerÈnes solubles |
US20100069578A1 (en) * | 2006-11-17 | 2010-03-18 | Rudolf Faust | Functional Hydrocarbon Polymers and Process for Producing Same |
JP2008231259A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Bakelite Co Ltd | 有機絶縁材料 |
JP2009013116A (ja) | 2007-07-05 | 2009-01-22 | Daicel Chem Ind Ltd | エチニルフェニルビアダマンタン誘導体 |
GB2451865A (en) | 2007-08-15 | 2009-02-18 | Univ Liverpool | Microporous polymers from alkynyl monomers |
US20240087880A1 (en) * | 2022-08-26 | 2024-03-14 | Applied Materials, Inc. | Systems and methods for depositing low-k dielectric films |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0869516A1 (fr) * | 1997-03-31 | 1998-10-07 | Dow Corning Toray Silicone Company, Limited | Composition et peocédé pour former des films minces électriquement isolants |
WO2000031183A1 (fr) * | 1998-11-24 | 2000-06-02 | The Dow Chemical Company | Composition contenant un precurseur de matrice reticulable et porogene et matrice poreuse prepares a partir de ladite composition |
JP2001192539A (ja) * | 2000-01-13 | 2001-07-17 | Jsr Corp | 熱硬化性樹脂組成物、その硬化物およびその硬化物を含む回路基板 |
WO2001078110A2 (fr) * | 2000-04-07 | 2001-10-18 | Honeywell International Inc. | Matieres dielectriques organiques a faible constante dielectrique basees sur des structures en forme de cage |
JP2002003683A (ja) * | 2000-06-26 | 2002-01-09 | Hitachi Chem Co Ltd | 低吸湿低複屈折樹脂組成物、これから得られる成形材、シート又はフィルムおよび光学用部品 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3483500B2 (ja) * | 1999-05-28 | 2004-01-06 | 富士通株式会社 | 絶縁膜形成材料、絶縁膜形成方法及び半導体装置 |
JP4651774B2 (ja) * | 2000-04-11 | 2011-03-16 | 新日鐵化学株式会社 | 芳香族オリゴマー、それを配合したフェノール樹脂組成物並びにエポキシ樹脂組成物およびその硬化物 |
EP1197998A3 (fr) * | 2000-10-10 | 2005-12-21 | Shipley Company LLC | Agent porogène antireflet |
US20030006477A1 (en) * | 2001-05-23 | 2003-01-09 | Shipley Company, L.L.C. | Porous materials |
JP2003131001A (ja) * | 2001-05-25 | 2003-05-08 | Shipley Co Llc | 多孔性光学物質 |
US7049005B2 (en) * | 2001-05-30 | 2006-05-23 | Honeywell International Inc. | Organic compositions |
-
2003
- 2003-01-14 AU AU2003210504A patent/AU2003210504A1/en not_active Abandoned
- 2003-01-14 WO PCT/US2003/000948 patent/WO2003060979A2/fr not_active Application Discontinuation
- 2003-01-14 CN CNA03805938XA patent/CN1643669A/zh active Pending
- 2003-01-14 JP JP2003560974A patent/JP2005516382A/ja active Pending
- 2003-01-14 KR KR10-2004-7010994A patent/KR20040104454A/ko not_active Application Discontinuation
- 2003-01-14 EP EP03729654A patent/EP1466356A2/fr not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0869516A1 (fr) * | 1997-03-31 | 1998-10-07 | Dow Corning Toray Silicone Company, Limited | Composition et peocédé pour former des films minces électriquement isolants |
WO2000031183A1 (fr) * | 1998-11-24 | 2000-06-02 | The Dow Chemical Company | Composition contenant un precurseur de matrice reticulable et porogene et matrice poreuse prepares a partir de ladite composition |
JP2001192539A (ja) * | 2000-01-13 | 2001-07-17 | Jsr Corp | 熱硬化性樹脂組成物、その硬化物およびその硬化物を含む回路基板 |
WO2001078110A2 (fr) * | 2000-04-07 | 2001-10-18 | Honeywell International Inc. | Matieres dielectriques organiques a faible constante dielectrique basees sur des structures en forme de cage |
JP2002003683A (ja) * | 2000-06-26 | 2002-01-09 | Hitachi Chem Co Ltd | 低吸湿低複屈折樹脂組成物、これから得られる成形材、シート又はフィルムおよび光学用部品 |
Non-Patent Citations (2)
Title |
---|
DATABASE WPI Section Ch Week 200230, Derwent World Patents Index; Class A13, AN 2002-245992, XP002263344 * |
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 05 3 May 2002 (2002-05-03) * |
Also Published As
Publication number | Publication date |
---|---|
AU2003210504A1 (en) | 2003-07-30 |
EP1466356A2 (fr) | 2004-10-13 |
AU2003210504A8 (en) | 2003-07-30 |
KR20040104454A (ko) | 2004-12-10 |
JP2005516382A (ja) | 2005-06-02 |
CN1643669A (zh) | 2005-07-20 |
WO2003060979A2 (fr) | 2003-07-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2003060979A3 (fr) | Compositions organiques | |
WO2003061029A3 (fr) | Compositions organiques | |
Zhang et al. | An elastic autonomous self‐healing capacitive sensor based on a dynamic dual crosslinked chemical system | |
CN101687983B (zh) | 芳族液晶聚酰胺酯共聚物、包含该共聚物的预浸料、包含该预浸料的预浸料层压材料、包含该预浸料的金属膜层压材料以及包含该预浸料的印刷线路板 | |
WO2008126411A1 (fr) | Composition de résine époxy, pré-imprégné, laminé, planche de câblage imprimé multicouches, dispositif semi-conducteur, feuille de résine isolante et procédé de fabrication d'une planche de câblage imprimé multicouches | |
WO1999029761A3 (fr) | Compositions de poly(arylene ether) et leurs procedes de fabrication | |
PL1641862T3 (pl) | Kompozycje kopolimeru estru sililowego | |
AU2003216067A1 (en) | Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications | |
EP1323762A3 (fr) | Composition polymère ou copolymère et dispositif émetteur de lumière à base de polymères | |
EP1683822A4 (fr) | Prepolymere, composition de prepolymere, polymere a poids moleculaire eleve dont la structure est perforee et film d'isolation electrique | |
CN104662097A (zh) | 树脂组合物、固化膜、层合膜及半导体器件的制造方法 | |
DE69717177T2 (de) | Polymer mit niedriger Dielektrizitätskonstante und Verlustfaktor, sowie daraus hergestellte Filme, Substrate und elektronische Bauteile | |
CA2733682C (fr) | Compositions polymeres comprenant des derives de per(phenylethynyl)arene | |
Lee et al. | Siloxane‐Based Hybrid Semiconducting Polymers Prepared by Fluoride‐Mediated Suzuki Polymerization | |
CN100566503C (zh) | 线路板用积层体 | |
KR20050004110A (ko) | 전기 절연재용 폴리이미드 수지 | |
JPS56141349A (en) | Curable polyphenylene ether type resin composition | |
TW200709923A (en) | Double-sided flexible printed circuit board and manufacturing method thereof | |
WO2005114726A3 (fr) | Empilage de systèmes de et méthodes | |
KR20220035927A (ko) | 열경화성 수지 조성물, 열경화성 수지막, 열경화막, 적층체, 그리고 프린트 배선판 및 그의 제조 방법 | |
GB0229659D0 (en) | Electronic devices | |
EP1083595A4 (fr) | Adhesif isolant pour pieces electroniques, et grille de connexion et composant a semiconducteur utilisant ledit adhesif | |
EP1702958A4 (fr) | Composition de resine durcissable | |
TW200407368A (en) | Organic compositions | |
JPH0811781B2 (ja) | 賦形高誘電性ポリフェニレンオキサイド系樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SK SL TJ TM TN TR TT TZ UA UG UZ VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2003729654 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2003560974 Country of ref document: JP Ref document number: 1020047010994 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2003805938X Country of ref document: CN |
|
WWP | Wipo information: published in national office |
Ref document number: 2003729654 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2003729654 Country of ref document: EP |