WO2000045196A3 - Verfahren und vorrichtung zur optischen untersuchung von strukturierten oberflächen von objekten - Google Patents

Verfahren und vorrichtung zur optischen untersuchung von strukturierten oberflächen von objekten Download PDF

Info

Publication number
WO2000045196A3
WO2000045196A3 PCT/DE2000/000256 DE0000256W WO0045196A3 WO 2000045196 A3 WO2000045196 A3 WO 2000045196A3 DE 0000256 W DE0000256 W DE 0000256W WO 0045196 A3 WO0045196 A3 WO 0045196A3
Authority
WO
WIPO (PCT)
Prior art keywords
illuminating
field
objects
whose central
structured surfaces
Prior art date
Application number
PCT/DE2000/000256
Other languages
English (en)
French (fr)
Other versions
WO2000045196A2 (de
Inventor
Michael Veith
Volker Knorz
Edgar Maehringer-Kunz
Original Assignee
Leica Microsystems
Ibm
Michael Veith
Volker Knorz
Maehringer Kunz Edgar
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems, Ibm, Michael Veith, Volker Knorz, Maehringer Kunz Edgar filed Critical Leica Microsystems
Priority to JP2000596395A priority Critical patent/JP2002535687A/ja
Priority to EP00908950A priority patent/EP1073917A2/de
Priority to KR1020007010364A priority patent/KR20010042027A/ko
Priority to US09/647,497 priority patent/US6633375B1/en
Publication of WO2000045196A2 publication Critical patent/WO2000045196A2/de
Publication of WO2000045196A3 publication Critical patent/WO2000045196A3/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/06—Means for illuminating specimens
    • G02B21/08—Condensers
    • G02B21/12—Condensers affording bright-field illumination
    • G02B21/125—Condensers affording bright-field illumination affording both dark- and bright-field illumination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors

Abstract

Es wird ein Verfahren und eine Vorrichtung zur optischen Untersuchung von strukturierten Oberflächen von Objekten, insbesondere von Wafern und/oder Masken beschrieben. Die optische Einrichtung weist einen Beobachtungsstrahlengang (6), dessen Mittelachse (42) senkrecht auf die Oberfläche des Objektes (16) gerichtet ist, ein Beleuchtungsstrahlenbündel (2), dessen Mittelstrahl (40) senkrecht auf die Oberfläche des Objektes (16) fällt und ein Beleuchtungsstrahlenbündel (3), dessen Mittelstrahl (41) schräg auf die Oberfläche des Objektes (16) fällt, auf. Im Beobachtungsstrahlengang (6) wird das Bild der Oberfläche des Objektes (16) beobachtet und/oder detektiert. Im Beobachtungsstrahlengang (6) ist dazu eine Filtereinrichtung (38) und/oder Detektoreinrichtung (18) angeordnet. Die optische Einrichtung weist eine Beleuchtungseinrichtung (39) zur simultanen Erzeugung einer Hellfeld- und einer Dunkelfeldbeleuchtung auf, wobei dem Hellfeld- (2) und/oder dem Dunkelfeld-Beleuchtungsstrahlenbündel (3) eine Einrichtung zur Kennung (11) der Beleuchtungsstrahlenbündel (2, 3) zugeordnet ist.
PCT/DE2000/000256 1999-01-29 2000-01-27 Verfahren und vorrichtung zur optischen untersuchung von strukturierten oberflächen von objekten WO2000045196A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000596395A JP2002535687A (ja) 1999-01-29 2000-01-27 物体のパタン加工表面を光学的に検査する方法および装置
EP00908950A EP1073917A2 (de) 1999-01-29 2000-01-27 Verfahren und vorrichtung zur optischen untersuchung von strukturierten oberflächen von objekten
KR1020007010364A KR20010042027A (ko) 1999-01-29 2000-01-27 물체의 구조화된 표면 광학검사 방법 및 장치
US09/647,497 US6633375B1 (en) 1999-01-29 2000-01-27 Method and device for optically examining structured surfaces of objects

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19903486.9 1999-01-29
DE19903486A DE19903486C2 (de) 1999-01-29 1999-01-29 Verfahren und Vorrichtung zur optischen Untersuchung von strukturierten Oberflächen von Objekten

Publications (2)

Publication Number Publication Date
WO2000045196A2 WO2000045196A2 (de) 2000-08-03
WO2000045196A3 true WO2000045196A3 (de) 2000-11-30

Family

ID=7895744

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/000256 WO2000045196A2 (de) 1999-01-29 2000-01-27 Verfahren und vorrichtung zur optischen untersuchung von strukturierten oberflächen von objekten

Country Status (7)

Country Link
US (1) US6633375B1 (de)
EP (1) EP1073917A2 (de)
JP (1) JP2002535687A (de)
KR (1) KR20010042027A (de)
DE (1) DE19903486C2 (de)
TW (1) TW440708B (de)
WO (1) WO2000045196A2 (de)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10045245A1 (de) * 2000-09-13 2002-03-28 Siemens Ag Einrichtung für optische Inspektion einer auf Defekte hin zu prüfenden Oberfläche eines Objekts
DE10162279A1 (de) * 2001-04-22 2002-10-31 Gunther Roeder Verfahren und Vorrichtung zur Bestimmung der Höhe eines Grates
US6750457B2 (en) * 2001-08-29 2004-06-15 Becton Dickinson And Company System for high throughput analysis
US20050122509A1 (en) * 2002-07-18 2005-06-09 Leica Microsystems Semiconductor Gmbh Apparatus for wafer inspection
DE10239548A1 (de) * 2002-08-23 2004-03-04 Leica Microsystems Semiconductor Gmbh Vorrichtung und Verfahren zur Inspektion eines Objekts
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
DE10301896A1 (de) * 2003-01-17 2004-07-29 Dr.-Ing. Willing Gmbh Stationäre und mobile Polierfehler- und Hologrammbeleuchtung
US20040150815A1 (en) * 2003-02-05 2004-08-05 Applied Vision Company, Llc Flaw detection in objects and surfaces
US20040227839A1 (en) * 2003-05-13 2004-11-18 Stavely Donald J. Systems and methods for determining focus from light collected by the periphery of a lens
DE10330005B4 (de) * 2003-07-03 2006-12-21 Leica Microsystems Semiconductor Gmbh Vorrichtung zur Inspektion eines Wafers
DE102004004761A1 (de) * 2004-01-30 2005-09-08 Leica Microsystems Semiconductor Gmbh Vorrichtung und Verfahren zur Inspektion eines Wafers
JP4837279B2 (ja) * 2004-04-05 2011-12-14 オリンパス株式会社 落射顕微鏡および蛍光フィルターセット
EP1738212B1 (de) * 2004-04-16 2010-08-25 Auburn University Mikroskopbeleuchtungsvorrichtung und adapter dafür
DE102004029212B4 (de) * 2004-06-16 2006-07-13 Leica Microsystems Semiconductor Gmbh Vorrichtung und Verfahren zur optischen Auf- und/oder Durchlichtinspektion von Mikrostrukturen im IR
DE102004034957A1 (de) * 2004-07-16 2006-02-02 Carl Zeiss Jena Gmbh Anordnung zur mikroskopischen Beobachtung und/oder Detektion und Verwendung
WO2006046236A1 (en) * 2004-10-26 2006-05-04 May High-Tech Solutions, Ltd. Method and apparatus for residue detection on a polished wafer
DE102005020542A1 (de) * 2005-05-03 2006-11-09 Carl Zeiss Jena Gmbh Einrichtung und Verfahren zur reproduzierbaren Einstellung der Pinholeöffnung und Pinholelage in Laserscanmikroskopen
DE102005047847A1 (de) * 2005-10-05 2007-04-26 Vistec Semiconductor Systems Gmbh Dunkelfeldobjektiv für ein Mikroskop
US8061610B2 (en) * 2005-10-24 2011-11-22 Cognex Technology And Investment Corporation System and method for employing color illumination and color filtration in a symbology reader
US7372556B2 (en) * 2005-10-31 2008-05-13 The Boeing Company Apparatus and methods for inspecting a composite structure for inconsistencies
WO2007064959A2 (en) * 2005-12-01 2007-06-07 Auburn University High resolution optical microscope
US7688505B2 (en) * 2005-12-09 2010-03-30 Auburn University Simultaneous observation of darkfield images and fluorescence using filter and diaphragm
DE102005061834B4 (de) * 2005-12-23 2007-11-08 Ioss Intelligente Optische Sensoren & Systeme Gmbh Vorrichtung und Verfahren zum optischen Prüfen einer Oberfläche
US20070242335A1 (en) * 2006-02-20 2007-10-18 Hasling Thomas A Translational filter, shutter, aperture apparatus for selecting and combining filtered and unfiltered light
US8031931B2 (en) 2006-04-24 2011-10-04 Applied Materials South East Asia Pte. Ltd. Printed fourier filtering in optical inspection tools
JP2007327896A (ja) * 2006-06-09 2007-12-20 Canon Inc 検査装置
US7714998B2 (en) 2006-11-28 2010-05-11 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
US7719674B2 (en) 2006-11-28 2010-05-18 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
DE102007018922A1 (de) * 2007-02-12 2008-08-14 Leica Microsystems Cms Gmbh Mikroskop
JPWO2008099939A1 (ja) * 2007-02-13 2010-05-27 株式会社ニコン・トリンブル 光分割素子、距離測定装置
TWI370894B (en) * 2007-02-26 2012-08-21 Corning Inc Method for measuring distortion
TWI433052B (zh) * 2007-04-02 2014-04-01 Primesense Ltd 使用投影圖案之深度製圖
US7782452B2 (en) * 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels
DE102008002780A1 (de) * 2008-02-22 2009-09-10 Vistec Semiconductor Systems Gmbh Verfahren und Vorrichtung zum Bestimmen der zu erwartenden Lage von Strukturen auf Masken während deren Herstellung
TWI479583B (zh) * 2008-04-04 2015-04-01 Nanda Technologies Gmbh 光學檢驗的系統與方法
US8462328B2 (en) * 2008-07-22 2013-06-11 Orbotech Ltd. Efficient telecentric optical system (ETOS)
US8928892B2 (en) 2009-03-04 2015-01-06 Elie Meimoun Wavefront analysis inspection apparatus and method
JP4922331B2 (ja) * 2009-03-27 2012-04-25 株式会社東芝 パターン検査装置
US8388204B2 (en) * 2009-09-22 2013-03-05 Cyberoptics Corporation High speed, high resolution, three dimensional solar cell inspection system
US8670031B2 (en) * 2009-09-22 2014-03-11 Cyberoptics Corporation High speed optical inspection system with camera array and compact, integrated illuminator
US8894259B2 (en) * 2009-09-22 2014-11-25 Cyberoptics Corporation Dark field illuminator with large working area
US8681211B2 (en) * 2009-09-22 2014-03-25 Cyberoptics Corporation High speed optical inspection system with adaptive focusing
US8872912B2 (en) * 2009-09-22 2014-10-28 Cyberoptics Corporation High speed distributed optical sensor inspection system
JP5501848B2 (ja) * 2010-05-10 2014-05-28 株式会社ハイロックス デジタル顕微鏡
US9128036B2 (en) 2011-03-21 2015-09-08 Federal-Mogul Corporation Multi-spectral imaging system and method of surface inspection therewith
JP2013098262A (ja) * 2011-10-28 2013-05-20 Canon Inc 光学装置、位置検出装置及び顕微鏡装置
US20130321906A1 (en) * 2012-05-29 2013-12-05 Peter KRIOFSKE Annulus to create distinct illumination and imaging apertures for an imaging system
TWI702386B (zh) * 2014-07-17 2020-08-21 以色列商奧寶科技股份有限公司 遠心亮場與環形暗場無縫融合式照射
KR102241978B1 (ko) * 2014-09-11 2021-04-19 삼성전자주식회사 피검체의 표면 검사 방법 및 이를 수행하기 위한 광학 시스템
EP3255415B1 (de) * 2015-02-04 2022-06-01 Syntegon Technology K.K. Inspektionsvorrichtung und inspektionssystem
AU2016232975C1 (en) * 2015-03-13 2021-11-25 Genea Ip Holdings Pty Limited Method and apparatus for microscopy
JP6119784B2 (ja) * 2015-03-17 2017-04-26 大日本印刷株式会社 異物検査方法
JP6119785B2 (ja) * 2015-03-17 2017-04-26 大日本印刷株式会社 異物検査装置、異物検査方法
WO2018163572A1 (ja) * 2017-03-10 2018-09-13 富士フイルム株式会社 画像処理システム、画像処理装置、画像処理方法及び画像処理プログラム
CN109870128B (zh) * 2019-03-19 2022-06-28 青岛科技大学 一种喷墨打印中微纳结构形貌实时监测光路系统
US11676266B2 (en) 2020-11-04 2023-06-13 Tokyo Electron Limited Method and apparatus for inspecting pattern collapse defects
CN112649438A (zh) * 2020-12-16 2021-04-13 苏州工业园区久泰精密电子有限公司 一种基于物联网的aoi自动检测一体机检测方法
CN113092346B (zh) * 2021-04-06 2022-02-11 中国水利水电科学研究院 一种藻类细胞计数检测系统及其检测方法
US11927545B1 (en) 2023-01-12 2024-03-12 Camtek Ltd Semiconductor edge and bevel inspection tool system

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2021784A1 (de) * 1969-05-09 1970-11-19 Reichert Optische Werke Ag Beleuchtungseinrichtung fuer Auflichtmikroskope
DE2331750C3 (de) * 1973-06-22 1978-04-20 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Auflicht-Beleuchtungseinrichtung für wahlweise Hell- und Dunkelfeldbeleuchtung
US4585315A (en) * 1984-11-13 1986-04-29 International Business Machines Corporation Brightfield/darkfield microscope illuminator
US4595289A (en) * 1984-01-25 1986-06-17 At&T Bell Laboratories Inspection system utilizing dark-field illumination
US4681442A (en) * 1984-05-14 1987-07-21 International Business Machines Corporation Method for surface testing
US4720191A (en) * 1985-11-19 1988-01-19 Carl-Zeiss-Stiftung Method and apparatus for light span microscopic dark-field display of objects
DE3714830A1 (de) * 1987-05-05 1988-11-17 Leitz Ernst Gmbh Kombinierte hellfeld-dunkelfeld- auflichtbeleuchtungseinrichtung
WO1998020327A1 (en) * 1996-11-04 1998-05-14 Kla-Tencor Corporation Automated inspection system with bright field and dark field illumination
US5805278A (en) * 1995-02-09 1998-09-08 Inspex, Inc. Particle detection method and apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54103362A (en) * 1978-01-31 1979-08-14 Matsushita Electric Ind Co Ltd Optical observation apparatus
US4644172A (en) * 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
JPH02170279A (ja) * 1988-12-23 1990-07-02 Hitachi Ltd 被検査対象パターンの欠陥検出方法及びその装置
NL8901380A (nl) * 1989-02-14 1990-09-03 Heuft Qualiplus Bv Simultane dubbele inspectie.
US5278012A (en) * 1989-03-29 1994-01-11 Hitachi, Ltd. Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate
US5293538A (en) * 1990-05-25 1994-03-08 Hitachi, Ltd. Method and apparatus for the inspection of defects
US5719704A (en) * 1991-09-11 1998-02-17 Nikon Corporation Projection exposure apparatus
JPH05223532A (ja) * 1991-07-10 1993-08-31 Raytheon Co 自動視覚検査システム
US5343290A (en) * 1992-06-11 1994-08-30 International Business Machines Corporation Surface particle detection using heterodyne interferometer
US5515452A (en) * 1992-12-31 1996-05-07 Electroglas, Inc. Optical character recognition illumination method and system
US5515163A (en) * 1994-09-01 1996-05-07 Sunshine Medical Instruments, Inc. Method and apparatus for detection, analysis and identification of particles
WO1996039619A1 (en) * 1995-06-06 1996-12-12 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen
US5820250A (en) * 1995-10-24 1998-10-13 Dolan-Jenner Industries, Inc. Dark field illuminator ringlight adaptor
US5883714A (en) * 1996-10-07 1999-03-16 Phase Metrics Method and apparatus for detecting defects on a disk using interferometric analysis on reflected light
US6201601B1 (en) * 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US5982493A (en) * 1998-06-02 1999-11-09 Motorola, Inc. Apparatus and method for acquiring multiple images
US6122047A (en) * 1999-01-14 2000-09-19 Ade Optical Systems Corporation Methods and apparatus for identifying the material of a particle occurring on the surface of a substrate

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2021784A1 (de) * 1969-05-09 1970-11-19 Reichert Optische Werke Ag Beleuchtungseinrichtung fuer Auflichtmikroskope
DE2331750C3 (de) * 1973-06-22 1978-04-20 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Auflicht-Beleuchtungseinrichtung für wahlweise Hell- und Dunkelfeldbeleuchtung
US4595289A (en) * 1984-01-25 1986-06-17 At&T Bell Laboratories Inspection system utilizing dark-field illumination
US4681442A (en) * 1984-05-14 1987-07-21 International Business Machines Corporation Method for surface testing
US4585315A (en) * 1984-11-13 1986-04-29 International Business Machines Corporation Brightfield/darkfield microscope illuminator
US4720191A (en) * 1985-11-19 1988-01-19 Carl-Zeiss-Stiftung Method and apparatus for light span microscopic dark-field display of objects
DE3714830A1 (de) * 1987-05-05 1988-11-17 Leitz Ernst Gmbh Kombinierte hellfeld-dunkelfeld- auflichtbeleuchtungseinrichtung
US5805278A (en) * 1995-02-09 1998-09-08 Inspex, Inc. Particle detection method and apparatus
WO1998020327A1 (en) * 1996-11-04 1998-05-14 Kla-Tencor Corporation Automated inspection system with bright field and dark field illumination

Also Published As

Publication number Publication date
TW440708B (en) 2001-06-16
JP2002535687A (ja) 2002-10-22
WO2000045196A2 (de) 2000-08-03
KR20010042027A (ko) 2001-05-25
US6633375B1 (en) 2003-10-14
EP1073917A2 (de) 2001-02-07
DE19903486A1 (de) 2000-08-03
DE19903486C2 (de) 2003-03-06

Similar Documents

Publication Publication Date Title
WO2000045196A3 (de) Verfahren und vorrichtung zur optischen untersuchung von strukturierten oberflächen von objekten
EP2256487A3 (de) Verfahren zur Prüfung einer Probe mit verschiedenen Prüfparametern
EP1353165A3 (de) Verfahren und Vorrichtung zur automatisierten Prüfung von Photomasken
EP0398781A3 (de) Vorrichtung zur Feststellung von Teilchen in flüssigen Metallen
WO2001096840A3 (en) High sensitivity optical inspection system and method for detecting flaws on a diffractive surface
WO2002093200A3 (en) Advanced phase shift inspection method
WO2003078976A3 (en) Excimer laser inspection system
EP1245987A3 (de) Konfokales Rastermikroskop
WO1998044330A3 (en) Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
WO2002035217A3 (en) Methods for continuous embedded process monitoring and optical inspection of substrates using specular signature analysis
WO2002029393A3 (en) Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques
WO1985003353A1 (en) Inspection system utilizing dark-field illumination
WO1998052025A1 (fr) Procede et instrument de controle de surface
TW200632311A (en) Visual inspection apparatus and visual inspection method
WO2003014659A3 (en) Method and system for measuring the topography of a sample
CA2334225A1 (en) Method and device for opto-electrical acquisition of shapes by axial illumination
JP4001653B2 (ja) 試料からの多重チャネル応答を用いた試料の光学的検査
JPH06294749A (ja) 板ガラスの欠点検査方法
JPS6321855B2 (de)
ATE370799T1 (de) Vorrichtung zur abgabe eines fluids
WO2001098755A3 (en) Optical inspection method and apparatus with adaptive spatial filter
EP1353209A3 (de) Scannende Anordnung, vorzugsweise zur Erfassung von Fluoreszenzlicht
GB2357577A (en) Illuminator for inspecting substantially flat surfaces
EP1139140A3 (de) Optisches Mikroskop mit konvergentem Beleuchtungsstrahl
WO2001044852A3 (de) Verfahren und vorrichtung zur mikroskopie

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP KR US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

WWE Wipo information: entry into national phase

Ref document number: 2000908950

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020007010364

Country of ref document: KR

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 09647497

Country of ref document: US

AK Designated states

Kind code of ref document: A3

Designated state(s): JP KR US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

WWP Wipo information: published in national office

Ref document number: 2000908950

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020007010364

Country of ref document: KR

WWW Wipo information: withdrawn in national office

Ref document number: 1020007010364

Country of ref document: KR

WWW Wipo information: withdrawn in national office

Ref document number: 2000908950

Country of ref document: EP