WO2002059861A1 - Display device - Google Patents

Display device Download PDF

Info

Publication number
WO2002059861A1
WO2002059861A1 PCT/JP2002/000501 JP0200501W WO02059861A1 WO 2002059861 A1 WO2002059861 A1 WO 2002059861A1 JP 0200501 W JP0200501 W JP 0200501W WO 02059861 A1 WO02059861 A1 WO 02059861A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing member
display device
resin material
resin
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/000501
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Yuichi Iwase
Yasunori Kijima
Toshimasa Sakayori
Kenichi Horie
Takashi Sugio
Takehito Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to KR10-2003-7009704A priority Critical patent/KR20030076623A/ko
Priority to EP02716357A priority patent/EP1361556A4/en
Priority to US10/466,901 priority patent/US8797484B2/en
Publication of WO2002059861A1 publication Critical patent/WO2002059861A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission

Definitions

  • FIG. 22 shows a light emitting element used in an organic electroluminescent device among the light emitting elements used in such a display device.
  • An example of a configuration of an organic electroluminescence (electroluminescence) device is shown below.
  • dark spots generally occur in a size that is invisible to the naked eye immediately after driving, and grow by continuous driving with this as a nucleus. It is also known that dark spots occur even in a storage state where no driving is performed, and grow over time.
  • FIG. 1 is a diagram showing a configuration of a display device according to the embodiment.
  • An organic EL element (hereinafter simply referred to as a light emitting element) 2 is, for example, a light-transmitting substrate when the display device is a “transmissive type” in which light is emitted from the element member L (base material 1) side.
  • a light-transmitting lower electrode 3 formed by sputtering is provided on the material 1.
  • the lower electrode 3 is used, for example, as an anode electrode.
  • a hole transport layer 4, a light emitting layer 5, and an electron transport layer 6 are sequentially provided.
  • An upper electrode 7 serving as a force source electrode is provided on the upper side, and the light emitting element 2 is configured by this.
  • co-evaporation of trace molecules may be performed for the purpose of controlling the emission spectrum of the light-emitting layer 5.
  • the organic thin film contains a trace amount of an organic substance such as a berylen derivative, a coumarin derivative, or a pyran dye, good.
  • the laminating means 13 includes a substantially box-shaped support member 32 whose front and top surfaces are open, and is supported by the support member 32 and uses a suction force from a vacuum pump (not shown) to form a sealing member U.
  • Holding means 33 capable of adsorbing and holding, and pressing force applying means 34 supported by the support 32 and capable of moving left and right while pressing the outer surface of the sealing member U, and the support 32
  • a support moving means 36 for moving the support in the vertical and horizontal directions.
  • FIGS. 3 and 7 to 16 a method of bonding the sealing member U to the element member L on which the light emitting element 2 is formed by using the bonding apparatus 10 according to the present embodiment is shown in FIGS. 3 and 7 to 16. This will be described with reference to FIG.
  • the display area '1a side where the light emitting element 2 is formed is used as the bonding surface L1, and the element member L is placed on the mounting table with the bonding surface L1 facing up.
  • 11 1 While installing in the right area on the top surface 1 1, the sealing member U is installed in the left area, and the claws 11 1 B are protruded and retracted to move the element member L and the sealing member U in the surface direction. Regulate.
  • the application of the resin material M by the application means 12 is started. That is, by moving the syringe device 16 by the syringe moving means 17, the tip side of the nozzle 20 is moved to one end in the left-right direction of the bonding surface L 1.
  • the discharge of the resin material M is started in the opposite direction, and a substantially linear bead B (see FIG. 4) extending in the same direction is reciprocated in the left-right direction of the syringe device 16 onto the bonding surface L1. Many are formed at predetermined intervals.
  • the application amount of the resin material M, the length and the pitch of the bead B, and the like can be arbitrarily set, whereby the thickness of the resin layer after the element member L and the sealing member U are bonded to each other can be set. Can be arbitrarily controlled.
  • the entire application means 12 moves to the depth side of the apparatus to create a space where the bonding means 13 can be positioned.
  • the suction pad 46 rises with respect to the suction block 44 while sucking the sealing member U, and as a result, the suction pad
  • the left end region of the sealing member U on the block 44 side is the base end side, and the sealing member U is held while bending the free end side of the suction pad 46 side upward.
  • the support 32 is further lowered to bring the left end side region of the sealing member U into contact with the resin material M first.
  • the suction pad 46 is slightly lowered with respect to the suction block 44, whereby the contact area between the sealing member U and the resin material M is on the right side.
  • the resin material M slightly expands and the resin material M located below the pressure roller 55 is crushed.
  • the resin material] VI is applied to a plurality of locations on the element member L so that the beads B are formed at predetermined intervals as shown in FIG.
  • the beads B are provided in a dome shape such that they can be substantially point-contacted at the initial contact when the sealing member U first contacts the element member L, as shown in FIG. 17B. M and sealing member The contact area of U becomes small, and it becomes difficult to mix air between them.
  • an air escape passage 28 is formed between the beads B, and the pressing force applying means 34 moves the sealing member U while pressing the sealing member U along the extending direction of the air escape passage 28.
  • the manufacture of the display device S using the organic EL element as the light emitting element 2 has been exemplified.
  • the present invention is not limited to this, and the present invention is not limited to this. It can also be applied.
  • the bonding device 10 or the bonding device is used. It is also possible to use 100.
  • each unit of the device in the present embodiment is not limited to the illustrated configuration example, and various changes can be made as long as substantially the same operation is achieved.
  • the light emitting element 2 was formed in the display area 1a on the substrate 1 made of a glass plate.
  • a sealing member U was bonded to an element member L having a light emitting element 2 formed on a substrate 1 by the above method in the same manner as in Example 1. Made in this way The resulting display device was a “top emission type” display device in which emitted light was extracted from the sealing member U side.
  • the light emitting element 2 was formed in the display area 1a on the base material 1 made of a glass plate to obtain an element member L.
  • ⁇ -NPD ⁇ -naphtyl pheni 1 diamine
  • Fig. 21 a hole transport layer under vacuum by vacuum evaporation.
  • A1q3 8-hydroxyquinor ine alminum
  • Li was deposited to about 0.5 nm as the cathode electrode.
  • A1Cu (Cu-1 weight percent) was deposited to a thickness of 200 nm as a force electrode sealing layer by vapor deposition (deposition rate: 0.3 nm Zsec.).
  • a light emitting element 2 was fabricated by vapor-depositing a 200 nm Au Ge electrode in order to complete the sealing.
  • the maximum emission wavelength was 520 nm, and the coordinates on the CIE chromaticity coordinates were (0.32, 0.55). Good green emission was exhibited.
  • the luminance at a current density of 400 mA / cm 2 was 260 000 cdZm 2 . It was clear that the shape of the light emitting scan Bae spectrum the emission from A 1 d 3.
  • the light emitting element 2 was formed in the display area 1a on the substrate 1 made of a glass plate.
  • the maximum emission wavelength was 520 nm, and the coordinates on the CIE chromaticity coordinates were (0.32, 0.55).
  • the luminance at a current density of 400 O mA / cm 2 was 1,600 cd Zm 2 . It was clear from the shape of the light emitting spectrum that light was emitted from A 1 Q 3 .
  • a sealing member U was bonded to an element member L having a light emitting element 2 formed on a substrate 1 by the above method in the same manner as in Example 1.
  • the display device manufactured in this manner was a “top emission type” display device in which light was emitted from the sealing member U side.
  • Example 2 When a drive test of the display device manufactured in this manner was performed under the same conditions as in Example 1 (initial luminance: 200 cd Zm 2 ), one hour after driving, the light emitting surface can be observed with the naked eye. There were no dark spots, and no dark spots were observed by observation through a 10-fold finder. It was also confirmed that no bubbles were mixed into the resin layer m.
  • a resin material is applied to a plurality of locations so that an air escape passage is formed between an element member provided with a display area and a sealing member.
  • a bonding force is applied along the air escape passage between the member and the sealing member, air is expelled from the air escape passage to the outside.
  • the resin layer is formed so that the partially applied resin material continues.
  • a display device in which no bubbles remain between the display region of the element member and the sealing member is obtained by forming the display device in which the element member and the sealing member are attached to each other in a state in which the sealing member is bonded. Can be.

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/JP2002/000501 2001-01-24 2002-01-24 Display device Ceased WO2002059861A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR10-2003-7009704A KR20030076623A (ko) 2001-01-24 2002-01-24 표시장치
EP02716357A EP1361556A4 (en) 2001-01-24 2002-01-24 DISPLAY DEVICE
US10/466,901 US8797484B2 (en) 2001-01-24 2002-01-24 Display apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001015425A JP3903204B2 (ja) 2001-01-24 2001-01-24 表示装置の製造方法
JP2001-015425 2001-01-24

Publications (1)

Publication Number Publication Date
WO2002059861A1 true WO2002059861A1 (en) 2002-08-01

Family

ID=18881977

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/000501 Ceased WO2002059861A1 (en) 2001-01-24 2002-01-24 Display device

Country Status (7)

Country Link
US (1) US8797484B2 (https=)
EP (1) EP1361556A4 (https=)
JP (1) JP3903204B2 (https=)
KR (1) KR20030076623A (https=)
CN (1) CN1578973A (https=)
TW (1) TWI308030B (https=)
WO (1) WO2002059861A1 (https=)

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JP4240276B2 (ja) 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 発光装置
JP2004191608A (ja) * 2002-12-11 2004-07-08 Sony Corp 表示装置およびその製造方法
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JP4581342B2 (ja) * 2003-06-13 2010-11-17 株式会社スリーボンド 貼合装置
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KR100801623B1 (ko) 2006-06-23 2008-02-11 삼성전자주식회사 표시장치의 제조방법과 이에 사용되는 표시장치의 제조장치및 이에 의하여 제조된 표시장치
JP5164422B2 (ja) 2007-04-26 2013-03-21 本田技研工業株式会社 燃料電池用膜電極構造体及びセパレータの積層方法及びその積層装置
EP2153699B1 (en) * 2007-05-18 2016-07-13 Henkel AG & Co. KGaA Organic electronic devices protected by elastomeric laminating adhesive
JP5197089B2 (ja) * 2008-03-27 2013-05-15 株式会社ジャパンディスプレイセントラル 平面表示装置の製造方法及び製造装置
JP5195385B2 (ja) * 2008-12-15 2013-05-08 カシオ計算機株式会社 保護板一体型表示パネルの製造装置
JP2009187962A (ja) * 2009-05-26 2009-08-20 Seiko Epson Corp 電気光学装置及び電子機器
US8246867B2 (en) * 2009-10-16 2012-08-21 Corning Incorporated Method for assembling an optoelectronic device
SG179299A1 (en) * 2010-09-13 2012-04-27 Trimech Technology Pte Ltd A display panel substrate assembly, an apparatus and a method for forming a display panel substrate assembly
JP5898698B2 (ja) * 2011-12-12 2016-04-06 株式会社日立製作所 半導体光素子
TWI457070B (zh) 2011-12-23 2014-10-11 Au Optronics Corp 顯示裝置及其組裝方法
JP5857765B2 (ja) * 2012-02-01 2016-02-10 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子
US20140071392A1 (en) * 2012-09-07 2014-03-13 Apple Inc. Initial contact control for lamination
WO2014077063A1 (ja) 2012-11-16 2014-05-22 コニカミノルタ株式会社 透光性電極、及び、電子デバイス
CN103848575B (zh) * 2012-12-07 2016-09-14 普罗科技有限公司 薄膜晶体管液晶显示面板制造方法
CN104626720B (zh) * 2013-11-07 2017-02-15 宸鸿科技(厦门)有限公司 面板贴合结构以及贴合方法
CN103647007B (zh) * 2013-12-30 2016-06-08 广州市鸿利光电股份有限公司 一种cob封装方法
US20150372251A1 (en) * 2014-06-19 2015-12-24 Toshishige Fujii Electric element package
CN104022234B (zh) * 2014-06-24 2016-10-26 深圳市华星光电技术有限公司 Oled封装设备及oled面板的封装方法
KR102190249B1 (ko) * 2014-07-25 2020-12-14 삼성디스플레이 주식회사 라미네이션 장치 및 라미네이션 방법
TWI900265B (zh) * 2024-09-30 2025-10-01 友達光電股份有限公司 顯示面板

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Also Published As

Publication number Publication date
CN1578973A (zh) 2005-02-09
US20040100601A1 (en) 2004-05-27
JP3903204B2 (ja) 2007-04-11
TWI308030B (https=) 2009-03-21
JP2002216950A (ja) 2002-08-02
EP1361556A1 (en) 2003-11-12
US8797484B2 (en) 2014-08-05
KR20030076623A (ko) 2003-09-26
EP1361556A4 (en) 2009-08-05

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