WO2000051789A1 - Lame circulaire a diamant - Google Patents

Lame circulaire a diamant Download PDF

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Publication number
WO2000051789A1
WO2000051789A1 PCT/JP2000/001061 JP0001061W WO0051789A1 WO 2000051789 A1 WO2000051789 A1 WO 2000051789A1 JP 0001061 W JP0001061 W JP 0001061W WO 0051789 A1 WO0051789 A1 WO 0051789A1
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WO
WIPO (PCT)
Prior art keywords
diamond
saw blade
grindstone
circular substrate
value
Prior art date
Application number
PCT/JP2000/001061
Other languages
English (en)
Japanese (ja)
Inventor
Takuma Yoshida
Kazuhiro Mashiko
Shigeyoshi Kobayashi
Original Assignee
Sankyo Diamond Industrial Co., Ltd.
Toho Titanium Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Diamond Industrial Co., Ltd., Toho Titanium Co., Ltd filed Critical Sankyo Diamond Industrial Co., Ltd.
Priority to EP00905312A priority Critical patent/EP1114696A4/fr
Publication of WO2000051789A1 publication Critical patent/WO2000051789A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades

Definitions

  • the present invention provides a diamond cutting tool that, when dry-ground or crushed on a brittle material typified by concrete or stone, exhibits excellent sharpness and can realize a long tool life. Regarding one blade. Background art
  • diamond saw blades have been widely used as tools for grinding and cutting hard and brittle materials such as stone and concrete structures.
  • the diamond blade is formed, for example, by attaching a diamond grindstone in which diamond abrasive grains are bonded by a bond to an outer peripheral portion of a disk-shaped metal substrate via a metal base called an underlayer.
  • the above-mentioned diamond saw blade is mounted on a rotating tool and rotated to grind or cut hard and brittle materials.
  • the conditions for exhibiting sharp sharpness are that an appropriate power is output from a rotating tool for applying power and the power
  • the minimum required number of diamond grains corresponding to the peripheral speed of the diamond saw blade is included in the diamond grindstone, and the diamond grain has a sharp edge from the tip of the bond. Larger protrusions, deep penetration into the work material while maintaining the state where the diamond abrasive particles protrude as much as possible, and destruction of these while discharging at high speed as cutting chips.
  • the decrease in the sharpness of the diamond saw blade has been solved by adjusting the hardness of the bond and giving the bond a property of performing a self-sharpening action.
  • the spontaneous cutting action means that the bond itself is also worn and the tip surface is retracted in accordance with the wear and fall of the diamond abrasive grains. This is the effect of maintaining the sharpness by protruding from the front end face of the.
  • the bond used in the diamond grindstone of the diamond saw blade is: 1) firmly holding the effective diamond grindstone, 2) depending on the state of wear of the diamond grindstone at the tip, itself wears, and causes the spontaneous cutting. , Play two contradictory roles.
  • Conventional diamond saw blades can only have one of the characteristics of good sharpness or long life.For example, when labor costs are high, the sharpness of diamond saw blades can be improved. When the cutting speed is prioritized by improving it, or when emphasizing the cost of the diamond saw blade itself, the sharpness is somewhat inferior, but the life is long. A diamond saw blade with good life characteristics was used. Thus, it was necessary to use different types of diamond saw blades according to the intended work and situation.
  • an object of the present invention is to solve the problem that either the sharpness or the life must be sacrificed, and to achieve a diamond saw blade that satisfies both good sharpness and high durability
  • the diamond saw blade according to the present invention is a diamond saw blade obtained by attaching a diamond grindstone to an outer peripheral edge of a circular substrate, wherein the circumference of a circle having a diameter equal to the maximum outer diameter of the diamond saw blade. Then, when a first value calculated by multiplying the maximum thickness of the circular substrate and a second value that is the total area of the end face of the diamond grindstone are compared, the first value The ratio of the second value is not less than 0.3 and not more than 1.0.
  • the total area value of the outer peripheral end face of the disk whose circumference is a circle whose diameter is the maximum outer diameter of the diamond saw blade and whose thickness is the maximum thickness of the circular substrate is described.
  • the ratio of the total area value of the end faces of the diamond whetstone is required to be 0.3 or more and 1.0 or less, and by satisfying this requirement, hard and brittle materials represented by concrete, stone, etc.
  • the diamond grindstone is 3.0 Om on the outer peripheral edge of the circular substrate.
  • a first value calculated by multiplying the circumferential length of a circle having a diameter equal to the maximum outer diameter of the diamond saw blade and the maximum thickness of the circular substrate, and
  • the ratio of the second value to the first value is preferably 0.3 or more and 0.8 or less.
  • the diamond grindstones are arranged on the outer peripheral edge of the circular substrate at an interval of not less than 3.0 Omm and less than 1.5 Omm, and have a circumferential length of a circle whose diameter is the maximum outer diameter of the diamond saw blade.
  • the ratio of the values of 2 is 0.4 or more and 0.9 or less.
  • the diamond saw blade of the present invention it is possible to achieve a long tool life while maintaining excellent sharpness. This eliminates the hassle of using differently, and maintains a good working environment.
  • the diamond grindstone is formed by bonding diamond abrasive grains with a bond, and when the Rockwell hardness of the bond is HRA60 or more and 80 or less, it is possible to hold the diamond abrasive grains firmly, which is preferable. is there.
  • the bond retains a sufficient holding force to hold the diamond grindstone, and the diamond grindstone falls off early. Therefore, the diamond saw blade can maintain a good sharpness and a long service life, and thus is preferable.
  • the diamond grinding stone when the concentration of the diamond abrasive grains with respect to the bond is 0.6 (ct / cm 3 ) or more and 1. (ct cm 3 ), the diamond is cut during the cutting operation on the work material. Whetstone 2 It is preferable that a sufficient load is applied to each of the diamond abrasive grains protruding from the constituent bond and a sharp edge can be exhibited.
  • the area of the end face of the cutting edge of the diamond grindstone is defined as the area of the cut surface when the diamond grindstone is extended in the outer peripheral direction of the circular substrate and cut along a plane perpendicular to the circular substrate.
  • the shape of the diamond grindstone is a shape in which at least a part of a surface parallel to the circular substrate is cut, chips of the work material are discharged from the cut portion, and the diamond saw blade has a good shape. Rotation can be obtained.
  • the diamond saw blade according to the present invention is a diamond saw blade having a diamond grindstone attached to an outer peripheral edge of a circular base, wherein the maximum thickness of the diamond grindstone is multiplied by the outer peripheral length of the diamond grindstone.
  • the value calculated by the above is compared with the area of the edge portion of the edge portion of the diamond wheel, the value of the area of the edge portion of the edge portion of the diamond wheel to the value calculated by multiplying the outer peripheral length of the diamond wheel.
  • the ratio is preferably 0.3 or more and 0.8 or less.
  • the diamond grindstone is formed by bonding diamond abrasive grains with a bond, and when the Rockwell hardness of the bond is HRA 60 or more and 80 or less, the diamond abrasive grain can be firmly held. This is preferable.
  • the bond retains a sufficient holding force to hold the diamond grindstone, and the diamond grindstone falls off early. It is preferable because the diamond saw blade can maintain good sharpness and a long life.
  • the bond with respect to the bond If the concentration of the diamond abrasive grains is 0.6 (ct / cm 3 ) or more and 1.4 (ct cm 3 ), the diamond abrasives protruding from the bond that constitutes the diamond grinding stone 2 during cutting work. A sufficient load is applied to each of the grains, and the grains can exhibit sharpness, which is preferable.
  • the area of the edge portion of the edge portion of the diamond grindstone is, more specifically, assuming that the diamond grindstone extends in the outer peripheral direction of the circular substrate, and is perpendicular to the circular substrate and the original diamond saw blade.
  • the shape of the diamond grindstone is a shape in which at least a part of a surface parallel to the circular substrate is cut out, chips of the work material are discharged from the cutout portion, and a diamond saw blade is formed. Good rotation can be obtained.
  • FIGS. 1 and 2 are schematic views showing a general diamond saw blade
  • FIG. 3 is a perspective view showing an outer peripheral edge of the diamond saw blade of FIG.
  • FIGS. 4 to 6 are explanatory views showing one embodiment of the diamond saw blade of the present invention
  • FIGS. 7 to 9 are explanatory views showing the outer peripheral portion of the diamond saw blade in the comparative example.
  • the diamond saw blade D includes a metal circular substrate 1, and a composite formed on a peripheral edge of the circular substrate 1 by diamond abrasive grains and a bond. This is a diamond saw D with a structure in which a number of diamond whetstones 2 are combined.
  • the diamond grindstone 2 is bonded to the circular substrate 1 via an underlayer, or bonded by a simultaneous sintering method without an underlayer.
  • FIG. 1 is a schematic view showing a diamond saw blade D of the present example.
  • a diamond saw blade D of the present embodiment has a circular substrate 1 and a plurality of diamond grindstones 2 attached to the outer periphery of the circular substrate 1 as main components.
  • the circular substrate 1 is a metal plate formed in a disk shape, and has a configuration in which an outer peripheral portion is divided in a circumferential direction by a plurality of slits 3.
  • the portion sandwiched between the slits 3 is a mounting portion 4 for mounting the diamond whetstone 2.
  • a mounting hole 1a for mounting to a rotary tool is formed at the center position of the substrate 1.
  • the circular substrate 1 of this example has a plurality of key-shaped slits 3a and a plurality of U-shaped slits 3b, but the present invention is not limited to this. Alternatively, a configuration in which only a U-shaped slit is formed may be used. Alternatively, the shape is not limited to the key shape and the U shape, but may be any shape.
  • the diamond whetstone 2 is a segment-shaped whetstone in which diamond abrasive grains are bonded with a bond, and has a rectangular parallelepiped shape having a length corresponding to the mounting portion 4 of the circular substrate 1. Is formed.
  • the diamond grindstone 2 is fixed to the circular substrate 1 by laser welding or the like via a metal base layer. Alternatively, they are integrally joined by a simultaneous sintering method without an intermediate layer.
  • the diamond grindstone 2 of the present example is provided with a step adjacent to the slit 3 as shown in FIG.
  • the steps are formed on both sides of the diamond grinding stone 2 from the slit 3 side to the vicinity of the center of the diamond grinding stone 2.
  • the step near the center is formed deeper than the step on the slit side, and is configured so that chips can be effectively discharged and frictional heat can be effectively released.
  • the shape and number of the diamond whetstones 2 are not particularly limited, and may be appropriately changed depending on the size and the thickness of the circular substrate 1 and the material of the work material.
  • the bond of this example is adjusted to have tough properties so that the diamond abrasive grains can be held firmly.
  • the bond is prepared, for example, so that the Rockwell hardness becomes HRA 60 or more in a state of being sintered while holding the diamond abrasive grains.
  • the upper limit of the hardness is adjusted to be HRA80 or less.
  • the above-mentioned HRA be 1 ′′ 16 5 or more and 75 or less, because the balance between the retention of diamond abrasive grains and the action of spontaneous cutting can be achieved at a high level in a well-balanced manner.
  • the diamond saw blade of the present invention includes the following embodiments. That is, the diamond grindstone is formed by bonding diamond abrasive grains with a bond, and the bond has a Rockwell hardness of HRA 65 or more and 75 or less.
  • the greatest feature of the present invention is that the entire edge of the cutting edge of the diamond whetstone 2 is That is, the area obtained by multiplying the area, that is, the area of the end face of the cutting edge of each diamond wheel 2 by the number of diamond wheels 2 to be arranged is adapted to predetermined requirements.
  • the above requirements are the first value X obtained by multiplying the circumference of a circle having a diameter of the maximum outer diameter c of the diamond blade D by the maximum thickness t of the thickness of the circular substrate 1;
  • YZX is set to 0.3 or more and 1.0 or less.
  • the diamond saw blade of the present invention also includes the following embodiments.
  • the ratio of the second value to the first value is 0.
  • the ratio of the second value to the first value is 0.
  • the maximum outer diameter c (mm) of the diamond saw blade D is within the circular substrate 1.
  • the linear length extends through the center O and extends to the tip 2a of the cutting edge of the diamond grindstone 2 on one side, and extends to the tip 2a of the cutting edge of the diamond grinding stone 2 on the other side. That is, the maximum outer diameter c (mm) of the diamond saw blade D is equal to the outer diameter a (mm) of the circular substrate 1 and the height b (mm) of the diamond grindstone 2 (with the circular substrate 1 of the diamond grindstone 2). It is determined by adding twice the length from the joint to the tip of the blade).
  • the diamond saw blade of the present example has the first value X (mm 2 ), and the total area Y (mm 2 ) of the edge portion end surface area e (mm 2 ) of the diamond whetstone 2 as the second value. when comparing, it is intended to be a second value Y (mm 2) power and 100% more than 30% of the first value X (mm 2) or less.
  • the ratio is not less than 0.9 and not more than 0.9, the state in which the diamond abrasive grains protrude greatly from the tip surface of the bond can be maintained for a long time, and the desired sharpness can be maintained for a long time.
  • the diamond saw blade D is formed by attaching a diamond grindstone 2 to the outer peripheral edge of a circular substrate 1. Depending on the interval at which the diamond grindstone is arranged, the diamond saw blade D is formed. Blade D can be classified into two types. For each type of diamond saw blade D, the range of Y (mm 2 ) ZX (mm 2 ) values that achieve high tool life while maintaining excellent sharpness are as follows.
  • the ratio Y (mm 2 ) X (mm 2 ) is formed by adjusting the size and the shape of the end face so that the value is 0.3 or more and 0.8 or less.
  • the ratio Y (mm 2 ) X (mm 2 ) is 0.4 or more and 0.9 or less It is formed by adjusting the size and the end face shape of the diamond whetstone 2 so that
  • the maximum thickness t (mm) of the diamond grindstone 2 and the outer peripheral length of the diamond grindstone 2 are used as criteria for selecting the size and shape of the diamond grindstone 2.
  • the value Z (mm 2 ) calculated by multiplying the I (mm) is compared with the area e (mm 2 ) of the edge of the cutting edge of the diamond whetstone 2, and Z (mm 2 ) Ze (mm 2 )
  • the diameter is not less than 0.3 and not more than 0.8, the diamond saw blade D can obtain a long tool life while maintaining excellent sharpness.
  • the above criterion is based on the virtual area Z (mm 2 ) calculated from the maximum thickness t (mm) of the diamond whetstone 2 and the outer peripheral length I (mm) of the diamond whetstone 2. This is to determine the ratio of the area e (mm 2 ) of the end face. Therefore, this method of comparing Z (mm 2 ) and the substantial end surface area e (mm 2 ) of the diamond grinding stone 2 will be specifically described when the shape of the end surface of the diamond grinding stone 2 is not a rectangular parallelepiped.
  • the present invention can be implemented in the case where the diamond grinding stone 2 has a zigzag shape as shown in FIGS.
  • the diamond saw blade of the present invention also includes the following embodiments.
  • the Rockwell hardness of the bond is HRA 60 or more and 80 or less as described above.
  • HRA 60 or less
  • the holding power for the diamond grains protruding from the tip of the bond is weakened, the diamond grains fall off in a short time, and new abrasive grains are generated due to the abrasion of the bond.
  • it Before it can function effectively, it loses its sharpness as a diamond saw blade and shortens its life.
  • the apparent minimum thickness s (mm) of the diamond grinding wheel 2 that is, the minimum thickness in the maximum thickness w direction as shown in FIGS.
  • the diamond saw blade can maintain good sharpness and long life.
  • the concentration of the diamond abrasive grains of the diamond whetstone 2, that is, the content of the diamond abrasive grains with respect to the bond is 0.6 to 1.4 (ct no cm 3 ), preferably 0.8 to 1.2 (ctZ cm 3 ), A sufficient load is applied to each of the diamond abrasive grains protruding from the bond constituting the diamond grinding stone 2 during the cutting operation on the work material, and the sharpness can be exhibited.
  • the diamond saw blade of the present invention includes the following embodiments.
  • diamond abrasive grains concentration is 0.8 for the bond (ctZcm 3) above 1.
  • ctZcm 3 Dearuko diamond saw blade according to claim.
  • the diamond saw blade D1 of this embodiment is formed by arranging a plurality of diamond whetstones 2 on an outer peripheral edge of a circular substrate 1.
  • key-shaped and U-shaped slits 3 are formed alternately, and the outer diameter (a) is formed to be 291 mm and the maximum thickness (t) is formed to be 2 mm.
  • the diamond grindstone 2 of the diamond saw blade D1 of the present embodiment is obtained by setting a diamond grindstone layer primary compact and an underlayer primary compact adjacent to each other, charging the sintering mold, and sintering under pressure. It is formed.
  • the diamond grindstone layer primary compact has a dangsten-based bond and diamond abrasive grains with a minimum grain diameter of 0.3 mm, and the percentage of the diamond abrasive grains after firing becomes 1.0 (ct cm 3 ). It is formed by mixing and molding.
  • the tungsten-based bond is adjusted so as to have a Rock-well hardness of the bond portion after firing (HRA68).
  • the diamond whetstone 2 has a height (b) (the length from the junction with the circular substrate 1 to the tip of the blade) of 8. Omm, which is apparent.
  • the minimum thickness (s), that is, the maximum thickness is 1.6 mm and the maximum thickness (w) is 2.8 mm in the w direction, and the area of the blade tip surface (e) was 27 mm 2 .
  • a total of 42 diamond whetstones 2 are attached to the mounting portions 4 between the slits 3 of the circular substrate 1.
  • the circular substrate 1 and the diamond grindstone 2 are formed in the sizes shown in the above numerical values, so that the maximum outer diameter (c) of the diamond saw blade is equal to the outer diameter of the circular substrate 1 (a) 291 mm + the diamond grindstone. Height (b) of 2 (8. Omm X 2).
  • the circumference (307mm x 3.14) calculated using the maximum outer diameter (c) of 307mm as the diameter is 964mm.
  • the area value calculated by multiplying the circumferential length of 964 mm by the maximum thickness (t) of the circular substrate 1 (t) of 2 mm is 1928 mm 2 .
  • Omm 2 calculated by multiplying the maximum thickness of the diamond grindstone by the outer peripheral length of the diamond grindstone, and the area of the substantial end face of the diamond grindstone (e) 27. The ratio of Omm 2 was 0.64.
  • the diamond saw blade D1 produced as described above was mounted on an engine cutter with a displacement of 85c G , and was rotated at 5000 rpm to produce a concrete plate (material age: 1 year, aggregate particle size: 20mm, plate Thickness: 60 mm) was subjected to a dry cutting test. As a result, high-speed cutting at a cutting speed of 1300 mm Zmin is possible without causing uneven wear of the diamond diamond wheel 2 on the circular substrate 1, and a cutting operation of 185 m before the life of the diamond saw blade D1 is reached. It was confirmed that it was possible.
  • the primary compact was made of a tungsten-based bond and diamond abrasive grains having a minimum grain diameter of 0.3 mm, and a diamond abrasive grain. It was formed by mixing and molding such that the concentration of the abrasive grains was 1.4 (ct Z cm 3 ).
  • the tungsten-based bond was prepared such that the Rockwell hardness of the bonded portion after firing was HRA70.
  • the diamond grindstone is formed to have a wall thickness of 30 ⁇ 20 thinner and a length reduction of 20% from the shape of the grindstone portion shown in Example 1, and the area of the blade tip surface ( e ) is 15.1 mm.
  • the diamond saw blade D2 was formed by welding 42 pieces to a circular substrate having a thickness of 2, Omm.
  • the circumference (307 mm X 3.14) calculated with the maximum outer diameter (c) of 307 mm of the diamond saw blade D2 as a diameter is 964 mm.
  • the area value calculated by multiplying the circumferential length 964 mm by the maximum thickness (t) of the circular substrate 2.0 is 1928 mm 2 .
  • this maximum thickness of the diamond wheel, for this virtual area by multiplying the outer circumferential length is calculated in the diamond grindstone (z) 33. 6mm 2, the area of the substantial end surface of the dust Iyamondo grindstone (e ) ratio of 15. 1 mm 2 was 0.45.
  • the diamond saw blade D2 produced as described above was subjected to a concrete cutting test in the same manner as in Example 1, and as a result, high-speed cutting at a cutting speed of 1200 mmZmin was possible, and the life of the diamond saw blade D2 was reached. It was confirmed that cutting work of 100m was possible by then.
  • the primary formed body is composed of a tungsten-based bond and a diamond abrasive having a minimum particle diameter of 0.3 mm, and the diamond abrasive has a concentration of 1.0 (ctZcm 3 ). It was formed by mixing and molding at a certain ratio.
  • the tungsten-based bond has a The rock well hardness of the hand part was adjusted to HRA65.
  • the diamond wheel 2 has a height (b) of 11. Omm, an apparent minimum thickness (s) of 2. Omm, and a maximum thickness (w) of 3.2 mm.
  • the shape of the blade tip surface (e) was 90.2 mm 2 , and 21 pieces were welded to a circular substrate 1 having a thickness (t) of 2.2 mm to produce a diamond sorbade D3.
  • the circumference (308 mm x 3.14) calculated using the maximum outer shape (c) of 308 mm as the diameter of the diamond saw blade D3 is 968 mm.
  • the area value calculated by multiplying the circumference of 968 mm by the maximum thickness of the circular substrate (22.2) is 2129 mm 2 .
  • a virtual area (z) calculated by multiplying the maximum thickness of the diamond grindstone by the outer peripheral length of the diamond grindstone (z) is 129.6 mm 2
  • a substantial end face area of the diamond grindstone (e) was 0.70.
  • the diamond saw blade D3 produced as described above was subjected to a concrete cutting test in the same manner as in Example 1. As a result, high-speed cutting at a cutting speed of 11 OOmmZmin was possible, and the life of the diamond saw blade D3 was reached. It was confirmed that cutting work of 320m was possible by now.
  • the diamond saw blade D4 of this comparative example is formed by arranging a plurality of diamond whetstones 2 on the outer peripheral edge of the circular substrate 1. You.
  • the circular substrate 1 of this comparative example is provided with a key-shaped slit 3 having a maximum outer diameter (c) of 307 mm and a maximum thickness (t) of 2 mm.
  • the diamond grindstone 2 of this comparative example is formed in a rectangular parallelepiped shape as shown in FIG. 8 and FIG. 8, and the area of the tip end surface (e) of the blade is 103 mm 2 .
  • a total of 21 diamond whetstones 2 are attached to the mounting portions 4 between the slits 3 of the circular substrate 1.
  • the circular substrate 1 and the diamond grindstone 2 are formed in the sizes shown in the above numerical values, and as a result, the circumferential length (307 mm) calculated by using the maximum outer diameter (c) of the diamond saw blade D4 as 307 mm in diameter is obtained.
  • X 3.14) is 964 mm.
  • the area value calculated by multiplying the circumferential length of 964 mm by the maximum thickness (t) of the circular substrate 1 of 2 mm is 1928 mm 2 .
  • the ratio of 103.0 mm 2 is 1.00.
  • the diamond saw blade D4 produced as described above was subjected to the same cutting test as in Example 1, and as a result, although the wear of the diamond whetstone 2 hardly progressed, the sharpness gradually became dull and every 10 m cut was performed. In addition, sharpening was required, and the average cutting speed before sharpening was required was 650 mmZmin.
  • Example 3 a cutting test was performed on an iron pipe (named “Ductile” iron pipe 80AJ, inner mortar lining, outer diameter 093 mm). Each cut took an average of 36 seconds.
  • the diamond saw blade D5 of this comparative example is formed by arranging a plurality of diamond whetstones 2 on the outer periphery of the circular substrate 1.
  • the circular substrate 1 of this comparative example has the same shape as that of the example 1, and has a key type and a U type slit 3 alternately formed, an outer diameter (a) of 291 mm, and a maximum thickness (t) of 2 mm. Is formed.
  • the diamond grindstone 2 of this comparative example has a length (b) (the length from the joint portion with the circular substrate 1 to the tip of the blade portion) of 8. Omm N as in the first embodiment.
  • the (s) 1. 6 mm are formed the maximum thickness (w) of 2. 8 mm, the area of the blade tip surface (e) to 27 mm 2, the mounting portion 4 between the slits 3 of the circular substrate 1, if A total of 42 are installed.
  • the rock well hardness after firing was adjusted to be HRA57 as the bond of the diamond whetstone 2.
  • the diamond saw blade D6 of this comparative example is formed by arranging a plurality of diamond whetstones 2 on the outer peripheral edge of the circular substrate 1.
  • the circular substrate 1 of this comparative example has the same shape as that of the example 1, and has a key type and a U type slit 3 alternately formed, an outer diameter (a) of 291 mm, and a maximum thickness (t) of 2 mm. Is formed.
  • the diamond grindstone 2 of this comparative example is similar to the diamond grindstone 1 of the first embodiment.
  • a total of 42 pieces are attached to the mounting part 4 between the slits 3, but as shown in Fig. 9, the apparent minimum thickness, that is, the maximum thickness (s) in the .
  • the diamond grindstone 2 in this comparative example is mixed with 4050 mesh diamond abrasive grains having the same particle size as in Example 1. Therefore, the apparent minimum thickness (s) of the diamond grindstone of this example is about 2.times.
  • the diamond saw blade D7 of this comparative example is formed by arranging a plurality of diamond grindstones on the outer peripheral edge of a circular substrate, and the maximum thickness (t) of the circular substrate is 1.8 mm. Except for this, it has the same shape as Comparative Example 1.
  • the diamond grindstone 2 of the present comparative example has a rectangular parallelepiped shape similar to that of the comparative example 1, the thickness (w) is 2.5 mm, and the area of the blade tip surface (e) is 95 mm2. As in the case of Comparative Example 1, a total of 21 diamond whetstones are attached to the mounting portions between the slits of the circular substrate.
  • the circumference (307 mm x 3.14) calculated with the maximum outer diameter (c) of the diamond saw blade D7 as 307 mm is 964 mm.
  • the area value calculated by multiplying the circumferential length of 964 mm by the maximum thickness (t) of the circular substrate 1 (1.8 mm) is “I 736 mm 2 .
  • a virtual area (z) of 95. Omm 2 calculated by multiplying the maximum thickness of the diamond grinding wheel by the outer peripheral length of the diamond grinding stone, and the area of the substantial end face of the diamond grinding stone (e ) The ratio of 95.0 mm 2 is 1.00.
  • the primary compact was a tungsten-based bond and diamond grain having a minimum grain diameter of 0.3 mm, and the sintered diamond grain had a concentration of 0.6 (ctZcm 3 ) It was formed by mixing and molding at a ratio of:
  • the tungsten-based bond was prepared such that the Rockwell hardness of the bond after firing was HRA58, and the diamond saw blade D3 produced as described above was subjected to a concrete cutting test in the same manner as in Example 1.
  • the cutting speed was 640 mmZmin, and the cutting distance until the life of the diamond saw blade D7 was reached was 50 m.
  • Example 3 a cutting test was performed on a steel pipe (namely, “Ductile—iron pipe 80A”, inner mortar lining, outer diameter 093 mm). As a result, one cut required an average of 45 seconds. Industrial applicability
  • the diamond saw blade of the present invention has a circle whose diameter is the maximum outer diameter of the diamond saw blade as a circumference and a surface area value of the disk whose plate thickness is the maximum thickness of the circular substrate.
  • the condition that the ratio of the total area value is 0.3 or more and 1.0 or less is a requirement. By satisfying this requirement, hard and brittle materials such as concrete and stone are dry-ground and cut. When performing cutting, it is possible to achieve a long tool life while maintaining excellent sharpness.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Cette lame circulaire à diamant (D) comprend des meules en diamant (2) fixées sur le bord périphérique extérieur d'un substrat en forme de disque (1), et elle est caractérisée en ce que le rapport entre une seconde valeur (représentant les zones totales des faces d'extrémité (e) des meules (2)) et une première valeur (que l'on calcule en multipliant une longueur périphérique d'un cercle dont le diamètre représente le diamètre extérieur maximal de la lame circulaire à diamant (D), avec une épaisseur maximale (t) du substrat en forme de disque (1)) est d'au moins 0,3 et peut aller jusqu'à 1,0.
PCT/JP2000/001061 1999-02-26 2000-02-24 Lame circulaire a diamant WO2000051789A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP00905312A EP1114696A4 (fr) 1999-02-26 2000-02-24 Lame circulaire a diamant

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11051728A JP2000246651A (ja) 1999-02-26 1999-02-26 ダイヤモンドソーブレード
JP11/51728 1999-02-26

Publications (1)

Publication Number Publication Date
WO2000051789A1 true WO2000051789A1 (fr) 2000-09-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/001061 WO2000051789A1 (fr) 1999-02-26 2000-02-24 Lame circulaire a diamant

Country Status (3)

Country Link
EP (1) EP1114696A4 (fr)
JP (1) JP2000246651A (fr)
WO (1) WO2000051789A1 (fr)

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Publication number Priority date Publication date Assignee Title
EP1254732A1 (fr) * 2001-01-11 2002-11-06 Shiga Yamashita Co., Ltd. Appareil à sectionner
JP2011509853A (ja) * 2008-01-22 2011-03-31 サンゴバン アブレシブ インコーポレーティド 楕円形ガレットを備えた丸鋸ブレード
US8701536B2 (en) 2008-01-22 2014-04-22 Saint-Gobain Abrasives, Inc. Circular saw blade with offset gullets

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DE10224596C1 (de) * 2002-06-04 2003-11-20 Krebs & Riedel Schleifscheiben Diamant-Segment für eine Trennscheibe und Trennscheibe zum Bearbeiten von Naturstein, Kunststein und/oder Feuerfest-Materialien
DE10302318C1 (de) * 2003-01-20 2003-11-20 Klaus Eiche Diamantwerkzeuge G Schneidsegment und Trennscheibe mit Schneidsegmenten
JP2008012606A (ja) * 2006-07-04 2008-01-24 Sumitomo Metal Mining Co Ltd 削孔用カップ型回転砥石

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JPH0731266U (ja) * 1993-11-09 1995-06-13 アカシロイ工業株式会社 電動カッタ−の刃体
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JPH03113757U (fr) * 1990-03-08 1991-11-21
GB2281075A (en) * 1993-08-18 1995-02-22 Hiroshi Hashimoto Grinding tool having abrasive protruberances on the surface thereof
JPH0731266U (ja) * 1993-11-09 1995-06-13 アカシロイ工業株式会社 電動カッタ−の刃体
JPH08309664A (ja) * 1995-05-16 1996-11-26 Matsushita Electric Ind Co Ltd ダイヤモンド砥石及び磁気ヘッドの製造方法
JPH09272857A (ja) * 1996-04-05 1997-10-21 Denki Kagaku Kogyo Kk 多結晶型立方晶窒化ほう素砥粒

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1254732A1 (fr) * 2001-01-11 2002-11-06 Shiga Yamashita Co., Ltd. Appareil à sectionner
JP2011509853A (ja) * 2008-01-22 2011-03-31 サンゴバン アブレシブ インコーポレーティド 楕円形ガレットを備えた丸鋸ブレード
US8701536B2 (en) 2008-01-22 2014-04-22 Saint-Gobain Abrasives, Inc. Circular saw blade with offset gullets

Also Published As

Publication number Publication date
JP2000246651A (ja) 2000-09-12
EP1114696A1 (fr) 2001-07-11
EP1114696A4 (fr) 2007-01-24

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