TW593440B - Thermosetting resin composition having low coefficient of thermal expansion and film using thereof - Google Patents

Thermosetting resin composition having low coefficient of thermal expansion and film using thereof Download PDF

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Publication number
TW593440B
TW593440B TW091122221A TW91122221A TW593440B TW 593440 B TW593440 B TW 593440B TW 091122221 A TW091122221 A TW 091122221A TW 91122221 A TW91122221 A TW 91122221A TW 593440 B TW593440 B TW 593440B
Authority
TW
Taiwan
Prior art keywords
thermosetting
weight
parts
thermosetting resin
resin composition
Prior art date
Application number
TW091122221A
Other languages
English (en)
Chinese (zh)
Inventor
Atsushi Takahashi
Hideo Baba
Ken Madarame
Hideo Nakako
Nozomu Takano
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of TW593440B publication Critical patent/TW593440B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Silicon Polymers (AREA)
TW091122221A 2001-09-25 2002-09-25 Thermosetting resin composition having low coefficient of thermal expansion and film using thereof TW593440B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001291635 2001-09-25

Publications (1)

Publication Number Publication Date
TW593440B true TW593440B (en) 2004-06-21

Family

ID=19113743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091122221A TW593440B (en) 2001-09-25 2002-09-25 Thermosetting resin composition having low coefficient of thermal expansion and film using thereof

Country Status (7)

Country Link
US (1) US20050065275A1 (https=)
EP (1) EP1454962A4 (https=)
JP (2) JP3966279B2 (https=)
KR (1) KR100848434B1 (https=)
CN (1) CN100489037C (https=)
TW (1) TW593440B (https=)
WO (1) WO2003029353A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL153812A0 (en) * 2003-01-06 2003-07-31 Bromine Compounds Ltd Improved wood-plastic composites
JP2006152261A (ja) * 2004-10-25 2006-06-15 Hitachi Chem Co Ltd 複合体、プリプレグ、金属箔張積層板、多層プリント配線板及びその製造方法
JP2006152260A (ja) * 2004-10-26 2006-06-15 Hitachi Chem Co Ltd 複合体、これを用いたプリプレグ、金属箔張積層板及び多層印刷配線板並びに多層印刷配線板の製造方法
KR101271662B1 (ko) 2005-02-16 2013-06-05 다우 코닝 도레이 캄파니 리미티드 강화 실리콘 수지 필름 및 이의 제조방법
US8092910B2 (en) 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
EP1856206B1 (en) * 2005-02-16 2011-10-12 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
WO2007018756A1 (en) 2005-08-04 2007-02-15 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
US8912268B2 (en) 2005-12-21 2014-12-16 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
US8084532B2 (en) 2006-01-19 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
WO2007097835A2 (en) 2006-02-20 2007-08-30 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
EP2117836B1 (en) 2007-02-22 2012-11-07 Dow Corning Corporation Reinforced silicone resin films
WO2008103226A1 (en) 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin films
JP2010519381A (ja) * 2007-02-22 2010-06-03 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルムおよびその調製方法
WO2009079205A1 (en) * 2007-12-18 2009-06-25 Dow Global Technologies Inc. Thermosetting compositions comprising silicone polyethers, their manufacture, and uses
US20110009527A1 (en) * 2008-02-15 2011-01-13 Bernd Hoevel Thermosetting compositions comprising silicone polyethers, their manufacture, and uses
JP5343025B2 (ja) * 2010-03-18 2013-11-13 新日鉄住金化学株式会社 ガスバリア性積層体フィルム
TWI522423B (zh) 2010-08-31 2016-02-21 道康寧東麗股份有限公司 聚矽氧烷組合物及其硬化物
US10329439B2 (en) * 2012-09-24 2019-06-25 Chomarat North America Plastisol compositions including organosilicon compound(s)
JP2016180088A (ja) * 2014-07-24 2016-10-13 三菱化学株式会社 熱硬化性樹脂組成物及びその成形体
WO2016017592A1 (ja) * 2014-07-28 2016-02-04 住友化学株式会社 シリコーン系封止材組成物及び半導体発光装置
US9617373B2 (en) * 2015-02-13 2017-04-11 LCY Chemical Corp. Curable resin composition, article, and method for fabricating the same
CN113527818B (zh) * 2021-08-12 2022-11-29 广东生益科技股份有限公司 一种树脂组合物及其应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243649A (ja) * 1986-04-15 1987-10-24 Nippon Retsuku Kk 電気絶縁用樹脂組成物
US4966922A (en) * 1988-06-09 1990-10-30 General Electric Company Dual curable silicone compositions
JPH0670181B2 (ja) * 1989-01-19 1994-09-07 信越化学工業株式会社 熱硬化性シリコーンゴム組成物
JP2508390B2 (ja) * 1989-09-11 1996-06-19 信越化学工業株式会社 熱硬化性樹脂組成物
CA2092457A1 (en) * 1992-05-28 1993-11-29 James E. Doin Oil resistant heat cured elastomer compositions with mixed metal oxides
US5508323A (en) * 1992-06-29 1996-04-16 Dow Corning Corporation Method for imparting fire retardancy to organic resins
JP3339910B2 (ja) * 1993-04-15 2002-10-28 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US5952439A (en) * 1993-04-15 1999-09-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
JP3464512B2 (ja) * 1993-11-04 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴム組成物
GB2284214B (en) * 1993-11-30 1998-03-04 Gen Electric Silicone and fluorosilicone heat cured filled rubber compositions
JP3104568B2 (ja) * 1995-03-24 2000-10-30 信越化学工業株式会社 高電圧電気絶縁体用シリコーンゴム組成物
JPH08337680A (ja) * 1995-06-09 1996-12-24 Hitachi Ltd 熱硬化性樹脂およびその樹脂を用いた半導体装置
US5939491A (en) * 1997-08-01 1999-08-17 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes
JPH11147934A (ja) * 1997-11-19 1999-06-02 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた高分子量エポキシフィルム
JPH11335565A (ja) * 1998-04-13 1999-12-07 Dow Corning Corp 熱硬化性シリコ―ンゴム組成物
DE69922577T2 (de) * 1998-05-07 2005-12-01 Shin-Etsu Chemical Co., Ltd. Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
JP2001139833A (ja) * 1999-11-16 2001-05-22 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
JP2001214075A (ja) * 2000-02-04 2001-08-07 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
ATE449123T1 (de) * 2000-03-31 2009-12-15 Hitachi Chemical Co Ltd Hitzehärtbare silikonzusammensetzung, harzfilm, metallfolie, isolationsfilm, metall-leiterplatte- laminat, multischicht-leiterplatte, die zusammensetzung enthaltend und verwendung der zusammensetzung

Also Published As

Publication number Publication date
KR100848434B1 (ko) 2008-07-28
EP1454962A4 (en) 2005-01-05
JP5370333B2 (ja) 2013-12-18
US20050065275A1 (en) 2005-03-24
CN1558931A (zh) 2004-12-29
EP1454962A1 (en) 2004-09-08
WO2003029353A1 (en) 2003-04-10
JP3966279B2 (ja) 2007-08-29
CN100489037C (zh) 2009-05-20
JPWO2003029353A1 (ja) 2005-01-13
JP2011006710A (ja) 2011-01-13
KR20040039407A (ko) 2004-05-10

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