WO2003029353A1 - Thermosetting resin composition with low thermal expansion and resin film - Google Patents

Thermosetting resin composition with low thermal expansion and resin film Download PDF

Info

Publication number
WO2003029353A1
WO2003029353A1 PCT/JP2002/009819 JP0209819W WO03029353A1 WO 2003029353 A1 WO2003029353 A1 WO 2003029353A1 JP 0209819 W JP0209819 W JP 0209819W WO 03029353 A1 WO03029353 A1 WO 03029353A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermosetting resin
thermal expansion
resin composition
low thermal
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/009819
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Atsushi Takahashi
Hideo Baba
Ken Madarame
Hideo Nakako
Nozomu Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to KR1020047004264A priority Critical patent/KR100848434B1/ko
Priority to US10/490,646 priority patent/US20050065275A1/en
Priority to EP02770210A priority patent/EP1454962A4/en
Priority to JP2003532588A priority patent/JP3966279B2/ja
Publication of WO2003029353A1 publication Critical patent/WO2003029353A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Silicon Polymers (AREA)
PCT/JP2002/009819 2001-09-25 2002-09-25 Thermosetting resin composition with low thermal expansion and resin film Ceased WO2003029353A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020047004264A KR100848434B1 (ko) 2001-09-25 2002-09-25 저열팽창성의 열경화성 수지 조성물 및 수지 필름
US10/490,646 US20050065275A1 (en) 2001-09-25 2002-09-25 Thermosetting resin composition of low thermal expansibility and resin film
EP02770210A EP1454962A4 (en) 2001-09-25 2002-09-25 HEAT-RESISTANT RESIN COMPOSITION WITH LOW HEAT EXTENSION AND RESIN FOIL
JP2003532588A JP3966279B2 (ja) 2001-09-25 2002-09-25 低熱膨張性の熱硬化性樹脂組成物および樹脂フィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001291635 2001-09-25
JP2001-291635 2001-09-25

Publications (1)

Publication Number Publication Date
WO2003029353A1 true WO2003029353A1 (en) 2003-04-10

Family

ID=19113743

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009819 Ceased WO2003029353A1 (en) 2001-09-25 2002-09-25 Thermosetting resin composition with low thermal expansion and resin film

Country Status (7)

Country Link
US (1) US20050065275A1 (https=)
EP (1) EP1454962A4 (https=)
JP (2) JP3966279B2 (https=)
KR (1) KR100848434B1 (https=)
CN (1) CN100489037C (https=)
TW (1) TW593440B (https=)
WO (1) WO2003029353A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006152260A (ja) * 2004-10-26 2006-06-15 Hitachi Chem Co Ltd 複合体、これを用いたプリプレグ、金属箔張積層板及び多層印刷配線板並びに多層印刷配線板の製造方法
JP2006152261A (ja) * 2004-10-25 2006-06-15 Hitachi Chem Co Ltd 複合体、プリプレグ、金属箔張積層板、多層プリント配線板及びその製造方法
CN101627096B (zh) * 2007-02-22 2012-11-07 道康宁公司 增强硅树脂膜及其制备方法
US9328242B2 (en) 2010-08-31 2016-05-03 Dow Corning Toray Co., Ltd. Polysiloxane composition and cured product thereof

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL153812A0 (en) * 2003-01-06 2003-07-31 Bromine Compounds Ltd Improved wood-plastic composites
US8092910B2 (en) 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
KR101272208B1 (ko) * 2005-02-16 2013-06-07 다우 코닝 도레이 캄파니 리미티드 강화 실리콘 수지 필름 및 이의 제조방법
JP5241242B2 (ja) 2005-02-16 2013-07-17 ダウ・コーニング・コーポレイション 強化シリコーン樹脂フィルムおよびその製造方法
JP2009503230A (ja) 2005-08-04 2009-01-29 ダウ・コーニング・コーポレイション 強化シリコーン樹脂フィルムおよびその製造方法
CN101356237B (zh) 2005-12-21 2011-06-29 陶氏康宁公司 有机硅树脂膜，其制备方法和纳米材料填充的有机硅组合物
KR101426316B1 (ko) 2006-01-19 2014-08-06 다우 코닝 코포레이션 실리콘 수지 필름, 이의 제조방법, 및 나노물질로 충전된실리콘 조성물
US8084097B2 (en) 2006-02-20 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
CN101626893B (zh) 2007-02-22 2013-07-03 道康宁公司 增强硅树脂膜
JP5377334B2 (ja) 2007-02-22 2013-12-25 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルム
JP5571568B2 (ja) * 2007-12-18 2014-08-13 ダウ グローバル テクノロジーズ エルエルシー シリコーンポリエーテルを含む熱硬化性組成物、それらの製造及び用途
CN102007167A (zh) * 2008-02-15 2011-04-06 陶氏环球技术公司 包含有机硅聚醚的热固性组合物，及其制备和用途
JP5343025B2 (ja) * 2010-03-18 2013-11-13 新日鉄住金化学株式会社 ガスバリア性積層体フィルム
US10329439B2 (en) * 2012-09-24 2019-06-25 Chomarat North America Plastisol compositions including organosilicon compound(s)
JP2016180088A (ja) * 2014-07-24 2016-10-13 三菱化学株式会社 熱硬化性樹脂組成物及びその成形体
WO2016017592A1 (ja) * 2014-07-28 2016-02-04 住友化学株式会社 シリコーン系封止材組成物及び半導体発光装置
US9617373B2 (en) * 2015-02-13 2017-04-11 LCY Chemical Corp. Curable resin composition, article, and method for fabricating the same
CN113527818B (zh) * 2021-08-12 2022-11-29 广东生益科技股份有限公司 一种树脂组合物及其应用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189362A (ja) * 1989-01-19 1990-07-25 Shin Etsu Chem Co Ltd 熱硬化性シリコーンゴム組成物
JPH0693182A (ja) * 1992-05-28 1994-04-05 General Electric Co <Ge> 金属酸化物混合物を含む改善された耐油性を示す熱硬化エラストマー組成物
JPH07126531A (ja) * 1993-11-04 1995-05-16 Toray Dow Corning Silicone Co Ltd シリコーンゴム組成物
JPH07216234A (ja) * 1993-11-30 1995-08-15 General Electric Co <Ge> 充填剤含有熱硬化性シリコーン及びフルオルシリコーンゴム組成物
WO1999006487A1 (en) * 1997-08-01 1999-02-11 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes
JPH11335565A (ja) * 1998-04-13 1999-12-07 Dow Corning Corp 熱硬化性シリコ―ンゴム組成物
JP2001139833A (ja) * 1999-11-16 2001-05-22 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
JP2001214075A (ja) * 2000-02-04 2001-08-07 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243649A (ja) * 1986-04-15 1987-10-24 Nippon Retsuku Kk 電気絶縁用樹脂組成物
US4966922A (en) * 1988-06-09 1990-10-30 General Electric Company Dual curable silicone compositions
KR950005318B1 (ko) * 1989-09-11 1995-05-23 신에쓰 가가꾸 고오교 가부시끼가이샤 열경화성 수지 조성물
US5508323A (en) * 1992-06-29 1996-04-16 Dow Corning Corporation Method for imparting fire retardancy to organic resins
US5952439A (en) * 1993-04-15 1999-09-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
JP3339910B2 (ja) * 1993-04-15 2002-10-28 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3104568B2 (ja) * 1995-03-24 2000-10-30 信越化学工業株式会社 高電圧電気絶縁体用シリコーンゴム組成物
JPH08337680A (ja) * 1995-06-09 1996-12-24 Hitachi Ltd 熱硬化性樹脂およびその樹脂を用いた半導体装置
JPH11147934A (ja) * 1997-11-19 1999-06-02 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた高分子量エポキシフィルム
DE69922577T2 (de) * 1998-05-07 2005-12-01 Shin-Etsu Chemical Co., Ltd. Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
WO2001074927A1 (en) * 2000-03-31 2001-10-11 Hitachi Chemical Co., Ltd. Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circuit board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189362A (ja) * 1989-01-19 1990-07-25 Shin Etsu Chem Co Ltd 熱硬化性シリコーンゴム組成物
JPH0693182A (ja) * 1992-05-28 1994-04-05 General Electric Co <Ge> 金属酸化物混合物を含む改善された耐油性を示す熱硬化エラストマー組成物
JPH07126531A (ja) * 1993-11-04 1995-05-16 Toray Dow Corning Silicone Co Ltd シリコーンゴム組成物
JPH07216234A (ja) * 1993-11-30 1995-08-15 General Electric Co <Ge> 充填剤含有熱硬化性シリコーン及びフルオルシリコーンゴム組成物
WO1999006487A1 (en) * 1997-08-01 1999-02-11 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes
JPH11335565A (ja) * 1998-04-13 1999-12-07 Dow Corning Corp 熱硬化性シリコ―ンゴム組成物
JP2001139833A (ja) * 1999-11-16 2001-05-22 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
JP2001214075A (ja) * 2000-02-04 2001-08-07 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1454962A4 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006152261A (ja) * 2004-10-25 2006-06-15 Hitachi Chem Co Ltd 複合体、プリプレグ、金属箔張積層板、多層プリント配線板及びその製造方法
JP2006152260A (ja) * 2004-10-26 2006-06-15 Hitachi Chem Co Ltd 複合体、これを用いたプリプレグ、金属箔張積層板及び多層印刷配線板並びに多層印刷配線板の製造方法
CN101627096B (zh) * 2007-02-22 2012-11-07 道康宁公司 增强硅树脂膜及其制备方法
US9328242B2 (en) 2010-08-31 2016-05-03 Dow Corning Toray Co., Ltd. Polysiloxane composition and cured product thereof

Also Published As

Publication number Publication date
JP3966279B2 (ja) 2007-08-29
JP2011006710A (ja) 2011-01-13
KR100848434B1 (ko) 2008-07-28
EP1454962A1 (en) 2004-09-08
EP1454962A4 (en) 2005-01-05
CN1558931A (zh) 2004-12-29
CN100489037C (zh) 2009-05-20
JPWO2003029353A1 (ja) 2005-01-13
JP5370333B2 (ja) 2013-12-18
TW593440B (en) 2004-06-21
KR20040039407A (ko) 2004-05-10
US20050065275A1 (en) 2005-03-24

Similar Documents

Publication Publication Date Title
WO2003029353A1 (en) Thermosetting resin composition with low thermal expansion and resin film
WO2008144183A3 (en) Low density oriented polymer composition with inert inorganic filler
WO2008002734A3 (en) Thermoplastic composition having improved scratch resistance, and articles formed therefrom
EP1642930A4 (en) RESIN COMPOSITION FOR FOAM AND USE
WO2003029352A1 (fr) Composition de resine a conductivite thermique elevee et son procede de production
WO2007011731A3 (en) Nanotextured surfaces
WO2003022929A1 (en) Flame-retardant heat-resistant resin composition and adhesive film comprising the same
WO2008087978A1 (ja) 重合性単量体含有組成物
MXPA04003303A (es) Composiciones de copolimero de propileno cristalino que tienen estabilidad y propiedades opticas mejoradas y solubilidad reducida.
TW200717741A (en) Thermalsetting composition for sealing organic EL element
EP1673411A4 (en) Adhesive Compositions
WO2008139679A1 (ja) 光及び／又は熱硬化性共重合体、硬化性樹脂組成物及び硬化物
WO2008143003A1 (ja) 透明複合シート
EP1961786A4 (en) HARDENABLE COMPOSITION FOR DAMPING MATERIAL AND DAMPING MATERIAL
TW200708557A (en) Nanocomposite and thermoplastic nanocomposite resin composition using the same
WO2003054103A3 (en) Resin with high damping properties
CA2361661A1 (en) Solid-state composition comprising solid particles and binder
WO2006127245A3 (en) Low gloss thermoplastic composition
WO2009028477A1 (ja) 飽和ポリエステル系樹脂組成物及びホットメルト接着剤組成物
CA2296633A1 (en) Thermosetting epoxy powder coatings having improved degassing properties
TW200702368A (en) Novel polyimide film and usage thereof
EP1865034A4 (en) INK COMPOSITION
WO2006128127A3 (en) Resin compositions with a low coefficient of thermal expansion and articles therefrom
EP0758003A3 (en) Reinforced polycarbonate compositions with improved surface appearance
WO2006050294A8 (en) High clarity, low friction polyethylene compositions for films

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG US UZ VC VN YU ZA ZM

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE BG CH CY CZ DK EE ES FI FR GB GR IE IT LU MC PT SE SK TR BF BJ CF CG CI GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 20028187032

Country of ref document: CN

Ref document number: 1020047004264

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2003532588

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2002770210

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2002770210

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 10490646

Country of ref document: US

WWW Wipo information: withdrawn in national office

Ref document number: 2002770210

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020077002246

Country of ref document: KR