4 50 0 2 0 經濟躬智«!財產局員工消費合作社印u 五、發明說明（1 ) (發明所屬之技術領域） 本發明係關於一種具有使用於個人電腦等之輕金屬製 框體的電子機器，及該電子機器之製造方法，以及用以形 成該電子機器之框體的金屬模具裝置。 (以往之技術） 在輕金屬製電子機器用框體，在最近作爲原材採用主 要使用鎂合金，依壓鑄法或觸變性法成形此等合金。此等 成形法係在裝置構造上雖有所不同，惟作爲其條件均將熔 融成5 8 0度至7 5 0度之合金注射塑製於大約1 〇 〇度 至3 5 0度之金屬模具內部而成形。 在第6圖表示以往之電子機器用框體1之構成。在成 形該電子機器用框體1時，從豎澆道2流入熔融金屬（在 該圖中，表示剛成形之後之電子機器用框體之形狀，在以 下之說明中金屬模具裝置之各部分也對應於該剛成形後之 電子機器用框體之形狀之部分加以說明。·），通過橫流道 3而將熔融金屬導入所期望之金屬模具內部。被導入之熔 融金屬係普及所有模穴4後均到達通氣孔5 ，又在該通氣 孔5又連結有澆池6。如此，當從豎澆道2導入熔融金屬 時，通過該通氣孔5可將空氣逃逸至外部，由此空隙在不 存在於框體內部之狀態可形成。 又，爲了從第6圖之剛成形後之框體形狀利用作爲電 子機器用框體1之形狀，之後切掉豎澆道2，橫流道3， 通氣道5或澆池6之部分，以構成電子機器用框體1。 H- 二 * ^1 ^1 ϋ ί 1 n t ϋ k ϋ (請先閱讀背面之注意事項再填寫本頁) -5: •線. I: 本紙張尺度適用中國囤家標準（CN’S)A4規格（210 X 297公釐） -4 - 450 0 2 0 A7 _B7_ 五、發明說明f ) {請先閲讀背面之注意事項再填寫本頁) 該熔融金屬在模穴4內部固化之後，取出該固化之框 體形狀，在電子機器用框體1設置例如向外部之散熱用或 作爲擴音器之孔部7時，以所定之節距用衝孔形成該孔部 7。由此，如上所述，將節距窄小之孔部7形成在電子機 器用框體1。 然而。在將框體形狀形成在模穴4內部之後又在模穴 形狀施以衝孔加工——地形成孔部7，而爲了實行後續加 工成爲成本較高之原因。所以，期望不需要費用，且可快 速地形成孔部7之製造方法。 在此，考量在模穴4內部設置突出之銷形狀，而在設 有該銷形狀之模穴4內部流進熔鐵並在形成有銷形狀之狀 態下從金屬模具裝置取出框體形狀之製造方法。 然而1在該製造方法中，在以窄小節距設有銷形狀時 ，熔鐵爲例如鎂金屬時，則在該期間熔鐵之流動性惡化， 有時候熔鐵不會進入銷形狀之間之部分，而有形成未塡充 之虞。 又’在採用鎂金屬所構成之框體時，爲了電子機器用 框體1之薄型化，在該框體形狀之窄小節距之衝孔加工時 經濟部智慧財產局員工消費合作社印製 有產生撕裂之現象缺點。在產生該撕裂時，因作爲製品之 外觀上成爲問題’又，爲了實行除去該撕裂之過程等需費 工夫。 (發明之槪要） 本發明係依據上述之事項而創作者，其目的係在於提 本紙張尺度適用中國囤家標準（CNS)A4規柊（210 x 297公餐） ----- A7 450020 B7____ 五、發明說明（3 ) 供一種具有外觀形狀良好，且以低成本可快速實行窄小節 距之孔形狀之加工之框體的電子機器及電子機器之製造方 法，金屬模具裝置者。 一種較佳之實施例，本發明之金屬模具裝置係， 屬於爲了形成具有所定節距之孔部之框體具有從上模 或下模突出所設置之銷構件的金屬模具裝置，其特徵爲： 在與該銷構件之突出端部相對向之上模或下模之任一 模形成有凹陷部，使上述銷構件可形成比框體之厚度較長 地突出形成，同時在該銷構件所設置之位置設有上述銷構 件之突出端部隔著所定間隙之流入旁路。 又，本發明之電子機器之製造方法， 使用申請專利範圍第1項所述之金屬模具裝置成形具 有所定節距之孔部之電子機器之框體的電子機器之製造方 法，其特徵爲具備： 在上述流入旁路流動熔鐵，而在整體金屬模具裝置內 部普及熔鐵的流動製程，及 在上述流動製程固化被導入於金屬模具裝置內部之熔 鐵以形成金屬模具成形品的固化製程，及 機器加工對應於介經上述固化製程所形成之金屬模具 成形品之上述凹陷部的隆起部分並將該隆起部分之高度與 其他部分整齊以形成貫穿之孔部的加工製程。 又，本發明之電子機器係， 具有所定節距之孔部所形成之框體的電子機器，其特 徵爲： - I------I-- I I----I — — —-- ί請先閱讀背面之沒意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中囤國家標準（CNS)A4規格（210x297公釐） 經濟部智慧財產局員工消費合作社印製 ，4 5 〇 0 2 〇 A7 一 B7 五、發明說明（4 ) 在上述孔部之周邊，起初設有隆起部分而在該隆起部 分形成有比上述框體之厚度較深之孔形狀1將該隆起部分 介經機器加工成爲與隆起部分以外之框體相同平面，而具 有存在於貫穿之孔部周邊之機器加工面者。 (實施發明所用之最佳形態） 以下，依據第2圖至第8圖說明本發明之之一實施形 態。 第2圖係表示筆記型個人電腦等的攜帶型電腦1〇之 形狀的外觀圖。在該圖中，攜帶型電腦1 〇係具備：電腦 本體11 ，及轉動自如地支撑於該電腦本體11的顯示單 元1 2。又，電腦本體1 1係具備框體1 3，而該框體 1 3係介經例如螺絲等適當地接合下部框體1 4與上部框 體1 5的構成。然而，下部框體1 4與上部框體1 5所接 合之構成係並不被限定於此者，藉由其他之構成來接合也 可以。 在以下之說明，將適用於攜帶型電腦1 0等之電子機 器之框體說用作爲電子機器用框體2 0。 將鎂合金等作爲材質的輕金屬所製之個人電腦等之電 子機器用框體2 0係如第5圖所示，爲了發揮個人電腦內 部之冷卻功能’或是爲了具有作爲向外部出聲音之擴音器 之功能而成爲需要以窄小節距有多數孔部2 1。爲了提供 此種電子機器用框體2 0，使用圖示於第3圖的金屬模具 裝置3 0。 本紙張K度適用中國國家標準（CNS)A4規格（210 X 297公复） — — — — —-------------—I— ^ '—IP — — — — (請先«讀背面之注音？Ϋ項再填寫本頁) 4 50 0 2 0 A7 B7 經濟部智慧財-1局員工消費合作杜印製 五、發明說明（？) 金屬模具裝置3 0係具有上模3 1與下模3 2。藉由 此等之嚙合形成有金屬模具裝置3 0。在該金屬模具裝置 3 0，設有熔鐵之導入口之豎澆道3 3，及引導熔鐵導入 至金屬模具內部，並引導該熔鐵之均勻擴散的橫流道3 4 。藉由橫流道3 4被引導之熔鐵，係被引導至金屬模具裝 置30之模穴35。 又，熔鐵係鎂合金之熔鐵，其他也可考量適用例如鋁 合金之溶鐵。 在該模穴3 5，爲了在上述電子機器用框體2 0形成 孔部2 1 ，於對應於該金屬模具裝置3 0之孔部2 1的部 分設有銷構件3 6。銷構件3 6係設於上模3 1 ，具有比 該電子機器用框體2 0之厚度稍突出之長度。 在與設有該銷構件3 6的上模3 1之部分相對向的下 模3 2，設有圖示於第4圖之流入旁路部3 7。該流入旁 路部3 7係設於比模穴3 5之其他部分更凹陷部分所設置 的凹陷部3 8。該凹陷部3 8之深度，係構成銷構件3 6 之突出端部與流入旁路3 7之底面之間具有與模穴3 5之 其他部分相同程度之間隔。 在上述模穴3 5之另一端形成有通氣孔3 9。該通氣 孔3 9係將存於金屬模具裝置3 0內部的空氣從金屬模具 裝置3 0向外部逃逸者，又，通氣孔3 9係又連通於澆池 4 0。由此，導入至金屬模具裝置3 0內部之熔鐵，係成 爲在模穴3 5內部一面防止產生空隙一面到達澆池4 0之 構成。 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐） • Ο - ----------- I # ---III--^ « - I - I--II <諝先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度.適用t國國家標準（CNS)A·!規格（210 X 297公釐） 450020 A7 _B7_ 五、發明說明ί6 ) 以下說明使用如上所構成之金屬模具裝置3 0來製造 電子機器用框體2 0之製造方法。又，在第6圖表示製造 方法之流程圖。 欲注射塑製成形輕金屬製電子機器用框體2 0時，對 於熔融之鎂合金負載例如約2 5 0噸之壓力。介經該壓力 之負載，熔鐵被導入在金屬模具裝置3 0內部之模穴3 5 ，惟在金屬模具裝置3 0內部，銷構件3 6以該熔鐵之導 入性不會成爲良好之間隔的節距（以下，稱此爲窄小節距 )被設置，又，由於熔融之鎂合金係流動性並不良好（亦 即，熔鐵接觸在熔鐵所接觸之上模3 1及下模3 2之內壁 面時，由於從該部分冷卻而被固化，故流動性不會變好） ，因此在設於窄小節距的各該銷構件3 6之間，流動性會 惡化。隨著此，產生未塡充部分，該部分成爲空隙因而產 生成形不良之原因。 爲了防止該成形不良之產生，在於下模3 2之凹陷部 3 8之流入旁路部3 7流動溶鐵，而將熔鐵先流動在該部 分之後’從該流入旁路部3 7將熔鐵流動至銷構件3 6之 間的部分（流動製程）。 由此，藉由從模穴3 5之一端向另一端的熔鐵之流動 ，產生熔鐵流進各該銷構件3 6之間的位置的一般之熔鐵 流動’以及在熔鐵容易流動之流入旁路部3 7產生比一般 者快速之熔鐵流動。如此，在從該流入旁路部3 7至位於 上方側的銷構件3 6之間產生流進熔鐵之流動。亦即，熔 鐵流進銷構件3 6之間的部分，結果，其大部分爲從流入 -9 ‘ — -----—— — — — — — — ^ · I I--— I—訂·！1!1·線 (請先閱讀背面之注意事項再填寫本頁) 450020 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明說明（7 ) 旁路部3 7向上方所實行，由此，熔鐵進入各該銷構件 3 6之間的位置成爲容易。 之後，熔鐵在模穴3 5內部固化而形成圖示於第7圖 的金屬模具成形品41(固化製程），惟在該金屬模具成 形品41 ，具有對應於上述凹陷部38所設置的隆起部分 4 2。 又，如第8圖所示，在該隆起部分4 2，對應於銷構 件3 6所設置的孔形狀4 3，形成比電子機器用框體2 0 之厚度較深。亦即，孔形狀4 3之下端側設成比電子機器 用框體20之厚更突出者。 例如藉由鐵床等實行切削加工（其他機械加工也可以 )，將該除去部分的隆起部分4 2成爲與金屬模具成形品 4 1之其他部分相同平面，孔部2 1設成貫穿於電子機器 用框體2 0之狀態（加工製程）。 又，介經實行該切削加工，在除去孔部2 1之周邊的 隆起部分4 2之部分形成有切削加工面（機械加工面） 4 4。 依照此種構成的金屬模具裝置3 0，電子機器用框體 2 0及其製造方法，在上述金屬模具裝置3 0設有銷構件 3 6，該銷構件3 6之突出長度形成比上述電子機器用框 體2 0之厚度更深，由在金屬模具裝置3 0形成有Μ陷部 3 8使該銷構件3 6之突出端部與凹陷部3 8之間的部分 成爲流入旁路部3 7，因此，從該流入旁路部3 7將熔鐵 流進銷構件3 6之間的部分，成爲可防止產生未塡充部分 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -----I-----裝·— —— — — — — 訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印制私 45002 0 A7 __ B7 五、發明說明（8 ) 0 由此，即使以窄小節距設置銷構件3 6時，也可將熔 鐵良好地流進該中間之部分。 又，藉由上述金屬模具裝置3 0，隆起部分4 2形成 在金屬模具成形品4 1 ，而藉由切削加工除去該隆起部分 4 2，孔部2 1形成在電子機器用框體2 0之構成，故， 與使用壓製加工或鑽孔等穿設加工窄小節距之孔部2 1時 相比較，可減低加工裝置所需之費用，又也可得到縮短加 工時間。 又’可抑制實行穿設加工或壓製加工時所產生的孔部 2 1之開口周圍部產生的撕裂之發生，成爲可將電子機器 用框體2 0之外觀形狀成爲良好》 又’形成將鎂合金作爲其材質的電子機器用框體2 0 ’可提供一種具有剛性高，薄型化也具有充分強度的電子 機器用框體2 0。 以上’說明本發明之一實施形態，惟本發明係在此以 外也可形成各種變形。以下說明該各種變形形態。 在上述實施形態’係說明具有窄小節距之孔部2 1的 電子機器用框體2 0，惟本發明係並不被限定於此種，也 可在其他零件等也適用本發明。 又’並不需要整體孔部2 1爲窄小節距，而是在具有 一部分爲窄小節距等各種節距之構成也適用本發明。 其他，在不變更本發明之要旨的範圍內，可形成各種 變形。 本紙張尺度適用中因國家標準（CNS)A4規格（210x297公餐） -----— —— — — — — — * I I I I--—訂-------- (請先閱讀背面之注意事項再填寫本頁) 4 5 0 0 2 〇 A7 __B7 五、發明說明（9 ) (圖式之簡單說明） 第1圖係表示以往例之電子機器用框體之形狀的斜視 圖。 第2圖係表示作爲本發明之一實施形態的電子機器之 攜帶型電腦之構成的斜視圖。 第3圖係表示相同之金屬模具裝置之形狀的剖視圖。 第4圖係表示相同之金屬模具裝置的局部放大圖。 第5圖係表示相同之使用於電子機器之電子機器用框 體之形狀的斜視圖。 第6圖係表示相同之電子機器之製造方法的流程圖。 第7圖係表示相同之金屬模具成形品之形狀的斜視圖 第8圖係表示相同之具有電子機器用框體的電子機器 之製造方法的剖視圖；A係表示切剖金屬模具成形品之隆 起部分之前的狀態的圖式；B係表示切剖金屬模具成形品 之隆起部分的狀態的圖式。 (記號之說明） 經濟部智慧財產局員工.消費合作社印製 -------------裝--------訂. (請先閱讀背面之注音？事項再填寫本頁) 1 0 :攜帶型電腦 1 1 :電腦本體 1 2 :顯不單兀 1 3 :框體 1 4 :下部框體 1 5 :上部框體 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 450020 _B7 五、發明說明C1。） 20:電子機器用框體 2 1 :孔部（突面部） 2 2 :突出部 2 4 :突面分離體 30:金屬模具裝置 3 1 :上模 3 2 :下模 3 3 :豎澆道 3 4 :橫流道 3 5 :模穴 3 6 :銷構件 3 7 :流入旁路部 3 8 :凹陷部 4 1 :金屬模具成形品 4 2 :隆起部分 4 3 :孔形狀 4 4 :切削加工面 <請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（2】0 X 297公釐）4 50 0 2 0 Economic Wisdom «! Property Cooperative Consumers' Cooperative Seal V. Description of the Invention (1) (Technical Field to Which the Invention belongs) The present invention relates to an electronic device having a light metal frame used for personal computers and the like , And a manufacturing method of the electronic machine, and a metal mold device for forming a frame body of the electronic machine. (Conventional technology) In the housings for electronic equipment made of light metals, recently, magnesium alloys have been mainly used as raw materials, and these alloys have been formed by die-casting or thixotropic methods. Although these forming methods are different in the structure of the device, as a condition, the alloys melted into 580 to 750 degrees are injection-molded into metal molds of about 1000 to 350 degrees. Shaped inside. FIG. 6 shows a configuration of a conventional housing 1 for an electronic device. When the frame 1 for an electronic device is formed, molten metal flows from the runner 2 (in this figure, the shape of the frame for an electronic device immediately after molding is shown. In the following description, each part of the mold device is also The part corresponding to the shape of the housing for an electronic device immediately after forming will be described ....), the molten metal is introduced into the desired metal mold through the cross flow channel 3. The introduced molten metal system spreads all the cavities 4 and reaches the vent hole 5, and the pouring hole 6 is connected to the vent hole 5. In this way, when molten metal is introduced from the vertical runner 2, air can escape to the outside through the vent hole 5, so that a void can be formed in a state where it does not exist inside the housing. In addition, in order to use the shape of the frame body 1 for an electronic device from the shape of the frame body immediately after forming in FIG. 6, the vertical runner 2, the cross runner 3, the air passage 5 or the pouring pond 6 are cut out to form Housing 1 for electronic equipment. H- 2 * ^ 1 ^ 1 ί ί 1 nt ϋ k ϋ (Please read the precautions on the back before filling out this page) -5: • Line. I: This paper size applies to China's standard (CN'S) A4 specifications ( 210 X 297 mm) -4-450 0 2 0 A7 _B7_ V. Description of the invention f) {Please read the precautions on the back before filling this page) After the molten metal is solidified in the cavity 4, remove the solidified frame The body shape is such that when the housing 1 for an electronic device is provided with a hole portion 7 for heat dissipation to the outside or as a loudspeaker, the hole portion 7 is formed at a predetermined pitch. Thus, as described above, the hole portion 7 having a narrow pitch is formed in the housing 1 for an electronic device. however. After the frame shape is formed inside the cavity 4, a punching process is performed in the cavity shape to form the hole portion 7 in order to carry out subsequent processing, which becomes a cause of higher cost. Therefore, a manufacturing method that can quickly form the hole portion 7 at no cost is desired. Here, it is considered that a protruding pin shape is provided inside the cavity 4, and molten iron flows into the cavity 4 provided with the pin shape, and the shape of the frame is taken out from the metal mold device in a state where the pin shape is formed. method. However, in this manufacturing method, when the pin shape is provided at a narrow pitch, and the molten iron is, for example, magnesium metal, the fluidity of the molten iron deteriorates during this period, and sometimes the molten iron does not enter between the pin shapes. In part, there is a risk that it will not be fully charged. In addition, when the frame made of magnesium metal is used, in order to reduce the thickness of the frame 1 for electronic equipment, it is produced during the punching processing of the narrow pitch of the frame shape by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economy The phenomenon of tearing has disadvantages. When such a tear occurs, it is a problem in appearance as a product ', and it takes time to implement the process of removing the tear. (Summary of the invention) The present invention was created based on the above-mentioned matters. The purpose of this invention is to apply the Chinese paper standard (CNS) A4 regulations (210 x 297 meals) to the paper size ----- A7 450020 B7____ V. Description of the invention (3) Provide an electronic machine and a method for manufacturing an electronic machine with a good appearance and shape, and a low-cost, low-pitched hole shape processing can be quickly performed, metal mold device. In a preferred embodiment, the metal mold device of the present invention belongs to a metal mold device for forming a frame body with a predetermined pitch hole portion and a pin member provided protruding from an upper mold or a lower mold, which is characterized in that: A recess is formed in any one of the upper die and the lower die opposite to the protruding end of the pin member, so that the pin member can be formed to protrude longer than the thickness of the frame body, and at the same time, the pin member is provided in the pin member. An inflow bypass is provided at a position where the protruding end of the pin member is positioned across a predetermined gap. In addition, the manufacturing method of the electronic device of the present invention uses the metal mold device described in item 1 of the scope of patent application to manufacture the electronic device with a frame of the electronic device having a predetermined pitch hole, and is characterized in that: The molten iron flowing in the bypass flow, and the molten iron flowing process is popularized in the overall metal mold device, and the molten iron introduced into the metal mold device is solidified in the above flowing process to form a mold molding product, and The machining process corresponds to a process of forming the raised portion of the recessed portion of the mold molded product formed through the curing process, and aligning the height of the raised portion with other portions to form a through hole portion. In addition, the electronic device of the present invention is an electronic device having a frame formed by holes with a predetermined pitch, and is characterized by:-I ------ I-- I I ---- I--- -ί Please read the unintentional matter on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed in the national standard (CNS) A4 specification (210x297 mm). Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by a consumer cooperative, 4 50002 A7-B7 V. Description of the invention (4) A bulge is initially provided around the above-mentioned hole portion, and a deeper hole is formed in the ridge portion than the thickness of the frame Shape 1 has the raised portion machined into the same plane as the frame body other than the raised portion, and has a machined surface existing around the hole portion that penetrates. (Best Mode for Carrying Out the Invention) An embodiment of the present invention will be described below with reference to Figs. 2 to 8. Fig. 2 is an external view showing the shape of a portable computer 10 such as a notebook personal computer. In the figure, the portable computer 10 includes a computer body 11 and a display unit 12 rotatably supported by the computer body 11. The computer body 11 is provided with a frame body 13 and the frame body 13 is a structure in which the lower frame body 14 and the upper frame body 15 are appropriately joined via, for example, screws. However, the structure to which the lower frame 14 and the upper frame 15 are joined is not limited to this, and other structures may be used for joining. In the following description, a housing of an electronic device suitable for a portable computer 10 or the like is used as a housing 20 for an electronic device. As shown in FIG. 5, a housing 20 for electronic equipment such as a personal computer made of a light metal made of magnesium alloy or the like is used for the purpose of exerting the cooling function inside the personal computer, or for the purpose of providing sound expansion to the outside The function of the microphone is required to have a large number of holes 21 at a narrow pitch. In order to provide such a housing 20 for an electronic device, a mold device 30 shown in Fig. 3 is used. The K degree of this paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 public copy) — — — — —-------------— I— ^ '—IP — — — — ( Please «read the phonetic on the back? Section before filling out this page) 4 50 0 2 0 A7 B7 Consumption cooperation by employees of the Smart Finance-1 Bureau of the Ministry of Economic Affairs 5. Printed description of the invention (?) Metal mold device 3 0 Die 3 1 and lower die 3 2. A metal mold device 30 is formed by these meshes. The metal mold device 30 is provided with a vertical runner 33 for introducing molten iron, and a cross flow channel 3 4 for guiding the introduction of the molten iron into the metal mold and guiding the molten iron to diffuse uniformly. The molten iron guided by the cross flow channels 34 is guided to the cavity 35 of the metal mold device 30. In addition, for molten iron of a molten iron-based magnesium alloy, for example, molten iron of an aluminum alloy can also be considered. In the cavity 35, a pin member 36 is provided at a portion corresponding to the hole portion 21 of the metal mold device 30 in order to form the hole portion 21 in the housing 20 for an electronic device. The pin member 36 is provided on the upper mold 3 1 and has a length slightly protruding from the thickness of the housing 20 for an electronic device. The lower die 3 2 facing the portion of the upper die 31 where the pin member 36 is provided is provided with an inflow bypass portion 37 shown in Fig. 4. The inflow bypass portion 37 is provided in a recessed portion 38 provided in a more recessed portion than the other portions of the mold cavity 35. The depth of the recessed portion 38 is such that the protruding end portion constituting the pin member 3 6 and the bottom surface of the inflow bypass 37 have the same distance as the other portions of the mold cavity 35. A vent hole 39 is formed at the other end of the cavity 35. The air vents 39 are used to escape the air stored in the metal mold device 30 from the metal mold device 30 to the outside, and the air vents 39 are connected to the pouring pool 40. Accordingly, the molten iron introduced into the mold device 30 has a structure in which a void is prevented from reaching the pouring pond 40 inside the cavity 35. This paper size applies to China National Standard (CNS) A4 (210x297 mm) • Ο------------ I # --- III-^ «-I-I--II <谞 Please read the notes on the back before filling this page.) Paper size printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Applicable to National Standard (CNS) A ·! Specifications (210 X 297 mm) 450020 A7 _B7_ V. Description of the invention 6) A method of manufacturing the housing 20 for an electronic device using the mold device 30 configured as described above will be described below. Fig. 6 shows a flowchart of the manufacturing method. When it is desired to injection-mold a light-metal frame 20 for electronic equipment, a load of, for example, about 250 tons is applied to the molten magnesium alloy. Through the load of this pressure, the molten iron is introduced into the cavity 3 5 inside the metal mold device 30, but inside the metal mold device 30, the pin member 36 does not become a good interval due to the introduction of the molten iron. The pitch (hereinafter, referred to as a narrow pitch) is set, and because the molten magnesium alloy system does not have good fluidity (that is, the molten iron contacts the upper die 3 1 and the lower die 3). When the inner wall surface of 2 is solidified by cooling from this part, the fluidity will not be improved). Therefore, the fluidity will be deteriorated between the pin members 36 provided at a narrow pitch. Along with this, an unfilled portion is generated, and this portion becomes a cause of voids and thus poor shape. In order to prevent the formation of poor molding, molten iron flows into the bypass portion 37 of the recessed portion 38 of the lower mold 32, and molten iron flows first after this portion. The iron flows to the portion between the pin members 36 (flow process). Thus, by the flow of molten iron from one end to the other end of the cavity 35, a general molten iron flow that flows into the position between the pin members 36 is generated, and that the molten iron flows easily. The inflow bypass portion 37 generates a faster molten iron flow than the ordinary one. In this way, a flow of molten iron flows between the inflow bypass portion 37 and the pin member 36 located on the upper side. That is, the molten iron flows into the portion between the pin members 36, and as a result, most of it flows from the inflow -9 '— -----—— — — — — — — ^ · I I-— I — Order! 1! 1 · Line (Please read the precautions on the back before filling out this page) 450020 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (7) The bypass section 3 7 is implemented upwards, thus It is easy for molten iron to enter the position between the respective pin members 36. After that, the molten iron is solidified inside the cavity 35 to form a metal mold molded product 41 (curing process) shown in FIG. 7. However, the metal mold molded product 41 has a ridge corresponding to the above-mentioned depression 38. Part 4 2. In addition, as shown in Fig. 8, the raised portion 42 is formed to have a thickness deeper than that of the housing 20 for an electronic device corresponding to the hole shape 43 provided in the pin member 36. That is, the lower end side of the hole shape 43 is provided to be more prominent than the thickness of the housing 20 for an electronic device. For example, cutting processing is performed by an iron bed or the like (other mechanical processing is also possible), the raised portion 42 of the removed portion is made into the same plane as the other portions of the molded product 41, and the hole portion 21 is provided to penetrate the electronic device. Use the state of the frame 20 (processing process). Further, a cutting surface (machined surface) 4 4 is formed in a portion excluding the raised portion 4 2 of the periphery of the hole portion 21 through this cutting process. According to the metal mold device 30 configured as described above, the electronic device housing 20 and the manufacturing method thereof, the metal mold device 30 is provided with a pin member 36, and the protruding length of the pin member 36 is longer than that of the electronic device. The thickness of the frame body 20 is deeper, and the M recessed portion 38 is formed in the mold device 30 so that a portion between the protruding end portion of the pin member 36 and the recessed portion 38 becomes the inflow bypass portion 37. Therefore, the molten iron flowing from the inflow bypass section 37 to the pin member 36 can be used to prevent the occurrence of unfilled parts. This paper is sized to the Chinese National Standard (CNS) A4 (210 X 297 mm). ) ----- I ----- installation · —— —— — — — — Order --------- line (Please read the notes on the back before filling this page) Intellectual Property Bureau of the Ministry of Economic Affairs Employee consumer cooperative printing private 45002 0 A7 __ B7 V. Description of the invention (8) 0 Therefore, even when the pin member 36 is set with a narrow pitch, molten iron can flow into the middle part well. In addition, by the above-mentioned metal mold device 30, the bulged portion 42 is formed in the metal mold molded product 41, and the bulged portion 42 is removed by cutting, and the hole portion 21 is formed in the electronic device housing 20. Because of the structure, compared with when punching holes 21 with a narrow pitch, such as pressing or drilling, the cost required for a processing device can be reduced, and the processing time can be shortened. It can also suppress the occurrence of tears around the openings of the hole portions 21 that are generated during the punching process or the pressing process, and can make the appearance and shape of the electronic device housing 20 good. The magnesium alloy as a material of the electronic device frame 20 ′ can provide the electronic device frame 20 having high rigidity and thinness and sufficient strength. As mentioned above, one embodiment of the present invention has been described, but the present invention can be modified in various ways in addition to this. The various modifications will be described below. In the above-mentioned embodiment ', the electronic device housing 20 having the narrow pitch holes 21 is described. However, the present invention is not limited to this, and the present invention can be applied to other parts and the like. It is not necessary that the entire hole portion 21 has a narrow pitch, but the present invention is also applicable to a structure having various pitches such as a portion having a narrow pitch. In addition, various modifications can be made without changing the gist of the present invention. The size of this paper is applicable due to the national standard (CNS) A4 specification (210x297 meals) -----—— —— — — — — — * III I --— Order -------- (Please read first Note on the back, please fill in this page again) 4 5 0 0 2 〇A7 __B7 V. Description of the invention (9) (Simplified description of the drawings) Figure 1 is a perspective view showing the shape of a conventional case for an electronic device. Fig. 2 is a perspective view showing the structure of a portable computer as an electronic device according to an embodiment of the present invention. Fig. 3 is a cross-sectional view showing the shape of the same metal mold device. Fig. 4 is a partially enlarged view showing the same metal mold device. Fig. 5 is a perspective view showing the shape of the same housing for an electronic device used in an electronic device. Fig. 6 is a flowchart showing a method of manufacturing the same electronic device. FIG. 7 is a perspective view showing the shape of the same mold product. FIG. 8 is a cross-sectional view showing the manufacturing method of the same electronic device having a frame for an electronic device. A diagram of a previous state; B is a diagram showing a state of a bulged portion of a mold molded product. (Explanation of the symbols) Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs. Printed by the Consumer Cooperatives. ------------- Installation -------- Order. (Please read the phonetic on the back? Matters before (Fill in this page) 1 0: Portable computer 1 1: Computer body 1 2: Display is not simple 1 3: Frame 1 4: Lower frame 1 5: Upper frame The paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) A7 450020 _B7 5. Description of the invention C1. ) 20: Frame for electronic equipment 2 1: Hole (protruded surface) 2 2: Protruded portion 2 4: Protruded surface separation body 30: Metal mold device 3 1: Upper mold 3 2: Lower mold 3 3: Vertical runner 3 4: Cross flow channel 3 5: Cavity 3 6: Pin member 3 7: Inflow bypass portion 3 8: Recessed portion 4 1: Molded product 4 2: Raised portion 4 3: Hole shape 4 4: Cutting surface < Please read the notes on the back before filling out this page) Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed in accordance with Chinese National Standard (CNS) A4 (2) 0 X 297 mm