WO2003015157A1 - Corps d'articulation en ceramique - Google Patents

Corps d'articulation en ceramique Download PDF

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Publication number
WO2003015157A1
WO2003015157A1 PCT/JP2002/008223 JP0208223W WO03015157A1 WO 2003015157 A1 WO2003015157 A1 WO 2003015157A1 JP 0208223 W JP0208223 W JP 0208223W WO 03015157 A1 WO03015157 A1 WO 03015157A1
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WO
WIPO (PCT)
Prior art keywords
ceramic
ceramic substrate
joint body
ceramic joint
conductive body
Prior art date
Application number
PCT/JP2002/008223
Other languages
English (en)
French (fr)
Inventor
Yasutaka Ito
Kazuteru Ohkura
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to US10/432,639 priority Critical patent/US6921881B2/en
Priority to KR10-2003-7009501A priority patent/KR20040031691A/ko
Priority to EP02758835A priority patent/EP1422754A1/en
Priority to JP2003519987A priority patent/JPWO2003015157A1/ja
Publication of WO2003015157A1 publication Critical patent/WO2003015157A1/ja

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    • H—ELECTRICITY
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    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
PCT/JP2002/008223 2001-08-10 2002-08-12 Corps d'articulation en ceramique WO2003015157A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US10/432,639 US6921881B2 (en) 2001-08-10 2002-08-12 Ceramic joint body
KR10-2003-7009501A KR20040031691A (ko) 2001-08-10 2002-08-12 세라믹 접합체
EP02758835A EP1422754A1 (en) 2001-08-10 2002-08-12 Ceramic joint body
JP2003519987A JPWO2003015157A1 (ja) 2001-08-10 2002-08-12 セラミック接合体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-243759 2001-08-10
JP2001243759 2001-08-10

Publications (1)

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WO2003015157A1 true WO2003015157A1 (fr) 2003-02-20

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PCT/JP2002/008223 WO2003015157A1 (fr) 2001-08-10 2002-08-12 Corps d'articulation en ceramique

Country Status (6)

Country Link
US (1) US6921881B2 (ja)
EP (1) EP1422754A1 (ja)
JP (1) JPWO2003015157A1 (ja)
KR (1) KR20040031691A (ja)
CN (1) CN1484855A (ja)
WO (1) WO2003015157A1 (ja)

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JP2004273866A (ja) * 2003-03-11 2004-09-30 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびそれを搭載した半導体製造装置
JP2019016676A (ja) * 2017-07-06 2019-01-31 日本特殊陶業株式会社 半導体製造装置用部品、および、半導体製造装置用部品の製造方法
JP2019149434A (ja) * 2018-02-27 2019-09-05 日本特殊陶業株式会社 保持装置

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EP1191002A4 (en) * 2000-02-24 2005-01-26 Ibiden Co Ltd SINTERED ALUMINUM NITRIDE PIECE, CERAMIC SUBSTRATE, CERAMIC HEATING BODY, AND ELECTROSTATIC CHUCK
JP2001247382A (ja) * 2000-03-06 2001-09-11 Ibiden Co Ltd セラミック基板
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JP3516392B2 (ja) * 2000-06-16 2004-04-05 イビデン株式会社 半導体製造・検査装置用ホットプレート
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JP4662725B2 (ja) * 2004-02-25 2011-03-30 日本碍子株式会社 基板加熱装置とその製造方法
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JP5025109B2 (ja) * 2005-08-26 2012-09-12 東京エレクトロン株式会社 基板載置機構、基板処理装置、および基板載置機構の製造方法
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JP5816454B2 (ja) * 2011-05-09 2015-11-18 新光電気工業株式会社 基板温調固定装置
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JP2015514661A (ja) * 2012-02-29 2015-05-21 ハリス，ジョナサン・エイチ 過渡液相、窒化アルミニウム製部品の常圧接合
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US20040071945A1 (en) 2004-04-15
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JPWO2003015157A1 (ja) 2004-12-02
CN1484855A (zh) 2004-03-24
EP1422754A1 (en) 2004-05-26

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