CN1111457C - Electronic appts. method of mfg. same, and mold - Google Patents
Electronic appts. method of mfg. same, and mold Download PDFInfo
- Publication number
- CN1111457C CN1111457C CN99807585A CN99807585A CN1111457C CN 1111457 C CN1111457 C CN 1111457C CN 99807585 A CN99807585 A CN 99807585A CN 99807585 A CN99807585 A CN 99807585A CN 1111457 C CN1111457 C CN 1111457C
- Authority
- CN
- China
- Prior art keywords
- basket
- mentioned
- bump
- hole portion
- electronic equipments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/06—Permanent moulds for shaped castings
Abstract
Electronics each comprising an electronics cabinet (20) having a boss part (21) such as a portable computer (10), wherein a projected part (22) is formed on the cabinet at a place where the boss part (21) is provided and a boss separating body (24) in which a locking hole (27) is formed and which is installed on the projected part (22) so as to form the boss (21).
Description
The present invention relates to the electronic equipments with light metal system basket, this electronic equipments manufacture method of usefulness such as computer and the metal mould device that is used to form this electronic equipments basket.
With in the basket, mainly used magnesium alloy as raw material at light metal system electronic equipments recently, these alloys have been shaped by casting die or thixotropy method.No matter in these forming processes, device construction is different, but which kind of, all needs alloy reaction-injection moulding in 100～350 ℃ of metal patterns with 580～750 ℃ of fusings as its molding condition.
Here, the formation of existing electronic equipments with basket 1 has been shown among Fig. 1.When forming this electronic equipments with basket 1, the deposite metal flows into from cast gate 2 that (electronic equipments is with the shape of basket after shown in this figure the shaping, in the following description, the each several part of metal mould device also is to describe corresponding to the part of electronic equipments after this shaping with the basket shape), by runner 3 deposite metal is imported desired metal pattern inside.The deposite metal that imports is flow through whole inner chamber 4 and is arrived arbitrary exhaust outlet 5, also links cup 6 simultaneously on this exhaust outlet 5.Therefore, deposite metal one imports from cast gate 2, and air promptly is discharged to the outside by this exhaust outlet 5, thus, can not form under there is not the state in hole in basket inside.
Provide the shape of utilization for the basket shape after shaping shown in Figure 1 forms as electronic equipments with basket 1, next excise cast gate 2, runner 3, exhaust outlet 5 or cup 6 parts, constitute the shape of electronic equipments usefulness basket 1.
Take out with the basket shape of solidifying behind inner chamber 4 inside solidifications these deposite metals, at electronic equipments with on the basket 1, such as be provided as to outside heat release with or the situation of the hole portion 7 of the usefulness of raising one's voice under, spacing punching in accordance with regulations forms this hole portion 7.Thus, as mentioned above, promptly in the electronic equipments closely spaced hole of formation portion 7 on the basket 1.
But, after inner chamber 4 inner formation basket shapes, on cavity shape, carry out punching processing and form hole portion 7 one by one, for being processed into the reason of cost up after will carrying out.Therefore, wish to propose neither to increase cost, can form the manufacture method of hole portion 7 again as early as possible.
Here can consider such manufacture method: in inner chamber 4 inside outstanding pin shape is set, liquation is flowed into be provided with in the inner chamber 4 of this pin shape, forming under the pin shape state from metal mould device taking-up basket shape.
But in this manufacture method, be provided with in little spacing under the situation of pin shape, liquation is such as being under the situation of magnesium alloy, and the liquation flowability degenerates between pin, and at this moment probably liquation does not advance part between pin, and forms not pack portion.
Moreover, under the situation of the basket that adopts magnesium alloy to form,, the shortcoming that produces the squeeze crack phenomenon is arranged when carrying out perforation processing with little spacing for making electronic equipments basket attenuation.Producing under the squeeze crack phenomenon situation, products appearance is bad, and the operation of removing these squeeze cracks again is also very bothersome.
The present invention is based on promptly that above-mentioned situation makes, and its purpose is to provide has the good surface appearance shape and the electronic equipments of the basket that can low-cost carry out the processing of little spacing hole fast and the manufacture method and the metal mould device thereof of electronic equipments are arranged.
In a suitable embodiment; metal mould device of the present invention is the metal mould device of being equipped with the pin member for the basket that forms the hole portion with prescribed distance from patrix or counterdie; it is characterized in that; above-mentioned pin member is given prominence to be formed also longlyer than basket wall thickness; simultaneously leave the inflow bypass that there is specified gap the outstanding end of above-mentioned pin member establishing this pin member position setting, on the either party of the counterdie of giving prominence to the end facing to this pin member or patrix, form recess.
In addition, electronic equipments manufacture method of the present invention is that the metal mould device recorded and narrated with claim 1 is shaped the electronic equipments of hole portion with prescribed distance with the electronic equipments manufacture method of basket, it is characterized in that it has:
Make liquation flow through above-mentioned inflow bypass, make liquation flow through the flow process of whole metal mould device inside again,
Make the liquation curing that in above-mentioned flow process, imports metal mould device inside, the curing process that forms the metal pattern formed products,
The protrusion of the above-mentioned recess of the metal pattern formed products that the above-mentioned curing process of correspondence is formed carries out machining, the height of this bump and other parts are made even and form the manufacturing procedure of through hole portion.
Have, electronic equipments of the present invention is the electronic equipments with the basket that forms prescribed distance hole portion again, it is characterized in that,
Periphery in above-mentioned hole portion, initially establish bump, on this bump, form than the also dark hole shape of above-mentioned basket wall thickness, make the basket beyond itself and the bump become same plane by this bump being carried out machining, and the hole portion periphery formation machined surface that is running through.
Fig. 1 is the stereogram of the electronic equipments of expression conventional example with the basket shape; Fig. 2 is the stereogram of expression as the hand-held computer formation of the electronic equipments of one embodiment of the invention; Fig. 3 is the sectional drawing of the same metal mould device shape of expression; Fig. 4 is the partial enlarged drawing of same metal mould device; Fig. 5 is that expression is used for the stereogram of the electronic equipments of same electronic equipments with the basket shape; Fig. 6 is the flow chart of the same electronic equipments manufacture method of expression; Fig. 7 is the stereogram of the same metal pattern formed products shape of expression; Fig. 8 is same sectional drawing with electronic equipments with the electronic equipments manufacture method of basket, and Fig. 8 A has represented the state before the metal pattern formed products excision bump, and Fig. 8 B has represented the state behind the metal pattern formed products excision bump.
According to Fig. 2～8 the present invention's one example is described below.
Fig. 2 is the outside drawing of shape of the portable electronic computer 10 of expression laptop etc.In the figure, hand-held computer 10 has computer body 11 and the display 12 that is supported on this computer body 11 free to rotate.Computer body 11 has basket 13, and this basket 13 is made of such as suitably being joined together with screw etc. bottom basket 14 and top basket 15.Bottom basket 14 is not limited thereto with engaging also of top basket 15, also can constitute joint by other.
In the following description, the basket that is applicable to the electronic equipments of hand-held computer 10 grades is illustrated with basket 20 as electronic equipments.
The electronic equipments such as light metal system computer that with magnesium alloy etc. are material are with basket 20, as shown in Figure 5, for playing the effect of cooling computer inside, perhaps for playing the effect that spreads out of the loudspeaker of sound to the outside, must be in the above form many holes portion 21 with little spacing.For such electronic equipments basket 20 is provided, used metal mould device shown in Figure 3 30.
Here liquation is the magnesium alloy liquation, and other are suitable for too as molten aluminium alloy.
In this inner chamber 35, be at above-mentioned electronic equipments with forming hole portion 21 on the basket 20, and be provided with pin member 36 in part corresponding to the hole portion 21 of this metal mould device 30.Pin member 36 has than this electronic equipments to be located on the patrix 31 with the also outstanding slightly length of the wall thickness of basket 20.
On the counterdie 32 of the part that faces toward the patrix 31 that is provided with pin member 36, be provided with inflow by-pass portion 37 shown in Figure 4.This inflow by-pass portion is located at recess 38, and this recess 38 is provided with all lowlyer than inner chamber 35 other parts.The degree of depth of this recess 38 forms: the spacing between the outstanding end of pin member 36 and inflow by-pass portion 37 bottom surfaces is identical with the spacing of inner chamber 35 other parts.
At the other end of above-mentioned inner chamber 35, formed exhaust outlet 39.This exhaust outlet 39 is used to make the air that is present in metal mould device 30 inside to escape into the outside from metal pattern 30, and in addition, this exhaust outlet 39 also is communicated with cup 40.Thus, import the liquation of metal mould device 30 inside, guarantee not produce the hole on the one hand, with advancing to guarantee to arrive cup 40 in inner chamber 35 inside.
Be described as follows with the manufacture method of basket 20 about make electronic equipments with the metal mould device 30 of above-mentioned formation.And the flow chart of this manufacture method has been shown among Fig. 6.
With injection molding shaping light metal system electronic equipments with under the situation of basket 20, to the magnesium alloy of fusing such as the load that applies about 250t.By this pressure load, liquation is imported in the inner chamber 35 of metal mould device 30 inside, yet, be provided with pin member 36 owing to import the spacing that property degenerates (below be called little spacing) at inner so that this liquation of metal mould device 30, because the magnesium alloy flowability of fusing degenerates (promptly, the patrix 31 that liquation will contact contacts liquation with the internal face one of counterdie 32, and this part turns cold and solidifies and flowability is degenerated), flowability degenerates between member 36 so each that makes little spacing setting sold.Produce not pack portion, this part produces the hole thereupon, and this often is to form bad structural reason.
For preventing to produce this shaping unfavorable condition, liquation is flowed in be located at the inflow by-pass portion 37 of counterdie 32 recesses 38, liquation is circulated in after this part, make liquation flow in part (flow process) between the pin member 36 from this inflow by-pass portion 37 again.
Thus, by liquation from inner chamber 35 1 ends to the flowing of the other end, when common liquation that liquation enters 36 of each pin members flows, in the inflow by-pass portion 37 that liquation flows easily, produced than above-mentioned and flowed faster that liquation flows.Therefore, produced and enter the liquation that is positioned at 36 of upper side pin members from this inflow by-pass portion 37 and flow.That is, liquation enters 36 of pin members, and consequently its major part flows to the top from flowing into by-pass portion 37, and thus, liquation enters each 36 of member of pin and becomes than being easier to.
Then, liquation forms metal pattern formed products 41 (curing process) shown in Figure 7 at inner chamber 35 inside solidifications, has the bump 42 that is provided with corresponding to above-mentioned recess 38 on this metal pattern formed products.
As shown in Figure 8, on this bump 42,, form also deeplyer with the wall thickness of basket 20 than electronic equipments corresponding to the hole shape 43 that pin member 36 is established.That is, the lower end side of hole shape 43 is designed to highlight from the wall thickness of electronic equipments with basket 20 again.
Again, become same plane for making as this bump 42 that will remove part and other parts of metal pattern formed products 41, such as carry out machining (other machinings also can) with milling machine, hole portion 21 is that relative electronic equipments runs through state for 20 one-tenth with basket.
Owing to carried out this machining, promptly on the part of removing hole portion 21 circumferential ridges parts 42, formed machining face (machined surface) 44.
The metal mould device 30 that as complying with, constitutes, electronic equipments basket 20 and its manufacture method, because pin member 36 is set in above-mentioned metal mould device, the outstanding length of this pin member 36 forms also deeplyer with the wall thickness of basket 20 than above-mentioned electronic equipments, form recess 38 in the metal mould device 30, outstanding end and 38 parts of recess at this pin member 36 form inflow by-pass portion 37, so liquation can flow into by-pass portion 37 from this and enter 36 parts of pin member, can prevent to produce not pack portion.
Thus, even be provided with little spacing under the situation of pin member 36, liquation also can enter part between the pin member well.
In addition, owing on metal pattern formed products 41, form bump 42 by above-mentioned metal mould device 30, with methods such as machining this bump 42 is removed, in electronic equipments formation hole portion 21 on the basket 20, therefore, compare with the situation that wears little spacing hole portion 21 with processing such as pressure processing or borings, on required processing unit (plant), can reduce cost, can shorten process time simultaneously.
In addition, this method can avoid occurring in the squeeze crack phenomenon of the around openings portion generation that wears the hole portion 21 that forms under processing or the pressure processing situation, thereby can guarantee that electronic equipments is good with the face shaping of basket 20.
Because with the magnesium alloy is that material is made electronic equipments basket 20, the rigidity height is even wall comparison Bao Yeke provides the basket 20 of the electronic equipments with sufficient intensity.
One embodiment of the invention more than has been described, the present invention at this embodiment and outside can do all distortion, be described as follows at this point.
In the above-described embodiments, narrated the electronic equipments basket 20 with little spacing hole portion 21, but the invention is not restricted to this, the present invention is also applicable to other parts.
In addition, also all hole portion 21 all is little spacing, and the present invention is applicable to that also a part is little spacing, can have the formation of various spacings.
Other in the scope that does not change aim of the present invention, can do all distortion.
Claims (5)
1. a metal mould device in order to form the basket with prescribed distance hole portion, is equipped with the pin member on patrix or counterdie; It is characterized in that,
The comparable basket wall thickness of above-mentioned pin member is more outstanding to be formed; be in the position that is provided with this pin member simultaneously; setting has the inflow bypass of specified gap from the outstanding end of above-mentioned pin member, and is forming recess facing to the counterdie of the outstanding end of this pin member or the either party of patrix.
2. the electronic equipments manufacture method of the electronic equipments basket with prescribed distance hole portion that is shaped with the described metal mould device of claim 1 is characterized in that it has:
Make liquation flow through above-mentioned inflow bypass, and make liquation flow through the flow process of whole metal mould device inside,
The liquation that imports metal mould device inside in the above-mentioned flow process is solidified, and forms the curing process of metal pattern formed products,
The bump of the above-mentioned recess of the metal pattern formed products that will form corresponding to above-mentioned curing process carries out machining, the height of this bump and other parts are made even and forms the manufacturing procedure of through hole portion.
3. electronic equipments has the basket of the hole portion that is formed with prescribed distance, it is characterized in that,
At above-mentioned hole portion periphery, originally establish bump, form than the also dark hole shape of above-mentioned basket wall thickness at this bump, make it become same plane, form machined surface at hole portion periphery thus with bump part in addition by this bump being carried out machining.
4. electronic equipments has the basket of the hole portion that has formed prescribed distance, it is characterized in that,
At above-mentioned hole portion periphery, originally establish bump, form than the also dark hole shape of above-mentioned basket wall thickness at this bump, remove this bump by machining, form the above-mentioned hole portion of running through with this.
5. electronic equipments as claimed in claim 3 is characterized in that, the material of above-mentioned basket is a magnesium alloy.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP173019/1998 | 1998-06-19 | ||
| JP10173019A JP2000005846A (en) | 1998-06-19 | 1998-06-19 | Electric equipment and manufacture of electric equipment, and method, mold device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1306464A CN1306464A (en) | 2001-08-01 |
| CN1111457C true CN1111457C (en) | 2003-06-18 |
Family
ID=15952709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99807585A Expired - Fee Related CN1111457C (en) | 1998-06-19 | 1999-04-02 | Electronic appts. method of mfg. same, and mold |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20010001979A1 (en) |
| JP (1) | JP2000005846A (en) |
| CN (1) | CN1111457C (en) |
| TW (1) | TW450020B (en) |
| WO (1) | WO1999065631A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040150947A1 (en) * | 2003-01-31 | 2004-08-05 | Tang Kenneth K. | Technique for controlling rotational vibration related to a drive module |
| JP4643689B2 (en) * | 2008-07-24 | 2011-03-02 | 株式会社東芝 | Mold, molded product and method for producing molded product |
| JP5396952B2 (en) * | 2009-03-19 | 2014-01-22 | 富士通株式会社 | Housing and housing manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2735794B2 (en) * | 1994-09-26 | 1998-04-02 | 廣川 弘治 | Mold, mold manufacturing method, and casting method using mold |
| JP3021296B2 (en) * | 1994-09-13 | 2000-03-15 | 株式会社デンソー | Box for electronic device, method of manufacturing the same, and method of using the same |
-
1998
- 1998-06-19 JP JP10173019A patent/JP2000005846A/en active Pending
-
1999
- 1999-03-09 TW TW088103620A patent/TW450020B/en not_active IP Right Cessation
- 1999-04-02 WO PCT/JP1999/001762 patent/WO1999065631A1/en active Application Filing
- 1999-04-02 CN CN99807585A patent/CN1111457C/en not_active Expired - Fee Related
-
2000
- 2000-12-18 US US09/737,870 patent/US20010001979A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1306464A (en) | 2001-08-01 |
| US20010001979A1 (en) | 2001-05-31 |
| JP2000005846A (en) | 2000-01-11 |
| WO1999065631A1 (en) | 1999-12-23 |
| TW450020B (en) | 2001-08-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030618 Termination date: 20100402 |