WO2002052236A1 - Capteur de contrainte - Google Patents

Capteur de contrainte Download PDF

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Publication number
WO2002052236A1
WO2002052236A1 PCT/JP2001/011017 JP0111017W WO02052236A1 WO 2002052236 A1 WO2002052236 A1 WO 2002052236A1 JP 0111017 W JP0111017 W JP 0111017W WO 02052236 A1 WO02052236 A1 WO 02052236A1
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WO
WIPO (PCT)
Prior art keywords
stress
sensor
substrate
strain gauge
post
Prior art date
Application number
PCT/JP2001/011017
Other languages
English (en)
Japanese (ja)
Inventor
Etsuo Ooba
Original Assignee
K-Tech Devices Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K-Tech Devices Corp. filed Critical K-Tech Devices Corp.
Priority to JP2002553085A priority Critical patent/JPWO2002052236A1/ja
Publication of WO2002052236A1 publication Critical patent/WO2002052236A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
    • G01L5/223—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to joystick controls
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
    • G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges

Definitions

  • the present invention relates to a stress sensor that can be used for a pointing device for a personal computer, a multifunctional switch for various electronic devices, and the like.
  • a stress sensor portion and a stress sensor support portion are separately manufactured, and they are later joined.
  • a stress sensor portion composed of a substrate and a post is supported on a stress sensor support portion, that is, a printed circuit board by soldering.
  • ⁇ Fixed configuration is shown. The use of a stress sensor always applies stress to the sensor. Then, in the stress sensor having the above configuration, the stress propagates to the solder and the printed circuit board.
  • the stress is applied to the boss in the X direction (that is, the lateral direction of the resident), and in Fig.
  • an object of the present invention is to provide a stress sensor that can withstand long-term use. Disclosure of the invention
  • the single substrate 4 has both the sensor unit 1 and the sensor support unit (hereinafter, simply referred to as a support unit '), and the sensor unit 1 is provided. Strain in response to the applied stress, and the electrical characteristics change in response to the deformation.
  • the substrate 4 to be deformed has a stress dispersing means 10.
  • a stress sensor functions as a stress sensor only when it has a control unit that detects and calculates the above-mentioned electrical characteristics.
  • a portion excluding the control unit is referred to as a “stress sensor” for convenience.
  • the single substrate 4 serves as both the sensor unit 1 and the support unit 2. Therefore, a binding material between the sensor unit 1 and the support unit 2 is not required, and the deterioration of the stress sensor itself due to the degradation of the binding force of the binding material cannot occur.
  • it since it is a single substrate, there is an advantage that the number of components can be reduced as compared with the conventional case.
  • the substrate deformed portion corresponding to the strain gauge 5 (hereinafter, referred to as a first deformed portion) has the stress dispersing means 10, damage or destruction of the stress sensor components due to local stress concentration. Can be avoided. Therefore, it is possible to provide a stress sensor that can withstand use for a long time.
  • the means for deforming a part of the sensor unit 1 in response to the applied stress is, for example, the post 3 shown in FIG. 2 and the like.
  • the strain gauge 5 whose electrical characteristics change in response to deformation is, for example, a resistance element ⁇ a piezoelectric element.
  • Fig. 2 shows an example of the basic structure of the sensor unit 1.
  • Fig. 2 (a) is a perspective view of the basic structure of the sensor unit 1
  • Fig. 2 (b) is a bottom view of the basic structure of the sensor unit 1
  • Fig. 2 (c) is a top view of the basic structure of the sensor unit 1.
  • 2 (d) is a perspective view of the basic structure of the sensor unit 1 and the support unit 2.
  • FIG. Four strain gauges 5 are arranged in the center of the lower surface of the cross-shaped substrate 4 having a central region and a plurality of flaky regions coupled to the central region (the junction between the central region and the flaky region).
  • the post 3 is arranged on the upper surface of the substrate 4 that can stimulate the strain gauge 5.
  • the post 3 When the four outer ends of the cross-shaped substrate 4 are fixed in some way, and a stress is applied to the post 3 in the X direction (that is, in the lateral direction), the post 3 operates as shown in FIG. That is, the substrate 4 bends, and at the same time, some of the resistors 6 constituting the strain gauge 5 It contracts and some of the resistors 6 expand. Or, all the strain gauges 5 extend, but the degree of extension of each strain gauge 5 differs.
  • the post 3 When a stress is applied to the post 3 in the z direction (that is, in the downward direction), the post 3 operates as shown in Fig. 3 (b). That is, when the substrate 4 bends, all of the resistors 6 constituting the strain gauge 5 expand to substantially the same extent. Then, the resistance value of each resistor 6 changes, and a change in the resistance value is output from the terminal 8, and a measuring unit (not shown) detects the change and makes it possible to grasp the magnitude and direction of the stress.
  • FIG. 2 is a perspective view of a configuration in which a support section 2 is added to the basic structure of the sensor section 1.
  • FIG. 1 shows a top view of a stress sensor according to the present invention, which is similar to a configuration in which a holding portion 2 is added to the basic structure of the sensor portion 1.
  • the substantially cross-shaped substrate 4 will be described.
  • the location that is most likely to receive the stress applied to the post 3 and is likely to be deformed can be seen from Fig. 3, but in most cases, the base of the approximate cross (the above-mentioned joint or the first deformed portion) (Equivalent). If the first deformed portion exceeds the elastic deformation region and undergoes plastic deformation, the output value from the sensor unit 1 with respect to the subsequent application of stress becomes inaccurate. The reason is that plastic deformation loses reversibility and does not recover even when stress is removed, and the strain gauge 5 on such a substrate 4 always receives the stress caused by the plastic deformation of the substrate 4. This is because
  • the substrate 4 must have both flexibility to be able to bend to some extent and rigidity or rigidity to be able to restore its shape when stress is removed against many times of bending. Must. Therefore, the first deformed portion has the stress dispersing means 10.
  • the stress dispersion means 10 is, for example, the roundness of the substrate 4 of the first deformed portion of the sensor unit 1 shown in FIG. Since the base of the cross in FIG. 2 (corresponding to the above-described joint or the first deformed portion) is not rounded, The stress applied to the intersection of the two sides (the base of the cross) tends to concentrate. The concentrated stress may cause the substrate 4 to plastically deform.
  • the applied stress can be dispersed over a wide range.
  • the dispersed stress is hardly propagated to the strain gauge irrelevant to the applied stress.
  • the substrate 4 is easily plastically deformed also depends on its material.
  • the substrate 4 made of ceramic is relatively hard to plastically deform.
  • the substrate 4 mainly composed of a resin-type material such as glass fiber reinforced epoxy resin, which is a material of a printed circuit board and the like, is relatively easily plastically deformed. Therefore, when the stress sensor has the configuration of the present invention, the effect of the present invention, that is, the effect that can withstand long-term use can be remarkably obtained when the substrate 4 mainly composed of a resin material is used.
  • a ceramic plate can be used as the substrate 4 constituting the present invention.
  • the stress dispersing means 10 there is a means shown in FIG. 2 for obliquely forming the angle formed by the base portions of the adjacent flaky regions.
  • the stress dispersing means 10 is also provided at a joint between the sensor unit 1 and the support unit 2 (hereinafter, referred to as a second deformed unit).
  • a second deformed unit a joint between the sensor unit 1 and the support unit 2
  • the reason is that the largest deformation is certainly the first deformation part in many cases.
  • the single substrate 4 is composed of the sensor part 1 and the support part 2. This is because, in a configuration that also serves as the above, the second deformed portion is often the next largest deformed portion in many cases. Further, depending on the change of the material, the thickness, and the like of the substrate 4, it is possible to make the amount of deformation of the second deformed portion larger than that of the first deformed portion. In such a case, it is more preferable to perform the stress dispersion means 10 on the second deformed portion.
  • FIG. 1 shows an example in which the stress dispersing means 10 is also provided for the second deformed portion.
  • the portion is obtuse, or the portion corresponding to the first deformed portion of the substantially cross-shaped substrate 4 as the basic structure is compared with other portions. Needless to say, there is a means for dispersing the stress by making it wider.
  • the R value (radius) of the roundness is preferably 0.1 mm or more. The reason is that if the R value is lower than this, it may be difficult to obtain a sufficient stress dispersion effect.
  • the R value applied to the second deformed portion may be smaller than the R value applied to the first deformed portion. The reason is that the amount of deformation of the second deformed portion when applying stress to the stress sensor of the present invention is often smaller than the amount of deformation of the first deformed portion.
  • the R value does not need to be increased without limit.
  • the diameter is 2 mm or less from the viewpoint of effective use without reducing the area of the non-deformed portion. Seem.
  • the stress dispersing means 10 is realized with a single circle or a similar shape as shown in Fig. 6 (b) and Fig. 6 (c) described later, since it depends on the size of the stress sensor, I can not say.
  • the R value is approximately 1.5 in consideration of easiness of processing the substrate 4 and sufficiently obtaining the dispersing effect of the stress dispersing means 10. ⁇ 3 mm is considered desirable.
  • the notch (hole 9) is formed in the single substrate 4 by a boundary region between the substrate deformed portion (the first deformed portion and the second deformed portion) and the substrate non-deformed portion (the support portion 2).
  • the sensor section 1 and the support section 2 are formed on the substrate 4.
  • a thin portion 14 may be used.
  • the thin portion 14 can be deformed more easily than other regions of the substrate 4 and has the same function as the substantially notched portion. For example, if the portion of the hole 9 in FIG. 1 is the thin portion 14 of the substrate 4, the flexibility of the thin portion 14 as compared to the other portions of the substrate 4 is higher than the deformation of the first deformed portion of the sensor portion 1.
  • the sensor section 1 and the support section 2 can be formed on a single substrate 4. Further, in this case, by forming the thin portion 14 so as to have a concave portion on the side of the substrate 4 on the side where the strain gauge 5 is provided, the sensitivity to the applied stress is greatly impaired as compared with the case where the hole 9 is provided. Will not be. In other words, by forming the thin portion 14, which is a stress transmission inhibiting member, at a position away from the strain gauge 5, the stress transmission to the strain gauge 5 'is improved. Further, depending on the material and thickness of the substrate 4, the strength required for the sensor unit 1 may not be obtained due to the provision of the holes 9. In such a case, it is particularly advantageous to replace the hole 9 with a thin portion 14. is there. The reason for this is that the thin portion 14 has a resistance and can bear the stress together with the substrate 4 other than the thin portion 14 against excessive stress.
  • FIG. 1 has a hole 9 whose cutout portion is a rounded square.
  • a circular or rounded triangle may be used.
  • the circular or rounded R value is preferably 0.1 mm or more. The reason for this is that, as mentioned earlier, it is thought that a stress distribution effect may not be sufficiently obtained with an R value below that value.
  • the stress sensor of the present invention for solving the problem to be solved by the present invention has a single substrate serving as both a sensor section 1 and a support section 2, and the sensor section 1 responds to a given stress. And has a strain gauge 5 whose electric characteristics change in response to the deformation.
  • the strain gauge 5 has a central region of the sensor unit 1, a plurality of flaky regions joined to the central region, and a joint portion thereof. Are fixed together with a boss 3 as a stress receiving member.
  • FIG. 6 shows an outline of the surface of the substrate 4 on the side where the boss 3 is not fixed in the configuration of the present invention.
  • the fixation here means that the substrate 4 and the post 3 which were originally separate members are integrated with an adhesive or the like.
  • the post 3 made of metal, ceramic, resin, or fiber-reinforced resin is fixed to one surface of the substrate 4.
  • An advantage of using metal or ceramic such as iron or high-carbon steel as the material of the post 3 is that the applied stress can be transmitted accurately due to their rigidity.
  • the first advantage in the case where a resin or a fiber reinforced resin is used as the material of the post 3 is that energy consumption is small in the production thereof. For example, the temperature at which a resin or a fiber-reinforced resin is molded and hardened is very low as compared with the sintering temperature of ceramics and the manufacturing temperature of metals.
  • a metal cutting and grinding process is required.
  • the second advantage is that it has better formability than ceramics and metals.
  • cracks may occur in the ceramic molding / sintering process and the metal fabrication process. This is due to the rigid body not being able to follow the volume shrinkage associated with temperature changes from very high to normal temperatures during cooling.
  • the melting temperature of the resin is very low as compared with the sintering temperature ⁇ ⁇ the forming temperature, the volume shrinkage upon cooling is small, and the rigidity of the resin is made of metal or Since it is lower than ceramics, it can be said that there is almost no such danger.
  • the post 3 can be used when the stress sensor of the present invention is applied to a pointing device for a personal computer, various electronic devices such as a mobile phone, particularly a multifunctional multidirectional switch of a small portable electronic device.
  • the stress sensor of the present invention is used as the multifunctional and multidirectional switch
  • the cross section of the side of the post 3 is used so that the operator can recognize in which direction the stress should be applied by tactile sensation.
  • the shape is polygonal, and that each command can be transmitted to the electronic device by applying a stress perpendicular to each plane on the side surface of the post 3.
  • the post 3 is preferably made of a resin or a fiber-reinforced resin as described above.
  • FIG. 1 is a diagram showing a top view of the stress sensor of the present invention.
  • FIG. 2 is a diagram illustrating an example of a basic structure of a sensor unit and a configuration in which a support unit is attached to the basic structure of the sensor unit.
  • FIG. 3 is a diagram showing a structure and an operation state of a conventional stress sensor device.
  • FIG. 4 is a diagram illustrating an example of the stress sensor according to the first embodiment of the present invention.
  • FIG. 5 is a diagram showing a state of electrical connection between a resistance element forming a strain gauge and a trimmable chip resistor.
  • FIG. 6 is a diagram illustrating a stress sensor according to an example of the second embodiment of the present invention.
  • FIG. 1 is a diagram showing a top view of the stress sensor of the present invention.
  • FIG. 2 is a diagram illustrating an example of a basic structure of a sensor unit and a configuration in which a support unit is attached to the basic structure of the sensor unit.
  • FIG. 3
  • FIG. 7 is a diagram illustrating a stress sensor according to an example of the third embodiment of the present invention.
  • FIG. 8 lists examples of stress dispersing means in the stress sensor according to the embodiment of the present invention.
  • FIG. FIG. 9 is a diagram listing examples of stress dispersing means in the stress sensor according to the embodiment of the present invention.
  • the reference numerals attached to these drawings are: 1 ... sensor part, 2 ... support part, 3 ... post, 4 ... substrate, 5 ... strain gauge, 6 ... resistor, 7 ... wiring, 8 ... terminal, 9 ... hole, 1 0 ... stress dispersing means, 1 1 ... tri-map chip resistor, 1 2 ... supporting 6, 1 3 ... notch, 14 ... thin part.
  • FIG. 4 a large-sized substrate 4 is prepared in which wirings 7 made of copper are arranged on both sides of a laminate mainly composed of an epoxy resin mixed with glass fibers.
  • FIG. 4A is a bottom view of the substrate 4
  • FIG. 4B is a top view of the substrate 4.
  • the four large substrates have a large number of dividing lines vertically and horizontally.
  • a plurality of rounded triangles 6 and support holes 12 described later are formed at predetermined positions by drilling. The roundness was set so that R was 0.4 mm.
  • a strain gauge 5 necessary to function as one stress sensor is formed in each section surrounded by the vertical and horizontal dividing lines.
  • a resin-based (carbon-resin) resistor paste is formed by screen printing and heat-cured to form resistor 6.
  • a wiring 7 serving as a resistance element electrode and a wiring extending therefrom are in contact with both ends of the resistor 6.
  • a silicone resin base is screen-printed, and then the paste is cured to form a protective film.
  • This silicone resin has an advantage that it is not easily deteriorated by repeated deformation and can maintain high adhesion to the substrate 4 or the resin-based resistor 6.
  • the trimmable chip resistor 11 electrically connected to each resistor element in series by the wiring 7 is arranged so as to realize the connection state with the resistor 6 as shown in FIG.
  • the trimmable chip resistor 11 was disposed on the surface of the substrate 4 opposite to the surface on which the resistive element was disposed, and on the non-deformed portion extending from the support portion 2. Therefore, the wiring 7 is made via via holes (not shown) of the substrate 4.
  • the reason for disposing the trimmer chip resistor 11 in the non-deformed part is that the trimmer chip resistor 11 is stressed. This is to prevent the resistance value from changing as much as possible.
  • the triple chip resistor 11 is provided by a known mounting technique and a single riff opening technique.
  • FIG. 5 simply shows the connection state of the strain gauge 5.
  • a series connection of the four resistors 6 and the trimmable chip resistor 11 constitutes a preige circuit.
  • a predetermined voltage is applied to a voltage application terminal (V c c) of this bridge circuit, and the other terminals are grounded.
  • V c c voltage application terminal
  • the resistor 6 and the Y terminal (Y out) on the left side of the figure constitute a stress sensor in the Y-axis direction
  • the resistor 6 and the X terminal (X out) on the right side constitute a stress sensor in the X-axis direction. Is done.
  • Whether or not to use the trimmable chip resistor 11 should be determined based on the material of each member constituting the above-described resistance element and the material of the substrate 4. For example, if the material of the substrate 4 is ceramic and the material of the resistor 6 is a metal glaze, even if laser trimming is performed directly on the resistor 6 constituting the resistor element, the subsequent Problems such as instability of the resistance value are negligible. Therefore, in such a case, it is not necessary to use the triple chip resistor 11. However, if it is necessary to use the trimmer chip resistor 11 due to other causes, it is needless to say that it should be used as necessary.
  • the alumina ceramic post 3 is fixed to a position corresponding to all of the strain gauges 5 on the side of the substrate 4 on which the trimmer chip resistor 11 is disposed.
  • An epoxy adhesive is used for fixing.
  • the material of the post 3 may be a metal, a resin, or a fiber-reinforced resin.
  • a post 3 formed of polyvinyl terephthalate (PVT) can be particularly preferably used. This PVT has the advantage of being able to transmit the applied stress relatively accurately because it has the highest rigidity among resin materials.
  • the heat resistance is good, there is an advantage that the rigidity can be maintained even when the use environment is slightly higher than normal temperature.
  • the large-sized substrate 4 is cut and divided by a disk cutter along the dividing line to obtain individual stress sensors.
  • workability is improved. The reason is that the work of attaching the post 3 to the board 4 having each stress sensor after dividing it into individual stress sensors is inferior in handling and handling, and complicated, compared to the work for the large board 4. It is.
  • the large-sized substrate 4 is made of ceramic such as alumina, it is preferable to use a large-sized substrate 4 in which a dividing groove is formed in advance instead of a dividing line. The reason is that, without using a disk cutter, the substrate 4 can be easily divided by applying a force or the like to open the division groove.
  • the support portion 2 is hardly deformed, and the sensor portion 1 can be deformed by the stress applied to the post 3.
  • the sensor portion 1 can be deformed by the stress applied to the post 3.
  • a gap is provided on the lower surface of the sensor unit 1
  • all the four resistance elements which are the strain gauges 5, can be expanded, and the resistance values of the four resistance elements can be increased to approximately the same level.
  • the information obtained from such electrical characteristics is information obtained from electrical characteristics different from those obtained when stress is applied in the lateral direction (X direction) as shown in FIG. 3 (a), and can be distinguished therefrom.
  • multifunction can be achieved by adding some function to the downward (z-direction) stress application.
  • the stress sensor of the present invention when used as a pointing device of a computer, a so-called mouse is clicked.
  • the function can correspond to the downward stress application.
  • the stress sensor of the present invention when used as a multifunctional / multidirectional switch for a small portable device such as a so-called mobile phone, when the downward stress is applied for a predetermined period of time, the mobile phone is not used. For example, it is possible to correspond to a command to turn on / off the power of a device.
  • the four holes 9 provided in the substrate 4 have a linear shape substantially orthogonal to a diagonal line of the substrate 4, and both ends of the line have a radius of 0.3 mm. Further, the strain gauge 5 is disposed on the surface of the substrate 4 on the side where the post 3 is disposed (fixed) at the position of the second deformed portion described above.
  • each strain gauge 5 expands or contracts according to the direction in which the stress is applied to the post 3 can be made the same as in the first embodiment of the present invention. . That is, the stress sensor control unit used in the first embodiment of the present invention can be used.
  • the second embodiment is intended to allow the stress applied to the post 3 to preferentially deform the second deformed portion.
  • the form is intended to mainly deform the outer end of the flaky region of the sensor unit 1.
  • a first advantage of the second embodiment is that the strength of the substrate 4 can be maintained high because more material of the substrate 4 can be left than in the first embodiment. Further, since the shape of the hole 9 is simpler than the shape of the hole 9 shown in FIG. 1, for example, the hole 9 can be easily formed by punching.
  • disposing the strain gauge 5 at the position of the second deformed portion described above is not only applicable to the form of the stress sensor shown in FIG. Needless to say, the present invention can be applied to the above-described second deformed portion position of the stress sensor of the present invention shown in FIG. 9 (except for FIG. 9 (1)).
  • the strain gauges 5 at both the first deformed portion position and the second deformed portion position by adding the amount of change in the electrical characteristics of the strain gages 5, good output characteristics can be obtained. It may be a stress sensor.
  • the outline of the bottom surface of the post 3 is larger than the central region of the substrate 4, and the entire central region is fixed while being covered by the bottom surface of the post 3.
  • This fixing means is based on the use of an epoxy adhesive.
  • the excess adhesive overflows around the bottom of the post 3, and when it cures, the shape of the post 3 is substantially changed, causing some variation in the manner in which the substrate 4 is deformed.
  • the sensor sensitivity varies.
  • the surplus adhesive passes through the hole 9 and moves to the substrate surface on the back side of the substrate 4 (the side where the post 3 is not disposed), thereby substantially changing the shape of the post 3 Therefore, the above problem is solved.
  • the bottom surface of the post 3 and the “joining portion” are fixed by the adhesive, deformation and stress concentration at the “joining portion” are prevented.
  • the position where the strain gauge 5 is disposed is set at substantially the center of the flaky region of the substrate 4.
  • the contour of the bottom surface of the post 3 corresponds to the position of the strain gauge 5.
  • the stress applied to the post 3 is transmitted to substantially the center of the flaky region of the substrate 4. This area is the easiest to deform in the sensor section 1 of the substrate 4 and has an advantage that the output from the strain gauge 5 can be increased.
  • FIG. 8A is a top view of a stress sensor showing an embodiment of the present invention when the shape of the hole 9 provided with the stress dispersing means 10 is L-shaped.
  • the first and second deformed portions in FIG. 1 have the holes 9 rounded to realize stress dispersion.
  • the advantage of adopting the hole 9 shape is that the area of the hole 9 can be reduced, and thereby, the wiring 7 and the wiring 7 can be formed on the four surfaces of the substrate other than the hole 9 and at a location where the substrate is not substantially deformed by applying stress. The point is that the arrangement of the trimmable chip resistor 11 can be facilitated.
  • the disadvantage of adopting the 69 shape is that it is difficult to machine such an L-shape by stamping. FIG.
  • FIG. 8 (b) is a top view of a stress sensor showing an embodiment of the present invention when the shape of the hole 9 provided with the stress dispersing means 10 is circular.
  • stress distribution is realized by the contour of the hole 9.
  • FIGS. 8 (c) and 8 (d) show the portions of FIG. 8 (b) that do not affect the first deformed portion and the second deformed portion, in this case, when punching the substrate 4 at the four corners of the sensor portion 1. This is a form that has been left.
  • FIG. 8 (e) shows a configuration in which the sensor section 1 and the support section 2 are separated by the cut section 13, the cut section 13 of the first deformed section has a round shape, and the second This is a mode in which a circular punched portion is provided at the end of the cut portion 13 on the deformed portion, thereby dispersing the stress in each deformed portion.
  • FIG. 8 (f) has the same configuration except that the cut portion 13 in FIG. 8 (e) is replaced by a thin portion 14.
  • the method of forming the thin portion 14 is by, for example, machining such as micro excavation. Since the thin portion 14 is easier to deform than other portions, the sensor portion 1 and the support portion 2 can be separated in substantially the same manner as when the cut portion 13 and the hole 9 are provided. That is, the first deformed portion and the second deformed portion can be deformed by the presence of the thin portion 14.
  • the advantage of separating the sensor part 1 and the support part 2 by the thin part 14 is that if excessive stress is applied to the sensor part 1, the book part 14 bears the excessive stress load. Therefore, the destruction of the stress sensor can be suppressed.
  • the effect of dispersing stress is also considered to be greater than others.
  • FIG. 8 (g) has the same configuration as that of FIG. 8 (e) except that the cut 13 is a hole 9.
  • the method for forming the holes 9 is such that the substrate 4 is penetrated by mechanical processing such as micro excavation, for example.
  • the hole at the boundary between the sensor part 1 and the support part 9 The circular punched hole formed at the end part is similar to the one shown in Figs. 8 (e) and 8 (f).
  • the diameter of the punched hole is suitably from 0.1 mm to 3 mm. The reason is that if the diameter is too small, the stress dispersion effect If the diameter is too small and the diameter is too large, the width of the substrate 4 applied to the second deformed portion is reduced, and there is a possibility that the substrate 4 may bear stress.
  • FIG. 8H shows a form in which the shape of the hole 9 is a rounded triangle as a whole while having the punched hole at the boundary between the sensor unit 1 and the support unit 2.
  • FIG. 8 (i) shows that the substrate 4 extending in all directions of the substantially cross-shaped sensor portion 1 gradually becomes wider, and the contour of the notch portion at the boundary between the sensor portion 1 and the support portion 2 has an obtuse angle. By doing so, it functions as the stress dispersion means 10.
  • FIG. 8 (j) shows that the substrate 4 extending in all directions of the substantially cross-shaped sensor portion 1 gradually becomes wider toward the center, and the contour of the notch portion relating to the first deformed portion forms an obtuse angle.
  • This is a mode that functions as the stress dispersion means 10 there.
  • the first deformed portion has a larger deformation amount than the second deformed portion.
  • the deformation amounts of the first deformed portion and the second deformed portion are reduced. It can be equivalent. As a result, it is possible to suppress the deterioration of the constituent members of the stress sensor unit 1 due to the deformation amount, and to prolong the service life when the stress sensor is used repeatedly.
  • FIG. 8 (k) is a form in which the shape of the hole 9 is entirely rounded in the form of FIG. 8 (j). ⁇
  • FIG. 8 (1) shows a form in which the shape of the hole 9 is rotated by 180 ° in the form of FIG. 8 (k).
  • the first deformed portion becomes very wide, and the stress is dispersed.
  • An advantage of this configuration is that the strain gauge 5 can be increased.
  • the strain gauge is a resistance element, the resistance value tends to be more stable as the resistance element size is larger.
  • the bottom surface of the post 3 is enlarged as shown in Fig. 8 (1) to make it possible for the stress applied in a certain direction to propagate to the strain gauge 5 unrelated to that direction. It is preferable to prevent it.
  • FIGS. 9 (a), 9 (b) and 9 (c) show the stress dispersion means in the first deformed portion in the configurations of FIGS. 8 (e), 8 (f) and 8 (g), respectively. While 10 was realized by the smooth curve of the cut section 13 and the thin section 14 and the hole 9, the circular notch ( This is a form realized by opening a hole 9).
  • the advantage of these configurations is that it is possible to avoid the difficulty of forming, for example, the cut portion 13, the thin portion 14, and the hole 9 as a smooth curve. Generally, it is least difficult to form the cut portion 13 and the thin portion 14 in a straight line. Also, it is least difficult to form the holes 9 straight or circular.
  • FIGS. 9 (d), 9 (e) and 9 (f) show the ease of manufacture of FIGS. 9 (a), 9 (b) and 9 (c), respectively.
  • This is a mode in which the stress dispersibility of the stress dispersing means 10 in the first deformed portion including the hole 9 is improved. That is, in the circumference of the circular hole 9 which is the stress dispersing means 10 in the first deformed portion, in FIG. 9 (a), FIG. 9 (b), and FIG. 9 (d), 9 (e), and 9 (f), the circle on the side farther from post 3 was not It is a form that can distribute the stress almost uniformly to other circumferential parts, because it cannot disperse the stress only to around 25% of the circumference.
  • FIG. 9 (g) shows the configuration of FIG. 8 (k) and FIG. 9 (h) shows the configuration of FIG. 8 (h) in which the four corners of the substrate 4 which are not substantially deformed can be more effectively utilized.
  • FIG. 9 (i) shows a configuration having a significantly deformed cross-shaped sensor unit 1.
  • the advantage of this mode is that, for example, when the wiring 7 from the strain gauge 5 is complicated, the wiring 7 can be easily accommodated in a part of the cross-shaped substrate 4 having a basic structure in a partly wide area.
  • FIG. 9 (j) shows a form in which the forms of FIGS. 8 (j) and 8 (k) can be formed only by straight-line cutting means and circular hole forming means.
  • the advantages of such a form are that the straight cut and the circular hole formation are the easiest to process and the production difficulties are small due to the simplicity of the shape.
  • FIG. 9 (k) shows a form in which the posts 3 are arranged in FIG. 8 (a) such that the bottom surface of the posts 3 overlaps a part of each hole 9 region.
  • FIG. 9 (1) shows a form in which four circular holes are formed in the substrate area corresponding to the four corner positions of the bottom surface of the post 3 to be fixed.
  • the shape of the hole is not limited to a circle, but making it circular makes it easier to make six holes compared to other shapes, and has the advantage that the stress dispersion function described later can be exhibited well. is there.
  • the hole has the function of the stress dispersing means 10 and the function of the hole 9 for forming the sensor unit 1 and the sensor support unit 2 on a single substrate.
  • the stress sensor of the present invention can be obtained.
  • This stress sensor has advantages such as extremely simple structure and less difficulty in manufacturing than other forms. Industrial applicability
  • a stress sensor that can withstand long-term use can be provided. Further, since the single substrate 4 is a stress sensor configured to serve as both the sensor unit 1 and the support unit 2, there is an advantage that the number of parts can be reduced as compared with the conventional case. Further, the stress sensor of the present invention can be suitably used for a pointing device for a personal computer, a multifunctional switch for various electronic devices, and the like.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Force In General (AREA)

Abstract

L'invention concerne un capteur de contrainte conçu pour pouvoir être utilisé de manière prolongée, comprenant un substrat (4) qui fonctionne à la fois comme ensemble capteur (1) et comme ensemble support (2). L'ensemble capteur (1) comprend un moyen permettant de déformer une partie de l'ensemble capteur (1) sous l'effet d'une contrainte donnée et un tensiomètre (5) dont les caractéristiques électriques sont modifiées par la déformation. Les portions de déformation sont pourvues d'un moyen (10) de dispersion de la contrainte
PCT/JP2001/011017 2000-12-25 2001-12-17 Capteur de contrainte WO2002052236A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002553085A JPWO2002052236A1 (ja) 2000-12-25 2001-12-17 応力センサ

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JP2000-393625 2000-12-25
JP2000393625 2000-12-25

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WO2002052236A1 true WO2002052236A1 (fr) 2002-07-04

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007139440A (ja) * 2005-11-15 2007-06-07 Alps Electric Co Ltd 荷重センサ
JP2009162737A (ja) * 2007-12-28 2009-07-23 Elantech Devices Corp 圧力センサー
WO2019031381A1 (fr) * 2017-08-10 2019-02-14 株式会社村田製作所 Capteur de contrainte et son procédé de fabrication
CN110553766A (zh) * 2018-05-30 2019-12-10 浙江清华柔性电子技术研究院 力传感器及其制造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5640178A (en) * 1994-09-16 1997-06-17 Fujitsu Limited Pointing device
JPH09280981A (ja) * 1996-04-09 1997-10-31 Matsushita Electric Ind Co Ltd 荷重センサ
US5811694A (en) * 1997-06-06 1998-09-22 Bokam Engineering Force Transducer
US5835977A (en) * 1996-08-19 1998-11-10 Kamentser; Boris Force transducer with co-planar strain gauges
JPH11135804A (ja) * 1997-08-29 1999-05-21 Matsushita Electric Works Ltd 半導体加速度センサ及びその製造方法
JPH11148877A (ja) * 1997-11-18 1999-06-02 Matsushita Electric Ind Co Ltd 荷重センサ
JP2000112652A (ja) * 1998-10-07 2000-04-21 Cts Corp チップ抵抗器を有するポインティング・スティック

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5640178A (en) * 1994-09-16 1997-06-17 Fujitsu Limited Pointing device
JPH09280981A (ja) * 1996-04-09 1997-10-31 Matsushita Electric Ind Co Ltd 荷重センサ
US5835977A (en) * 1996-08-19 1998-11-10 Kamentser; Boris Force transducer with co-planar strain gauges
US5811694A (en) * 1997-06-06 1998-09-22 Bokam Engineering Force Transducer
JPH11135804A (ja) * 1997-08-29 1999-05-21 Matsushita Electric Works Ltd 半導体加速度センサ及びその製造方法
JPH11148877A (ja) * 1997-11-18 1999-06-02 Matsushita Electric Ind Co Ltd 荷重センサ
JP2000112652A (ja) * 1998-10-07 2000-04-21 Cts Corp チップ抵抗器を有するポインティング・スティック

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007139440A (ja) * 2005-11-15 2007-06-07 Alps Electric Co Ltd 荷重センサ
JP4486025B2 (ja) * 2005-11-15 2010-06-23 アルプス電気株式会社 荷重センサ
JP2009162737A (ja) * 2007-12-28 2009-07-23 Elantech Devices Corp 圧力センサー
WO2019031381A1 (fr) * 2017-08-10 2019-02-14 株式会社村田製作所 Capteur de contrainte et son procédé de fabrication
US11215516B2 (en) 2017-08-10 2022-01-04 Murata Manufacturing Co., Ltd. Strain sensor and manufacturing method therefor
CN110553766A (zh) * 2018-05-30 2019-12-10 浙江清华柔性电子技术研究院 力传感器及其制造方法

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