Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22C—FOUNDRY MOULDING
  • B22C9/00—Moulds or cores; Moulding processes
  • B22C9/06—Permanent moulds for shaped castings

Definitions

• the present invention relates to an electronic device having a straight body made of light metal used for a computer, a method of manufacturing the electronic device, and a mold apparatus for forming a body of the electronic device.
• Fig. 6 shows the configuration of a conventional electronic device, which is injected into a mold and molded. When molding the electronic device body 1, molten metal flows from the sprue 12 (this figure shows the shape of the electronic device housing immediately after molding.
• each part of the mold apparatus will be described as a part corresponding to the shape of the electronic device housing immediately after the molding.
• the molten metal is passed through the runner 3 to the desired mold ⁇ part. Is introduced.
• the introduced molten metal spreads over the entire cavity 4 and eventually reaches an air vent 5, and a water pool 6 is further connected to the air vent 5.
• the air can escape to the outside through the air vent 5, whereby the air can escape.
• the body can be formed without being inside the housing.In order to form the shape to be used as the housing 1 for electronic equipment from the housing shape immediately after molding in FIG.
• the sprue 1, runner 3, air vent 5 or pool 6 is cut off to form the shape of the body 1 for electronic equipment.
• the solidified housing shape is taken out, and a hole 7 is provided in the electronic device straight body 1, for example, for heat radiation to the outside or as speed. If it is possible, the hole 7 is formed by punching out the hole 7 with a ⁇ bit. As a result, the narrow hole 7 of the pitch is formed in the electronic device housing 1 as described above.
• a protruding pin shape is provided inside the cavity 4, and the molten metal is flown inside the cavity 4 provided with the pin shape to form a pin shape.
• a manufacturing method that takes out the body shape is conceivable.
• the pin shape when the pin shape is provided with a narrow pitch, for example, when the molten metal is a magnesium alloy, the fluidity of the molten metal deteriorates during this time, In some cases pins If the molten metal does not enter the portion between the shapes and an unfilled portion is formed, there is a possibility that the molten metal may be lost.
• the thickness of the housing 1 for electronic devices may be reduced, so that when the punching process is performed with a narrow pitch of this housing shape, a problem may occur. It has the following disadvantages. If this occurs, it will cause a problem in appearance as a product, so it is necessary to take additional steps such as taking steps to remove the pain. Become.
• the present invention has been made on the basis of the above-mentioned circumstances, and the purpose thereof is to provide a good external appearance, a low pitch, a narrow pitch, and a narrow pitch hole shape. It is an object of the present invention to provide an electronic device having a large number of electronic devices capable of performing the process quickly, a method of manufacturing the electronic device, and a mold device.
• the mold apparatus of the present invention is provided with a casing having a hole of a predetermined pitch (provided so as to protrude from an upper mold or a lower mold to form a book).
• a mold device having a pin member having a pin member
• the pin member can be formed so as to protrude longer than the thickness of the body, and a predetermined gap from the protruding end of the pin member is provided at a position where the pin member is provided.
• a recess is formed in either the lower die or the upper die facing the protruding end of the pin member so as to provide an inflow bypass path having a groove.
• the method for manufacturing an electronic device includes: In a method for manufacturing an electronic device in which a housing of the electronic device having a hole of a predetermined pitch is molded using the die device described in claim 1, molten metal is caused to flow through the inflow bypass passage to completely fill the inside of the die device. A fluidizing step of distributing the molten metal to the body, and a solidifying step of solidifying the molten metal introduced into the inside of the mold apparatus by the above-described fluidizing process to form a molded article.
• a raised portion is initially provided around the hole, and a hole shape deeper than the thickness of the housing is formed in the raised portion, and the raised portion is formed by mechanical processing. It is characterized by having a machined surface around the through hole by making it the same plane as the other body.
• Fig. 1 is a perspective view showing a shape of a B body for an electronic device according to a conventional example
• Fig. 2 is a perspective view showing a configuration of a portable computer as an electronic device according to an embodiment of the present invention.
• Fig. 3 is a sectional view showing the shape of the mold apparatus.
• Fig. 4 is a partially enlarged view of the same mold equipment.
• FIG. 5 is a perspective view showing the shape of a housing for an electronic device similarly used for the electronic device.
• Fig. 6 is a diagram showing a flowchart related to a method for manufacturing an electronic device.
• Fig. 7 is a perspective view showing the shape of a molded product.
• FIG. 8 is a cross-sectional view of a method for manufacturing an electronic device having an electronic device housing in the same manner, and FIG. 8A shows a state before the protruding portion of the molded product is cut.
• B is a diagram showing a state in which the protruding portion of the molded product is cut.
• FIG. 2 is an external view showing the shape of a portable computer 10 such as a notebook computer.
• a portable computer 10 has a computer main body 11 and a display rotatably supported by the computer main body 11. Units 1 and 2 are provided. Further, the computer main body 11 has a body 13, and the lower body 14 and the upper body 15 are appropriately joined to each other by, for example, screws or the like. Configuration. However, the configuration in which the lower housing 14 and the upper housing 15 are joined together is not limited to this, and may be joined by other configurations. In this section, the case applied to electronic devices such as portable computers 10 is described as the case 20 for electronic devices. I will tell.
• the housing 20 for electronic devices such as a light metal personal computer made of a magnesium alloy or the like, has a function of cooling the inside of the NOSCON, or is external to the outside. There is a case where a large number of holes 21 are required at a narrow pitch to have a function as a force for generating sound.
• a mold apparatus 30 shown in FIG. 3 is used.
• the mold apparatus 30 has an upper mold 31 and a lower mold 32, and the mold apparatus 30 is formed by the engagement of these.
• This mold device 30 has a sprue 33, which is a 1: 1 guide of the molten metal, and a plan to introduce the molten metal into the mold to guide the uniform diffusion of the molten metal.
• Runners 3 and 4 are provided. The molten metal guided by the runner 34 is guided to the cavity 35 of the mold IK 30.
• the molten metal is a magnesium alloy molten metal.
• aluminum or aluminum molten metal may be used, the cavity 35 described above has the above-mentioned characteristics.
• a pin member 36 is provided at a portion corresponding to the hole 21 of the mold apparatus 30.
• the pin member 36 is provided on the upper die 31 with a length slightly protruding from the thickness of the electronic device housing 20.
• the lower die 32 facing the upper die 31 provided with the pin members 36 is provided with an inflow bypass part 37 shown in FIG.
• This inflow bypass part 37 is the other part of the cavity 35. It is provided in the recessed part 38 that is provided to be more depressed.
• the depth of the recess 38 is such that the distance between the protruding end of the pin member 36 and the bottom surface of the inflow bypass portion 37 is substantially the same as the other portions of the cavity 35. It is configured.
• An air vent 39 is formed at the other end of the cavity 35.
• the air vent 39 allows the air inside the mold device 30 to escape from the mold device 30 to the outside, and the air vent 39 further increases the water pool. It is passing through to 0. As a result, the molten metal introduced into the mold apparatus 30 reaches the pool 40 while preventing the occurrence of voids inside the cavity 35. I have.
• FIG. 6 shows a flowchart of the manufacturing method.
• the molten metal is caused to flow into the inflow bypass section 37 provided at 38, the molten metal is first caused to flow into this section, and then the molten metal is passed from the inflow bypass section 37 to the pin member 36.
• Flow (flow rate) is caused to flow into the inflow bypass section 37 provided at 38, the molten metal is first caused to flow into this section, and then the molten metal is passed from the inflow bypass section 37 to the pin member 36.
• the flow of the molten metal from one end of the cavity 35 to the other end is accompanied by the flow of the molten metal at the position between the individual pin members 36.
• a faster flow of the molten metal is generated in the inflow bypass section 37 where the molten metal flows more easily. Therefore, this inflow vino ,.
• the molten metal flows into the part of the pin member 36 located at the upper part of the molten metal part 37 (jlij). As a result, most of the force is applied upward from the S inflow no-pass section 37, which allows the molten metal to enter the position between the individual pin members 36. It will be easier.
• a hole shape 43 provided corresponding to the pin member 36 is smaller than the thickness of the electronic device housing 20. Is also deeply formed. That is, the lower end side of the hole shape 43 protrudes further from the thickness of the electronic device housing 20. It will be provided.
• the raised portion 42 which is the removed portion, is cut (for example, by a milling machine) so as to be flush with the other portion of the molded product 41. If the process is performed, the hole 21 can be formed in a state penetrating the electronic device housing 20 (processing step).
• a cut surface (machined surface) 44 is formed in a portion where the raised portion 42 around the hole 21 is removed.
• the mold apparatus 30 is provided with a pin member 36.
• a recess 38 is formed in the mold device 30 so that the protruding length of the pin member 36 is formed deeper than the thickness of the electronic device housing 20. Since the portion between the projecting end of the pin member 36 and the recessed portion 38 forms the inflow bypass portion 37, the molten metal is poured from the inflow bypass portion 37. It is possible to prevent the generation of unfilled parts by making it enter the part of question 6 above.
• a raised portion 42 is formed in the molded product 41 by the mold apparatus 30, and the raised portion 42 is removed by cutting or the like, whereby the hole 2 is removed.
• 1 is formed as a straight body 20 for electronic equipment, so that the narrow-pitch hole 21 is pressed or drilled. JP 017
• the cost required for the processing equipment can be reduced in comparison with the case of drilling with a tool or the like, and the processing time can be shortened.
• the housing for electronic equipment 20 using a magnesium alloy as its material, it is possible to provide an electronic equipment river it body 2 ⁇ having high rigidity and sufficient strength even when thinned.
• a magnesium alloy as its material
• the electronic device housing 20 having the narrow-pitch hole 21 has been described.
• the present invention is not limited to this, and the present invention is applicable to other components and the like. It is now possible.
• the present invention can be applied to a configuration having various pitches, such as a case in which the entire hole 21 is not a narrow pitch, and a portion is a narrow pitch. It is.

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Molds, Cores, And Manufacturing Methods Thereof (AREA)
• Casings For Electric Apparatus (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Related Child Applications (1)

Publications (1)

Family

ID=15952709

Family Applications (1)

Country Status (5)

Families Citing this family (3)

Citations (2)

• 1998
  • 1998-06-19 JP JP10173019A patent/JP2000005846A/ja active Pending
• 1999
  • 1999-03-09 TW TW088103620A patent/TW450020B/zh not_active IP Right Cessation
  • 1999-04-02 WO PCT/JP1999/001762 patent/WO1999065631A1/ja active Application Filing
  • 1999-04-02 CN CN99807585A patent/CN1111457C/zh not_active Expired - Fee Related
• 2000
  • 2000-12-18 US US09/737,870 patent/US20010001979A1/en not_active Abandoned

Patent Citations (2)

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