JP2013197375A - プローブ装置及びウエハ搬送ユニット - Google Patents
プローブ装置及びウエハ搬送ユニット Download PDFInfo
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- JP2013197375A JP2013197375A JP2012063864A JP2012063864A JP2013197375A JP 2013197375 A JP2013197375 A JP 2013197375A JP 2012063864 A JP2012063864 A JP 2012063864A JP 2012063864 A JP2012063864 A JP 2012063864A JP 2013197375 A JP2013197375 A JP 2013197375A
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- semiconductor wafer
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- 238000012546 transfer Methods 0.000 title claims abstract description 39
- 239000000523 sample Substances 0.000 title claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 151
- 239000004065 semiconductor Substances 0.000 claims abstract description 108
- 238000005259 measurement Methods 0.000 claims abstract description 10
- 238000007689 inspection Methods 0.000 claims abstract description 7
- 230000007723 transport mechanism Effects 0.000 claims abstract 4
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 117
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【解決手段】半導体ウエハに形成された半導体デバイスの電気的な検査を行うプローブ装置であって、載置台上に載置された前記半導体ウエハの前記半導体デバイスにプローブを接触させて電気的な測定を行う測定部と、半導体ウエハ収納容器151が載置されるロードポート152と、上下駆動機構163と、回転駆動機構162と、水平駆動機構とを有し、前記半導体ウエハ収納容器151と前記載置台との間で前記半導体ウエハを搬送可能とされたウエハ搬送機構160と、前記ウエハ搬送機構160の前記上下駆動機構163によって上下動可能とされ、前記半導体ウエハ収納容器151の蓋を開閉する蓋開閉機構190と、を具備した。
【選択図】図2
Description
Claims (5)
- 半導体ウエハに形成された半導体デバイスの電気的な検査を行うプローブ装置であって、
載置台上に載置された前記半導体ウエハの前記半導体デバイスにプローブを接触させて電気的な測定を行う測定部と、
半導体ウエハ収納容器が載置されるロードポートと、
上下駆動機構と、回転駆動機構と、水平駆動機構とを有し、前記半導体ウエハ収納容器と前記載置台との間で前記半導体ウエハを搬送可能とされたウエハ搬送機構と、
前記ウエハ搬送機構の前記上下駆動機構によって上下動可能とされ、前記半導体ウエハ収納容器の蓋を開閉する蓋開閉機構と、
を具備したことを特徴とするプローブ装置。 - 請求項1記載のプローブ装置であって、
前記蓋開閉機構は、前記蓋を吸着する吸着機構と、前記蓋の複数のラッチ機構を開閉するラッチ開閉機構とを具備し、前記ラッチ開閉機構は、1つの駆動機構と当該駆動機構に接続されたリンク機構によって、複数の前記ラッチ機構を開閉するよう構成されたことを特徴とするプローブ装置。 - 半導体ウエハ収納容器が載置されるロードポートと、
上下駆動機構と、回転駆動機構と、水平駆動機構とを有し、前記半導体ウエハ収納容器内内の前記半導体ウエハを出し入れするウエハ搬送機構と、
前記ウエハ搬送機構の前記上下駆動機構によって上下動可能とされ、前記半導体ウエハ収納容器の蓋を開閉する蓋開閉機構と、
を具備したことを特徴とするウエハ搬送システム。 - 請求項3記載のウエハ搬送システムであって、
前記蓋開閉機構は、前記蓋を吸着する吸着機構と、前記蓋の複数のラッチ機構を開閉するラッチ開閉機構とを具備し、前記ラッチ開閉機構は、1つの駆動機構と当該駆動機構に接続されたリンク機構によって、複数の前記ラッチ機構を開閉するよう構成されたことを特徴とするウエハ搬送システム。 - 請求項3又は4記載のウエハ搬送システムであって、
前記半導体ウエハの位置決めを行う位置決め機構を具備したことを特徴とするウエハ搬送システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012063864A JP5894825B2 (ja) | 2012-03-21 | 2012-03-21 | プローブ装置及びウエハ搬送ユニット |
TW102108044A TWI580981B (zh) | 2012-03-21 | 2013-03-07 | Probe device and wafer transfer unit |
KR1020130029564A KR101705858B1 (ko) | 2012-03-21 | 2013-03-20 | 프로브 장치 및 웨이퍼 반송 유닛 |
CN201310090834.1A CN103325706B (zh) | 2012-03-21 | 2013-03-21 | 探测装置和晶片搬送单元 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2012063864A JP5894825B2 (ja) | 2012-03-21 | 2012-03-21 | プローブ装置及びウエハ搬送ユニット |
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JP2013197375A true JP2013197375A (ja) | 2013-09-30 |
JP5894825B2 JP5894825B2 (ja) | 2016-03-30 |
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JP2012063864A Active JP5894825B2 (ja) | 2012-03-21 | 2012-03-21 | プローブ装置及びウエハ搬送ユニット |
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JP (1) | JP5894825B2 (ja) |
KR (1) | KR101705858B1 (ja) |
CN (1) | CN103325706B (ja) |
TW (1) | TWI580981B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108808367A (zh) * | 2018-06-26 | 2018-11-13 | 山东卓越生物技术股份有限公司 | 卡片安装结构及卡片 |
KR20230158112A (ko) | 2021-03-30 | 2023-11-17 | 도쿄엘렉트론가부시키가이샤 | 처리 장치 및 기판 반송 방법 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108213745B (zh) * | 2016-12-16 | 2020-01-24 | 上海新昇半导体科技有限公司 | SiC晶体切片移动设备及移动方法 |
CN113013075A (zh) * | 2021-02-25 | 2021-06-22 | 上海广川科技有限公司 | 一种晶圆检测装置及方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000002239A1 (fr) * | 1998-07-03 | 2000-01-13 | Nikon Corporation | Systeme d'exposition, procede de production de ce dernier, procede de transfert de tranches, dispositif et procede de fabrication du dispositif |
JP2001248610A (ja) * | 2000-03-03 | 2001-09-14 | Semiconductor Leading Edge Technologies Inc | シリンダ及びそれを用いたロードポート並びに生産方式 |
JP2010073827A (ja) * | 2008-09-17 | 2010-04-02 | Tokyo Electron Ltd | プローブ装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040075822A1 (en) * | 1998-07-03 | 2004-04-22 | Nikon Corporation | Exposure apparatus and its making method, substrate carrying method, device manufacturing method and device |
WO2000033376A1 (fr) * | 1998-12-02 | 2000-06-08 | Dainichi Shoji K.K. | Contenant |
KR100425498B1 (ko) * | 2001-07-21 | 2004-03-30 | 엘지전자 주식회사 | 이동 단말기의 데이터 자동인식 방법 |
KR100468437B1 (ko) * | 2002-08-23 | 2005-01-27 | 코리아테크노(주) | 후프 오프너의 후프도어 개폐장치 |
JP4146495B1 (ja) | 2006-05-11 | 2008-09-10 | 東京エレクトロン株式会社 | 処理装置 |
CN101071784B (zh) * | 2006-05-11 | 2010-08-18 | 东京毅力科创株式会社 | 检查装置和检查方法 |
KR100867606B1 (ko) * | 2007-03-29 | 2008-11-10 | 코리아테크노(주) | 후프오프너의 후프도어 해제장치 |
JP5120018B2 (ja) * | 2007-05-15 | 2013-01-16 | 東京エレクトロン株式会社 | プローブ装置 |
JP5134495B2 (ja) * | 2008-10-16 | 2013-01-30 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
CN102116835B (zh) * | 2009-11-06 | 2014-12-03 | 东京毅力科创株式会社 | 探测装置以及衬底运送方法 |
JP5518513B2 (ja) * | 2010-02-04 | 2014-06-11 | 平田機工株式会社 | フープオープナ及びその動作方法 |
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2012
- 2012-03-21 JP JP2012063864A patent/JP5894825B2/ja active Active
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- 2013-03-07 TW TW102108044A patent/TWI580981B/zh active
- 2013-03-20 KR KR1020130029564A patent/KR101705858B1/ko active IP Right Grant
- 2013-03-21 CN CN201310090834.1A patent/CN103325706B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000002239A1 (fr) * | 1998-07-03 | 2000-01-13 | Nikon Corporation | Systeme d'exposition, procede de production de ce dernier, procede de transfert de tranches, dispositif et procede de fabrication du dispositif |
JP2001248610A (ja) * | 2000-03-03 | 2001-09-14 | Semiconductor Leading Edge Technologies Inc | シリンダ及びそれを用いたロードポート並びに生産方式 |
JP2010073827A (ja) * | 2008-09-17 | 2010-04-02 | Tokyo Electron Ltd | プローブ装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108808367A (zh) * | 2018-06-26 | 2018-11-13 | 山东卓越生物技术股份有限公司 | 卡片安装结构及卡片 |
KR20230158112A (ko) | 2021-03-30 | 2023-11-17 | 도쿄엘렉트론가부시키가이샤 | 처리 장치 및 기판 반송 방법 |
Also Published As
Publication number | Publication date |
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CN103325706A (zh) | 2013-09-25 |
JP5894825B2 (ja) | 2016-03-30 |
KR20130107238A (ko) | 2013-10-01 |
KR101705858B1 (ko) | 2017-02-10 |
TWI580981B (zh) | 2017-05-01 |
TW201350884A (zh) | 2013-12-16 |
CN103325706B (zh) | 2017-09-08 |
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