WO2003010807A1 - Procede de fabrication d'un dispositif de circuit integre semi-conducteur - Google Patents
Procede de fabrication d'un dispositif de circuit integre semi-conducteur Download PDFInfo
- Publication number
- WO2003010807A1 WO2003010807A1 PCT/JP2002/007445 JP0207445W WO03010807A1 WO 2003010807 A1 WO2003010807 A1 WO 2003010807A1 JP 0207445 W JP0207445 W JP 0207445W WO 03010807 A1 WO03010807 A1 WO 03010807A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- manufacturing semiconductor
- wafer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005498 polishing Methods 0.000 abstract 3
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Semiconductor Memories (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Element Separation (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Cette invention porte sur un procédé de fabrication d'un dispositif de circuit intégré semi-conducteur, lequel procédé consiste à détecter si une rayure apparaît sur la surface polie d'une tranche (7) à la suite d'un traitement de polissage par la détection de vibrations générées par la tranche (7) lors du polissage au moyen d'un détecteur (9) de vibrations disposé dans un touret de polisseur (3).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001222695A JP2003037090A (ja) | 2001-07-24 | 2001-07-24 | 半導体集積回路装置の製造方法 |
JP2001-222695 | 2001-07-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003010807A1 true WO2003010807A1 (fr) | 2003-02-06 |
Family
ID=19056135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/007445 WO2003010807A1 (fr) | 2001-07-24 | 2002-07-23 | Procede de fabrication d'un dispositif de circuit integre semi-conducteur |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2003037090A (fr) |
WO (1) | WO2003010807A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6030041B2 (ja) * | 2013-11-01 | 2016-11-24 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
US9878421B2 (en) * | 2014-06-16 | 2018-01-30 | Applied Materials, Inc. | Chemical mechanical polishing retaining ring with integrated sensor |
JP6739899B2 (ja) * | 2015-01-16 | 2020-08-12 | キオクシア株式会社 | 半導体装置の製造方法および半導体製造装置 |
JP6400620B2 (ja) | 2016-03-11 | 2018-10-03 | 東芝メモリ株式会社 | 半導体製造装置の制御装置および制御方法 |
JP6860727B2 (ja) * | 2020-04-24 | 2021-04-21 | キオクシア株式会社 | 半導体装置の製造方法および半導体製造装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0739687A2 (fr) * | 1995-04-26 | 1996-10-30 | Fujitsu Limited | Procédé et dispositif de polissage |
JPH11254304A (ja) * | 1998-03-10 | 1999-09-21 | Super Silicon Kenkyusho:Kk | センサを組み込んだ定盤 |
JP2001096455A (ja) * | 1999-09-28 | 2001-04-10 | Ebara Corp | 研磨装置 |
JP2002160154A (ja) * | 2000-09-18 | 2002-06-04 | Stmicroelectronics Inc | Cmp処理のモニタ/制御に対する音響分光分析の使用 |
-
2001
- 2001-07-24 JP JP2001222695A patent/JP2003037090A/ja active Pending
-
2002
- 2002-07-23 WO PCT/JP2002/007445 patent/WO2003010807A1/fr unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0739687A2 (fr) * | 1995-04-26 | 1996-10-30 | Fujitsu Limited | Procédé et dispositif de polissage |
JPH11254304A (ja) * | 1998-03-10 | 1999-09-21 | Super Silicon Kenkyusho:Kk | センサを組み込んだ定盤 |
JP2001096455A (ja) * | 1999-09-28 | 2001-04-10 | Ebara Corp | 研磨装置 |
JP2002160154A (ja) * | 2000-09-18 | 2002-06-04 | Stmicroelectronics Inc | Cmp処理のモニタ/制御に対する音響分光分析の使用 |
Also Published As
Publication number | Publication date |
---|---|
JP2003037090A (ja) | 2003-02-07 |
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