WO2000002239A1 - Systeme d'exposition, procede de production de ce dernier, procede de transfert de tranches, dispositif et procede de fabrication du dispositif - Google Patents

Systeme d'exposition, procede de production de ce dernier, procede de transfert de tranches, dispositif et procede de fabrication du dispositif Download PDF

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Publication number
WO2000002239A1
WO2000002239A1 PCT/JP1999/003565 JP9903565W WO0002239A1 WO 2000002239 A1 WO2000002239 A1 WO 2000002239A1 JP 9903565 W JP9903565 W JP 9903565W WO 0002239 A1 WO0002239 A1 WO 0002239A1
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WO
WIPO (PCT)
Prior art keywords
substrate
container
exposure apparatus
wafer
opening
Prior art date
Application number
PCT/JP1999/003565
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Ken Hattori
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to KR1020007013604A priority Critical patent/KR20010043979A/ko
Priority to AU43959/99A priority patent/AU4395999A/en
Publication of WO2000002239A1 publication Critical patent/WO2000002239A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Definitions

  • the present invention relates to an exposure apparatus and a method for manufacturing the same, a substrate transfer method, and a device manufacturing method and a device. More specifically, the present invention relates to an exposure apparatus having a substrate transfer system, a method for manufacturing the same, and a method using the substrate transfer system. The present invention relates to a substrate transfer method, a device manufacturing method using the above-described exposure apparatus, and a device manufactured by the manufacturing method. Background art
  • An exposure apparatus such as a so-called stepper or a so-called scanning stepper is used in a lithographic process for manufacturing a semiconductor device or the like.
  • a reticle pattern as a mask is formed on a one-lot wafer.
  • a wafer loader system is provided as a substrate transfer system for loading a wafer onto a wafer stage and unloading the wafer.
  • FIG. 34 is a schematic plan cross-sectional view of a conventional exposure apparatus 300, mainly showing a wafer loader system.
  • This exposure apparatus 300 can be suitably used by being connected in-line to a not-shown developer (CoaterZD eveloper: hereinafter abbreviated as “C / D” as appropriate). It is. Note that, in FIG. 34, parts other than the wafer stage WST of the air conditioning system and the exposure apparatus body are not shown.
  • the exposure apparatus 300 includes a first chamber 202 and a second chamber 204 arranged adjacent to each other in the Y direction, and most of the wafer loader system is provided in the first chamber 202.
  • the reticle pattern (not shown) is stored in the second chamber 204
  • the main body of the exposure apparatus (parts other than the wafer stage WST are not shown) for transferring to the wafer W on the stage WST is housed.
  • the wafer loader system is composed of an X guide 206 extending in the X direction (left and right directions in FIG. 34) and a Y guide 206 located above (the front side in FIG. 34) and extending in the Y direction (vertical direction in FIG. 34).
  • a guide 208 is provided as a transport guide.
  • the Y guide 208 is provided so as to penetrate the first and second chambers 202 and 204.
  • Carrier tables 210A and 210B are arranged at both ends in the X direction on the Y side of the X guide 206 in the first chamber 202, and these carrier tables 210A and 210B are provided.
  • an open carrier (Open Carrier: hereafter abbreviated as “ ⁇ C” as appropriate) 2 12 A and 2 12 B capable of storing a plurality of wafers are placed.
  • a horizontal articulated robot (scalar robot) 214 that is driven by a driving device (not shown) and moves along the X guide 206 is provided.
  • the Y guide 208 is provided with a wafer opening arm 216 and a wafer opening arm 218 which are driven by a driving device (not shown) and move along the Y guide 208. ing.
  • a turntable (rotary table) 220 that can be finely driven in the X ⁇ ⁇ two-dimensional direction is arranged on one X side of the _Y direction end of the Y guide 208 in the first chamber 202.
  • the wafer edge sensor 222 is arranged at a position separated by a predetermined distance in the Y direction.
  • the wafer stage WST moves XY two-dimensionally on the surface plate held by the vibration isolation pad, and the reticle pattern is transferred to the wafer W held on the wafer stage WST. It has become so.
  • an in-line interface (not shown) with the C / D (hereinafter abbreviated as an in-line I / F) is arranged on the ⁇ X side of the first chamber 202.
  • an operation sequence of exposure apparatus 300 in FIG. 34 will be described.
  • the wafer W that has completed the resist coating process by the C / D (not shown) is transferred to a robot arm (not shown) of the in-line IZF unit by a C / D side arm (not shown), and the robot arm , Is passed to the inline delivery unit.
  • the horizontal articulated robot 211 moves to the left end position along the X guide 206, extends the arm toward the inline transfer section through the opening of the chamber 202, and transfers the inline.
  • the arm of the robot 214 transports the wafer W to the position indicated by the symbol W20 in FIG. This transfer is performed by rotation and expansion and contraction (and, in some cases, up and down movement) of the arm of the robot 214.
  • the horizontal articulated robot 2-4 moves to the right along the X guide 206 to the front of the turntable 220, and the arm of the robot 214 expands and contracts the wafer W.
  • the sheet is transported to the position indicated by the symbol W21.
  • the wafer W is transferred from the arm of the robot 214 to the turntable 220. This delivery is performed by lowering the arm of the robot 214 or raising the evening table 220.
  • the drive unit 220 is rotationally driven by a drive system (not shown), whereby the wafer W held on the drive table 220 is rotated.
  • a controller (not shown) controls the direction of the notch of the wafer W and the center of the wafer W.
  • the amount of eccentricity (direction and size) with respect to the center of the table 220 is determined.
  • the direction of the notch portion of the wafer W is adjusted to a predetermined direction by rotating the turntable 220, and the eccentric amount between the center of the wafer W and the center of the turntable 220 at that time in the X direction.
  • the turntable 220 is minutely driven in the X direction and the Y direction according to the component and the Y direction component to correct the notch direction and the center position of the wafer W.
  • the load arm 2 16 is at the predetermined wafer receiving position, Due to the center position correction, the center of the load arm at the wafer receiving position is aligned with the center of the wafer.
  • the eccentricity component in the Y direction may be corrected by the stop position of the load arm 2 16.
  • the load arm 216 receives the wafer W from the evening table 220, moves along the Y guide 208, and stands above the wafer stage WST waiting at a predetermined loading position.
  • the wafer is transferred to the wafer stage WST.
  • an exposure processing operation is performed on the wafer W transferred onto the wafer stage WST.
  • the unloading arm 218 transports the exposed wafer W to a position above the X guide 206 and transfers it to the arm of the robot 214 waiting there. Then, the wafer W is transferred by the arm of the robot 214, and finally transferred to the in-line transfer unit.
  • the Z-direction stroke of the arm of the robot 214 is set to a stroke necessary for transferring the wafer to the evening table 220 or the like.
  • the carrier table 21OA or 210B is moved up and down so that the wafer to be accessed is adjusted to the height of the arm of the robot 214.
  • the access of the wafer in the OC is performed by moving the carrier table up and down.
  • Front Opening Unified Pod (hereinafter referred to as “FUP UP”) Wafers are also stored and transported in openable containers called ").
  • FOUP Front Opening Unified Pod
  • the FOUP maintains the cleanness in the FOUP (to prevent dust from entering the FOUP). Since the UP needs to be pressed against the outer wall of the first chamber 202, the table on which the FO UP is mounted cannot be moved up and down every time the wafer is accessed.
  • the vertical movement distance of a mouth-bottom arm or an evening table or the like is made as small as possible to shorten the wafer transfer time.
  • Wafer stage WS Wafer transfer height and set the OC installation height.
  • the height of the wafer stage WST was set to be approximately 600 mm above the floor because the overall height of the equipment had to be kept as low as possible, and the height of transferring the wafer from the robot arm to the turntable was also set to be approximately 600 mm above the floor.
  • the height of about 600 mm was an acceptable height because the wafer size was mainly 8 inches or less, but if the mainstream in the future is considered to be a wafer size of 12 inches, it is not necessarily an appropriate height. It cannot be called the OC or FOU P installation height. In other words, in the case of a 12-inch wafer, there is a restriction from the ergonomic point of view, and it must be set to approximately 900 mm on the floor. For this reason, in order to achieve as much as possible a common transport system with the FOUP compatible case, if an attempt is made to access the wafers in the OC by robot, the access to the top wafer in the OC is not possible.
  • the access height is approximately 1 1 70 (900 + 270) mm on the floor and the wafer transfer height to the table is approximately 600 mm on the floor
  • the Z-stroke of the robot arm is extremely low. It can be as large as 570 mm.
  • the Z-direction drive mechanism is increased in size, the space for moving up and down the robot arm is increased, and the throughput is reduced due to an increase in the wafer transfer time.
  • the so-called stand-alone loan which makes the exposure equipment independent of the substrate processing equipment such as CZD, is also used.
  • a container table for mounting a transport container for storing and transporting wafers for each lot is set in the chamber of the exposure apparatus. Then, a wafer is transferred between the container placed on the container table and the wafer stage by a wafer loader system.
  • an open type container such as ⁇ C has been mainly used as a transport container in the past, but in recent exposure equipment corresponding to 12 inch wafers, wafers have been cleaned.
  • openable containers such as the FOUP described above to store wafers before and after exposure. There is a move to carry.
  • the clean room where the exposure equipment is installed is very expensive, so it is desirable to reduce its floor area. Therefore, a large number of exposure equipment can be efficiently placed in a limited space. Is required.
  • the dimension of the exposure apparatus in the depth direction must be increased. Need to be smaller.
  • the opening and closing device of the FOUP door needs to be arranged at the position facing the container table due to its nature.
  • the opening and closing device and the robot for taking in and out the wafer in F0UP are consequently required. It is necessary to arrange them in the chamber side by side in the depth direction of the device, and the front of the chamber protrudes further toward the front of the device compared to the case of ⁇ C, which makes the device larger. For this reason, it is difficult to meet the above-mentioned demands for adopting the above-mentioned optimal layout and improving the space efficiency of the clean room.
  • the present invention has been made under such circumstances, and a first object of the present invention is to provide an exposure apparatus, a method of manufacturing the same, and a method of transporting a substrate, which contribute to a reduction in the production cost of devices such as semiconductor devices. Is to do.
  • a second object of the present invention is to provide a device manufacturing method capable of manufacturing a device such as a semiconductor element at a lower cost, and a device manufactured by the method. Disclosure of the invention
  • an exposure apparatus connected in-line with a substrate processing apparatus (200), wherein a substrate transfer unit that transfers a substrate to and from the substrate processing apparatus is provided therein.
  • the inline interface section is independently provided between the apparatus and the substrate processing apparatus as in a conventional apparatus. Since there is no need to provide such a device, the required space of the clean room can be reduced accordingly, and the improvement of space efficiency can reduce the equipment cost of the clean room and, consequently, the production cost of devices such as semiconductor devices.
  • the substrate delivery unit may include the substrate processing device.
  • the substrate may be transferred to and from the substrate transfer arm on the loading side.
  • the substrate since the substrate is transferred to and from the substrate transfer arm on the substrate processing apparatus side by the substrate transfer unit, the substrate is transferred via the in-line interface unit in the conventional example.
  • the number of times of transferring the substrate can be reduced, thereby reducing the generation of dust and, by extension, the yield of devices, thereby further reducing the production cost.
  • the substrate transfer unit may include the substrate transporter
  • the substrate transfer section may further include an inline interface unload arm for transferring the exposed substrate to and from the substrate transfer arm.
  • the load-side transfer sequence of the substrate before exposure loading of the substrate from the substrate processing apparatus
  • the unload-side transfer sequence of the exposed substrate selection of the substrate to the substrate processing apparatus
  • the in-line interface unload arm includes: It is desirable that the in-line interface is disposed almost directly below the load arm. In such a case, since both arms are arranged vertically in two stages, the installation space can be reduced as much as possible when compared to a case where both arms are arranged side by side, and the surrounding space can be reduced. Effective use becomes possible.
  • a substrate stage (WST) on which a substrate to be exposed is placed; and a substrate transport system (100) for transporting the substrate to the substrate stage.
  • the substrate transfer section can be arranged in a chamber (12) in which a connection section of the substrate transfer system with the substrate processing apparatus is stored.
  • a chamber (12) in which a connection section of the substrate transfer system with the substrate processing apparatus is stored.
  • the substrate transfer unit is disposed at a corner of the chamber on the side where the substrate processing apparatus is connected, and can be configured by a robot having an arm that can freely rotate and expand and contract.
  • the substrate processing apparatus even if the substrate processing apparatus is connected to either the front side or the side of the chamber, it can be dealt with without changing the structure of the substrate transfer system and the substrate transfer section. Also, in this case, whether the inline interface is provided temporarily or whether the inline interface is connected to the front side or the side of the chamber, the substrate transport system and the substrate transfer unit It is possible to respond without changing the structure.
  • an exposure apparatus connected in-line with a substrate processing apparatus (200), wherein the substrate stage (WST) on which a substrate to be exposed is placed; A substrate transport system (100) for transporting the substrate with respect to; and a chamber (12) in which a connection portion of the substrate transport system with the substrate processing apparatus is housed, on a side opposite to the substrate processing apparatus.
  • a second exposure apparatus comprising: a container table for disposing a substrate container for storing the substrate.
  • the container table for installing the substrate container is disposed on the opposite side of the substrate processing apparatus in the chamber in which the connection portion of the substrate transport system with the substrate processing apparatus is stored. Adjust the length of the transport path (transport guide) of the transport system
  • the space in front of the container table can be used effectively, and a robot arm or the like can be arranged in the space, and the footprint hardly increases due to the improvement of the space efficiency in the chamber.
  • a substrate processing apparatus for example, in-line connection with a C / D, OC, and FOP
  • the configuration of the substrate transfer system and the transfer sequence can be made as common as possible.
  • the present invention by improving the space efficiency in the chamber (improving the space efficiency in the clean room), the configuration of the substrate transfer system, and the common transfer sequence, the cost of equipment such as the clean room and the exposure apparatus can be reduced. The production cost of devices such as semiconductor elements can be reduced.
  • the substrate transport system (100) transfers the unexposed substrate from each of the substrate processing apparatus (200) and the container on the container table to the substrate stage (WS).
  • T a first transfer guide for transferring the exposed substrate toward the substrate processing apparatus and the container, respectively.
  • a transport guide that is, an unload-side transport guide (16)
  • the ends of the first and second transport guides on the container table side are set to positions shorter than the front of the container table. Is desirable.
  • a robot arm or the like can be arranged in front of the container table.
  • the container table may be a table (22B) for installing an open-type container (24B).
  • the container table may be A plurality of substrates are housed at predetermined intervals in the vertical direction, an opening is provided only on the front surface, and an openable container (106) having a lid ( ⁇ 08) for opening and closing the opening is installed.
  • Table (104) the container table for installing the openable container is Since the connection part with the apparatus is arranged on the opposite side of the substrate processing apparatus in the chamber in which the apparatus is housed, an opening / closing mechanism for opening and closing the lid of the openable / closable container can be arranged in front of the container table. Therefore, it is possible to install the FOUP in the same chamber space as when installing a container without a lid such as an open carrier.
  • the second exposure apparatus may further include a rotating device for rotating the container table.
  • the container table for installing the substrate container can be rotationally driven by the rotating device. Therefore, according to the empty space outside the chamber of the clean room where the exposure apparatus is installed, and the loading of the substrate container.
  • the direction of loading and unloading the board container to and from the container table can be determined in consideration of the efficiency of unloading work. Therefore, the space efficiency of the clean room and the efficiency of loading / unloading the substrate container can be improved at the same time.
  • the substrate processing apparatus can be arranged on either the front side or the side of the chamber via the in-line interface or without the in-line interface.
  • the substrate processing apparatus may be a coating apparatus (a resist coating apparatus), a developing apparatus (a developing apparatus), or the like. It is desirable. In such a case, a series of processes of resist coating, exposure, and development, which are performed in a lithographic process using an exposure apparatus and a substrate processing apparatus, are performed under an environment in which dust and the like are almost certainly prevented from entering the apparatus. It can be performed efficiently with high efficiency, and the production cost of devices can be reduced by improving productivity.
  • an exposure apparatus for transferring a predetermined pattern onto a substrate comprising: a substrate stage (WST) on which a substrate (W) to be exposed is placed; And a rotary table (42) that rotatably holds the substrate and moves in a predetermined direction while forming a part of a substrate transport system (100) that transports the substrate. is there.
  • a part of the substrate transport system that transports the substrate to the substrate stage is provided, and the rotary table that rotatably holds the substrate and moves in a predetermined direction is provided.
  • the substrate rotation error can be corrected while transporting the substrate toward the substrate stage, for example, by detecting the substrate rotation error in advance. Becomes Therefore, a part of the substrate rotational position alignment time can be overlapped with the substrate transfer time, thereby improving the throughput and improving the productivity, and also reducing the production cost of devices such as semiconductor devices. become.
  • a displacement detector (48, 90) for detecting a displacement of the substrate rotating on the turntable (42) during the movement in the predetermined direction may be further provided.
  • the position shift detecting device can perform the position shift detection operation during the transfer of the substrate, and the position shift detection time of the substrate can be completely overlapped with the transfer time of the substrate. Throughput is further improved.
  • a dedicated space for detecting a positional shift for the approximate alignment of the substrate is not required, and the space efficiency is improved. Therefore, by improving productivity and reducing equipment costs, it is possible to further reduce the production cost of devices such as semiconductor elements.
  • the peripheral exposure unit (51) is provided integrally with the rotary table so as to be movable in the predetermined direction, and exposes a peripheral portion of the substrate rotating on the rotary table.
  • a peripheral exposure unit that is provided so as to be movable in a predetermined direction integrally with the rotary table and that exposes a peripheral portion of the substrate rotating on the rotary table is further provided.
  • Peripheral exposure can be performed. For this reason, the peripheral exposure time can at least partially overlap the substrate transfer time, thereby improving the throughput and reducing dust generation due to peeling of the resist around the substrate. Therefore, by improving productivity and yield, The production cost of devices such as elements can be reduced.
  • the peripheral exposure unit may perform peripheral exposure of the substrate at a predetermined position in the substrate transport path, but exposes the peripheral portion of the substrate rotating on the rotary table while moving in the predetermined direction. You may do it.
  • the peripheral exposure unit when a peripheral exposure unit is provided, the peripheral exposure unit may also have a displacement detection function for detecting a displacement of the substrate.
  • the peripheral exposure unit by adjusting the position shift of the substrate such as a wafer based on the result of the position shift detection, it becomes possible to expose the periphery of the substrate with substantially the same width over the entire circumference by the peripheral exposure unit. .
  • the substrate transport system (100) further includes a position correction system that corrects the detected positional shift of the substrate during the transport of the substrate. Is also good. In such a case, the displacement of the substrate is corrected during the transfer of the substrate by the position correction system, so that the throughput does not decrease due to the correction.
  • the substrate transport system (100) has a substrate transport arm (50) that moves in a direction orthogonal to the direction of movement of the rotary table (42) and receives the substrate from the rotary table.
  • the position correction system may correct the position of the substrate in the two-dimensional direction by correcting the position of the rotary table and the position of the substrate transfer arm. Further, in this case, the position correction system may correct the positional deviation of the substrate in the rotational direction by rotating the turntable.
  • a substrate stage on which a substrate (W) to be exposed is mounted; and a substrate transport system (100) for transporting the substrate to the substrate stage.
  • a container table ((22A, 22B) or 104) on which a container ((24A, 24B) or 106) for storing the substrate is installed; and Before the exposure processing of the substrate inside the container, the second position from the first position.
  • a fourth exposure apparatus including a driving device ((90, 94) or (90, 114)) that is driven downward to the position.
  • the driving device drives the container table to descend from the first position to the second position before starting the exposure processing of the substrate inside the container.
  • the first position is a height position suitable for the work of installing the container on the container table.
  • the second position is set to the height of the substrate transfer path by the substrate transfer system, for example, approximately 600 mm above the floor, which is the installation height of the substrate stage.
  • the moving stroke in the height direction can be set short, and the lowering drive from the first position to the second position of the container table needs to be performed only once before starting the exposure processing of the substrate inside the container. Therefore, even if the substrate becomes large, the throughput of the substrate transfer can be improved, and the productivity of devices such as semiconductor elements can be improved, thereby reducing the production cost of the device.
  • a transfer arm that moves vertically with respect to the container table in order to access a substrate in the container after the container table is lowered to the second position.
  • a substrate detection device for notifying the substrate inside the container while the container table is descending may be further provided.
  • the sensor unit of this board detection device is configured by a fiber sensor
  • the container is an open type container
  • both a transmission type and a reflection type sensor are used, but the container is an open / close type container.
  • a reflection type photo sensor is used.
  • this is made of a light-transmitting material, It is possible to use a remote sensor.
  • a substrate stage (WST) on which a substrate (W) to be exposed is mounted; a container table on which a container for storing the substrate is installed; a substrate stage and the container A substrate transport system (100) for transporting a substrate between the substrate transport system and the substrate transport system, and moves relative to the container table during the substrate transport sequence to detect the substrate in the container.
  • WST substrate stage
  • a substrate transport system (100) for transporting a substrate between the substrate transport system and the substrate transport system, and moves relative to the container table during the substrate transport sequence to detect the substrate in the container is a fifth exposure apparatus provided with a substrate detection device that performs the following.
  • the board detecting device detects the board in the container by moving relatively to the container table in the middle of the board transfer sequence of the board transfer system, that is, the board transfer of the board in the container to the board stage.
  • the board in the container is detected in parallel with the operation for For this reason, the throughput can be improved as compared with the case where the substrate in the container is detected irrespective of the above-mentioned substrate transfer, and the productivity is improved, and as a result, the production cost of devices such as semiconductor elements is reduced. Can be reduced.
  • the substrate detection device When the lid is moved to open the lid of the container, a substrate in the container can be detected. In such a case, when the lid is moved to open the lid of the openable container, the substrate in the container is detected by the substrate detection device. That is, since the opening and closing of the lid and the detection of the substrate are performed in parallel, the throughput can be improved as compared with the case where the substrate in the container is detected after the opening and closing of the lid.
  • the substrate transport system (100) includes a robot (32 or 92) for loading and unloading a substrate from and to the container
  • the apparatus may detect a substrate in the container when the robot moves. In such a case, the robot moves the container to carry out the board.
  • the substrate can be easily detected by the substrate detection device, and the detected substrate can be unloaded from the container by the robot.
  • an open container such as an open carrier may be used as the container.However, a plurality of substrates are stored at predetermined intervals in the vertical direction, and an opening is provided only on the front surface.
  • An openable / closable container (106) having a lid (108) for opening and closing the opening may be used.
  • a substrate detection device having a transmission type or reflection type photo sensor may be used, but in the case of an openable container, the substrate detection device is a transmission type that enters and exits the container. It is desirable to have a photo sensor.
  • the substrate detection device may detect the presence or absence of the substrate for each stage of the container.
  • a substrate stage (WST) on which a substrate (W) to be exposed is mounted; and a substrate transport system (100) for transporting the substrate to the substrate stage.
  • a sixth exposure apparatus comprising: an opening / closing mechanism (112) arranged in a chamber accommodating at least a part of the substrate transport system, for opening and closing a lid of the container.
  • the opening / closing mechanism for opening / closing the openable / closable container lid is disposed in the chamber in which at least a part of the substrate transfer system is housed. Can be maintained.
  • the cleanroom cleanliness level is class 1. There is no problem even if it is about 0 to 100. Therefore, according to the present invention, clean room equipment costs and running costs are low. As a result, the production cost of devices such as semiconductor elements can be reduced.
  • a container table may also be arranged in the chamber.
  • the space in the chamber is almost the same as in the case of the inline connection with the substrate processing apparatus and the open-type container. That is, it is possible to configure an apparatus that supports in-line connection with the substrate processing apparatus and an openable container without increasing the footprint of the apparatus.
  • a space for the container mounted on the container table and a space for mounting and storing a mask having a pattern transferred to the substrate are formed. They can be set at almost the same height. In such a case, both the installation of the container and the mounting of the mask can be performed under ergonomically nearly optimal conditions.
  • the container mounting space and the space for mounting and storing the mask may be provided in independent chambers.
  • the container when the space for mounting the container is provided on each of the left and right sides in the chamber, the container may be mounted on only one of the spaces, and the operation device may be arranged on the other.
  • the operating device can be arranged at a height position under ergonomically nearly optimum conditions without increasing the space in the chamber.
  • the sixth exposure apparatus may further include a rotating device for rotating the container table.
  • the container table for installing the substrate container can be rotationally driven by the rotating device, so that the substrate container is loaded into and unloaded from the container table in consideration of the efficiency of loading and unloading of the substrate container.
  • the direction can be determined. Therefore, the efficiency of the loading / unloading operation of the substrate container can be improved.
  • the sixth exposure apparatus may further include a drive mechanism for moving the container table in a direction substantially perpendicular to the installation surface of the container table. Heel In such a case, the drive mechanism can move the container table in a direction almost perpendicular to the installation surface of the container table, so set the container installation position on the container table to a position suitable for the container installation work. At the same time, it is possible to set the transfer position of the board in the container to the board transport system to a different position suitable for the transfer work, and to perform the container installation work and the board transfer work efficiently together And throughput can be improved.
  • the drive mechanism moves the container table, and thereafter, the control device opens the container lid by the opening / closing mechanism, or the opening / closing mechanism After closing the lid of the container by the controller, the controller may move the container table to the unloading position of the container by the driving mechanism.
  • a sixth exposure apparatus in the chamber, the substrate transport system and the container, wherein the lid is opened and closed by the opening and closing mechanism at a position lower than a container transfer position of the container table, is provided.
  • a connection section may be provided.
  • the container delivery position is a height position suitable for the work of installing the container, for example, if the substrate in the container is a 12-inch wafer, it is roughly 900 m above the floor from an ergonomic point of view.
  • connection is set to the height of the board transfer path by the board transfer system, for example, approximately 60 O mm on the floor, which is the installation height of the board stage, a height suitable for each work At this position, container installation work and transfer of substrates to the substrate transport system are possible.
  • the sixth exposure apparatus may further include a substrate detecting device that detects a substrate in the container during at least one of an opening operation and a closing operation of the container by the opening / closing mechanism.
  • a substrate detecting device that detects a substrate in the container during at least one of an opening operation and a closing operation of the container by the opening / closing mechanism.
  • the substrate in the container is detected by the substrate detection device during at least one of the operation of opening and closing the lid of the openable / closable container. That is, since the opening and closing of the lid and the detection of the substrate are performed in parallel, the base in the container is independent of the opening and closing operation of the lid. Throughput can be improved as compared with the case of detecting a board.
  • the substrate detection device may be provided independently of the opening / closing mechanism, or may be attached to the opening / closing mechanism.
  • the substrate detection device when at least one of the opening operation and the closing operation of the container by the opening / closing mechanism is provided with a substrate detecting device that detects a substrate in the container,
  • the substrate detection device may be provided in the transport device.
  • the board detection device can detect the board in the container while the opening / closing mechanism is opening or closing the container lid, and while the board is being loaded into or unloaded from the container by the transport device. become. In other words, it becomes possible to perform three operations in parallel: the opening and closing operation of the container, the unloading or loading operation of the substrate, and the detecting operation of the substrate.
  • the sixth exposure apparatus in order to connect a connection part of the container to the substrate transfer system provided in the chamber and the container, a surface substantially parallel to a container installation surface of the container stand. And a driving mechanism for moving the container table inside.
  • the drive mechanism moves the container table in a plane substantially parallel to the container installation surface of the container table, and the container moves with respect to the substrate transfer system provided in the chamber.
  • the connection part and the container are connected.
  • a substrate stage on which a substrate to be exposed is placed; a substrate transport system for transporting a substrate to the substrate stage; and at least a part of the substrate transport system.
  • An opening for transferring a substrate is formed in at least one of a side surface and a side surface adjacent to the one side surface of the chamber, and the substrate transfer system includes any one of the chambers.
  • a transfer device provided so that the opening formed in the surface can be used. This is the seventh exposure apparatus.
  • the substrate transfer system has a transfer device provided with an opening formed on any one of the one side surface and the side surface adjacent to the one side surface of the chamber.
  • a substrate processing apparatus such as a C / D can be connected to either side of the two adjacent side surfaces, and even if a substrate processing apparatus is connected to either side, the substrate transfer system can be connected. There is no need to change the configuration such as. That is, there is provided an exposure apparatus capable of coping with both so-called front inline and right and left inline.
  • an opening / closing type having a substrate stage on which a substrate to be exposed is placed; an opening portion provided with an opening portion for accommodating the substrate; A container table on which a container is installed; and a substrate transport system for transporting the substrate stored in the container with respect to the substrate stage, wherein the substrate transport system includes an opening / closing device for opening and closing the door;
  • An eighth exposure apparatus comprising: a transfer arm for taking the substrate in and out of the substrate; wherein the transfer arm is provided in the opening / closing device.
  • the transfer arm that is provided in the substrate transfer system and moves the substrate into and out of the container (openable / closable container) is provided in the open / close device that opens and closes the container door. Compared to a case where the transfer arm and the transfer arm are separately provided, space can be saved, and the size of the apparatus in the depth direction can be reduced.
  • the opening and closing device can be configured to include an opening and closing member for opening and closing the door, and a drive mechanism for driving the opening and closing member and the transfer arm.
  • This drive mechanism may be a mechanism that independently drives the opening / closing member and the transfer arm, or may be a mechanism that integrally drives the opening / closing member and the transfer arm. In the latter case, the opening or closing of the door by the opening / closing member is inevitably based on the transfer arm. Since the loading and unloading operations are performed in parallel with a part of the loading and unloading operations, the time required for unloading the substrate from the container or loading the substrate into the container is reduced.
  • the container may store only one substrate, or may store a plurality of substrates at predetermined intervals.
  • the drive mechanism can drive the opening / closing member in a direction approaching / separating from / to the container table and in a direction in which the substrates in the container are arranged.
  • the operation of opening the door is a combination of the movement of the door in the direction away from the container table and the movement of the board in one predetermined direction in which the boards are arranged.
  • the operation of closing the door is the direction in which the boards are arranged in the door. Because the combination of the movement in the other direction and the movement in the direction approaching the container table, the door can be reliably opened and closed by the opening and closing member.
  • the driving mechanism when the container is a container for storing a plurality of substrates at predetermined intervals upward and downward, the driving mechanism includes the opening / closing member and the transfer arm. Are desirably driven in the vertical direction. In such a case, it is possible to access any substrate in the container by the transfer arm while the door is being opened and closed by the opening and closing member.
  • the opening / closing device may further include a substrate detection device that detects a substrate in the container.
  • the board in the container can be detected during the opening and closing operation of the container door.
  • a substrate transport method for storing a substrate and loading and unloading an arbitrary substrate by a transport arm into and from an openable container having a door for opening and closing an opening
  • a substrate transport method is characterized in that the opening / closing operation and the above-mentioned arbitrary substrate loading / unloading operation by the transport arm are performed at least partially in parallel.
  • the operation of opening and closing the door and the operation of taking in and out the arbitrary substrate by the transfer arm are performed at least partially in parallel means: a. When the operation and the unloading operation of the arbitrary substrate by the transfer arm are performed at least partially in parallel, b. When the operation of closing the door and the unloading operation of the arbitrary substrate by the transfer arm are performed at least partially in parallel C. When the operation of opening the door and the loading operation of an arbitrary substrate by the transfer arm are performed at least partially in parallel, d. The operation of closing the door and the loading operation of the arbitrary substrate by the transfer arm are at least partially performed. When performed in parallel, it means one of four cases:
  • the operation of opening or closing the container door and the operation of unloading or loading any substrate by the transfer arm are performed at least partially in parallel.
  • the time required for loading and unloading of the board by the transfer arm and the time required for the loading and unloading of the board are overlapped.
  • the time required for loading and unloading substrates from the container can be reduced.
  • the loading and unloading of an arbitrary substrate into and out of the container is performed according to at least the loading and unloading position of the substrate. It can be performed in a state where it is opened to the position where it is set. In such a case, it is possible to reduce the time required to start or carry out the substrate, as compared with a case where the container is always fully opened and then the substrate is taken in and out of the container. Further, it is possible to reduce the possibility of dust entering the container when the substrate is taken in and out.
  • the door is moved in the vertical direction when the door is opened and closed. It is desirable to make it.
  • the transport arm is moved in a horizontal direction with the door opened at least to a position corresponding to the loading and unloading position of the substrate, and the substrate is loaded and unloaded. You may do it.
  • the time until the start of unloading or the start of substrate loading can be shortened. It is also possible to reduce the possibility of dust entering the container when the substrate is taken in and out.
  • the present invention provides a method for manufacturing an exposure apparatus used in a lithographic process, comprising: providing a substrate stage (WST) on which a substrate to be exposed is mounted; Providing a substrate transport system (100) for transporting the substrate to the substrate stage, the substrate being rotatable while moving the substrate in a predetermined direction. It is a manufacturing method of.
  • the optical system, the substrate stage, the substrate transfer system including the rotary table and other various components are adjusted mechanically, optically, and electrically to adjust the third aspect of the present invention.
  • An exposure apparatus can be manufactured.
  • the method of manufacturing a first exposure apparatus may further include the step of providing a displacement detection apparatus for detecting a displacement of the substrate rotating on the rotary table during the movement in the predetermined direction. Can be.
  • a method of manufacturing an exposure apparatus used in a lithographic process comprising: providing a substrate stage (WST) on which a substrate to be exposed is mounted; A substrate transfer system for transferring the substrate to a stage
  • the optical system, the substrate stage, the substrate transfer system, the container table, the driving device, and other various components are adjusted mechanically, optically, and electrically to adjust the fourth aspect of the present invention.
  • the container table may be in the second position.
  • the method may further include at least one of the steps of providing a substrate detection device that detects
  • the present invention is a device manufacturing method using the exposure apparatus of the present invention, and can also be said to be a device manufactured by the manufacturing method.
  • FIG. 1 is a diagram schematically showing a cross-sectional view (plan sectional view) of an exposure apparatus according to a first embodiment of the present invention, centering on a substrate transport system.
  • FIG. 2 is a side view showing the vicinity of the in-line I / F, the mouth and the door together with the robot 32.
  • FIG. 3 is a side view showing the vicinity of the load X-axis turntable.
  • FIG. 4 is a front view showing a state near the ⁇ guide in a state where the load Y-axis arm holds a wafer and the unload Y-axis arm holds another wafer.
  • FIG. 5 is a diagram showing the exposure apparatus main body housed in the second chamber 14 together with the control system.
  • FIG. 6 is a side view showing the vicinity of the carrier table.
  • FIG. 7 is a diagram for explaining the relationship between the wafer holder and the unloaded Y-axis arm at the loading position when the wafer is unloaded.
  • FIG. 8 is a plan view of the vicinity of the carrier table for explaining a state of detecting a wafer in 0 C during the carrier table lowering drive.
  • FIG. 9 illustrates a modification of the displacement detection device for detecting the displacement of the wafer.
  • FIG. 10 is an arrangement diagram of sensors for explaining a first briar alignment method for a rectangular substrate.
  • FIG. 11 is a side view of the vicinity of the peripheral exposure unit.
  • FIG. 12 is a view showing a modification of the notch of the wafer holder, the stage transfer arm, and the load Y-axis arm.
  • FIG. 13 is a diagram schematically showing a case where the directions of the exposure processing sequence start position and the exposure processing sequence end position of wafer stage WST with respect to the mouthing position are different.
  • FIG. 14 is a side view of the vicinity of the carrier table for explaining another method for adjusting the wafer to be accessed to the height of the robot arm.
  • Fig. 15A is a diagram for explaining a configuration in which a transmission type substrate detection sensor is attached to the drive unit of a robot via a support base, and the robot arm and the substrate detection sensor move up and down physically. Then, it is a side view near a carrier stand.
  • FIG. 15B is a plan view near the carrier table corresponding to FIG. 15A.
  • FIG. 16A and FIG. 16B are diagrams showing other examples of the IZF arm.
  • FIG. 17 is a view schematically showing a cross sectional view (plan sectional view) of an exposure apparatus according to the second embodiment of the present invention, centering on a substrate transfer system.
  • FIG. 18 is a side view showing a state near the FOUP table of the exposure apparatus of FIG.
  • FIG. 19 is a plan view of the vicinity of the F ⁇ UP table for explaining how wafers in the F ⁇ UP are detected when the front door of the F ⁇ UP is opened.
  • FIG. 20 is a diagram for explaining a main space configuration of the first chamber constituting the exposure apparatus of the second embodiment.
  • FIG. 21A is a diagram for explaining the configuration in which a reflection type substrate detection sensor is attached to the drive unit of the robot and the substrate detection sensor moves up and down integrally with the robot. It is.
  • FIG. 21B is a plan view near the F ⁇ UP table corresponding to FIG. 21A.
  • Fig. 22A is a diagram for explaining a configuration in which a transmission-type substrate detection sensor (transmission-type photosensor) is attached to the driving section of a robot, and the substrate detection sensor moves up and down integrally with the robot. It is a side view near a FOUP stand.
  • a transmission-type substrate detection sensor transmission-type photosensor
  • FIG. 22B is a plan view near the FOUP table corresponding to FIG. 22A.
  • FIG. 23 is a schematic cross-sectional view of the exposure apparatus when two FOUP tables are mounted.
  • FIG. 24 is a plan view near the carrier table of the exposure apparatus according to the third embodiment of the present invention.
  • FIG. 25 is a side view showing the vicinity of the carrier table in FIG.
  • FIG. 26 is a plan view of the vicinity of a carrier table of an exposure apparatus constituting a pre-inline lithography system to which the carrier table according to the third embodiment shown in FIG. 24 is applied.
  • FIG. 27 is a diagram showing a state where the carrier table of FIG. 26 has rotated 90 °.
  • FIG. 28A is a plan view showing the vicinity of the robot in a left in-line type exposure apparatus provided with a robot as a substrate transfer section.
  • FIG. 28B is a plan view showing the vicinity of the robot in a pre-inline type exposure apparatus provided with a robot as a substrate transfer section.
  • FIG. 29 is a diagram schematically showing a cross sectional view (plan sectional view) of an exposure apparatus according to the fourth embodiment of the present invention, centering on a substrate transport system.
  • FIG. 30 is a side view showing the vicinity of the F ⁇ UP table of FIG.
  • FIG. 31 is a plan view of the vicinity of the FUPUP table for explaining the state of detection of a wafer in the FOP of FIG. 30.
  • FIG. 32 is a flowchart for explaining an embodiment of a device manufacturing method according to the present invention.
  • FIG. 33 is a flowchart showing the processing in step 404 of FIG.
  • FIG. 34 is a schematic cross-sectional view of a conventional exposure apparatus. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 schematically shows a cross sectional view (plan sectional view) of an exposure apparatus 0 according to the first embodiment, centering on a substrate transport system.
  • the exposure apparatus 10 can be suitably used by being connected in-line with a computer-develosba (hereinafter abbreviated as “C / D”). Note that, in FIG. 1, parts other than the air conditioning system and the wafer stage WST of the exposure apparatus main body are not shown.
  • the exposure apparatus 10 includes a first chamber 12 and a second chamber 14 arranged adjacent to each other in the Y direction (the vertical direction in FIG. 1). Most of the wafer loader system 100 as a substrate transfer system is housed in the first chamber 12, and the exposure apparatus body 21 (see FIG. 5) is housed in the second chamber 4. . These first and second chambers 12 and 14 are installed in a clean room.
  • the first chamber 12 is actually a divided chamber that is divided into an upper chamber and a lower chamber.
  • the lower chamber contains most of the wafer loader system 100.
  • An exposure apparatus having such a divided chamber is disclosed in, for example, Japanese Patent Application Laid-Open No. 7-240366 and US Patent Application Nos. 08/9555 and 427 corresponding thereto. It is disclosed in detail. To the extent permitted by the national laws of the designated or designated elected country in this international application, the disclosures in the above-mentioned publications and US patent applications are incorporated herein by reference.
  • the wafer loader system 100 includes first and second sections extending in the X direction (the left-right direction in FIG. 1) at predetermined intervals in the Y direction at portions near the second chamber 14 in the first chamber 12.
  • the X guides 16 and 18 are provided as conveyance guides, and a Y guide 20 located above (in front of the paper surface in FIG. 1) and extending in the Y direction.
  • the first X guide 16 constitutes a second transport guide (unloading transport guide)
  • the second X guide 18 constitutes the first transport guide (loading transport guide).
  • the guide 20 extends from the first chamber 12 side to the second chamber 14 side via the opening 12 a of the first chamber 12 and the opening 14 a of the second chamber 14.
  • carrier tables 22 A and 22 B as container tables are arranged.
  • carrier tables 22A and 22B open'carriers (hereinafter referred to as "OC") 24A and 24B as containers capable of storing a plurality of wafers are placed.
  • the first X guide 16 is located at a position slightly closer to the X side than the end face of the X side of the carrier table 2B from the vicinity of the side wall on one side (X side) in the X direction of the first chamber 12. It extends to the position.
  • a slider 26 driven along the X guide 16 by a linear motor or the like (not shown) is placed on the upper surface of the slider 26, Unload X-axis table 28 is fixed.
  • a CZD as a substrate processing apparatus is provided above the slider 26 of the first X guide 16, that is, the left end movement position of the unload X-axis table 28 (see reference numeral 28 ′ in FIG. 1).
  • An in-line interface as a substrate transfer unit for transferring wafers W to and from the transfer arm (open-door) on the 200 side. Abbreviated as "one arm").
  • the second X guide 18 extends from a position slightly + X side of the other end (+ X side) in the X direction of the carrier base 22 A to the same position as the first X guide 16.
  • a horizontal articulated robot (scalar robot) 32 is arranged at a position facing the carrier table 22 A on the X side (left side in FIG. 1) of the second X guide 18.
  • FIG. 2 shows a side view (left side view in FIG. 1) of the horizontal articulated robot 32 and the in-line I / F ⁇ load arm 30 and its vicinity.
  • a horizontal articulated robot 32 (hereinafter abbreviated as “robot 32” as appropriate) has an arm 34 that can freely expand and contract and rotate in the XY plane. And a drive section 36 for driving the section 34.
  • the robot 32 is driven within a predetermined range in the vertical direction (Z direction) by a vertical movement mechanism 37 installed on the floor of the chamber 12.
  • an in-line interface / unload arm (hereinafter, referred to as an “in-line IZF / unloader”) as a substrate transfer unit is provided directly below the in-line I / F load arm 30.
  • 3 8 are arranged. That is, the in-line I / F ⁇ load arm 30 and the in-line I / F / un-armed arm 38 are arranged in a positional relationship such that they overlap in plan view.
  • a slider 40 driven along a X guide 18 by a linear motor (not shown) or the like is placed on the upper surface of the second X guide 18.
  • a load X-axis turn tape 42 as a rotary table is provided on the upper surface.
  • FIG. 3 shows a side view of the vicinity of the load X-axis turntable 42.
  • the load X-axis turntable 42 is fixed to the upper surface of the slider 40 and holds a substrate W as a substrate (indicated by reference numeral W 3 in FIG. 3). 3 and a drive device 4 for rotating the drive 3.
  • the slider 40 is provided with an L-shaped extending portion 40a extending upward at a predetermined length at one end in the Y direction and bent at the upper end in the Y direction.
  • a wafer edge sensor 48 including a light emitting element (not shown) and a light receiving element (for example, a photodiode or a CCD line sensor) 46 (not shown) is provided above the extension portion 40a. This wafer edge sensor 48 is used for an outline of a wafer W described later. Used for approximate alignment.
  • the Y guide 20 is driven by a vertical movement / slide mechanism (not shown) including a mover of a linear motor, and is loaded with a load Y as a substrate transfer arm that moves along the Y guide 20.
  • a vertical movement / slide mechanism including a mover of a linear motor, and is loaded with a load Y as a substrate transfer arm that moves along the Y guide 20.
  • An axis arm 50 and an unloading Y-axis arm 52 are provided.
  • the mouth Y-axis arm 50 is driven by a vertical movement / slide mechanism (not shown), and an end in the Y direction of the Y guide 20 near a position indicated by a virtual line 50 'in FIG. It is movable from a position near the part to a predetermined loading position (wafer transfer position) indicated by a solid line 50, and is also movable in a predetermined range in the vertical direction.
  • a stage delivery arm 54 constituting a briar alignment device described later is arranged.
  • the unloading Y-axis arm 52 is driven by an up-and-down moving 'sliding mechanism, not shown, from the position indicated by the virtual line 52' in FIG. 1 to the position of the stage transfer arm 54 described above.
  • the load is movable along a moving surface below the moving surface of the Y-axis arm 50 and is movable in a predetermined range in the vertical direction.
  • FIG. 4 shows a state in which the load Y-axis arm 50 holds a wafer (indicated by reference numeral W4) and the unloaded Y-axis arm 52 holds another wafer (indicated by reference numeral W8).
  • a state near the Y guide 20 is shown in a front view. Note that, in the state of FIG. 4, the load X-axis turntable 42 has moved to the vicinity of the left end movement position.
  • FIG. 5 shows the exposure apparatus main body 21 housed in the second chamber 14 together with its control system. The exposure apparatus main body 21 transfers a pattern of a reticle R as a mask onto a wafer W as a substrate by a step-and-scan method.
  • the exposure apparatus body 21 includes an illumination system 60 including an exposure light source, a reticle stage RST holding a reticle R, a projection optical system, and a wafer stage WS ⁇ as a substrate stage on which a wafer W is mounted. It has.
  • the illumination system 60 includes an exposure light source and an illumination optical system (both not shown).
  • Illumination optics include illuminance equalizing optics such as a collimator lens, fly-eye lens, rod-type integrator, and other optical integration systems, relay lenses, variable ND filters, reticle blinds, relay lenses
  • the slit-shaped illumination area IAR on the reticle R is illuminated with the illumination light IL at a uniform illuminance.
  • illumination light IL for example K r F excimer laser light, A r F excimer laser light, F 2 excimer one laser light (wavelength 1 5 7 nm) excimer Mareza light, harmonics of a copper vapor laser or YAG laser or the like, Alternatively, ultraviolet emission lines (g-line, i-line, etc.) from an ultra-high pressure mercury lamp are used.
  • each of the above-mentioned driving units in the illumination system that is, the variable ND filter, the reticle blind, and the like are controlled by an illumination control device (exposure controller) 62 in accordance with an instruction from the main control device 70.
  • the reticle stage R ST is arranged on a reticle base plate 64, and a reticle R is fixed on an upper surface thereof by, for example, vacuum suction.
  • the reticle stage RST is driven by an optical axis of an illumination optical system (projection optical system PL described later) for positioning a reticle R by a reticle stage drive unit (not shown) composed of a magnetic levitation type two-dimensional linear actuator. 2D in the plane perpendicular to the optical axis AX (in the XY plane) (in the XY plane) It can be driven at a specified scanning direction (here, Y direction) at a specified scanning speed.
  • the position of reticle stage R ST is always detected by reticle laser interferometer 66 with a resolution of, for example, about 0.5 to 1 nm.
  • the position information of the reticle stage RST from the interferometer 66 is sent to the stage control device 69 and the main control device 70 via the stage control device 69, and the stage control device 69 receives the instruction from the main control device 70.
  • the projection optical system PL is disposed below the reticle stage RST in FIG. 5, and the direction of the optical axis AX is the Z-axis direction.
  • a predetermined projection magnification that is telecentric on both sides, for example, 1 Z 5 (or A reduction optical system having the condition 14) is used. Therefore, when the illumination area IAR of the reticle R is illuminated by the illumination light IL from the illumination system 60, the illumination light IL passing through the reticle R causes the reticle R in the illumination area IAR to pass through the projection optical system PL.
  • a miniature image (partially inverted image) of the circuit pattern is formed in the exposed area IA on the wafer W on the surface of which a resist (photosensitive agent) is applied.
  • the wafer stage WST is arranged on a wafer base plate 67 arranged below the projection optical system PL in FIG. 5, and a wafer holder 68 is mounted on the wafer stage WST.
  • a wafer W having a diameter of 12 inches is vacuum-adsorbed via a vacuum chuck (not shown).
  • the wafer holder 68 can be tilted in any direction with respect to the best image forming plane of the projection optical system PL by a driving unit (not shown), and can be finely moved in the optical axis AX direction (Z direction) of the projection optical system PL. It is configured.
  • the wafer holder 68 is also capable of rotating around the Z axis.
  • the wafer stage WST is driven in the two-dimensional directions of the X-axis and the Y-axis by a wafer driving device 72 composed of a magnetic levitation type two-dimensional linear actuator. That is, the wafer stage WST moves not only in the scanning direction (Y direction) but also in the scanning direction so that a plurality of shot areas on the wafer W can be positioned in the exposure area IA conjugate to the illumination area IAR. It is configured to be movable in the vertical non-scanning direction (X direction), and scans (scans) each shot area on the wafer W and moves to the scanning start position for the next shot exposure. A step-and-scan operation that repeats the moving operation is performed.
  • the position of the wafer stage WST is always detected by the wafer laser interferometer 74 with a resolution of, for example, about 0.5 to 1 nm.
  • the measured value of the interferometer 74 is
  • the stage controller 69 is sent to the main controller 70 via the stage controller 69, and the stage controller 69 receives the position information of the wafer stage WS according to the instruction from the main controller 70.
  • the wafer stage WS is driven via the wafer driving device 72.
  • a reference plate FP on which a reference mark for baseline measurement and other reference marks are formed is arranged.
  • the operations of the illumination system 60, reticle stage RST, wafer stage WST, etc. during scanning exposure are managed by the main controller 70 via the illumination controller 62, stage controller 69, etc. Is done.
  • the position of an alignment mark (a wafer mark) attached to each shot area on the wafer W is detected.
  • An off-axis type alignment microscope ALG is provided, and the measurement result of the alignment microscope ALG is supplied to the main controller 70.
  • the exposure apparatus body 21 includes an irradiation optical system AF that supplies imaging light flux (detection beam FB) for forming a plurality of slit images obliquely with respect to the optical axis AX direction, and an exposure optical system AF.
  • multipoint focal position detection system a oblique incidence type comprising a light-receiving optical system AF 2 Metropolitan for receiving the reflected light beam on the surface of the wafer W of the imaging light beam through a respective slit Bok "but the projection optical system PL
  • the wafer position information from the multipoint focal position detection system AF is sent to the stage controller 69 via the main controller 70.
  • the stage controller 6 9 Drives the wafer holder 68 in the Z direction and the tilt direction based on the wafer position information ..
  • a focus sensor similar to the multi-point focal position detection system AF is disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 6-283043. Gazette and the corresponding US Patent No. 5,448,333 Etc., and to the extent permitted by the national law of the designated country or selected elected country in this international application, the disclosures in the above-mentioned publications and U.S. patents are partially incorporated by reference.
  • the exposure apparatus 10 of the present embodiment includes a briar alignment device 80 disposed at the above-described loading position (wafer transfer position).
  • the briar alignment device 80 includes a briar alignment device main body 82 and a vertical movement / rotation mechanism 86 that is provided below the briar alignment device main body 82 and supports the above-described stage transfer arm 54 to vertically move and rotate. And three CCD cameras 88 a, 88 b, 88 c arranged above the stage transfer arm 54.
  • a control device including an image processing system for processing image signals from the CCD cameras 88a, 88b, and 88c and a control system for the vertical movement / rotation mechanism 86 is built in the briar alignment device main body 82. ing.
  • the CCD cameras 88a, 88b, 88c are for detecting the outer edge of the wafer held in the stage transfer unit 54, respectively.
  • the CCD camera 88a, 88b, 88c is a 12-inch wafer (shown as a wafer W5 in FIG. 1) held on the stage transfer arm 54, as shown in FIG. Is located at a position where the outer edge including the notch can be imaged.
  • the central CCD camera 88b is for detecting the notch (V-shaped cutout).
  • the briar alignment device 82 is controlled by the wafer loader control device 90 shown in FIG. 5, and detects the outer edge (outer shape) of the wafer W by three CCD cameras 88a, 88b, and 88c. It is supplied to the controller 90.
  • the wafer loader controller 90 calculates the X, Y, 0 errors of the wafer W, and controls the vertical movement / rotation mechanism 86 to correct the 0 error among the errors.
  • the information on the X and Y errors obtained based on the wafer outline measurement by the briar alignment device 80 is sent to the main controller 70 via the wafer loader controller 90.
  • the main controller 70 corrects the error by, for example, adding an offset corresponding to the X and Y errors during the search alignment operation of the wafer W.
  • the above-described stage transfer arm 54 and unloading Y-axis arm 5 are provided at the both ends in the X direction on the upper surface (wafer mounting surface) side of the wafer holder 6 8 on the wafer stage WST, as described above.
  • a pair of notches 68 a and 68 b each having a predetermined depth and extending in the Y direction into which the claw portion at the tip of the second can be inserted are formed.
  • the main components such as the reticle base plate 64, the wafer base plate 67, the projection optical system PL and the like constituting the above-described exposure apparatus main body 21 are held by the same main body frame. It is held horizontally via an anti-vibration pad (not shown) arranged on the bottom surface of the.
  • the horizontal multi-joint type is positioned at a position facing the carrier table 22 B on the + X side of the second X guide 18.
  • a horizontal articulated robot 92 similar to the robot 32 is arranged.
  • an opening 12b for loading a wafer into the lower chamber and unloading a wafer from the lower chamber is formed on the X-side wall of the lower chamber of the first chamber 12 as shown in FIG. C / D 200 as a substrate processing apparatus is connected in-line through the opening 12b.
  • the side walls of the lower chamber of the first chamber 12 in the Y direction are provided for inserting and removing the OCs 24A and 24B at positions facing the carrier tables 22A and 22B in plan view. Openings 12c and 12d are formed.
  • FIG. 6 shows a side view of the vicinity of the carrier table 22A.
  • the opening 1 2 c of the chamber 12 has a height H 1 (H 1 is approximately 900 mm here) from the floor and a height of approximately 1200 mm. It is formed over.
  • the other opening 12d is also formed at substantially the same height as the opening 12c.
  • the carrier table 22 A is fixed to the upper surface of a drive shaft 96 that is moved up and down by a vertical movement mechanism 94 fixed to the bottom of the chamber 12. Have been. Also, as shown in FIG.
  • a light emitting element 98A and a light receiving element 98B are arranged on both sides in the X direction near the + Y direction end of the carrier table 22A, as shown in FIG. ing. These light emitting element 98A and light receiving element 98B are arranged at a position slightly lower than the height of H1 on the floor, as shown in FIG. A light emitting element 99A and a light receiving element 99B are arranged at the same height on both sides in the X direction near the + Y direction end of the other carrier table 22B, facing each other. I have.
  • the above-described arms and tables for holding and transporting the wafer W prevent the wafer W during operation from being displaced similarly to the wafer holder 68.
  • Means, for example, a vacuum chuck, an electrostatic chuck and the like are provided.
  • a not-shown C / D side opening arm holding the wafer W on which the resist coating has been completed is inserted into the chamber 12 through the opening 12b, and the wafer W is in-lined from the CZD side loading arm.
  • IZF ⁇ Passed to Road Arm 30.
  • the C / D side door has a shape that does not interfere with the in-line I / F ⁇ load arm 30 when the wafer W is delivered. For example, this is performed by lowering the load arm on the C / D side (or raising the in-line IZF load arm 30).
  • the wafer W for which the transfer has been completed is indicated by a symbol W1.
  • the C / D side load arm (not shown) is To the outside of chamber 12 After confirming the evacuation of the C / D-side load arm via a sensor (not shown), the wafer loader controller 90 connects the arm 34 with the in-line IZF via the drive unit 36 of the robot 32.
  • the wafer loader controller 90 connects the arm 34 with the in-line IZF via the drive unit 36 of the robot 32.
  • ⁇ Load arm 30 After the wafer is inserted below the wafer W held in the inline I / F, the re-robot 32 is raised (or the in-line IZF / load arm 30 is lowered) by, for example, the vertical movement mechanism 37. ⁇ Transfer the wafer from the load arm 30 to the arm 34 of the robot 32.
  • FIG. 2 shows a state immediately before the delivery of the wafer W.
  • the wafer loader controller 90 sets the robot so that the wafer W and the arm 34 of the robot 32 have a locus that does not interfere with the inline IZF, the door 30 and the chamber 12. Control 3 2 At this time, the mouth X-axis table 42 has moved to the position indicated by the imaginary line 4 2 ′. 2 Next, in the wafer loader controller 90, the robot is moved via the vertical movement mechanism 37.
  • the arm 32 of 32 is driven downward (or the load X-axis turntable 42 is driven upward) to transfer the wafer W from the arm 34 of the robot 32 to the load X-axis unit table 42.
  • the wafer loader control device 90 drives the X-axis evening table 42 together with the slider 40 in the + X direction to transfer the wafer W to the position indicated by the imaginary line W3. . During this transfer, the wafer loader controller 90 drives the
  • the load X-axis turntable 42 is rotated via 44 (see FIG. 3), and the wafer W held on the load X-axis turntable 42 is rotated. Then, the wafer loader controller 90 determines the direction of the notch of the wafer W and the center of the wafer based on the light amount signal output from the light receiving element 46 constituting the wafer edge sensor 48 during the rotation of the wafer W.
  • Load X-axis turntable 4 Calculate the amount of eccentricity in the XY 2D direction with respect to the center of 2. The notch direction and the amount of eccentricity of the center of the wafer were calculated. A specific method of this method is disclosed in, for example, Japanese Patent Application Laid-Open No. H10-127709. Note that the wafer rotation sensor and the eccentricity of the wafer on which the orientation flat is formed can be obtained using the wafer edge sensor 48 in the same manner.
  • the wafer loader control device 90 controls the rotation angle of the load X-axis turntable 42 so that the direction of the notch obtained above matches a predetermined direction, for example, the Y direction. Further, the wafer loader controller 90 determines the stop position of the X-axis movement of the load X-axis turntable 42 in accordance with the X-axis component of the eccentricity of the wafer center at that time, and loads the X-axis at that position. Stop the turntable 42. The wafer loader controller 90 corrects the rotation of the wafer W and the displacement in the X direction in this manner.
  • the load Y-axis arm 50 When the wafer W is transferred to the position indicated by the imaginary line W3, the load Y-axis arm 50 is in a range that does not interfere with the wafer W at the position of the imaginary line W3 (for example, indicated by the imaginary line W8). It is waiting at a position near the position indicated by the virtual line 50 ', and the wafer loader controller 90 drives the load Y-axis arm 50 toward the position indicated by the virtual line 50'. Then, the load Y-axis arm 50 is stopped at a position where the center of the wafer W and the center of the claw portion of the load shaft 50 are aligned. As described above, by controlling the stop position of the load Y-axis arm 50, the Y-direction component of the eccentricity is corrected.
  • the wafer loader control device 90 performs the approximate alignment (first stage briar alignment) of the wafer W in this manner.
  • the wafer loader control device 90 transfers the wafer W from the load X-axis turntable 42 to the load ⁇ -axis arm 50.
  • the transfer of the wafer W is performed, for example, by raising the load Y-axis arm 50 (or lowering the load X-axis turntable 42).
  • the wafer loader controller 90 loads the ⁇ axis arm 50 from the position of the imaginary line 50 'in FIG. Move to position. As a result, the wafer W is transferred to the position indicated by the virtual line W5.
  • the wafer loader controller 90 sets the wafer W, that is, the load Y-axis arm, at the position indicated by the virtual line W4. Wait 50.
  • the wafer loader controller 90 transfers the load X-axis unit 42 to a virtual line for transferring the next wafer. 4 Move to the left end movement position indicated by 2 '.
  • the wafer loader controller 90 transfers the wafer W from the load Y-axis arm 50 to the stage transfer arm 54. This transfer is performed by raising the stage transfer arm 54 (or lowering the load Y-axis arm 50). The state immediately before the transfer is shown in FIG.
  • the wafer loader controller 90 starts moving the load Y-axis arm 50 toward the position indicated by the virtual line 50 ′ for the next transfer.
  • the load Y-axis arm 50 is moved to the position indicated by the virtual line 50 'within a range that does not interfere with the wafer W located at the position of the virtual line W3 (for example, up to near the position indicated by the virtual line W8). It is possible to get closer.
  • the wafer loader controller 90 sets the stage transfer arm 54 holding the wafer W via the vertical movement / rotation mechanism 86 shown in FIG. Is driven upward by a predetermined amount. Then, the wafer loader control device 90 detects the outer edge (outer shape) of the wafer W by using three CCD cameras 88a, 88b, 88c constituting the briar alignment device 80, and The X, Y, and S errors of the wafer W are obtained based on the detection results. The vertical movement / rotation mechanism 86 is controlled to correct the S error.
  • the detection of the X, Y, and 0 errors of the wafer W was newly generated by the residual error after the rough alignment of the first stage and the subsequent transfer and transfer operations. Since the correction is performed to correct the error, the correction is performed with higher accuracy.
  • the X and ⁇ errors obtained based on the wafer outline measurement by the briar alignment device 80 are sent to the main control device 70 via the wafer loader control device 90, and the main control device 70 outputs This is corrected by adding an offset corresponding to the X and Y errors during the search alignment operation of the wafer at.
  • the position of the wafer stage WST at the loading position may be adjusted to correct the X and Y errors.
  • stage controller 69 controls wafer stage WST based on an instruction from main controller 70. Is moved from the exposure end position shown in FIG. 1 to the loading position, and the exposed wafer W is transferred to the unloading position (that is, the loading position).
  • the claw provided with the suction portion at the tip of the unloading Y-axis arm 52 is provided with the notch 6 8 a of the wafer holder 68. Engage with 6 8 b.
  • the wafer loader controller 90 sets the unload Y-axis arm 52 to a predetermined position based on an instruction from the main controller 70. Unload the wafer W that has been exposed from the wafer holder 68 on the wafer stage WST by driving the amount to rise. ⁇ Transfer to the axis arm 52 and unload from the wafer holder 68.
  • the unload ⁇ -axis arm 52 is driven to a position indicated by a virtual line 52 ′ in FIG.
  • the wafer W is transferred from the mouthing position indicated by the imaginary line W5 to the position indicated by the imaginary line W8 by the unloading axis arm 52.
  • the unload ⁇ axis arm 52 is made to stand by at the position indicated by the solid line in FIG.
  • the wafer loader control device 90 drives the stage transfer arm 54 downward through the vertical movement / rotation mechanism 86, and the unexposed The wafer W is transferred from the stage transfer arm 54 onto the wafer holder 68 and loaded.
  • the claw provided with the suction portion at the end of the stage transfer arm 54 engages with the notches 68 a and 68 b of the wafer holder 68.
  • the main controller 70 instructs the stage controller 69 to move the wafer stage WST to the start position of the exposure sequence. I do.
  • the stage controller 69 drives the wafer stage WST in the + Y direction to move to the start position of the exposure sequence (the position shown in FIG. 1).
  • an exposure sequence (schematic alignment, fine alignment such as EGA, exposure) for the wafer W on the wafer holder 68 is started. Note that this exposure sequence is the same as a normal scanning stepper except that the position shift of the wafer is not measured by the flute sensor on the wafer stage, and thus a detailed description is omitted.
  • the notches 68 a and 68 b are formed in the wafer holder 68, so that the claw of the stage transfer arm 54 is formed.
  • the wafer stage WST is smoothly moved without the wafer holder 68 contacting the part.
  • the high-speed movement operation of the wafer stage WST is efficiently used, so that the time for exchanging the wafer can be reduced, and the throughput can be improved. It is possible.
  • wafer loader controller 90 When receiving a confirmation signal from main controller 70 that wafer stage WST has retreated from the loading position, wafer loader controller 90 loads stage transfer arm 54 at the loading position for the next wafer transfer Y It is driven up to the wafer transfer position with the shaft arm 50.
  • the wafer header controller 90 descends the unload Y-axis arm 52 (or unloads the X-axis table 2). 8) to transfer the wafer W from the unloading Y-axis arm 52 to the unloading X-axis table 28.
  • the wafer loader controller 90 moves the unloading Y-axis arm 52 to the mouthing position for carrying the next wafer and stands by for unloading the next wafer.
  • the wafer loader controller 90 Unloads the slider 26 integrally.
  • Virtual axis 2 in Fig. 1 Drive to the position indicated by 8 ', that is, the in-line I ZF ⁇ wafer transfer position with the unload arm 38.
  • the wafer W is transferred from the position of the virtual line W8 to a position below the position indicated by the virtual line W1 in FIG. 1 (see reference numeral W9 in FIG. 2).
  • the wafer loader control device 90 transfers the wafer W from the unload X-axis table 28 to the in-line IZF / unload arm 38. This delivery is performed by lowering the unload X-axis table 28 (or raising the in-line IZF / un-opening door 38).
  • the wafer loader controller 90 moves the unload X-axis table 28 to the position shown by the solid line in FIG. 1 for carrying the next wafer.
  • the wafer loader control device 90 Upon confirming that the unload X-axis tape 28 has retreated from the position of the virtual line 28 ', the wafer loader control device 90 notifies the CZD 200 of the fact.
  • the CZD-side unload arm (not shown) is inserted into the chamber 12 through the opening 12b, and the wafer W is moved from the in-line ⁇ / F ⁇ unload arm 38 to the CZD-side unloader door. Handed to the child.
  • the unloading arm on the CZD side is shaped so as not to interfere with the in-line IZF ⁇ unloading arm 38 when the wafer W is delivered.
  • the delivery of the wafer W is performed on the CZD side unloading arm. This is done by raising the load arm (or lowering the in-line IZF / unlock arm 38).
  • the C / D side load arm may be used as it is for the CZD side door arm.
  • an unillustrated door opening on the CZD side holds the wafer W and retreats out of the chamber 12 through the opening 12b.
  • the OC 24 A transported by the PGV (manual transport vehicle) or AGV (self-propelled transport vehicle) is placed on the carrier table 22 A through the opening 12 c of the chamber 12. Is done.
  • the OC 24A may be installed on the carrier table 22A from above using OHT (Over Head Transfer).
  • the wafer loader controller 90 drives the carrier table 22A down a predetermined amount, specifically, about 30 Omm downward through the vertical movement mechanism 94. I do. Next, the reason for this will be described with reference to FIG.
  • the height H1 of the carrier table 22A from the floor when installing the OC 24A using the above PG V etc. is restricted from the ergonomic point of view during the installation work, and is set to approximately 900 mm above the floor. Is set.
  • a plurality of wafer holding shelves, for example, 25 wafer shelves are provided in the OC 24A, and the height of each wafer from the upper surface of the carrier table 22A is H QT (see FIG. 6). Is approximately 270 mm, and the bottom ⁇ 8 (see Fig. 6) is approximately 30 mm. Therefore, when the carrier table 22A is fixed, the height of accessing the wafer in the OC 24A is approximately 930 (900 + 30) mm to approximately 1170 (900 + 270) mm.
  • the load W on which the wafer W taken out from the OC 24 A is placed next is placed on the X axis.
  • the height of the sample 42 is almost equal to the height of the wafer stage WS T, that is, approximately 600 mm on the floor. Is set to This is because the installation height of the wafer stage WS has an effect on the overall height of the equipment, and the overall height of the equipment has a direct effect on the ceiling height of the clean room. This is because the installation height of the WST must be as low as possible within the permissible range of its configuration.
  • the height is determined only by the vertical movement of each component during transfer. Hardly change. Therefore, the wafer access height (H3 in FIG. 6) for transferring the wafer to the load X-axis turntable 42 by the arm 34 of the robot 32 is approximately 600 mm. Therefore, it is assumed that the wafer W in the OC 24 A (see reference numeral W 10 in FIG. 1) is taken out by the arm 34 of the robot 32 and transferred to the load X-axis turntable 42 while the carrier table 22 A is fixed.
  • the Z-direction stroke of the arm 34 (that is, the robot 32) is approximately 570 mm (600 mm to 110 mm). Therefore, the up-and-down movement mechanism 37 of the robot 32 becomes large and it is difficult to secure the space, and the robot 32 needs to perform up-and-down movement of approximately 570 mm every time one wafer is accessed. Getting worse.
  • the OC 24 A is set on the carrier table 22 A at the position of the height H 1, then lowered to the height H 2, and the wafer from the OC 24 A thereafter.
  • the transfer of the wafer or the transfer of the wafer into the OC 24 A is performed by moving the robot 32 up and down in the Z direction. Further, when the transfer of the wafer from C 24 A or the transfer of the wafer to OC 24 A has been completed, the carrier table 22 A is raised to the unloading position at the height H 1. In this way, in the exposure apparatus 10 of the present embodiment, the vertical movement stroke of the robot 32 is shortened by (HI-H2).
  • the height of H2 is set to approximately 600 mm, the height of the top wafer will be approximately 870 (600 + 270) mm. Therefore, the arm 34 of the robot 32 only needs to make a reciprocating motion in a vertical direction of approximately 600 mm to approximately 870 mm and a stroke of 270 mm.
  • the vertical movement mechanism 94 of the carrier table 22A can be disposed immediately below the carrier table 22A as shown in FIG. 6, and the above-described lowering operation of the carrier table 22A is performed for one wafer. Since the operation is performed only once at the time of replacing the carrier, not the operation every time the access is performed, there is little effect on the throughput.
  • the wafer loader control device 90 uses a photosensor (substrate detection sensor) including a light emitting element 98A and a light receiving element 98B as shown in FIG.
  • a photosensor substrate detection sensor
  • the presence or absence of wafers at each stage in OC 24A is detected, and the result is stored in a memory (not shown).
  • the inaccessible wafer For example, it is also possible to detect an obliquely placed wafer or the like over two stages and perform some kind of error processing.
  • the wafer loader control device 90 drives the robot 32 upward according to the height of the wafer to be accessed, based on the information on the presence or absence of the wafer W in each stage stored in the memory. That is, the wafer 32 is driven up to a height at which the arm 34 of the robot 32 can be inserted into a gap between the wafer to be accessed and an obstacle (bottom of the wafer or OC) existing therebelow. In this case, the arm 34 of the robot 32 only needs to rise up to the height H 4 (see FIG. 6). Although the number of wafers is smaller than the actual number in FIG. 6 for convenience of drawing, there are 25 wafer holding shelves in OC24A, and H4 is the uppermost (lower). The access height of the wafer (from the 25th row to the 25th row) is shown.
  • the wafer loader control device 90 the arm 34 is rotated and expanded / contracted via the driving unit 36, and the arm 34 of the robot 32 is inserted under the target wafer. Then, the wafer W is placed on the arm 34, the arm 34 of the robot 32 is contracted, and the wafer W is taken out of the OC 24A. Next, the wafer loader controller 90 rotates and expands and contracts the arm 34 of the robot 32 to transfer the wafer W to a position indicated by a virtual line W2 in FIG. At this time, the wafer W and the arm 34 of the robot 32 are transported along a trajectory such that they do not interfere with other wafers and the like in the ⁇ C 24 A and the 4C 24 A.
  • the wafer loader control device 90 moves the arm 34 of the robot 32 to the unload X-axis table 28 located at the position of the imaginary line 28. Is inserted below the wafer W held at To move the wafer W from the unload X-axis table 28 to the arm 34 of the robot 32.
  • the arm 34 of the robot 32 is extended, retracted, rotated, and raised to transfer the wafer W from the position indicated by the virtual line W11 to the position indicated by the virtual line W10.
  • the wafer W was transported by the arm 34 of the robot 32 to a height at which the wafer W was to be stored, the arm 34 of the robot 32 was extended, and the wafer W was inserted slightly above the storage step in the OC 24A. Thereafter, the arm 34 of the robot 32 is lowered to transfer the wafer W to the storage stage, and the arm 34 of the robot 32 is contracted and evacuated outside 0C24A.
  • the wafer loader controller 90 drives the carrier table 22 A up from the height H 2 to H 1 to drive the P GV 'AGV 'Wait for transport of C 24 A by OHT or the like.
  • the operation when the wafer is stored and transported by the other OC 24 B is basically the same as that described above by the OC 24 A, but the sequence of wafer transport operation is shown in Fig. 1. Beginning from moving the wafer W from the position indicated by the imaginary line W1 2 to the position indicated by the imaginary line W1 3, the position indicated by the imaginary line W1 2 from the position indicated by the imaginary line W1 4 The difference is that the wafer W is moved to and finished.
  • the wafer transfer arms (C / D side door arm, C / D side unload door) on the CZD 200 side
  • the in-line I / F load arm 30 and the in-line I / F 'unload arm 38 as the substrate transfer section that transfers the wafer W between the chambers are installed inside the chamber 12 as in the conventional equipment.
  • there is no need to provide an inline interface separately from the C / D and the space required for the clean room can be reduced accordingly, thereby reducing the cost of clean room equipment. .
  • the in-line I / F ⁇ load arm 30 and the in-line I / F ⁇ unload arm 38 directly connect the C / D side load arm and C / Since the wafers are transferred to and from the D-side unload arm, the number of times the wafers are transferred can be reduced, thereby reducing dust generation.
  • the in-line I / F ⁇ mouth arm 30 and the in-line I / F ⁇ unload arm 38 are arranged in upper and lower stages, so that the loading side transfer sequence (wafer loading from CZD) and the unloading side
  • the transfer sequence (wafer collection to C / D) can be performed independently. For example, the wafer after exposure processing is not collected on the CZD side and remains in the in-line IZF section, so the next wafer cannot be loaded into the in-line IZF section and the load side sequence cannot be continued. The occurrence can be avoided.
  • the in-line I / F ⁇ load arm 30 and the in-line I / F ⁇ unopened arm 38 are arranged in the upper and lower stages to save space as much as possible. This space can be effectively used as a space for arranging the robot 32 and the OC 24 A (buffer) for temporarily evacuating the wafer W.
  • the wafer transfer system 100 holds the wafer and moves in the X direction.
  • the load X-axis evening table 42 and the turntable 42 are integrated in the X direction.
  • the wafer W is rotated by the table 42 while the wafer table 42 is being moved in the X direction by the wafer loader control unit 90. Deviation, center position deviation) is detected. That is, in the present embodiment, the wafer loader control device 90 and the wafer edge sensor 48 constitute a displacement detection device. This makes it possible to completely overlap the wafer displacement detection time (the wafer displacement detection time for the first stage briar alignment) with the wafer transfer time, thereby improving throughput. .
  • the wafer loader controller 90 corrects the positional deviation of the wafer detected based on the output of the wafer edge sensor 48 during the transport of the wafer (first stage briar alignment). Therefore, the throughput does not decrease. Specifically, the wafer loader controller 90 corrects the X-direction component of the rotation and the eccentricity of the wafer W by the rotation of the load X-axis turntable 42 and the stop position in the X-direction. 4 Receive the wafer from 2 Load Y-axis arm 50 Corrects the Y-direction component of the eccentricity of the wafer by the Y-axis stop position.
  • a position correction system is configured by the wafer loader control device 90, the load X-axis turntable 42, the load Y-axis arm 50, and a drive system thereof.
  • the wafer loader control apparatus 90 transfers the carrier table 22A (or 22B) to the wafer inside the OC24A (or OC224B) via the vertical movement mechanism 94.
  • the actuator Prior to the start of the exposure process, the actuator is driven to descend from the first position (position of height H1) to the position of second position (height H2). That is, in the present embodiment, a driving device is configured by the wafer loader control device 90 and the vertical movement mechanism 94.
  • the position of the height H1 is set to ⁇ C24A on the carrier table 22A.
  • the height position suitable for the work for example, in the case of a 12-inch wafer,
  • the height on the floor is set to about 900 mm, and the height H 2 is set to about 600 m above the floor, which is the installation height of the wafer stage WST, which is a reference for the height of the wafer transfer path by the wafer transfer system 100.
  • the vertical movement stroke of the arm 34 of the robot 32 when accessing the wafer W in the OC 24 A is as short as approximately 270 mm. It can be set to a long stroke, and the carrier table 2
  • the downward drive from the height H1 position of 4 A to the height H2 position may be performed only once before the exposure processing of the wafer inside the OC 24A. Therefore, even when a 12-inch wafer or the like is used, the throughput of wafer transfer can be improved.
  • the wafer loader control device 90 when the carrier table 22A (or 22B) is driven downward, the substrate including the light emitting element 98A (or 99A) and the light receiving element 98B (or 99B) is driven. Using a detection sensor, the presence / absence of wafer W in each stage in OC 24 A (or 24 B) is detected. That is, in the present embodiment, a substrate detection device is configured by the wafer loader control device 90, the light emitting element 98A (or 99A), and the light receiving element 98B (or 99B). It is possible to detect the presence or absence of wafer W in each stage in A (or 24B).
  • the transfer of the load side wafer is performed by the port X-axis turntable 42 and the load Y-axis arm 50, and the transfer of the unload side wafer is performed by the unload Y.
  • the load-side transfer and unload-side transfer of the wafer between CZD (or OC) and the wafer stage WST can be performed independently (simultaneously). it can. Therefore, during the transfer sequence, up to five wafers (virtual lines W1, W3, W4, W5, and wafer stage WST) can be taken into the apparatus only on the load side.
  • this apparatus can improve the throughput compared to the above-mentioned conventional apparatus (only a maximum of three wafers can be loaded on the load side only during the transfer sequence). .
  • the wafer alignment for the precise alignment of the wafer W is detected by the wafer alignment device 80 at the loading position in parallel with the exposure of the wafer on the wafer stage WST. I have. this Therefore, the throughput can be improved as compared with the case where the precision alignment is performed after the wafer is put on the wafer stage ws T.
  • the wafer edge sensor 48 is provided on the extension of the slider 40 to which the load X-axis turntable 42 is fixed has been described. 1 is separated from the X-axis turntable 48 and fixed at the position shown in FIG. 1, and after the wafer W is transferred to the position shown by the imaginary line W3, the positional deviation detection and the outline of the wafer are detected. Alignment (first stage briamentation) may be performed.
  • the wafer edge sensor 48 includes one light receiving element.
  • the present invention is not limited to this.
  • a photo sensor 4 including a light emitting element and a light receiving element 8 ⁇ , 48 ⁇ , and 48 C are provided, and the notch sensor that detects the notch of the wafer W is configured by the center nozzle sensor 48 B.
  • the remaining two photo sensors 48 A, 48 C May be arranged symmetrically on both sides of the notch sensor.
  • the rotation angle of the jaw is adjusted so that the direction of the notch is in a predetermined direction, and the load X-axis turntable 42 is moved to the photo sensor 48. Stop at the position where the signal of A and 48 C are equal, and stop the load Y-axis arm 50 in accordance with the wafer center obtained from the signal of the photo sensor 48 A or 48 C.
  • the first stage of the briament may be performed.
  • a wafer is used as a substrate
  • the present invention is not limited to this.
  • a square substrate such as a glass plate for a liquid crystal display panel may be used as the substrate. good.
  • the first stage briament of such a rectangular substrate is, for example, as follows using five sets of flute sensors 49A to 49E arranged in a positional relationship as shown in FIG. You can do it.
  • the X-axis component of the eccentricity is corrected by stopping the load X-axis turntable 42 at the position where the signals of C and 49D become equal, and the photosensors 49A (or 49B) and 49
  • the Y-axis component of the amount of eccentricity may be corrected by stopping the dovetail axis arm 50 at a position corresponding to the center of the rectangular substrate P obtained from the signal of E.
  • the adjustment of the rotation angle and the centering may be performed by a combination of a known positioning pin and a positioning roller (positioning hammer).
  • the center of the wafer or the square substrate after the adjustment of the rotation angle and the centering (positioning) is at a fixed position, so that the load X-axis turntable 42 and the load Y-axis arm 50 are also specified. Stop at the position.
  • misregistration detection for precise alignment at the loading position can be performed in the same manner as in the above embodiment.
  • five CCD cameras are provided.
  • the respective CCD cameras may be provided in the briliament device 80 in the same arrangement as the photosensors in FIG. 10 described above.
  • peripheral exposure is performed on the extended portion 40a of the slider 40 provided with the load X-axis turntable 42.
  • a unit 51 may be provided.
  • another third X guide 53 is provided in parallel with the X guide 18, and the peripheral exposure unit 51 is integrated with the extension 40 a along the X guide 53.
  • the peripheral exposure unit 51 be movable in the Y direction relative to the extension 40a. In this way, the wafer W is rotated by the load X-axis turntable 42 during the transfer of the wafer in the X direction, and the wafer W is rotated by the exposure light guided through the optical fiber 55 during the rotation.
  • peripheral exposure By exposing the peripheral resist, peripheral exposure can be performed. In this case, part of the peripheral exposure time is added to the wafer transfer time. It is possible to improve throughput and reduce dust generation due to peeling of the resist around the wafer.
  • the peripheral exposure unit 51 is not necessarily required to move in the X direction, but only needs to be movable relative to the load X-axis turntable 42 in the Y direction.
  • the wafer loader controller 90 can detect the position shift of the wafer W based on the output of the light receiving element 46 in the same manner as in the above-described embodiment, and based on the position shift detection result.
  • the periphery of the wafer W can be exposed with the same width over the entire circumference.
  • the wafer loader controller 90 can correct the detected wafer misalignment during the wafer transfer (first stage pre-alignment) as in the above embodiment.
  • the mouthing position (wafer replacement position) is positioned with respect to the exposure processing sequence end position of the wafer stage WST (that is, the exposure processing sequence start position).
  • the exposure processing sequence end position of the wafer stage WST that is, the exposure processing sequence start position.
  • the wafer stage WST If the exposure processing sequence start position and the exposure processing sequence end position are in the same direction with respect to the mouthing position, the notches 6 8 a and 6 8 b on the wafer holder 68, the stage transfer arm 54, and the load
  • the shape of the Y-axis arm 50 and the unloaded Y-axis arm 52 may be the same as in FIG.
  • the directions of the exposure processing sequence start position and the exposure processing sequence end position of the wafer stage WS with respect to the opening—deposition position are different. As a result, as shown in FIG.
  • the line connecting the center of the wafer (indicated by W7B) to the center of the wafer at the end position of the exposure processing sequence, the center of the wafer at the loading position, and the start of the exposure processing sequence If the line segment connecting the center of the wafer at the position (indicated by the symbol W 6 B) forms an angle S, the unloading during wafer unloading Y-axis arm 52 and wafer holder 68 Notch on the wafer holder 68 according to the angle ⁇ to prevent interference between the wafer transfer arm 54 and the wafer holder 68 when the wafer is closed. (Increase the notch area). Therefore, in order to secure a sufficient area of the wafer suction area of the wafer holder 68, the start position and the end position of the exposure sequence of the wafer stage WST are set so that the angle 6 is minimized. It is desirable.
  • the operation to adjust the wafer W to be accessed to the height of the arm 34 of the robot 32 is as follows.
  • Vertical movement H 2 ⁇ high H5
  • the vertical movement stroke of the carrier base 22 A is a long stroke (height HI to height H 5), and the vertical movement mechanism 94 becomes large. Since there is a space indicated by a mesh-like hatched portion, the vertical movement mechanism 94 may be arranged in this portion.
  • the present invention is not limited to this, and the optical axis of the transmission type substrate detection sensor is set near the wafer center.
  • a light emitting element and a light receiving element constituting the substrate detection sensor may be arranged so as to pass through.
  • the deflection of the wafer W due to its own weight is considered to be the greatest near the center. Therefore, when the deflection of the wafer due to its own weight becomes a problem, the arrangement is particularly effective.
  • the transmission type substrate detection sensor (98A, 98B) is connected to the robot 32 via the support base 97.
  • the robot 32 and the substrate detection sensors (98A, 98B) may be configured to move up and down integrally with each other.
  • the detection height of the substrate detection sensor is set to a height that allows the arm 34 to detect the wafer immediately before accessing the wafer W, and the information on the presence / absence of the wafer in all stages in the OC is described above. Detection and matting may be performed collectively, or the presence or absence of a wafer at each stage may be detected immediately before access.
  • the substrate detection sensor is not limited to the transmission type, and a reflection type sensor may be used.
  • a reflection type substrate detection sensor when used, the direction of the notch portion of the wafer is the detection direction of the substrate detection sensor. If the values match, there is a possibility that a desired signal intensity may not be obtained. Therefore, it is desirable to detect the wafer from two directions using two substrate detection sensors.
  • the presence or absence of a wafer at each stage in 0 C may be detected using a transmission type or reflection type wafer detection sensor in the same manner as described above.
  • the in-line IZF ⁇ load arm 30 and the in-line IZF / unload arm 38 are provided and arranged vertically is described.
  • the present invention is not limited to this.
  • FIG. As shown in (1), an I / F arm 31 provided with two upper and lower claw portions (substrate holding portions) may be provided, and this may be moved up and down.
  • the timing of delivery to and from the CZD-side load arm and the CZD-side unload arm may be controlled to move a single IZF arm up and down between a wafer opening position and an unloading position.
  • in-line IZF 'load arm 30 and the in-line IZF' un-open door 38 only move up and down to transfer the wafer W
  • means for preventing the wafer from shifting may be omitted.
  • an IZF arm having a claw portion formed in a tapered shape such as an I / F arm 30 ′ shown in FIG. 16B, may be used.
  • the openings 12 b, 12 c, and 12 d that form a boundary between the inside of the chamber 12 and the outside that may have a lower degree of cleanliness than the inside of the chamber 12 in the above embodiment have external Equipped with a down-flow air curtain to prevent air from flowing in from outside, or a mechanical shirt that opens and closes immediately before and after the wafer is transferred by the wafer transfer arm on the C / D side or immediately before and after loading and unloading of 0C. May be.
  • the exposure apparatus 10 can be equipped with up to two OCs. ⁇ 2nd Embodiment >>
  • FIG. 17 schematically shows a cross sectional view (plan sectional view) of an exposure apparatus 110 according to the second embodiment, centering on a wafer loader system 100 as a substrate transfer system.
  • This exposure apparatus 110 is preferably used by in-line connection with C / D 200 Is what you can do. Note that, in FIG. 17, parts other than the wafer stage WST of the air conditioning system and the exposure apparatus main body are not shown.
  • an L-shaped partition wall 102 is provided in a plan view at a + X direction end and a ⁇ Y direction end (obliquely lower right in FIG. 17) of the first chamber 12.
  • a front unified unified board (Front unified board) is used.
  • Opening Unified Pod The main feature is that the FOU P table 104 is installed as a container table for installing “F ⁇ U PJ” hereafter.
  • the FOU P table 104 is arranged only on the right side of the chamber 12, that is, on the side opposite to the side where the C / D 200 is arranged. Have been.
  • FOU P 106 stores a plurality of wafers W as substrates at predetermined intervals in the vertical direction, and has an opening only on the front surface (the + Y side surface in FIG. 17).
  • This is an openable / closable container (wafer cassette) having a front door 108 as a lid for opening and closing the unit, and is the same as, for example, the transport container disclosed in Japanese Patent Application Laid-Open No. 8-279546.
  • the FOU P 106 is pressed against the opening 102a of the partition wall 102, and the front door 108 is connected to the opening 102a. Need to be opened and closed via Therefore, in this embodiment, the opening / closing mechanism (orbuna) 112 of the front door 108 is arranged on the + X side of the second X guide 18 on the + Y side of the partition wall 102. Also, due to this influence, the installation position of the robot 92 is slightly shifted to the + Y side as compared with the case of FIG.
  • the opening 102 a has a height H 6 (H 6 is approximately 900 mm here) from a height H 7 (H 7 is approximately 600 mm here) from the floor surface of the partition wall 102. ) It is formed at a slightly lower position. Further, as shown in FIG. 18, a plurality of, for example, 25 stages of wafer holding shelves are provided in the FOU P 106, and the wafers of each stage are viewed from the upper surface of the FOU P table 104. The height of the top HFT is approximately 280 mm, and the height of the bottom HFB is approximately 40 mm.
  • the FOUP table 104 has a drive shaft 111 which is driven in the vertical direction and the Y direction by a vertical movement and slide mechanism 114 fixed to the bottom of the chamber 12. It is fixed to the upper surface of 6.
  • the vertical movement / sliding mechanism 114 is also controlled by the wafer loader controller 90 (see FIG. 5).
  • a front door 108 is engaged by vacuum suction or mechanical connection, and a mechanism for releasing a key (not shown) provided on the front door 108 is provided inside the opening / closing mechanism 112, and a mechanism for releasing a key (not shown) provided on the front door 108 is provided.
  • the open / close member 120 provided is housed, and a pair of reflective substrate detection sensors 118 A and 118 B are fixed to the upper end of the open / close member 120.
  • a method similar to the method of opening and closing the front door 108 by the opening / closing mechanism 112 is disclosed in detail in the above-mentioned Japanese Patent Application Laid-Open No. Hei 8-279546.
  • the opening / closing member 120 is fitted to the opening 102 a so that the inside of the partition wall 102 does not open to the outside in a normal state (a state in which the F ⁇ UP is not set).
  • the opening 102a is closed.
  • the opening / closing mechanism 112 is also controlled by the above-described wafer port controller 90 (see FIG. 5).
  • the wafer transfer operation when exchanging wafers with the C / D 200 is exactly the same as in the first embodiment described above, and a description thereof will be omitted.
  • the OUP 106 is a F ⁇ UP table located at a height H 6 (H 6 is approximately 900 mm above the floor for ergonomic reasons) from the floor through the opening 1 2 d of the chamber 12 Installed on 104. It is needless to say that the FOU P 106 may be installed on the FOU P table 104 from above using ⁇ HT (Over Head Transfer).
  • the above-described lowering operation of the FOUP table 104 is not performed for each access of one wafer, but is performed only once at the time of FOUP replacement, so that there is little effect on throughput.
  • the FOU P table 104 is driven in the + ⁇ direction via the vertical movement / slide mechanism 114 to press the FOU P 106 against the partition wall 102. This is because it is necessary to maintain a high degree of cleanliness in the F ⁇ UP 106 even after the front door 108 has been opened. This is to prevent direct contact with the space outside the partition wall 102, which may have a lower degree of cleanness than the inside of the partition 102.
  • the wafer loader controller 90 uses the opening / closing member ⁇ 20 of the opening / closing mechanism 112 to move the front door 108 of the FOU P106 into the position indicated by the imaginary line 108 ′′ in FIG. From the position where P106 is pressed against the partition wall 102, via the position indicated by the virtual line 108 ', to the storage position inside the opening / closing mechanism 1 1 2 indicated by the solid line, the front door The opening operation is performed at 108.
  • the wafer loader control device 90 uses a pair of reflective substrate detection sensors 1 18A and 1 1 as shown in FIG.
  • FOU P 1 06 using 8 B The presence or absence of a wafer at each stage is detected, and the result is stored in a memory (not shown). At this time, an inaccessible wafer, for example, a wafer placed obliquely over two stages, may be detected and some error processing may be performed.
  • the wafer loader control device 90 drives the robot 92 upward according to the height of the wafer to be accessed, based on the information on the presence or absence of the wafer W at each stage stored in the memory. That is, the robot 92 is driven to move up to a height at which the arm of the robot 92 can be inserted into the gap between the wafer to be accessed and the obstacle (bottom of the wafer or FOP) existing thereunder.
  • the robot 9 2 has a maximum height H
  • the wafer loader control device 90 takes out the wafer W from the FOU P 106 using the robot 92 in the same manner as the removal of the wafer from the OC in the above-described first embodiment using the robot 92. It is transported to the position indicated by the virtual line W16. At this time, the wafer W and the arm of the robot 92 carry the wafer along a locus that does not interfere with other wafers in the FUP 106. In addition, FOU P
  • a reciprocating movement of approximately 880 mm and a stroke of approximately 280 mm is sufficient.
  • the wafer loader control device 90 uses the arm of the robot 92 to transfer the wafer W into the OC in the first embodiment described above. In the same way as in the delivery of the FOU P106.
  • the wafer loader control unit 90 opens the front door 108 of the FOU P 106 by opening and closing the mechanism 120 when the processing of all the wafers in the FOU P 106 is completed. Move along the route and perform the door closing operation. After the door closing operation is completed, the wafer loader controller 90 drives the F ⁇ UP table 104 up from the height H 7 to H 6 to transfer the FOU P 104 by PGV, AGV, OHT, or the like. To wait.
  • the same effects as those of the exposure apparatus 10 of the first embodiment can be obtained, and the FOU P table on which the FOU P 106 is installed 1 and FIG. 1 because the opening and closing mechanism 1 1 2 of the front door 1 08 of the FOU P 1 06 was placed in the lower chamber of the chamber 12 where most of the wafer loader system 100 was stored.
  • the space in the chamber 12 is the same as the space in the first embodiment described above. In other words, it is possible to configure an in-line connection and FOUP compatible device without increasing the footprint of the device in the case of in-line connection with C / D and OC.
  • the FOU P table 104 for installing the FOU P 106 is located on the opposite side of the wafer loader system 100 from the connection with the C / D 200. Therefore, an opening / closing mechanism 1 1 2 for opening and closing the front door 108 of the F ⁇ ⁇ UP 106 can be arranged in front of the FOU P table 104, in the same chamber space as when installing an OC etc. It can be said that it is possible to set up a FOU P.
  • a pair of reflection-type substrate detection sensors 118A and 118B are used to detect the presence or absence of wafers at each stage in FOU P106. That is, in the second embodiment, the wafer loader control device 90 and the reflection type substrate detection A sensor for detecting the substrate is constituted by the sensors 118A and 118B, and the opening and closing of the front door 108 and the detection of the wafer are performed in parallel with the substrate detecting device. Throughput can be improved as compared to the case where a wafer in F0UP106 is detected later. Also in this case, it is possible to efficiently detect the presence or absence of a wafer at each stage in FOU P106.
  • the F 0 UP 106 (FOU P On the opposite side from where the stand 104) is installed, there is an empty space equal to the space required to mount FOU P106. Judging from the dimensions of the FOU P104 for 12-inch wafers, this empty space has a dimension of approximately 400 mm in the depth direction (Y direction) and approximately 600 mm in the width direction (X direction). .
  • the height H 6 (see Fig. 18) from the floor of the FOU P table 104 when the F 0 UP 106 is installed is roughly 900. mm, the height of FOU P106 itself is approximately 350 mm, and the free space above F0UP106 is approximately 200 mm, and the height of the space required for mounting FOUP106 is approximately above the floor. 1 450 mm. Therefore, an empty space having a volume of approximately 600 mm ⁇ 400 mm ⁇ 1450 mm exists on the opposite side of the FOU P 106 (FOU P table 104) in the chamber 12.
  • the operation device of the entire exposure apparatus is arranged in this space.
  • the height of the keyboard home key is approximately 1 000 mm above the floor
  • the height of the touch screen monitor Is approximately 1400 mm or less above the floor and within the above space. Therefore, this device is equipped with one FOU P, and it does not increase the size of the device compared to the case with OC, and has the operating device at the optimum height from the front and ergonomic point of view. Has been arranged.
  • FIG. 20 shows a main space configuration of the first chamber 12 constituting the exposure apparatus 110 of the second embodiment.
  • the chamber 12 is divided into an upper chamber 12A and a lower chamber 12B. Looking at the direction, the height at the center is set lower than at both sides.
  • the mounting space of FOU P 106 is set in the space 122 with a width of approximately 60 OmmX, a depth of approximately 400 mm, and a height of approximately 1,450 mm, which is indicated by the hatched portion located at the end on the + X side.
  • a hatched space # 26 at the center of the upper chamber 12A is a space for mounting and storing a reticle. That is, in the exposure apparatus 110, the space for carrying out and carrying in the FOU P 106 and the space for mounting and storing the reticle are set at substantially the same height (position in the Z direction). For this reason, the reticle can be mounted under conditions close to ergonomically optimal conditions, as in the case of installation of FOU P106.
  • the reticle can be mounted on the floor at a height of approximately 1100 mm to 1650 mm on the floor, which is the same level as that of the conventional 8-inch wafer for 0 C. This allows the number of reticle mounted Can also be secured.
  • the mechanism for mounting and storing the reticle is disclosed in detail in Japanese Patent Application Laid-Open No. 7-130607 and US Patent No. 5,442,163 corresponding thereto. To the extent permitted by the laws of the designated designated country or selected elected country, The disclosures in the above publications and U.S. patents are incorporated herein by reference. Further, as a mechanism for mounting and storing a reticle, a FOUP and an opening / closing mechanism used as a mechanism for mounting and storing a wafer in the present embodiment may be used as a mechanism for mounting and storing a wafer in the present embodiment.
  • a space above the space 126 may be used for storing the reticle.
  • the space for mounting the FO UP in the upper chamber 1 2 A 1 2 2 The upper space 1 2 8 A and the space 1 2 4 for the mounting of the operating device Reticle the upper space 1 2 8 B It may be a space for mounting and storing.
  • the reflection type substrate detection sensor 1 18 A, 11 1 is provided above the opening / closing member 120 constituting the opening / closing mechanism 112 of the front door 108 of the FOU P 106. 8B is provided, and when moving downward to open the front door 108, the presence or absence of wafers in each stage in FOU P106 by the board detection sensors 1118A and 118B
  • the present invention is not limited to this.
  • the reflection-type board detection sensors 1118A and 118B are attached to the drive unit of the robot 92 through the sensor support 130, The board detection sensors 118A and 118B may be moved up and down integrally with the robot 92.
  • the substrate detection sensors 1 18 A and 1 18 B can be set to a height that can detect the wafer in the FO UP 106 just before the arm of the robot 92 accesses the wafer. desirable. In this way, when the wafer loader control device 90 accesses the wafer in the FOU P 106 to carry out the wafer by the arm of the robot 92 (immediately before the access), the substrate detection sensor 1 18 A, 118B can be used to easily detect the presence or absence of a wafer and carry it out.
  • the transmission type board detection sensor (transmission type flute sensor) 132 is attached to the drive unit of the robot 92 via the sensor support 134 and the substrate detection sensor 1 is mounted.
  • the 32 may move up and down integrally with the robot 92.
  • the substrate detection sensor 132 sets the wafer in the FOU P 106 at such a height that the wafer can be detected immediately before the arm of the robot 92 accesses, and the drive system (not shown) drives the wafer in the Y direction. It is desirable to be configured to be able to move relative to the motor. By doing so, the wafer loader control device 90 moves the robot 92 up and down with the substrate detection sensor 132 retracted to the Y direction position shown by the solid line in FIG.
  • the board detection sensor 1 32 By inserting the board detection sensor 1 32 into F 0 UP 106 as shown by the virtual line 1 32 ′ through the drive system of the FOU P based on the output of the board detection sensor 1 32 The presence / absence of a wafer at each stage in 106 may be detected immediately before access. Further, in the second embodiment, from the viewpoint of improving the throughput, the case where the opening and closing operation of the front door 108 is performed only at the time of replacing the FOU P 106 has been described. However, the present invention is not limited to this. The opening and closing operation of the door 108 may be performed.
  • the opening and closing operation of the front door 108 may be performed each time a wafer is accessed.
  • an operation sequence of two opening and closing operations per wafer one time for loading and one time for unloading
  • the case where one FOUP is mounted in the lower chamber of the first chamber 12 has been described.
  • the length of the first chamber 12 in the Y direction For example, as shown in FIG. 23, a configuration in which up to two FOU Ps 106 can be mounted can be adopted.
  • the transfer sequence when storing and transferring the wafer by the FOU P106 on the left is the same as that of the first embodiment described above, except for the opening and closing operation of the front door.
  • FIGS. 1 and 2 show the exposure apparatus 10 of the first embodiment and the exposure apparatus 10 of the second embodiment.
  • FIG. 17 shows the optical device 110, the CZD in the first chamber 12 in which the connection portion of the wafer loader system 100 with the C / D 200 is stored.
  • Carrier table 22 B or FOU P table 104 as a container table is placed on the opposite side of 200, and CZD 20 CK Carrier table 22 B or FOU P table 104 is not available from OC 24 B or FOU P 106 respectively.
  • the first X guide 16 as a second transport guide for transporting the carrier table 22B or the F ⁇ UP table 104 has an end on the side of 04 shorter than the front of 0 C 24 B or F 0 UP 106. Set to position. For this reason, the robot 92 or the like can be arranged in front of the OC 24 B or the F-UP 106 regardless of whether the C or the F-UP is used.
  • first and second chambers 12, 14 and the like described in the first and second embodiments are merely examples, and it is a matter of course that the present invention is not limited to this. That is, the wafer loader system (substrate transfer system) and the exposure apparatus main body may be arranged in a single chamber, or the first and second chambers and the C / D may be arranged in the X direction. Therefore, the configuration of the transfer guide of the substrate transfer system may be appropriately changed. ⁇ Third embodiment >>
  • the exposure apparatus of the third embodiment is different from the exposure apparatus of the second embodiment described above.
  • the carrier table 2 instead of the carrier table 2 2B, the carrier table 2 has a substantially semicircular container base on the side opposite to the one Y-side side wall of the chamber 12. 2C is provided, and the carrier table 22C is disposed near the corner in the chamber 12, and the carrier table 22C is moved in the clockwise direction indicated by arrows F and F ', and counterclockwise. It is characterized in that a rotating device 140 that is driven to rotate in the circumferential direction is provided below the carrier table 22C. Other configurations and the like are the same as those in the first embodiment. In FIGS. 24 and 25, the illustration of the substrate detection sensor is omitted.
  • the robot 92 is driven up and down within a predetermined stroke range by a vertical movement mechanism 37 ′ similar to the above-described vertical movement mechanism 37.
  • the same effects as those of the above-described first embodiment can be obtained, and 0 C 24 B as a substrate container is installed. Since the carrier table 22C can be driven to rotate by the rotating device 140, the efficiency of loading and unloading of OC24B is taken into consideration according to the empty space outside the chamber of the clean room where the exposure device is installed. Thus, the direction of loading and unloading of OC 24 B with respect to the carrier table 22 C can be determined. Therefore, the space efficiency of the clean room and the efficiency of loading and unloading the substrate container can be improved at the same time.
  • a left and right CZD is arranged on the left (or right) side of the exposure apparatus as in the first embodiment.
  • in-line or right in-line
  • in-line there is also what is called in-line before placing C / D etc. on the front side of the exposure apparatus.
  • FIG. 26 shows a case where the carrier table 22 C and the robot 92 etc. are arranged in the chamber 12 of the exposure apparatus constituting the lithography system in front.
  • a plan view near the carrier table 22C is shown.
  • a C / D (not shown) is arranged on the front side (one Y side) of the chamber 12, the trajectory of a carrier such as a PGV or an AGV is controlled. It is difficult to lay.
  • an opening 12 e for carrying in and out the OC 24 B with respect to the carrier table 22 B is formed in the right side wall of the chamber 12. As shown by arrow G, OC 24 B is carried in from the right side of the device.
  • the rotating device 140 rotates the carrier table 22C by 90 ° in the direction of arrow F, as shown in FIG. 27.
  • the wafer loader control device 90 described above can use the arm of the robot 92 to access the wafer W in the OC 24B without any trouble.
  • the exposure apparatus provided with the carrier table 22C having the rotation device 140 can support left and right in-line and front in-line without changing most components of the wafer transfer system 100. .
  • the carrier table 22A disposed on the left side of the chamber 12 may be removed, and an inline I / F arm may be disposed at that part.
  • the FOU P table can be configured to be rotatable.
  • a mechanism for rotating the FOUP table 104 may be added to the drive system 114 for moving the # 11 table 104 in the Z and ⁇ directions.
  • the CZD 200 may be connected via an inline interface.
  • a robot 32 having an arm 34 which can freely rotate and expand and contract is arranged at a corner of the chamber 12 where the C / D is connected.
  • the robot 32 may constitute a substrate transfer unit that transfers a wafer to and from the C / D 200 via the in-line interface unit 142.
  • the inline interface section 142 is connected to the side of the chamber 12 as shown in FIG.
  • the CZD 200 can be disposed on the front side. And can be connected to either side.
  • an opening for accessing the carrier table (FOUP table) of the exposure apparatus and a detachable member for opening and closing the opening are provided on each of the front side and the side surface of the chamber 12 of the exposure apparatus. If this is done, a common carrier (FOU P) can be used regardless of the connection position of the C / D 200.
  • FIG. 29 is a cross sectional view (plan sectional view) of an exposure apparatus 210 according to the fourth embodiment. Is schematically shown centering on the substrate transport system. In FIG. 29, the illustration of the air-conditioning system and the like is omitted.
  • the exposure apparatus body 21 also shows only the wafer stage WST.
  • This exposure apparatus 210 is different from the above-described first and second embodiments in that it is a so-called stand-alone exposure apparatus. For this reason, the configuration of the wafer loader system 100 is slightly different from that of the exposure apparatus 10 of the first embodiment.
  • the end on the X side of the first X guide 16 is located at the left side in FIG. 29 from the end face of the F0UP table 104A on one side in the X direction (+ X side). It is slightly on the + X side, and there is no inline 'I ZF load arm etc.
  • two FOUP tables 104A and 104B are installed in the chamber 12 as container containers, and accordingly, two planar views are set in the chamber 12 as well.
  • L-shaped partition walls 102A and 102B are formed.
  • the FOUP tables 104A and 104B slide in the Y direction, but do not move up and down. Therefore, the heights of the openings 102c and 102d formed in the partition walls 102A and 102B of the chamber 12 are different from those of the second embodiment described above.
  • the opening portion 102d has a height H20 (from around H10 (H10 is approximately 900 mm here)) above the floor in the partition wall 102B.
  • H20 is formed at a position slightly lower than about 1200 mm).
  • the opening 102c is also formed in the partition wall 102A from a position near the height H10 from the floor surface to a position slightly lower than the height H20.
  • a pair of opening / closing devices 112A and 112B are provided instead of the opening / closing mechanism 120 for the front door of the FOUP described above.
  • opening / closing devices (orbners) 112A and 112B are, as shown in FIG.
  • the X guide 18 is arranged on one side and the other side in the X-axis direction.
  • one F ⁇ UP table 104 B has a drive shaft 1 16 driven in the ⁇ -axis direction by a slide mechanism 111 ′ fixed to the bottom of the chamber 12. It is fixed to the upper surface of.
  • the slide mechanism 114 ' is controlled by the wafer header controller 90 described above.
  • the slide mechanism 114 ′ may be controlled by the stage control device 69.
  • the other container table 22A side is also configured in the same manner as above.
  • the one opening / closing device 112B engages with the front door 108 by vacuum suction or mechanical connection and engages with the front door 108.
  • An opening / closing member 120 provided with a mechanism for releasing a key shown in the figure, a drive shaft 152 to which the opening / closing member 120 is attached, and a drive shaft 152 mounted in the vertical direction and the Y-axis direction, that is, FOUP It has a vertical movement and a slide mechanism 154 as a drive mechanism for driving in a direction approaching / separating from the table 104B.
  • the opening / closing member 120 is fitted in the opening ⁇ 0 2 d in a normal state (when the FOUP is not set) so that the inside of the partition wall 102 B does not open to the outside. Thus, the opening 102 d is closed.
  • a horizontal articulated robot (scalar robot) 92 is physically mounted on the back side of the opening / closing member 120 constituting the opening / closing device 112B.
  • This horizontal articulated robot hereinafter abbreviated as “robot” as appropriate
  • the arm 92 includes an arm 34 as a transfer arm that can expand and contract and rotate freely in the XY plane, and a drive unit 36 that drives the arm 34.
  • the drive unit 36 is attached to the opening / closing member 120.
  • the arm 34 is located above the opening / closing member 120 by a predetermined distance (the minimum distance required to access the wafer in the FOUP 106B).
  • the robot 92 that is, the arm 34
  • the robot 92 is driven in the up-down direction and the Y-axis direction integrally with the opening / closing member 120 by the up-down movement / slide mechanism 154.
  • the driving section 36 of the robot 92 has a pair of reflective substrate detection sensors 1 18 A and 1 18 B via a pair of supporting members 38. Are fixed respectively.
  • the other opening and closing device 112A also has an opening and closing member 120, a drive shaft (not shown) to which the opening and closing member 120 is attached, and It is configured to include a vertical movement / slide mechanism 154 that drives in the axial direction, that is, the direction in which the container table 22A approaches and separates from the container table 22A.
  • the robot 32 is physically attached to the opening / closing member 120, and the vertical movement and the sliding mechanism 154 move the robot 32 integrally with the opening / closing member 120 in the vertical direction and the Y-axis direction.
  • a pair of reflective substrate detection sensors 118A and 118B are fixed to the drive section of the robot 32 via a support member (see FIG. 29).
  • the wafer transfer sequence is basically the same as the sequence of storing and transporting the wafer by OC in the first embodiment described above, and the sequence of opening and closing the F 0 UP door is described below. This is the same as the sequence when the wafer is stored, transported and used by the FOUP in the second embodiment described above.
  • the FOU P at the height position where the F 0 UP 106 A and the 106 B are installed on the FOU P tables 104 A and 104 B.
  • the exposure apparatus 210 of the present embodiment described above as is clear from FIG. 29 and the description so far, the exposure apparatus 210 can be used as it is as an OC-compatible apparatus.
  • the opening / closing devices 112A and 112B are provided with the robots 32 and 92, and the opening / closing member 120 is located at a position that does not hinder the turning and extension / contraction of the arm 34. Since it is located, the wafers in the OC installed on the container table can be carried out by the arms 34 of the robots 32 and 92, or the wafers can be carried in the OC. Also, regarding the wafer transfer sequence, there is no difference between the OC compliant case and the FOUP compliant case except for the opening and closing operation of the front door 108.
  • the open / close member 120 for opening / closing the front door ⁇ 08 of the F ⁇ UP 106A, 106B, and the robots 32, 92 having the arm 34 are provided. Are moved in the vertical and Y-axis directions integrally by the slide mechanism 154 via the drive shaft 152. The following simultaneous operations can be performed when a wafer is unloaded from or into the B 106B or loaded into the F-UP 106A or the B 106B.
  • the operation of opening the front door 108 is a combination of the movement of the front door ⁇ 08 in the + Y direction and the movement of the front door downward
  • the operation of closing the front door 108 is the movement of the front door 108 upward.
  • a combination of movement in the Y direction Therefore, for example, when unloading an arbitrary wafer from FOU P 106 A and 106 B with the front door 108 closed, during the operation of opening the front door 108 (moving downward).
  • the arm 34 is inserted into the FOU P 106 A, 106 B, and the robots 32, 92 and the opening / closing member 120 are slightly driven to transfer the wafer to the arm 34.
  • the operation of retracting the arm 34 holding the wafer out of the outside of the 106B and 106B and the downward driving operation of the front door 108 are simultaneously performed for a predetermined time, thereby performing the predetermined time. It is possible to unload the wafer W while opening the front door 108.
  • the speed of the downward drive of the front door 108 (and the robots 32 and 92) at the specified time described above depends on the obstacles (specifically, the obstacles below the wafer unloaded from FOU P 106A and 106B).
  • the speed is set so that the arm 34 during retreat does not contact the adjacent wafer (the wafer in the lower storage stage) or the inner wall of the bottom wall of FOU P 106 A, 106 B. It is more desirable that this speed be the maximum speed at which the arm 34 does not come into contact with an obstacle below in consideration of the time for unloading the wafer by the arm 34 from the viewpoint of improving throughput.
  • the arm 34 holding the wafer retreats outside the F ⁇ UP 106 A and 106 B, the wafer is transported from that position to the position indicated by the imaginary lines W 13 and W 2 in FIG. 29.
  • the operation of the arm 34 (this operation includes, in part, the downward driving operation of the robots 32 and 92, that is, the front door 108) is performed.
  • the wafer when a wafer is loaded into FOU P 106 A and 106 B, the wafer is moved during the operation of driving the mouth bots 32 and 92 and the opening / closing member 120 upward and closing the front door 108. Insert the held arm 34 into the shell 106, 106B, and slightly move the robots 32, 92 and the opening / closing member 120 downward to set the wafer in the FOU P 106A, 106B. By moving the arm 34 out of the FOU P in parallel with driving the front door 108 upward for a predetermined time, the wafer W can be loaded while the front door 108 is closed. It is.
  • the speed of the upward drive of the front door 108 (and the robots 32 and 92) at the above-mentioned predetermined time depends on the obstacles (specifically, the obstacles above the wafer carried into the FOU Ps 106A and 106B). Specifically, the speed is set so that the arm 34 during retreat does not come into contact with an adjacent wafer (wafer in the upper storage stage) or the inner surface of the upper wall of FOU P 106 A and 106 B. It is more desirable that this speed be the maximum speed at which the arm 34 does not come in contact with an obstacle above, in consideration of the evacuation time of the arm 34, from the viewpoint of improving throughput.
  • the operation of opening or closing the front door 108 of the FOU P 106 A, 106 B is performed by unloading or loading an arbitrary wafer by the arm 34.
  • the operation required to open or close the front door 108 and the time required to carry out or carry in the wafer by the arm 34 are partly overlapped because at least part of the operation is performed in parallel.
  • the operation of opening or closing the front door 108 and the operation of unloading or loading the wafer and the operation of unloading or loading the wafer are performed separately in time. It is possible to reduce the time required for loading wafers into FOU P 106 A and 106 B.
  • a configuration in which the opening / closing member and the robot arm can be independently driven for example, a configuration in which the drive unit 36 of the robots 32 and 92 can also move the arm 34 up and down, that is,
  • the driving mechanism of the opening / closing member 120 and the arm 34 can be configured by the moving / sliding mechanism 154 and the driving section 36.
  • the opening / closing member 120 engaged with the front door 108 moves up and down integrally with the robots 32 and 92, so that an arbitrary wafer is unloaded or loaded.
  • the arm 34 is moved horizontally to unload the wafer. Or, they are brought in. For this reason, always open the FOU P106A, 106B fully and then carry out the wafer from FOUP106A, 106B or carry in the wafer to F0UP106A, 106B.
  • the time required to start the wafer unloading or wafer loading can be shortened compared to the case where the wafer removal is performed, and the dust generated by the vertical movement of the robot when the wafer is unloaded or wafer loaded is reduced.
  • 106 B can be reduced.
  • the transfer provided in the wafer loader system 100 to carry out the wafer in the FOU P 106 A, 106 B or carry in the wafer to the FOU P 106 A, 106 B. Since the arm 34 as an arm is provided in the opening / closing devices 112A and 112B for opening and closing the front door 108, as is apparent from FIG. 29, the opening / closing device and the transfer arm are connected to each other.
  • the space can be saved, and the size of the device in the depth direction can be reduced.
  • the above-described optimal layout is adopted and the space of the clean room is adopted. Efficiency can be improved as much as possible.
  • the wafer loader controller 90 (or the stage controller 69) unloads the lowermost wafer in the F ⁇ UPs 106A and 106B, the front door 1
  • the 08 is opened using the switchgear 1 1 2 A and 1 1 2 B, a pair of reflective board detection sensors 1 1 8 A and 1 1 8 B are integrated with the opening and closing member 1 20 and the front door 1 08 Is moved downward.
  • the wafer loader control device 90 detects the presence or absence of wafers in each stage in the FUPUPs 106A and 106B by using the reflection type substrate detection sensors 118A and 118B.
  • a substrate detection device is configured by the wafer header control device 90 and the pair of reflection type substrate detection sensors 118A and 118B. Since wafer detection is performed in parallel with opening of 108, throughput can be improved compared to the case of detecting wafers in FOU P 106A and 106B after opening of front door 108. is there.
  • the substrate may be a square type such as a glass plate for a liquid crystal display panel. A substrate may be used.
  • the present invention can be applied to a case where an open / close type container accommodating a plurality of square substrates is provided in a chamber of a liquid crystal exposure apparatus in order to improve the cleanliness.
  • a liquid crystal exposure device there is a device that performs exposure while holding the mask and the rectangular substrate vertically. It is conceivable to store a plurality of square substrates at predetermined intervals in the direction.However, in such a case, the opening / closing member of the container is moved closer to or away from the container table, and By providing a drive mechanism for driving the doors in the door opening / closing device, the substrate transfer method according to the present invention can be applied similarly to the above embodiment.
  • the operation sequence in which at least a part of the FOUP door opening / closing operation by the opening / closing member 120 and the carrying operation of the carrying arm 34 are performed in parallel can also be adopted in the above-described second embodiment. . That is, in the fourth embodiment, the vertical movement / slide mechanism 154 is also used as the opening / closing member 120 of the FOUP and the drive mechanism of the transport arm 34. Even when different driving mechanisms are provided, at least a part of the operation sequence of the opening / closing member 120 of the FOUP door and the operation sequence of the transfer arm 34 are performed in parallel as described above. Throughput can be improved.
  • the present invention provides a stationary exposure type stepper for transferring a reticle pattern onto a wafer by a step-and-repeat method, and a projection optical system.
  • a light exposure device such as a proximity exposure device that transfers a mask pattern onto a substrate by bringing the mask and substrate into close contact with each other, an EB exposure device, an X-ray exposure device, and other stages on which the substrate is placed.
  • the exposure method and type are not particularly limited, and the application of the exposure apparatus is also applicable to semiconductor manufacturing and rectangular glass plates.
  • the present invention is not limited to an exposure apparatus for liquid crystal for transferring a display element pattern, and can be widely applied to, for example, an exposure apparatus for manufacturing an imaging device (CCD or the like) or a thin-film magnetic head.
  • the system is not limited to the reduction system, and any of the unity magnification and the enlargement system may be used.
  • charged particle beams such as X-rays and electron beams
  • the electron gun in the case of using the electron beam, Kisaborai Bok to thermionic emission type lanthanum (L a B 6), it can be used tantalum (T a).
  • T a tantalum
  • a far ultraviolet ray such as an excimer laser
  • a material which transmits far ultraviolet rays such as quartz and fluorite
  • the system is a catadioptric or catoptric optical system.
  • an EUV exposure apparatus uses an all-reflective optical system and a reflective reticle.
  • an electron optical system including an electron lens and a deflector may be used as the optical system. It goes without saying that the optical path through which the electron beam passes is kept in a vacuum state.
  • the stage may be an evening eve that moves along a guide, or a guideless type without a guide.
  • reaction force generated by the movement of the reticle stage is disclosed in, for example, Japanese Patent Application Laid-Open No. H08-330224 and U.S. Patent Application No. 08 / 416,558 corresponding thereto.
  • the disclosures in the above publications and US patent applications are incorporated herein by reference.
  • the reaction force generated by the movement of the stage is disclosed, for example, in Japanese Patent Application Laid-Open No. Hei 8-63231 and corresponding US patent application Ser. No. 09 / 260,544.
  • the mover and the stator of the electromagnetic force motor for moving the stage may be eliminated by relatively moving the mover and the stator in directions opposite to each other with respect to the base board.
  • the disclosure in the above-mentioned gazettes and U.S. patent applications is incorporated herein by reference.
  • the exposure apparatus of each of the above-described embodiments includes various subsystems including each of the constituent elements (el ements) recited in the claims of the present application, and is provided with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling to maintain accurate accuracy. Before and after this assembly, in order to ensure these various precisions, adjustments to achieve optical precision for various optical systems, adjustments to achieve mechanical precision for various mechanical systems, and various electrical systems Is adjusted to achieve electrical accuracy.
  • the process of assembling the exposure apparatus from various subsystems includes mechanical connection, wiring connection of electric circuits, and piping connection of pneumatic circuits among the various subsystems. It goes without saying that there is an individual assembly process for each subsystem before the assembly process from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure equipment is completed, comprehensive adjustments are made to ensure various precisions of the entire exposure equipment. It is desirable to manufacture the exposure apparatus in a clean room where the temperature, cleanliness, etc. are controlled.
  • the method of transferring a substrate using an inline, open carrier, FOUP, or the like, and the apparatus of transferring a substrate are not limited to the exposure apparatus, but may be an inspection apparatus.
  • the present invention can also be applied to other device manufacturing apparatuses.
  • Figure 32 shows a flow chart of an example of manufacturing devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.).
  • device functions and performance design for example, circuit design of a semiconductor device, etc.
  • Step 402 mask manufacturing step
  • a wafer is manufactured using a material such as silicon.
  • step 404 wafer processing step
  • step 405 device assembly step
  • steps 404 and 404 wafer processing step
  • step 405 device assembly step
  • processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) are required. Included accordingly.
  • step 406 (inspection step), an operation check test, a durability test, and the like of the device manufactured in step 405 are performed. After these steps, the device is completed and shipped.
  • FIG. 33 shows a detailed flow example of step 404 in the case of a semiconductor device.
  • step 4 11 oxidation step
  • step 4 12 CVD step
  • step 4 13 electrode formation step
  • step 4 14 ion implantation step
  • ions are implanted into the wafer.
  • the post-processing step is executed as follows.
  • step 415 register forming step
  • a photosensitive agent is applied to the wafer.
  • step 416 exposure step
  • the circuit pattern of the mask is transferred to the wafer by the lithographic system (exposure apparatus) described above.
  • Step 417 development step
  • Step 418 etching step
  • the exposed members other than the portion where the resist remains are etched. Remove by Then, in a step 419 (registry removing step), unnecessary resists after etching are removed.
  • the exposure apparatus of each of the above embodiments is used in the exposure step (step 4 16). Can be manufactured at lower cost. Industrial applicability
  • the exposure apparatus according to the present invention is suitable for transferring a circuit pattern of a micro device such as an integrated circuit onto a substrate such as a wafer in a lithographic process.
  • the device manufacturing method according to the present invention is suitable for manufacturing a device having a fine circuit pattern.
PCT/JP1999/003565 1998-07-03 1999-07-02 Systeme d'exposition, procede de production de ce dernier, procede de transfert de tranches, dispositif et procede de fabrication du dispositif WO2000002239A1 (fr)

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KR1020007013604A KR20010043979A (ko) 1998-07-03 1999-07-02 노광장치 및 그의 제조방법, 기판반송방법, 그리고디바이스 제조방법 및 디바이스
AU43959/99A AU4395999A (en) 1998-07-03 1999-07-02 Exposure system, method of manufacture thereof, method of wafer transfer, deviceand method of manufacture device

Applications Claiming Priority (4)

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JP20444498 1998-07-03
JP10/204444 1998-07-03
JP10/283172 1998-10-06
JP28317298 1998-10-06

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WO2002045154A1 (fr) * 2000-12-01 2002-06-06 Kabushiki Kaisha Yaskawa Denki Robot de transfert et procédé d'inspection de substrat mince
EP1282486A1 (en) * 2000-05-03 2003-02-12 Berkeley Process Control, Inc. Self teaching robotic wafer handling system
WO2003026002A1 (fr) * 2001-09-18 2003-03-27 Murata Kikai Kabushiki Kaisha Vehicule a guidage automatique
JP2003332250A (ja) * 2002-03-15 2003-11-21 Asm Internatl Nv 炉内でウェハをバッチ処理するための方法および装置
US7308756B2 (en) * 2003-09-11 2007-12-18 Seiko Epson Corporation Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
JP2008153474A (ja) * 2006-12-18 2008-07-03 Canon Inc 処理装置
JP2013197375A (ja) * 2012-03-21 2013-09-30 Tokyo Electron Ltd プローブ装置及びウエハ搬送ユニット
TWI457722B (zh) * 2012-03-26 2014-10-21 Taiwan Semiconductor Mfg 微影設備配置及提升半導體工件製程生產率的方法
JP2015072995A (ja) * 2013-10-02 2015-04-16 キヤノン株式会社 リソグラフィ装置、リソグラフィシステム、および物品の製造方法
US9196515B2 (en) 2012-03-26 2015-11-24 Taiwan Semiconductor Manufacturing Co., Ltd. Litho cluster and modulization to enhance productivity
TWI797114B (zh) * 2017-03-31 2023-04-01 日商尼康股份有限公司 移動體裝置、曝光裝置、平板顯示器的製造方法、元件製造方法以及移動體的驅動方法

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Cited By (17)

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EP1282486A1 (en) * 2000-05-03 2003-02-12 Berkeley Process Control, Inc. Self teaching robotic wafer handling system
EP1282486A4 (en) * 2000-05-03 2007-06-06 Berkeley Process Control Inc HANDLING SYSTEM FOR AUTODIDACTIC ROBOTIC PADS
US6927181B2 (en) 2000-12-01 2005-08-09 Kabushiki Kaisha Yaskawa Denki Transfer robot and inspection method for thin substrate
US7008884B2 (en) 2000-12-01 2006-03-07 Kabushiki Kaisha Yaskawa Denki Transfer robot and inspection method for thin substrate
WO2002045154A1 (fr) * 2000-12-01 2002-06-06 Kabushiki Kaisha Yaskawa Denki Robot de transfert et procédé d'inspection de substrat mince
WO2003026002A1 (fr) * 2001-09-18 2003-03-27 Murata Kikai Kabushiki Kaisha Vehicule a guidage automatique
JP4575647B2 (ja) * 2002-03-15 2010-11-04 エーエスエム インターナショナル エヌ．ヴェー． 炉内でウェハをバッチ処理するための方法および装置
JP2003332250A (ja) * 2002-03-15 2003-11-21 Asm Internatl Nv 炉内でウェハをバッチ処理するための方法および装置
US7308756B2 (en) * 2003-09-11 2007-12-18 Seiko Epson Corporation Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
JP2008153474A (ja) * 2006-12-18 2008-07-03 Canon Inc 処理装置
JP2013197375A (ja) * 2012-03-21 2013-09-30 Tokyo Electron Ltd プローブ装置及びウエハ搬送ユニット
TWI580981B (zh) * 2012-03-21 2017-05-01 Tokyo Electron Ltd Probe device and wafer transfer unit
TWI457722B (zh) * 2012-03-26 2014-10-21 Taiwan Semiconductor Mfg 微影設備配置及提升半導體工件製程生產率的方法
US8903532B2 (en) 2012-03-26 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Litho cluster and modulization to enhance productivity
US9196515B2 (en) 2012-03-26 2015-11-24 Taiwan Semiconductor Manufacturing Co., Ltd. Litho cluster and modulization to enhance productivity
JP2015072995A (ja) * 2013-10-02 2015-04-16 キヤノン株式会社 リソグラフィ装置、リソグラフィシステム、および物品の製造方法
TWI797114B (zh) * 2017-03-31 2023-04-01 日商尼康股份有限公司 移動體裝置、曝光裝置、平板顯示器的製造方法、元件製造方法以及移動體的驅動方法

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