540301 .、 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明< ) 【發明所屬之技術領域】 本發明係關於電腦等輕金屬製之電子機器用框體的構 造以及製造此電子機器用框_體之製造方法、金屬模裝置。 【習知技術】 對於輕金屬製電子機器用框體，最近主要是採用鎂合 金，這些合金係藉由壓鑄法或振動液化法來成形。這些成 形法，其裝置構造相異。但是，這些成形法的成形條件， 皆是將5 8 0度〜7 5 0度之熔融合金，射入大約爲 1 0 0度〜3 5 0度之金屬模的內部。 在此，將習知的電子機器用框體3 0之構造顯示於第 6圖。在此電子機器用框體中，從金屬模裝置1之做爲金 屬熔液的導入部分之豎澆道2導入金屬熔液（在此圖中， 以對應此剛成形後之電子機器用框體之形狀的部分來加以 說明。），通過橫流道3將金屬熔液導入所要的金屬模內 部。導入後的金屬熔液，行經模腔4全體，而到達透氣孔 5。在此，透氣孔5更與澆口杯6連結。因此，若金屬熔 液從豎澆道2被導入，則可以使空氣通過此透氣孔5而逃 至外部。藉由此手段，可以形成在框體內部沒有孔隙存在 的狀態。 _ 在此，在此電子機器用框體中，爲了將熱釋放至外部 、或是將聲音擴散至外部而發揮出喇叭的機能，以一定的 間隔配置多數個孔部7。 在此情況下，爲了使孔部7之間隔分別保持相同，如 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） — — — — — — — — — — — - — — — III— > — — — — — — (請先閱讀背面之注意事項再填寫本頁) 540301 經濟部智慧財產局員工消費合作社印製 A7 __B7___ 五、發明說明ί ) 第6圖和第7圖所示，一般而言係將孔部7配置成格子狀 〇 爲了以如此的配置來形.成孔部7，習知係對由金屬模 裝置1所成形之金屬成形品進行沖孔加工來形成。或是， 如第7圖所示，預先在金屬模裝置1之模腔4內部，配置 突出形成格子狀之銷構件8，然後將金屬熔液導入此模腔 4內部，使其在模腔4內部凝固。藉由此手段，形成如此 格子狀配置的孔部7。 - 但是’上述孔部7 ’爲了防止異物進入框體內部，一 般係設置成狹小的節距（pitch)。因此，從金屬模裝置1內 部取出上述金屬成形品之後，以狹小的節距進行多數個孔 數之沖孔後加工，而需要花費時間以及成本。 因此，雖然預先在金屬模裝置1內部設置以狹小節距 排列配置的銷構件8，但是，當被導入金屬模內部之金屬 熔液接觸模腔4的內壁面時，由於會快速地冷卻，特別是 設置多數個隔開狹小節距之銷構件8時，金屬熔液的流動 性無法良好。 亦即，如第2圖的箭頭所示，金屬熔液筆直地通過銷 構件8列之間，而在該處凝固，而會有金屬熔液沒有塡入 構成這些列之各個銷構件8之間印間隙9內。 因此，金屬熔液沒有塡入銷構件8之間的部分，形成 未充塡之處，因此會發生沒有形成規定配置之孔部7而發 生大範圍未充塡處等不良情況。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） — — — — — — — — — — — i i I I β — — — — (請先閱讀背面之注意事項再填寫本頁) -5- 540301 A7 B7 五、發明說明ί ) 【發明之揭示】 (請先閲讀背面之注意事項再填寫本頁) 本發明係爲了解決上述課題而發明出來，其目的爲提 供一種其內部具有設置成可以使金屬熔液的流動性良好之 銷構件之配置的金屬模裝置、以及利用此銷構件之配置的 電子機器之製造方法。 對於一個理想的實施型態，本發明的金屬模裝置，係 針對爲了形成由具有隔開規定節距之孔部的金屬材料所構 成之電子機器用框體，而具有從第1的模或第2的模突出 設置之銷構件的金屬模裝置，其特徵爲： 上述銷構件，其連結最接近而相鄰之銷構件的中心線 ，沒有配置成與將金屬熔液導入金屬模裝置之模腔內部的 方向垂直。 爭 經濟部智慧財產局員工消費合作社印製 又，本發明之電子機器之製造方法，係針對使用金屬 模裝置來形成由具有隔開規定節距之孔部的金屬材料所構 成之電子機器用框體的電子機器之製造方法，其特徵爲： 具備使金屬熔液擴散在上述金屬模裝置內部之流動過 程；以及在上述流動過程中，使被導入金屬模裝置內部之 金屬熔液凝固來形成框體之凝固過程；而且， 上述金屬模裝置係前述的金屬模裝置。 .【本發明之實施形態】 以下，根據第3圖〜第8圖來說明本發明之一實施形 態。 第3圖係表示筆記型電腦等的手提式電腦10之形狀 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 540301 A7 B7 五、發明說明4() 的外觀圖。在此圖中，手提式電腦10，具備：電腦本體 1 1、以及轉動自如地被支持在電腦本體1 1上的顯示組 件1 2。又，電腦本體1 1具有框體1 3 ;此框體1 3係 例如藉由螺絲等，將下部框體1 4和上部框體1 5適當地 接合在一起所構成。但是，下部框體1 4和上部框體1 5 的接合構造不限於此，以可以藉由其他構造來接合。 在此，在以下的說明中，以電子機器用框體20，做 爲適用於手提式電腦1 0等的電子機器之框體，來加以說 明。再者，以下的說明，係根據第4圖〜第8圖。 例如，以鎂合金爲材料所形成之輕金屬製之電腦等的 電子機器用框體2 0，以狹小的間隔形成多數個孔部2 1 。此孔部2 1的外觀形狀，發.揮出冷卻電腦內部之機能、 或是將聲音擴散至外部而發揮出喇叭的機能。 此種多數個孔部2 1，係將金屬熔液導入金屬模裝置 3 0的內部所形成。 •第7圖所示的金屬模裝置3 0,係具有最爲第1的模 之上模3 1、以及做爲第2的模之下模3 2 ;藉由上模 3 1和下模32的嚙合，形成金屬模裝置3 0。在此金屬 模裝置3 0中，設置做爲金屬熔液之導入口的豎澆道3 3 ;以及將金屬熔液導引至金屬模裝置3 0的內部，導引金 屬熔液使其均勻擴散之橫流道3 4。由橫流道3 4所導引 的金屬熔液，被導引至金屬模裝置3 0之模腔3 5內。 再者，金屬熔液雖然爲鎂合金的熔液，除此以外，也 可以應用銘合金的金屬熔液。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公茇） (請先閲讀背面之注意事項再填寫本頁) -裝·丨丨丨It丨·訂·！ — 經濟部智慧財產局員工消費合作社印製 540301 A7 B7 五、發明說明< ) (請先閲讀背面之注意事項再填寫本頁) 在模腔3 5的內部，爲了在上述電子機器用框體2 0 上成孔部2 1，在對應此電子機器用框體2 0之孔部2 1 的部分，設置銷構件3 6。舞構件3 6，在上述金屬模裝 置3 0之模腔3 5的內部，其配置相對於習知的格子狀排 列，作成以下般的排列。 如第4圖所示，銷構件3 6的排列，若以排列成格子 狀時之相鄰的銷構件3 6的間隔爲a，則對於本發明之銷 構件3 6的排列，與相鄰之兩個銷構件3 6之金屬熔液的 流動成直角之列之中，相對於一方的銷構件3 6的列，另 一方的銷構件3 6的列設置成僅錯開半個節距（P1tch)。 因此，相鄰的銷構件3 6之間的間隔，如第4圖所示 ，習知爲a ，若根據三平方的定理來算出，變化成b( = 5/2)。根據此方法，相鄰的銷構件3 6之間的間隔， 與配置成格子狀的銷構件3 6之情況比較，可以作成擴展 狀態。 經濟部智慧財產局員工消費合作社印製 隨著此擴展狀態，可以流過此銷構件3 6之間的金屬 熔液流量，與習知的格子狀配置相比，能夠增大流量；亦 郎，可以使金屬熔液容易流動。 再者，在此情況下，係將上述銷構件3 6分別配置成 隔開大約半個節距，金屬熔液的薄動沒有絲毫變化。因此 .，金屬熔液可以穿過擴展開之銷構件3 6之間。 藉由將銷構件3 6做如此的配置，上述銷構件3 6設 置成成爲交錯狀的配置。 但是，銷構件3 6的配置，也不限於此種配置。亦即 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 540301 ’、 A7 B7 五、發明說明d:) ，如第5圖所示，相鄰的2列銷構件3 6 (此情況之列， 與金屬熔液的流動方向平行）之中，也可以使一方的銷構 件3 6的列，相對於另一方的銷構件3 6的列，僅錯開半 個節距。 即使在此情況下，相鄰的銷構件3 6之間的間隔，如 第5圖所示，從習知的a變化成b ( = a*，5/2)。因此，相鄰 的銷構件3 6之間的間隔，比配置成格子狀的銷構件3 6 之情況增大，而可以使金屬熔液容易流動。 - 又，不僅可以將上述銷構件3 6隔開半個節距而配置 成交錯狀，交錯狀的配置也不限於此，而有各種情況。亦 即，不配置成基本配置之格子狀，而配置成長方形，利用 從棊本配置分別將銷構件3 6往縱方向或橫方向錯開半個 節距，可以構成具有與第4圖相異之角度而構成交錯狀（ 在第6圖中，將基本的長方形往縱方向錯開半個節距的結 果，交錯狀配置之銷構件3 6，設置成傾斜一定角度的格 子狀。）。 在此情形下，最靠近相鄰之銷構件3 6爲1號和4號 、2號和4號、4號和6號...等。此情形，由於配置 成交錯狀，所以可以使金屬熔液遍及兩者之間的間隙部 3 7° . 在此情形下，銷構件3 6的配置，相對於金屬熔液之 流動方向，其連結最靠近相鄰之2個銷構件3 6的中心線 ，沒有垂直，而成爲以一定角度傾斜交叉的狀態。藉由此 手段，與相鄰之銷構件3 6之間的連線配置成垂直於流動540301. Printed by A7 B7, Consumer Cooperative of Employees of Intellectual Property Bureau, Ministry of Economic Affairs. 5. Description of the invention < A method for manufacturing a frame body and a mold device. [Known Technology] Recently, magnesium alloys have been mainly used for housings of electronic equipment made of light metals. These alloys are formed by die casting or vibration liquefaction. These forming methods have different device structures. However, the forming conditions of these forming methods are that a molten alloy of 580 degrees to 750 degrees is injected into the inside of a mold having a temperature of about 100 degrees to 350 degrees. Here, the structure of the conventional electronic device housing 30 is shown in FIG. In the frame for an electronic device, the molten metal is introduced from the vertical runner 2 serving as the introduction portion for the metal melt in the mold device 1 (in this figure, it corresponds to the frame for the electronic device immediately after molding) The shape of the part will be explained.), The molten metal is introduced into the desired mold through the cross-flow channel 3. The introduced molten metal passes through the entire cavity 4 and reaches the vent hole 5. Here, the vent hole 5 is further connected to the gate cup 6. Therefore, if a molten metal is introduced from the vertical runner 2, air can escape through the vent hole 5 to the outside. By this means, it is possible to form a state in which no pores exist inside the frame. _ Here, in this housing for an electronic device, in order to release heat to the outside or diffuse sound to the outside to exert the function of a speaker, a plurality of holes 7 are arranged at regular intervals. In this case, in order to keep the intervals of the holes 7 respectively the same, if this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) — — — — — — — — — — — — — — — III— > — — — — — — (Please read the notes on the back before filling in this page) 540301 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 __B7___ V. Description of the invention ί) Figures 6 and 7 As shown, in general, the hole portions 7 are arranged in a grid shape. In order to form such a configuration. The hole portions 7 are conventionally formed by punching a metal molded product formed by the mold device 1. . Alternatively, as shown in FIG. 7, a pin member 8 protruding to form a grid shape is arranged in the cavity 4 of the metal mold device 1 in advance, and then the molten metal is introduced into the cavity 4 to be in the cavity 4. Internal solidification. By this means, the holes 7 arranged in a grid pattern are formed in this manner. -However, the above-mentioned hole portion 7 is generally provided with a narrow pitch to prevent foreign matter from entering the inside of the housing. Therefore, after taking out the above-mentioned metal molded product from the inside of the mold device 1, punching and processing of a plurality of holes with a narrow pitch are required, which requires time and cost. Therefore, although the pin members 8 arranged in a narrow pitch are arranged inside the mold device 1 in advance, when the molten metal introduced into the mold comes into contact with the inner wall surface of the mold cavity 4, it will be rapidly cooled. When a plurality of pin members 8 with a narrow pitch are provided, the fluidity of the molten metal cannot be good. That is, as shown by the arrow in FIG. 2, the molten metal passes straight between the rows of pin members 8 and solidifies there, and there is no molten metal entering between the pin members 8 constituting the rows. Printed gap 9. Therefore, the molten metal does not penetrate into the portion between the pin members 8 and forms an unfilled portion. Therefore, defects such as a wide range of unfilled portions may occur due to the formation of the hole portion 7 having a predetermined arrangement. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) — — — — — — — — — — — ii II β — — — (Please read the notes on the back before filling this page) -5- 540301 A7 B7 V. Description of the invention) [Disclosure of the invention] (Please read the precautions on the back before filling out this page) The present invention was invented in order to solve the above problems, and its purpose is to provide an internal device with settings A mold device capable of arranging a pin member having good fluidity of the molten metal, and a method for manufacturing an electronic device using the pin member. For an ideal embodiment, the metal mold device of the present invention is provided with a mold from the first mold or the first mold for forming a housing for an electronic device made of a metal material having holes with a predetermined pitch. The metal mold device of the pin member provided with the mold of 2 is characterized in that: the above-mentioned pin member is connected to the center line of the nearest adjacent pin member, and is not arranged to be connected with the mold cavity for introducing the molten metal into the mold device The direction of the interior is vertical. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A method for manufacturing a bulk electronic device, comprising: a flow process for diffusing a molten metal into the mold device; and forming a frame by solidifying the molten metal introduced into the mold device during the flow. The solidification process of the body; Moreover, the above-mentioned metal mold device is the aforementioned metal mold device. [Embodiment of the present invention] Hereinafter, an embodiment of the present invention will be described with reference to Figs. 3 to 8. Fig. 3 shows the shape of a portable computer 10 such as a notebook computer. The paper size is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm) 540301 A7 B7. 5. Appearance of 4 (). In this figure, the portable computer 10 includes a computer body 11 and a display unit 12 supported rotatably on the computer body 11. The computer body 11 has a frame body 13; this frame body 13 is formed by appropriately bonding the lower frame body 14 and the upper frame body 15 together, for example, with screws. However, the joint structure of the lower frame 14 and the upper frame 15 is not limited to this, and may be joined by another structure. Here, in the following description, a case 20 for an electronic device will be described as a case suitable for an electronic device such as a portable computer 10 or the like. The following description is based on FIGS. 4 to 8. For example, a frame 20 for an electronic device such as a light metal computer made of a magnesium alloy is used as a material, and a plurality of hole portions 2 1 are formed at narrow intervals. The external shape of this hole 21 is to cool the internal function of the computer or to diffuse the sound to the outside to exert the function of a speaker. The plurality of holes 21 are formed by introducing a molten metal into the inside of the mold device 30. • The metal mold device 30 shown in FIG. 7 has the first mold upper mold 3 1 and the second mold lower mold 3 2; the upper mold 31 and the lower mold 32 The meshing forms a mold device 30. In this metal mold device 30, a vertical runner 33 is provided as an introduction port for the molten metal; and a molten metal is guided to the inside of the mold device 30, and the molten metal is guided to uniformly diffuse. The cross flow channel 3 4. The molten metal guided by the cross-flow channel 34 is guided into the cavity 35 of the metal mold device 30. In addition, although the molten metal is a molten magnesium alloy, a molten metal of an alloy can also be used. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 cm) (Please read the precautions on the back before filling this page)-Install · 丨 丨 It 丨 · Order ·! — Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 540301 A7 B7 V. Description of the invention <) (Please read the precautions on the back before filling out this page) Inside the cavity 3 5 for the above-mentioned electronic machine housing A hole member 21 is formed on 20, and a pin member 36 is provided at a portion corresponding to the hole portion 21 of the housing 20 for an electronic device. The dance members 36 are arranged inside the cavity 35 of the above-mentioned metal mold device 30 with respect to the conventional grid-like arrangement, so as to form the following arrangement. As shown in FIG. 4, if the arrangement of the pin members 36 is such that the interval between adjacent pin members 36 when arranged in a grid is a, the arrangement of the pin members 36 of the present invention is adjacent to the adjacent ones. The flow of the molten metal of the two pin members 36 is at right angles. With respect to the row of one pin member 36, the row of the other pin member 36 is set to be offset by half a pitch (P1tch). . Therefore, the interval between the adjacent pin members 36, as shown in FIG. 4, is known as a, and if calculated according to the theorem of three squares, it changes to b (= 5/2). According to this method, the interval between the adjacent pin members 36 can be expanded as compared with the case where the pin members 36 are arranged in a grid pattern. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs With this expanded state, the metal melt flow that can flow through this pin member 36 can increase the flow compared with the conventional grid-like configuration; Yilang, Can make metal melt flow easily. Furthermore, in this case, the above-mentioned pin members 36 are respectively arranged at intervals of about half a pitch, and the thin movement of the molten metal is not changed at all. Therefore, the molten metal can pass between the extended pin members 36. By arranging the pin members 36 in such a manner, the above-mentioned pin members 36 are arranged in a staggered arrangement. However, the arrangement of the pin members 36 is not limited to such an arrangement. That is, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed 540301 ', A7 B7 5. Invention description d :), as shown in Figure 5 Of the two adjacent rows of pin members 36 (in this case, parallel to the direction of flow of the molten metal), the row of one pin member 36 may also be aligned with respect to the other pin member 36. Columns, staggered by half a pitch. Even in this case, as shown in Fig. 5, the interval between the adjacent pin members 36 is changed from the conventional a to b (= a *, 5/2). Therefore, the interval between the adjacent pin members 36 is larger than that in the case of the pin members 36 arranged in a grid, and the molten metal can be easily flowed. -In addition, the pin members 36 may be arranged in a staggered manner at half pitches. The staggered arrangement is not limited to this, and there are various cases. That is, instead of being arranged in a grid shape in a basic arrangement, it is arranged in a rectangular shape, and the pin members 36 are shifted by half a pitch in the vertical or horizontal direction from the original arrangement, respectively. The angle forms a staggered pattern (As shown in FIG. 6, the basic rectangle is shifted by half a pitch in the longitudinal direction, and the pin members 36 arranged in a staggered pattern are arranged in a lattice shape inclined at a certain angle.). In this case, the closest pin members 36 are No. 1 and No. 4, No. 2 and No. 4, No. 4 and No. 6, etc. In this case, since the metal melts are arranged in a staggered manner, the gap between the two can be 37 °. In this case, the arrangement of the pin members 36 is connected to the flow direction of the metal melts. The center lines of the two adjacent pin members 36 are not perpendicular, but are inclined and intersected at a certain angle. By this means, the connection lines with the adjacent pin members 36 are arranged perpendicular to the flow
本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公« ) ~Z ------I---I 裝 — 訂· — I mmmMm -mmmMm «ϋ ϋ I s, <請先閱讀背面之注意事項再填寫本頁} 540301 A7 B7 五、發明說明τ() (請先閱讀背面之注意事項再填寫本頁) 方向之情況相比，銷構件3 6之間的間隔可以擴大，而可 以防止對金屬熔液的流動產生妨礙的情況發生，增加金屬 熔液的流量。 又，上述銷構件3 6，雖然將相對於金屬熔液的流動 方向呈垂直或平行之相鄰的兩列銷構件3 6，分別使一列 的銷構件3 6相對於另一列錯開大約半個節距；但是，銷 構件3 6的錯開量並不限定爲半個節距，只要可以使金屬 熔液在銷構件3 6之間良好地流動，該錯開量可以爲任意 値。 在具有此種配置之金屬模裝置3 0的內部，從豎澆道 3 3導入金屬熔液，然後從橫流道3 4使此金屬熔液擴散 ，而導入模腔3 5內。此時，由於金屬熔液導入模腔3 5 內，係利用模腔3 5將金屬熔液擴散後再導入，所以金屬 熔液在模腔3 5內成爲平行流。又，此金屬熔液的導入， 相對於模腔3 5的內壁面，大致呈平行。 經濟部智慧財產局員工消費合作社印製 在此情況下，對溶解後的鎂合金，例如施加2 5 0 t 左右的壓力，爲了進行電子機器用框體2 0的射出成形， 導入模腔3 5內。 藉由此導入，金屬熔液在設置成上述配置之銷構件 3 6之間的部分不會發生短路，f能夠擴散。亦即，如第 .4圖〜第6圖所示，金屬熔液可以繞入相鄰的銷構件3 6 之間的間隙部3 7之間。 藉由此手段，對於設置銷構件3 6的部分，不會發生 未充塡之處，而可以將金屬熔液充塡入模腔3 5內部，然 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ----- 經濟部智慧財產局員工消費合作社印製 540301 A7 _ B7 五、發明說明《 ) 後’金屬熔液到達透氣口 3 8。 透氣口 3 8，係用來使存在於金屬模裝置3 0內部的 空氣逃至外部；又透氣口 3 β更連通澆口杯3 9。藉由此 手段’導入金屬模裝置3 0內部的金屬熔液，一邊防止在 框體內部發生孔隙，一邊到達透氣口 3 8。 若將金屬熔液導入模腔3 5內部，金屬模裝置3 0的 溫度大約爲1 0 0度〜3 5 0度，由於比溶解後的鎂合金 的溫度（大約爲5 8 0度〜7 5 0度）低，此金屬熔液的 溫度一旦接觸金屬模裝置3 0便立即降低，於是金屬熔液 凝固。 但是，由於對金屬熔液施加上述壓力來進行導入，又 ，由於銷構件3 6的配置係設置成如上所述的配置，所以 金屬熔液在凝固以前便會到達透氣口 3 8，然後金屬熔液 才凝固。 金屬熔液凝固後，使上模3 1和下模3 2分開，以頂 出銷押出金屬模成形品，如第8圖所示，形成具有對應上 述銷構件3 6之配置所形成之孔部2 1的電子機器用框體 2 0。因此，此孔部2 1的配置也設置成交錯狀或是相鄰 的孔部2 1之間的間隔增大。 但是，在相同面積中所形成的孔部2 1個數，基本上 .沒有改變，從孔部2 1放出熱量的機能以及做爲喇叭的聲 音擴散性也沒有問題。 若根據此種β構成之金屬模裝置3 0以及電子機器用框 體2 0之製造方法，上述銷構件3 6設置成：相對於金屬 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） — — — — —-----I I ! I (請先閱讀背面之注意事項再填寫本頁) 540301 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明4 ) 熔液的流動方向呈垂直或平行之相鄰的兩列銷構件3 6之 中，使一列的銷構件3 6相對於另一列錯開大約半個節距 。因此，相鄰的銷構件3 6 _之間隔可以增大。 藉由此手段，銷構件36之間的部分，有多量的金屬 熔液流過，進而，與將銷構件3 6配置成格子狀的情況相 比，金屬熔液可以通過銷構件3 6之間。 因此，金屬熔液也可以擴散至銷構件3 6之間的間隙 部37,可以防止發生未充塡部分。 - •因此，不會有未充塡部分，可以製造出沒有發生成形 不良之電子機器用框體2 0，而可以提高電子機器用框體 2 ◦之良率。 又，即使不將上述相鄰之銷構件3 6的另一側錯開大 約半個節距地構成交錯狀，而將銷構件3 6配置成其他種 交錯狀的情況，由於連結相鄰之銷構件3 6的中心線，相 對於金屬熔液的流動，成爲垂直狀態，所以在此種情形下 ，銷構件3 6與配置成格子狀的情況相比，可以增大金屬 熔液的流量。 進而，在將銷構件3 6配置成此種交錯狀的情況下， 與將銷構件3 6配置成格子狀的情況相比，相鄰的銷構件 3 6之間並沒有被配置成與金屬熔液之流動方向平行，金 .屬熔液不難繞入這些銷構件3 6之間的間隙部3 7，而可 以使金屬熔液良好地注入。藉由此手段，可以防止發生未 充塡之處，防止電子機器用框體2 0發生成形不良的情況 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -12- — — — — — — — — — — — -lull· — — — I — I — 11 — (請先閱讀背面之注意事項再填寫本頁) 540301 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明iib ) 又，特別是將相對於將金屬熔液導入模腔3 5內部之 導入方向呈垂直之相鄰的兩列銷構件3 6之中，相對於一 方的銷構件3 6的列，另一方之銷構件3 6的列大約錯開 半個節距的構成，銷構件3 6妨礙金屬熔液之直線流動， 使可以使其在銷構件3 6之間蛇行。因此，特別可以良好 地使金屬熔液擴散至銷構件3 6之間。 以上，雖然已經說明了本發明之一實施形態，本發明 也可以做各種變化。說明如下。 - 在上述實施形態中，雖然已經說明了將銷構件3 6配 置成一列相對於另一列錯開大約半個節距所形成之交錯狀 、或是其他交錯狀；但是，除此以外，例如第9圖所示， 也可以構成將銷構件3 6配置成格子狀，而相對於此配置 之銷構件3 6，使金屬熔液的導入方向傾斜一定角度地導 入。 在此情形下，如第9圖之箭頭所示，金屬熔液的流動 可以穿過銷構件3 6之間，因此，即使將銷構件3 6配置 成格子狀，若使金屬熔液的導入方向傾斜，也可以使金屬 熔液擴散至存在於銷構件3 6之間的間隙部3 7。 其他，在不變更本發明之要旨的範圍內，可以做各種 變化。 【圖面之簡單說明】 第1圖係表示關於習知例之電子機器用框體之形狀的 立體圖。 (請先閱讀背面之注意事項再填寫本頁) 裝 --r--訂----- 華 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 540301 經濟部智慧財產局員工消費合作社印製 A7 ___B7_ 五、發明說明<1 ) 第2圖係表示習知例之銷構件的配置以及金屬熔液之 流動狀態的圖。 第3圖係表示做爲關於牢發明之一實施形態的電子機 器之手提式電腦之構成的立體圖。 第4圖係表示同樣的金屬模裝置內部之銷構件的配置 狀態的圖；顯示出將銷構件的列，往垂直於金屬熔液之導 入方向的方向，分別錯開半個節距之狀態圖。 第5圖係表示同樣的金屬模裝置內部之銷構件的配置 狀態的圖；顯示出將銷構件的列，往平行於金屬熔液之導 入方向的方向，分別錯開半個節距之狀態圖。 第6圖係表示同樣地設置成交錯狀之情況之銷構件的 配置狀態圖。 第7圖係表示同樣的金屬模裝置之構成的側剖面圖。 第8圖係表示同樣的電子機器用框體之構成的立體圖 〇 第9圖係表示相對於本發明之變化例之格子狀的銷構 件配置，使金屬熔液的導入方向傾斜規定角度的狀態圖。 【圖號說明】 20:電子機器用框體 . .2 1 :孔部 3 0 :金屬模裝置 3 1 :上模 3 2 :下模 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -14- -----------•裝-----l· — — 訂--------- (請先閲讀背面之注意事項再填寫本頁) 540301 A7 _____B7 五、發明說明迨 ) 件 腔構 模銷 5 6 3 3 (請先閱讀背面之注意事項再填寫本頁)This paper size applies to China National Standard (CNS) A4 specification (210 X 297 male «) ~ Z ------ I --- I binding — binding · — I mmmMm -mmmMm« ϋ ϋ I s, < Please Read the precautions on the back before filling in this page} 540301 A7 B7 V. Description of the invention τ () (Please read the precautions on the back before filling in this page) Compared with the orientation, the interval between the pin members 3 and 6 can be enlarged , And can prevent the flow of the molten metal from being hindered, and increase the flow of the molten metal. In addition, although the above-mentioned pin members 36 are two adjacent rows of pin members 36 which are perpendicular or parallel to the flow direction of the molten metal, the pin members 36 of one row are staggered by about half a knot with respect to the other row. However, the staggered amount of the pin members 36 is not limited to a half pitch, as long as the molten metal can flow well between the pin members 36, the staggered amount can be arbitrary. In the metal mold device 30 having such a configuration, a molten metal is introduced from the vertical runner 33, and then the molten metal is diffused from the lateral flow channel 34 to be introduced into the cavity 35. At this time, since the molten metal is introduced into the cavity 35, the molten metal is diffused and then introduced by the cavity 35, so that the molten metal flows in parallel in the cavity 35. The introduction of the molten metal is substantially parallel to the inner wall surface of the cavity 35. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In this case, a pressure of about 250 tons is applied to the dissolved magnesium alloy. For injection molding of the frame 20 for electronic equipment, the mold cavity 3 5 is introduced. Inside. With this introduction, a short-circuit does not occur in the portion of the molten metal between the pin members 36 arranged as described above, and f can diffuse. That is, as shown in FIGS. 4 to 6, the molten metal can be wound between the gap portions 37 between the adjacent pin members 3 6. By this means, for the portion where the pin member 36 is provided, there will be no unfilled portion, and the molten metal can be filled into the cavity 35, but the paper size applies the Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) ----- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 540301 A7 _ B7 V. Description of the invention "" After the metal melt reaches the vent 3 8. The vent hole 38 is used to escape the air existing inside the metal mold device 30 to the outside; and the vent hole 3 β is more connected to the gate cup 39. By this means, the molten metal inside the mold device 30 is introduced, and while preventing the occurrence of pores in the frame body, it reaches the ventilation opening 38. If the molten metal is introduced into the cavity 35, the temperature of the metal mold device 30 is about 100 degrees to 350 degrees, because the temperature of the molten magnesium alloy (about 5 8 degrees to 7 5) 0 degree), the temperature of the molten metal will decrease as soon as it contacts the mold device 30, so the molten metal solidifies. However, since the above-mentioned pressure is applied to the molten metal for introduction, and because the arrangement of the pin member 36 is set as described above, the molten metal will reach the vent 38 before the solidification, and then the molten metal The liquid freezes. After the molten metal is solidified, the upper mold 31 and the lower mold 32 are separated, and the molded product of the metal mold is pushed out by ejection pins. As shown in FIG. 2 1 2 0 2 for electronic equipment. Therefore, the arrangement of the hole portions 21 is also arranged in a staggered manner or the interval between adjacent hole portions 21 is increased. However, the number of holes 21 formed in the same area is basically the same. There is also no problem with the function of releasing heat from the holes 21 and the sound diffusivity as a horn. According to the manufacturing method of the metal mold device 30 and the electronic device frame 20 according to the β structure, the above-mentioned pin member 36 is set to apply the Chinese National Standard (CNS) A4 specification (210 X) to the paper size 297 mm) — — — — —----- II! I (Please read the precautions on the back before filling out this page) 540301 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description 4) Melting The flow direction of the liquid is in two adjacent rows of pin members 36 which are vertical or parallel, so that the pin members 36 in one row are staggered by about half a pitch with respect to the other row. Therefore, the interval between adjacent pin members 3 6 _ can be increased. By this means, a large amount of molten metal flows through the portion between the pin members 36, and compared with the case where the pin members 36 are arranged in a lattice shape, the molten metal can pass between the pin members 36 . Therefore, the molten metal can also diffuse into the gap portion 37 between the pin members 36, and it is possible to prevent an underfilled portion from occurring. -• As a result, there is no unfilled part, and it is possible to manufacture the electronic device housing 20 without forming defects, and to improve the yield of the electronic device housing 2 ◦. In addition, even if the other side of the adjacent pin members 36 is not staggered by a half pitch, and the pin members 36 are arranged in other staggered shapes, the adjacent pin members are connected. The center line of 36 is perpendicular to the flow of the molten metal. Therefore, in this case, the pin member 36 can increase the flow rate of the molten metal compared to the case where the pin member 36 is arranged in a grid. Furthermore, when the pin members 36 are arranged in such a staggered manner, compared with the case where the pin members 36 are arranged in a lattice shape, the adjacent pin members 36 are not arranged to be fused with the metal. The flow direction of the liquid is parallel, and the metal melt is not difficult to get into the gap portion 37 between the pin members 36, so that the metal melt can be injected well. By this means, it is possible to prevent the occurrence of underfilling and the occurrence of poor forming of the housing 20 for electronic equipment. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -12- — — — — — — — — — — — — —Lull · — — — I — I — 11 — (Please read the notes on the back before filling out this page) 540301 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Description of the Invention iib) Furthermore, in particular, the two rows of pin members 36 which are adjacent to each other in a direction perpendicular to the introduction direction of the molten metal into the cavity 35 are opposite to the row of one pin member 36, On the other hand, the rows of the pin members 36 are staggered by half a pitch. The pin members 36 prevent the metal melt from flowing in a straight line so that they can meander between the pin members 36. Therefore, the molten metal can be particularly well diffused between the pin members 36. Although one embodiment of the present invention has been described above, the present invention can be variously modified. described as follows. -In the above embodiment, although it has been described that the pin members 36 are arranged in a staggered shape formed by one row staggered by about half a pitch with respect to the other row, or other staggered shapes; however, for example, the ninth As shown in the figure, the pin members 36 may be arranged in a grid shape, and the direction of introduction of the molten metal may be introduced at a certain angle with respect to the pin members 36 arranged in this manner. In this case, as shown by the arrow in FIG. 9, the flow of the molten metal can pass between the pin members 36. Therefore, even if the pin members 36 are arranged in a grid shape, if the direction of introduction of the molten metal is made Inclinedly, the molten metal may be diffused to the gap portions 37 existing between the pin members 36. In addition, various changes can be made without changing the gist of the present invention. [Brief Description of Drawings] Fig. 1 is a perspective view showing the shape of a casing for an electronic device according to a conventional example. (Please read the precautions on the back before filling out this page) Loading --r--order ------ Chinese paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 540301 Intellectual Property of the Ministry of Economic Affairs Printed by the Consumer Cooperatives of the Bureau A7 ___B7_ 5. Description of the invention < 1) The second picture is a diagram showing the arrangement of the pin member of the conventional example and the flow state of the molten metal. Fig. 3 is a perspective view showing the structure of a portable computer as an electronic device according to an embodiment of the invention. Fig. 4 is a diagram showing the arrangement state of the pin members in the same metal mold device; the state diagrams are shown in which the rows of the pin members are staggered by half a pitch in a direction perpendicular to the direction of introduction of the molten metal. Fig. 5 is a diagram showing the arrangement state of the pin members in the same metal mold device; the state diagrams are shown in which the rows of the pin members are shifted by half a pitch in a direction parallel to the direction of introduction of the molten metal. Fig. 6 is a view showing an arrangement state of the pin members in the case where they are similarly arranged in a staggered manner. Fig. 7 is a side sectional view showing the structure of the same mold device. Fig. 8 is a perspective view showing the structure of the same housing for an electronic device. Fig. 9 is a state diagram in which the direction of introduction of the molten metal is inclined at a predetermined angle with respect to the arrangement of the lattice-shaped pin members according to the modification of the present invention. . [Illustration of drawing number] 20: Frame for electronic equipment.. 2 1: Holes 3 0: Metal mold device 3 1: Upper mold 3 2: Lower mold The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -14- ----------- • equipment ----- l · — — order --------- (Please read the notes on the back before filling in this Page) 540301 A7 _____B7 V. Description of the invention 迨) Piece cavity mold pin 5 6 3 3 (Please read the precautions on the back before filling this page)
-裝— l· — — 訂·！ I I ^#1. 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -15--Equipped — l · — — Ordered! I I ^ # 1. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) A4 (210 X 297 mm) -15-