WO2002091478A3 - Gehäuse für ein optoelektronisches bauelement und optoelektronisches bauelement - Google Patents

Gehäuse für ein optoelektronisches bauelement und optoelektronisches bauelement Download PDF

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Publication number
WO2002091478A3
WO2002091478A3 PCT/DE2002/001645 DE0201645W WO02091478A3 WO 2002091478 A3 WO2002091478 A3 WO 2002091478A3 DE 0201645 W DE0201645 W DE 0201645W WO 02091478 A3 WO02091478 A3 WO 02091478A3
Authority
WO
WIPO (PCT)
Prior art keywords
optoelectronic component
housing
radiation
absorbs
emits
Prior art date
Application number
PCT/DE2002/001645
Other languages
English (en)
French (fr)
Other versions
WO2002091478A2 (de
Inventor
Herbert Brunner
Alfred Hartl
Werner Marchl
Original Assignee
Osram Opto Semiconductors Gmbh
Herbert Brunner
Alfred Hartl
Werner Marchl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh, Herbert Brunner, Alfred Hartl, Werner Marchl filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2002091478A2 publication Critical patent/WO2002091478A2/de
Publication of WO2002091478A3 publication Critical patent/WO2002091478A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

Die Erfindung beschreibt ein Gehäuse für ein Strahlung emittierendes und/oder empfangendes Bauelement, das einen Gehäusegrundkörper (1) mit einer Ausnehmung aufweist, wobei in der Ausnehmung ein ringförmiger Körper (5) befestigt ist, der eine Montagefläche für ein Strahlung emittierendes und/oder empfangendes Element umschliesst und derart gebildet ist, dass eine Innenfläche der Ringapertur zumindest teilweise als Reflektor für die Strahlung dient. Weiterhin beschreibt die Erfindung ein mit einem solchen Gehäuse ausgestattetes Bauelement.
PCT/DE2002/001645 2001-05-07 2002-05-07 Gehäuse für ein optoelektronisches bauelement und optoelektronisches bauelement WO2002091478A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10122002A DE10122002A1 (de) 2001-05-07 2001-05-07 Gehäuse für ein optoelektronisches Bauelement und optoelektronisches Bauelement
DE10122002.2 2001-05-07

Publications (2)

Publication Number Publication Date
WO2002091478A2 WO2002091478A2 (de) 2002-11-14
WO2002091478A3 true WO2002091478A3 (de) 2003-02-20

Family

ID=7683821

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/001645 WO2002091478A2 (de) 2001-05-07 2002-05-07 Gehäuse für ein optoelektronisches bauelement und optoelektronisches bauelement

Country Status (2)

Country Link
DE (1) DE10122002A1 (de)
WO (1) WO2002091478A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105258084A (zh) * 2014-07-11 2016-01-20 欧司朗有限公司 具有led的led模块和用于制造led模块的方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI237546B (en) 2003-01-30 2005-08-01 Osram Opto Semiconductors Gmbh Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component
DE20306928U1 (de) * 2003-01-30 2004-06-03 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung aussendendes und/oder empfangendes Halbleiter-Bauelement und Gehäuse-Grundkörper für ein derartiges Bauelement
JP2004265977A (ja) * 2003-02-28 2004-09-24 Noritsu Koki Co Ltd 発光ダイオード光源ユニット
DE102004014207A1 (de) * 2004-03-23 2005-10-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit mehrteiligem Gehäusekörper
EP1751806B1 (de) 2004-05-31 2019-09-11 OSRAM Opto Semiconductors GmbH Optoelektronisches halbleiterbauelement und gehäuse-grundkörper für ein derartiges bauelement
DE102004045950A1 (de) * 2004-09-22 2006-03-30 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102005012398B4 (de) * 2004-11-30 2011-02-03 Osram Opto Semiconductors Gmbh Optischer Reflektor und Verfahren zu dessen Herstellung
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
DE102005002352A1 (de) * 2005-01-18 2006-07-27 Vishay Semiconductor Gmbh Infrarot-Transceiver und Herstellungsverfahren
US20060293435A1 (en) 2005-06-10 2006-12-28 Marens Marvin M Light-emitting diode assembly housing comprising high temperature polyamide compositions
JP4828248B2 (ja) * 2006-02-16 2011-11-30 新光電気工業株式会社 発光装置及びその製造方法
DE102008038748B4 (de) * 2008-08-12 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenmontierbares, optoelektronisches Halbleiterbauteil
US8525213B2 (en) 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
DE102010025319B4 (de) 2010-06-28 2022-05-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines oberflächenmontierbaren Halbleiterbauelements und oberflächenmontierbare Halbleiterbauelemente
KR20120108437A (ko) * 2011-03-24 2012-10-05 삼성전자주식회사 발광소자 패키지
DE102011116534B4 (de) * 2011-10-20 2022-06-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierendes Bauelement

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919585A (en) * 1974-05-24 1975-11-11 Bell Telephone Labor Inc Encapsulation for light emitting element providing high on-off contrast
JPS5856483A (ja) * 1981-09-30 1983-04-04 Toshiba Corp 光半導体装置
EP0854523A2 (de) * 1997-01-15 1998-07-22 Toshiba Corporation Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren
JPH10242526A (ja) * 1997-02-21 1998-09-11 Citizen Electron Co Ltd 表面実装型発光ダイオード及びその製造方法
JP2000277813A (ja) * 1999-03-26 2000-10-06 Matsushita Electric Works Ltd 光源装置
WO2001024281A1 (de) * 1999-09-30 2001-04-05 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelektronisches bauelement mit reflektor und verfahren zur herstellung desselben
WO2001082385A1 (de) * 2000-04-26 2001-11-01 Osram Opto Semiconductors Gmbh Strahlungsemittierendes halbleiterbauelement mit lumineszenzkonversionselement

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2065940T3 (es) * 1989-05-31 1995-03-01 Siemens Ag Opto-componente montable en la superficie.
US6274924B1 (en) * 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
KR100425566B1 (ko) * 1999-06-23 2004-04-01 가부시키가이샤 시티즌 덴시 발광 다이오드

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919585A (en) * 1974-05-24 1975-11-11 Bell Telephone Labor Inc Encapsulation for light emitting element providing high on-off contrast
JPS5856483A (ja) * 1981-09-30 1983-04-04 Toshiba Corp 光半導体装置
EP0854523A2 (de) * 1997-01-15 1998-07-22 Toshiba Corporation Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren
JPH10242526A (ja) * 1997-02-21 1998-09-11 Citizen Electron Co Ltd 表面実装型発光ダイオード及びその製造方法
JP2000277813A (ja) * 1999-03-26 2000-10-06 Matsushita Electric Works Ltd 光源装置
WO2001024281A1 (de) * 1999-09-30 2001-04-05 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelektronisches bauelement mit reflektor und verfahren zur herstellung desselben
WO2001082385A1 (de) * 2000-04-26 2001-11-01 Osram Opto Semiconductors Gmbh Strahlungsemittierendes halbleiterbauelement mit lumineszenzkonversionselement

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 144 (E - 183) 23 June 1983 (1983-06-23) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105258084A (zh) * 2014-07-11 2016-01-20 欧司朗有限公司 具有led的led模块和用于制造led模块的方法

Also Published As

Publication number Publication date
WO2002091478A2 (de) 2002-11-14
DE10122002A1 (de) 2002-11-21

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