JPS6146049B2 - - Google Patents

Info

Publication number
JPS6146049B2
JPS6146049B2 JP1546081A JP1546081A JPS6146049B2 JP S6146049 B2 JPS6146049 B2 JP S6146049B2 JP 1546081 A JP1546081 A JP 1546081A JP 1546081 A JP1546081 A JP 1546081A JP S6146049 B2 JPS6146049 B2 JP S6146049B2
Authority
JP
Japan
Prior art keywords
sealing
resin
printed circuit
circuit board
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1546081A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57128930A (en
Inventor
Tadaaki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP1546081A priority Critical patent/JPS57128930A/ja
Publication of JPS57128930A publication Critical patent/JPS57128930A/ja
Publication of JPS6146049B2 publication Critical patent/JPS6146049B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1546081A 1981-02-04 1981-02-04 Resin sealing Granted JPS57128930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1546081A JPS57128930A (en) 1981-02-04 1981-02-04 Resin sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1546081A JPS57128930A (en) 1981-02-04 1981-02-04 Resin sealing

Publications (2)

Publication Number Publication Date
JPS57128930A JPS57128930A (en) 1982-08-10
JPS6146049B2 true JPS6146049B2 (zh) 1986-10-11

Family

ID=11889405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1546081A Granted JPS57128930A (en) 1981-02-04 1981-02-04 Resin sealing

Country Status (1)

Country Link
JP (1) JPS57128930A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01172445U (zh) * 1988-05-17 1989-12-06
US7153116B2 (en) 2002-11-29 2006-12-26 Apic Yamada Corporation Resin molding machine
US7622067B2 (en) * 2005-05-30 2009-11-24 Spansion Llc Apparatus and method for manufacturing a semiconductor device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954308A (en) * 1988-03-04 1990-09-04 Citizen Watch Co., Ltd. Resin encapsulating method
NL9401682A (nl) * 1994-10-12 1996-05-01 Fico Bv Werkwijze voor het omhullen van een chip en scheidingsstrip en matrijshelft te gebruiken met deze werkwijze.
NL1012488C2 (nl) 1999-07-01 2001-01-03 Fico Bv Inrichting en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.
NL1022323C2 (nl) * 2003-01-08 2004-07-09 Fico Bv Inrichting en werkwijze voor het met omhulmateriaal omhullen van een op een drager bevestigde elektronische component.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01172445U (zh) * 1988-05-17 1989-12-06
US7153116B2 (en) 2002-11-29 2006-12-26 Apic Yamada Corporation Resin molding machine
US7622067B2 (en) * 2005-05-30 2009-11-24 Spansion Llc Apparatus and method for manufacturing a semiconductor device

Also Published As

Publication number Publication date
JPS57128930A (en) 1982-08-10

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