WO2001020544A1 - Carte de circuit integre et son procede de fabrication - Google Patents

Carte de circuit integre et son procede de fabrication Download PDF

Info

Publication number
WO2001020544A1
WO2001020544A1 PCT/KR2000/001003 KR0001003W WO0120544A1 WO 2001020544 A1 WO2001020544 A1 WO 2001020544A1 KR 0001003 W KR0001003 W KR 0001003W WO 0120544 A1 WO0120544 A1 WO 0120544A1
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
board
protecting plate
chip card
plate
Prior art date
Application number
PCT/KR2000/001003
Other languages
English (en)
Inventor
Ken Saruta
Original Assignee
3B System Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3B System Inc. filed Critical 3B System Inc.
Priority to AU74545/00A priority Critical patent/AU7454500A/en
Publication of WO2001020544A1 publication Critical patent/WO2001020544A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to IC Card and its manufacturing method
  • an existing integrated circuit chip card (50) As shown on Fig 4, an existing integrated circuit chip card (50)
  • the above coils (54) can be formed as manifold winding or cut
  • circuit (52) is arranged on a part of the lower outside plate (51).
  • the coils (53) and the integrated circuit (52) are installed in
  • Fig. 1 is a side view of an integrated circuit chip card of this
  • Fig. 2 is a deal side view of an integrated circuit chip card of
  • Fig. 3 is A-A line of cross-sectional view, showing an
  • Fig. 4 is A-A line of cross-sectional view of an existing
  • Fig. 1 and Fig. 2 show the integrated circuit chip card of this
  • circuit chip card ( 1) of this invention includes board protecting plate
  • outside plate and the lower outside plate.
  • the above coils (3) can be formed as manifold winding or cut images for generating more current by the changes of magnetism
  • Circuit element protecting plate (7) installed on the upper part
  • circuit (2) is located, and the circuit element protecting plate (7)
  • Circuit element protecting board (7) is installed on the board
  • the integrated circuit chip card (1) is manufactured by installing
  • method of this invention can protect the integrated circuit, removing
  • this invention can prevent the cut or twist of the coil, made in the
  • the card' s durability can be extended.
  • the thickness of the whole card is thin and regular compared

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention porte sur une carte de circuit intégré fabriquée en installant la plaque de protection de la plaquette du circuit intégré (COB, COF, ou puce sur cadre de conducteurs) et la plaque de protection des éléments du circuit intégré entre les plaques extérieures, inférieure et supérieure où est situé le circuit intégré, et en formant pour installer les éléments du circuit un trou ou un sillon, de la même taille que les éléments de circuit, dans la plaque de protection où est placé le circuit intégré, puis en disposant les bobines sur la plaque de protection et en comprimant les plaques extérieures, inférieure et supérieure. Ainsi, l'invention empêche-t-elle de couper ou tordre la bobine pendant le traitement puisque la carte de circuit intégré est fabriquée en comprimant les plaques extérieures, inférieure et supérieure, sans courber la section découpée de bobine, ce qui prévient les dommages sur les éléments du circuit intégré. En outre, en supprimant les protubérances à la surface de la carte finie, on en prolonge la durée.
PCT/KR2000/001003 1999-09-10 2000-09-04 Carte de circuit integre et son procede de fabrication WO2001020544A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU74545/00A AU7454500A (en) 1999-09-10 2000-09-04 Ic card and manufacturing method for ic card

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019990038623A KR100363657B1 (ko) 1999-09-10 1999-09-10 집적회로칩카드 및 이의 제조방법
KR1999/38623 1999-09-10

Publications (1)

Publication Number Publication Date
WO2001020544A1 true WO2001020544A1 (fr) 2001-03-22

Family

ID=19610944

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2000/001003 WO2001020544A1 (fr) 1999-09-10 2000-09-04 Carte de circuit integre et son procede de fabrication

Country Status (3)

Country Link
KR (2) KR200170147Y1 (fr)
AU (1) AU7454500A (fr)
WO (1) WO2001020544A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG125930A1 (en) * 2002-12-02 2006-10-30 Sony Corp Ic card

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100702940B1 (ko) * 2000-07-28 2007-04-03 삼성테크윈 주식회사 집적회로카드와 이의 제조방법
KR100910769B1 (ko) * 2002-06-11 2009-08-04 삼성테크윈 주식회사 Ｉｃ 카드 및, 그것의 제조 방법
KR20090093606A (ko) * 2008-02-29 2009-09-02 주식회사 엘지화학 무선 주파수 인식 태그 및 이를 포함하는 카드
KR100987250B1 (ko) * 2010-03-25 2010-10-12 진영범 스마트 카드 제조방법
KR100987215B1 (ko) 2010-04-07 2010-10-12 진영범 스마트 카드 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0896090A (ja) * 1994-09-26 1996-04-12 Toshiba Corp 無線カード装置の製造方法
JPH10278458A (ja) * 1997-04-08 1998-10-20 Toppan Printing Co Ltd 非接触型ｉｃカード及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0786357A4 (fr) * 1994-09-22 2000-04-05 Rohm Co Ltd Carte de ci du type sans contact et procede de fabrication de cette carte
JPH08216570A (ja) * 1995-02-09 1996-08-27 Hitachi Chem Co Ltd Ｉｃカード
JPH09161035A (ja) * 1995-12-13 1997-06-20 Mitsubishi Plastics Ind Ltd 非接触ｉｃカード
JPH1024685A (ja) * 1996-07-10 1998-01-27 Dainippon Printing Co Ltd Ｉｃカード及びその製造方法
JPH1134563A (ja) * 1997-07-22 1999-02-09 Tokin Corp 非接触型ｉｃカード及びその製造方法
JPH1191275A (ja) * 1997-09-25 1999-04-06 Dainippon Printing Co Ltd 非接触型ｉｃカードの製造方法および非接触型ｉｃカード

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0896090A (ja) * 1994-09-26 1996-04-12 Toshiba Corp 無線カード装置の製造方法
JPH10278458A (ja) * 1997-04-08 1998-10-20 Toppan Printing Co Ltd 非接触型ｉｃカード及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG125930A1 (en) * 2002-12-02 2006-10-30 Sony Corp Ic card
US7377446B2 (en) 2002-12-02 2008-05-27 Sony Corporation IC card

Also Published As

Publication number Publication date
KR19990084064A (ko) 1999-12-06
AU7454500A (en) 2001-04-17
KR200170147Y1 (ko) 2000-02-15
KR100363657B1 (ko) 2002-12-12

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