WO2003009362A1 - Element de polissage, dispositif de polissage mecano-chimique (cmp) et procede de production de dispositif a semi-conducteur - Google Patents
Element de polissage, dispositif de polissage mecano-chimique (cmp) et procede de production de dispositif a semi-conducteur Download PDFInfo
- Publication number
- WO2003009362A1 WO2003009362A1 PCT/JP2002/006780 JP0206780W WO03009362A1 WO 2003009362 A1 WO2003009362 A1 WO 2003009362A1 JP 0206780 W JP0206780 W JP 0206780W WO 03009362 A1 WO03009362 A1 WO 03009362A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- wafer
- productionj
- elastic member
- semiconductor device
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 11
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000002390 adhesive tape Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/20—Mountings for the wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020037007085A KR100564125B1 (ko) | 2001-07-19 | 2002-07-04 | 연마체, 화학 기계적 연마 장치 및 반도체 디바이스의제조 방법 |
US10/467,627 US20040242132A1 (en) | 2001-07-19 | 2002-07-04 | Polishing element, cmp polishing device and productionj method for semiconductor device |
EP02743826A EP1408538A4 (en) | 2001-07-19 | 2002-07-04 | POLISHING ELEMENT, CMP POLISHING DEVICE AND MANUFACTURING METHOD FOR A SEMICONDUCTOR COMPONENT |
JP2003514607A JPWO2003009362A1 (ja) | 2001-07-19 | 2002-07-04 | 研磨体、cmp研磨装置及び半導体デバイスの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-219431 | 2001-07-19 | ||
JP2001219431 | 2001-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003009362A1 true WO2003009362A1 (fr) | 2003-01-30 |
Family
ID=19053436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/006780 WO2003009362A1 (fr) | 2001-07-19 | 2002-07-04 | Element de polissage, dispositif de polissage mecano-chimique (cmp) et procede de production de dispositif a semi-conducteur |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040242132A1 (ja) |
EP (1) | EP1408538A4 (ja) |
JP (1) | JPWO2003009362A1 (ja) |
KR (1) | KR100564125B1 (ja) |
CN (1) | CN1224082C (ja) |
TW (1) | TW537945B (ja) |
WO (1) | WO2003009362A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007021604A (ja) * | 2005-07-13 | 2007-02-01 | Nitta Haas Inc | 研磨布固定用の両面粘着テープおよびこれを備えた研磨布 |
JP2008307610A (ja) * | 2007-06-12 | 2008-12-25 | Nikon Corp | 研磨パッドのサイズ設定方法 |
JP2011507720A (ja) * | 2007-12-31 | 2011-03-10 | イノパッド,インコーポレイテッド | 化学的機械的平坦化パッド |
KR20150080696A (ko) * | 2014-01-02 | 2015-07-10 | 주식회사 엘지실트론 | 웨이퍼 연마 장치 |
WO2020115867A1 (ja) * | 2018-12-06 | 2020-06-11 | 三菱電機株式会社 | Osr貼り付け装置及びosr貼り付け方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004023009A (ja) | 2002-06-20 | 2004-01-22 | Nikon Corp | 研磨体、研磨装置、半導体デバイス及び半導体デバイス製造方法 |
US7348276B2 (en) | 2005-03-30 | 2008-03-25 | Fujitsu, Limited | Fabrication process of semiconductor device and polishing method |
EP1981685B1 (en) * | 2006-01-30 | 2012-05-30 | MEMC Electronic Materials, Inc. | Double side wafer grinder and methods for assessing workpiece nanotopology |
DE202006004193U1 (de) * | 2006-03-14 | 2006-06-08 | Richter, Harald | Adapterplatte für einen Vakuumsauger |
KR100901982B1 (ko) * | 2007-07-12 | 2009-06-08 | 주식회사 실트론 | 접착강도 시험장치 |
DE102010040512B4 (de) | 2010-09-09 | 2016-03-10 | Infineon Technologies Ag | Chip mit einer Hochfrequenzschalteranordnung und Schaltungsanordnung, Verfahren zur Herstellung einer Hochfrequenzschaltungsanordnung |
CN105500186A (zh) * | 2016-01-21 | 2016-04-20 | 苏州新美光纳米科技有限公司 | 晶片抛光用抛光垫及抛光垫的自吸附方法 |
JP6765267B2 (ja) * | 2016-09-28 | 2020-10-07 | 株式会社ディスコ | 研磨ユニット |
JP6986930B2 (ja) * | 2017-11-07 | 2021-12-22 | 株式会社荏原製作所 | 基板研磨装置および研磨方法 |
CN109648463B (zh) * | 2018-12-14 | 2021-04-23 | 厦门大学 | 一种半导体晶片光电化学机械抛光加工方法 |
CN113414717A (zh) * | 2021-08-05 | 2021-09-21 | 燕山大学 | 一种复合杯形抛光轮及其抛光方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0950974A (ja) * | 1995-08-07 | 1997-02-18 | Sony Corp | 研磨布及び半導体装置の製造方法 |
EP0845328A2 (en) * | 1996-11-29 | 1998-06-03 | Sumitomo Metal Industries, Ltd. | Polishing pad and apparatus for polishing a semiconductor wafer |
JPH11156701A (ja) * | 1997-11-28 | 1999-06-15 | Nec Corp | 研磨パッド |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5287663A (en) * | 1992-01-21 | 1994-02-22 | National Semiconductor Corporation | Polishing pad and method for polishing semiconductor wafers |
US5938504A (en) * | 1993-11-16 | 1999-08-17 | Applied Materials, Inc. | Substrate polishing apparatus |
JP2891083B2 (ja) * | 1993-12-14 | 1999-05-17 | 信越半導体株式会社 | シート状研磨部材およびウエーハ研磨装置 |
US5564965A (en) * | 1993-12-14 | 1996-10-15 | Shin-Etsu Handotai Co., Ltd. | Polishing member and wafer polishing apparatus |
US6099954A (en) * | 1995-04-24 | 2000-08-08 | Rodel Holdings, Inc. | Polishing material and method of polishing a surface |
US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
US5921856A (en) * | 1997-07-10 | 1999-07-13 | Sp3, Inc. | CVD diamond coated substrate for polishing pad conditioning head and method for making same |
US5931724A (en) * | 1997-07-11 | 1999-08-03 | Applied Materials, Inc. | Mechanical fastener to hold a polishing pad on a platen in a chemical mechanical polishing system |
US5882251A (en) * | 1997-08-19 | 1999-03-16 | Lsi Logic Corporation | Chemical mechanical polishing pad slurry distribution grooves |
JP2000077366A (ja) * | 1998-08-28 | 2000-03-14 | Nitta Ind Corp | 研磨布及びその研磨布の研磨機定盤への脱着方法 |
JP2001054859A (ja) * | 1999-08-20 | 2001-02-27 | Nikon Corp | 研磨装置及び研磨部材 |
JP2001160545A (ja) * | 1999-12-02 | 2001-06-12 | Okamoto Machine Tool Works Ltd | 半導体基板上の白金層の化学機械研磨方法 |
US6402591B1 (en) * | 2000-03-31 | 2002-06-11 | Lam Research Corporation | Planarization system for chemical-mechanical polishing |
US6561889B1 (en) * | 2000-12-27 | 2003-05-13 | Lam Research Corporation | Methods for making reinforced wafer polishing pads and apparatuses implementing the same |
-
2002
- 2002-07-04 KR KR1020037007085A patent/KR100564125B1/ko active IP Right Grant
- 2002-07-04 EP EP02743826A patent/EP1408538A4/en not_active Withdrawn
- 2002-07-04 US US10/467,627 patent/US20040242132A1/en not_active Abandoned
- 2002-07-04 CN CNB028059743A patent/CN1224082C/zh not_active Expired - Lifetime
- 2002-07-04 WO PCT/JP2002/006780 patent/WO2003009362A1/ja active IP Right Grant
- 2002-07-04 JP JP2003514607A patent/JPWO2003009362A1/ja active Pending
- 2002-07-19 TW TW091116079A patent/TW537945B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0950974A (ja) * | 1995-08-07 | 1997-02-18 | Sony Corp | 研磨布及び半導体装置の製造方法 |
EP0845328A2 (en) * | 1996-11-29 | 1998-06-03 | Sumitomo Metal Industries, Ltd. | Polishing pad and apparatus for polishing a semiconductor wafer |
JPH11156701A (ja) * | 1997-11-28 | 1999-06-15 | Nec Corp | 研磨パッド |
Non-Patent Citations (1)
Title |
---|
See also references of EP1408538A4 * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007021604A (ja) * | 2005-07-13 | 2007-02-01 | Nitta Haas Inc | 研磨布固定用の両面粘着テープおよびこれを備えた研磨布 |
JP2008307610A (ja) * | 2007-06-12 | 2008-12-25 | Nikon Corp | 研磨パッドのサイズ設定方法 |
JP2011507720A (ja) * | 2007-12-31 | 2011-03-10 | イノパッド,インコーポレイテッド | 化学的機械的平坦化パッド |
KR20150080696A (ko) * | 2014-01-02 | 2015-07-10 | 주식회사 엘지실트론 | 웨이퍼 연마 장치 |
KR101596561B1 (ko) | 2014-01-02 | 2016-03-07 | 주식회사 엘지실트론 | 웨이퍼 연마 장치 |
WO2020115867A1 (ja) * | 2018-12-06 | 2020-06-11 | 三菱電機株式会社 | Osr貼り付け装置及びosr貼り付け方法 |
JPWO2020115867A1 (ja) * | 2018-12-06 | 2021-09-02 | 三菱電機株式会社 | Osr貼り付け装置及びosr貼り付け方法 |
JP7101812B2 (ja) | 2018-12-06 | 2022-07-15 | 三菱電機株式会社 | Osr貼り付け装置及びosr貼り付け方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2003009362A1 (ja) | 2004-11-11 |
CN1494734A (zh) | 2004-05-05 |
TW537945B (en) | 2003-06-21 |
EP1408538A4 (en) | 2008-07-09 |
US20040242132A1 (en) | 2004-12-02 |
KR100564125B1 (ko) | 2006-03-27 |
CN1224082C (zh) | 2005-10-19 |
KR20040010566A (ko) | 2004-01-31 |
EP1408538A1 (en) | 2004-04-14 |
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