WO1999005233A1 - Procede de fixation de tres petits articles - Google Patents

Procede de fixation de tres petits articles Download PDF

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Publication number
WO1999005233A1
WO1999005233A1 PCT/JP1998/003196 JP9803196W WO9905233A1 WO 1999005233 A1 WO1999005233 A1 WO 1999005233A1 JP 9803196 W JP9803196 W JP 9803196W WO 9905233 A1 WO9905233 A1 WO 9905233A1
Authority
WO
WIPO (PCT)
Prior art keywords
article
micro
adhesive layer
fixing
thin film
Prior art date
Application number
PCT/JP1998/003196
Other languages
English (en)
Japanese (ja)
Inventor
Katsuyuki Yamaguchi
Hiroo Nakayama
Original Assignee
Citizen Watch Co., Ltd.
Tefco Aomori Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co., Ltd., Tefco Aomori Co., Ltd. filed Critical Citizen Watch Co., Ltd.
Priority to JP50964699A priority Critical patent/JP4359791B2/ja
Publication of WO1999005233A1 publication Critical patent/WO1999005233A1/fr
Priority to HK00101296A priority patent/HK1022490A1/xx

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0002—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe
    • G04D3/0043—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the time-indicating mechanisms
    • G04D3/0051—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the time-indicating mechanisms for time markers
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/06—Dials
    • G04B19/10—Ornamental shape of the graduations or the surface of the dial; Attachment of the graduations to the dial
    • G04B19/103—Ornamental shape of the graduations or the surface of the dial; Attachment of the graduations to the dial attached or inlaid numbers

Definitions

  • the present invention relates to a method for fixing minute articles such as rose letters for watches and decorative parts to an adherend such as a clock display panel. Background technology
  • electrodeposition imaging has been widely used for articles having fine and complicated shapes, such as roses for watches and decorative parts.
  • the electrodeposition imaging method a large number of products with high uniformity can be produced, and the obtained electrodeposition images can be adhered to the adherend while being aligned in a lump. It is suitable for manufacturing a clock face that requires precise positioning.
  • the electrodeposition method (also referred to as the electrodeposition method) is applied to not only electrodeposited images such as loose characters, but also electrodeposition for guides used for positioning and linear electrodes for preventing excessive electrodeposition. Electrodeposition is being performed simultaneously. That is, in this method, not only a target electrodeposited image but also an auxiliary electrodeposit not finally formed as a product is formed at the same time. Such auxiliary electrodeposits are necessary for process control, but are not Therefore, it is desirable to use a less expensive metal. For this reason, in the electrodeposition imaging method, the electrodeposition image is manufactured using relatively inexpensive metals such as nickel in consideration of the balance of the product price.
  • the present invention has been made in view of the prior art as described above, and is capable of accurately forming a fine article having a sharp angle and a pattern on its surface, which is difficult to obtain by a noble metal, a nonmetal, or an electrodeposition method. It is an object of the present invention to provide a method for fixing a small article that can be collectively fixed on an adherend surface. Disclosure of the invention
  • the present inventors applied the basic technology cultivated by the electrodeposition imaging method, and completed the present invention as described below.
  • Fixing the micro-article to an adherend via a fixing adhesive layer It is characterized by including.
  • micro-article storage section a separately manufactured micro-article is stored, and a bonding adhesive layer is formed on the back surface of the micro-article,
  • a method for fixing the micro-article wherein the micro-article is fixed to the surface of the adherend via the fixing adhesive layer while separating the micro-article from the support base material.
  • micro-article storage section a separately manufactured micro-article is stored, and a bonding adhesive layer is formed on the back surface of the micro-article,
  • the jig thin film and the minute article are placed on the surface of the adherend, and the minute article portion is pressed to fix the minute article to the surface of the adherend via the fixing adhesive layer;
  • a step of accommodating a separately manufactured minute article in the minute article accommodating section is characterized by including a step of forming a fixing adhesive layer on a portion of the adherend to be fixed with the micro article, and a step of fixing the micro article to the adherend via the fixing adhesive layer.
  • the pressure-sensitive adhesive layer is preferably made of an ultraviolet-curable pressure-sensitive adhesive.
  • the jig thin film is formed on a conductive base material surface by an electrodeposition method.
  • the conductive base material includes a metal plate, It is preferable that the conductive layer be formed of a conductive thin film formed thereon.
  • the jig thin film may be formed by etching a metal foil.
  • the adherend is transparent to ultraviolet rays and the adhesive layer for fixing is made of an ultraviolet-curable pressure-sensitive adhesive.
  • the fixing adhesive layer is cured by irradiating ultraviolet rays from the back surface of the adherend, so that the micro-article and the adherend can be further bonded. Can be firmly joined.
  • FIG. 1 is a cross-sectional view showing a jig thin film having a small article accommodating portion formed on an upper surface of a conductive substrate
  • FIG. 2 is an example of a conductive substrate (multilayer substrate).
  • FIG. 3 is a plan view showing an example of a photomask film
  • FIG. 4 is a sectional view showing a state in which a photoresist is laminated on the surface of a conductive base material
  • FIG. 5 is a sectional view showing a state at the time of exposure.
  • FIG. 6 is a cross-sectional view showing a developed state after exposure
  • FIG. 7 is a cross-sectional view showing an electrodeposited state after development
  • FIG. 8 is a photo resist after removing the photoresist after electrodeposition.
  • FIG. 1 is a cross-sectional view showing a jig thin film having a small article accommodating portion formed on an upper surface of a conductive substrate
  • FIG. 2 is an example of a conductive substrate (multilayer substrate
  • FIG. 9 is a cross-sectional view showing a state in which the tool thin film is transferred and held on a supporting substrate together with a conductive film.
  • FIG. 9 is a cross-sectional view showing a state in which the conductive film is removed.
  • FIG. Figure 11 is a cross-sectional view showing the state in which the article is stored. Figure 11 shows the jig thin film.
  • FIG. 12 is a cross-sectional view showing a state in which release paper is stuck to the adhesive layer for fixing, and
  • FIG. 13 is a bonding force of the pressure-sensitive adhesive layer by irradiating ultraviolet rays.
  • FIG. 14 is a cross-sectional view showing a state where the jig thin film is removed, and FIG.
  • FIG. 15 is a cross-sectional view showing a state where a small article is fixed.
  • 16 is a cross-sectional view showing a state in which a jig thin film and a small article are placed on an adherend
  • FIG. 17 is a sectional view showing a state in which the small article is being pressed
  • FIG. FIG. 4 is a cross-sectional view showing a state in which the jig thin film is removed and only a minute article is fixed on an adherend.
  • Figure 19 shows the FIG. 20 is a cross-sectional view illustrating a state in which a bonding adhesive layer is formed on a portion where a small article is to be fixed
  • FIG. 20 is a cross-sectional view illustrating a state in which the bonding adhesive layer is ultraviolet-cured after the micro article is fixed. is there.
  • conductive base material multi-layer base material: 1 a ... metal plate, lb ... conductive thin film); 2 ... micro-article; 3 ... micro-article accommodation section; 4 ... jig thin film; 5 ... photomask; Mark corresponding to the small article storage section 3; 7 ... photo resist; 8 ... conductive section; 9 ... support base material;
  • a rose character for a watch is made into a minute article and is fixed to the surface of a clock display plate (adherend).
  • the present invention is not limited to the rose character for a watch.
  • the present invention can be applied to fixing of small articles such as various decorative letters, symbols, resin molded bodies, glass, and jewelry.
  • Such microscopic articles are manufactured by, for example, metal stamping, electroforming, resin molding, polishing and cutting of glass and jewelry.
  • a plated film is formed on the surface of the rose letters by wet plating or dry plating to complete the rose letters.
  • the thickness of the minute article varies depending on the application. For example, in the case of a character for a watch, the thickness is about 100 to 400 m. Such a small article is separately manufactured in advance before the following steps.
  • the jig thin film 4 is prepared.
  • the jig thin film can be formed by, for example, an electrodeposition method or an etching method.
  • a treatment having a blank portion for accommodating the above-described micro-article 2 hereinafter referred to as “micro-article accommodation section 3”
  • the component thin film 4 is formed
  • the micro-article accommodation section 3 is formed slightly larger than the micro-article.
  • a metal plate such as stainless steel or A laminate having a conductive film 1b provided on the surface of such a metal plate 1a (hereinafter, also referred to as a multilayer substrate 1) is used (see FIG. 2).
  • a multilayer substrate 1 having a conductive film 1b provided on the surface of the metal plate 1a.
  • the conductive film 1b of the multilayer substrate 1 is a flexible thin film having conductivity.
  • Examples of such a conductive film 1b include a conductive metal thin film formed by electrolytic plating (electrodeposition) or an electroless plating, a conductive paint film formed by a conductive paint, and a conductive polymer.
  • a conductive polymer thin film formed by the above method is used, and a conductive metal thin film formed by electrodeposition is preferably used.
  • the thickness of the conductive film 1b is not particularly limited, but is usually about 10 to 50 / zm, preferably about 20 to 30 / zm.
  • the conductive film lb is separated from the surface of the metal plate 1a in a later step. Therefore, in order to facilitate release of the conductive film 1b, it is preferable to perform a release treatment on the surface of the metal plate 1a before forming the conductive film 1b.
  • the release treatment is performed, for example, by treating the surface of the metal plate 1a with a surface oxidation by anodic electrolysis, a surfactant or the like.
  • an electrodeposition image 4 having a small article storage portion 3 is formed on the surface of the conductive film 1b (the electrodeposition image 4 is referred to as a "jig thin film 4").
  • a specific method for forming an electrodeposited image is described in, for example, Japanese Patent Application Laid-Open No. 3-107496. Has been described. Although not limited, a general method for forming the jig thin film 4 will be described below.
  • a small letter 2 for a watch is used as a minute article 2 and is fixed to the surface of a watch display plate (adherend).
  • a positive photomask film 5 is prepared by photography or printing.
  • the figure shows a negative film.
  • a mark 6 corresponding to the minute article storage section 3 is drawn in white.
  • a photoresist 7 such as a liquid resist, a dry film resist, or a resist ink for printing is applied to the upper surface of the conductive film 1b of the multilayer substrate 1 and baked. Then
  • the film 5 is placed on the conductive film 1b with the photoresist ⁇ interposed therebetween, and in this state, exposure is performed by an exposure machine or the like (in FIG. 5,
  • the shaded portion in the film 5 corresponds to the jig thin film 4 and blocks light.
  • a resist film (corresponding to the exposed photoresist 7b) may be formed by printing using an ink.
  • a metal is deposited on the conductive portion 8 by an electrodeposition method (electrodeposition image method) to form a jig thin film 4.
  • the small article storage section 3 having a vertical hole and a sharp edge.
  • five dry film resists of 50 m thickness are laminated (250 m in total), exposed and developed, and then electrodeposited to a thickness of 200 / m to remove the resist film.
  • An electrodeposited film with a sharp edge is obtained at a thickness of 200 / m.
  • Electrodeposition conditions are, for example, for an effective electrodeposition area of 15 O mm X 150 mm,
  • a metal such as gold, silver, copper, iron, platinum, or an alloy thereof may be used in consideration of the price of the final product and the like.
  • a jig thin film 4 having an arbitrary thickness can be obtained, for example, in a range of about 20 to 300 m. It is preferable that the thickness of the jig thin film 4 is approximately equal to the thickness of the above-described micro-article 2.
  • a fixing adhesive described later can be applied with a uniform thickness.
  • the photoresist 7 on the conductive film 1b was removed by immersion in an aqueous solution, and as shown in FIG. A jig thin film 4 having a portion 3 is formed.
  • a resist film is formed in a predetermined shape on a metal foil such as aluminum, brass, or stainless steel, and then an etching solution is sprayed or dipped to cure the film. Create a functional thin film.
  • the thickness of the metal foil is appropriately selected according to the thickness of the micro-article 2 described above.
  • the etching method consists of the following steps.
  • the photoresist and the etching solution conventionally known ones can be used without particular limitation.
  • an etching solution used for the aluminum, brass, and stainless steel a solution of ferric chloride, hydrochloric acid, sodium hydroxide, or the like, or a mixed solution thereof is generally used.
  • the jig thin film 4 obtained by the electrodeposition method or the etching method as described above is transferred onto a pressure-sensitive adhesive layer 10 of a supporting substrate 9 such as a film.
  • Fig. 8 shows the transfer method using the electrodeposition method.
  • the jig thin film 4 is formed on the conductive coating 1 b.
  • the conductive coating 1 is formed. Separate b at the same time. That is, separation is performed at the interface between the conductive film 1b and the metal plate 1a, and the jig thin film is sandwiched between the conductive film 1b and the support base material 9. Separate. As a result, the jig thin film 4 can be peeled while being securely held.
  • the jig thin film 4 and the metal plate can be separated from each other with little deformation, no stress remains in the jig thin film 4 and no deformation occurs.
  • the metal plate can be used repeatedly.
  • a film having a high surface smoothness for example, an electrolytic plating film (electrodeposited film) or the like is used as the conductive film 1b, the photoresist adheres to the conductive film lb, so that generation of burrs can be prevented.
  • the jig thin film is formed by the etching method, it may be simply stuck on the pressure-sensitive adhesive layer 10 of the supporting substrate 9 such as a film.
  • the pressure-sensitive adhesive layer 10 can be formed of, for example, a UV-curable, heat-curable, or even time-curable pressure-sensitive adhesive.
  • typical examples of the UV-curable pressure-sensitive adhesive include an addition-polymerizable compound having two or more unsaturated bonds, a photopolymerizable compound such as an alkoxysilane having an epoxy group, a carbonyl compound and an organic sulfur compound.
  • Rubber-based pressure-sensitive adhesives containing a photopolymerization initiator such as a compound, a peroxide, an amine, or an onium salt-based compound, and an acrylic pressure-sensitive adhesive. 0-1969695).
  • the compounding amounts of the photopolymerizable compound and the photopolymerization initiator are generally 10 to 500 parts by weight and 0.1 to 20 parts by weight, respectively, per 100 parts by weight of the base polymer.
  • acryl-based polymers include conventional ones (see Japanese Patent Publication No. 57-54068, Japanese Patent Publication No. 58-33909, etc.), as well as non-radical reactivity on the side chain. Having a saturated group (Japanese Patent Publication No. 61-56-6264) Also, those having an epoxy group in the molecule can be used.
  • addition polymerizable compound having two or more unsaturated bonds examples include, for example, polyhydric alcohol ester polyol ester of acrylic acid / methacrylic acid, and epoxy compound / resin compound.
  • an epoxy group-functional crosslinking agent having one or more epoxy groups in the molecule such as ethylene glycol diglycidyl ether, may be added to enhance the crosslinking effect.
  • the pressure-sensitive adhesive layer 10 is formed using an ultraviolet-curable adhesive, it is necessary to use a transparent film or the like as the support substrate 9 in order to enable the ultraviolet irradiation treatment.
  • heat-curable pressure-sensitive adhesives include crosslinking agents such as polyisocyanate, melamine resin, amide-epoxy resin, peroxide, and metal chelate compound, and divinylbenzene if necessary.
  • time-curable pressure-sensitive adhesive there can be mentioned a pressure-sensitive adhesive whose adhesive strength is reduced by evaporating a mixed solvent over time.
  • the pressure-sensitive adhesive layer 10 is an ultraviolet-curable type. When formed with a pressure-sensitive adhesive, a small amount of ultraviolet light is applied to the pressure-sensitive adhesive layer 10 before removing the conductive thin film 1b, thereby reducing the adhesive force of the pressure-sensitive adhesive layer 10. It is preferable to keep it. Prior to separation of the metal plate 1a and the conductive thin film 1b (see FIG. 8), the adhesive force of the pressure-sensitive adhesive layer 10 can be reduced.
  • the adhesive force of the ultraviolet-curing adhesive is as strong as 240 g / 25 mm width
  • the conductive thin film 1 b can be applied to the pressure-sensitive adhesive layer 10 unless the adhesive force is reduced to some extent. This is because it becomes difficult to peel off from If the adhesive force of the ultraviolet curable adhesive layer is excessively reduced, the jig thin film 4 is also separated when the conductive thin film 1b is removed, which is not preferable. Therefore, it is desirable that the adhesive strength after ultraviolet irradiation is about 300 to 600 g / 25 ram width, preferably about 400 to 500 g / 25 mm width.
  • the minute article 2 separately manufactured as described above is accommodated in the minute article accommodation section 3 of the jig thin film 4.
  • the micro-article 2 is accommodated and attached to the pressure-sensitive adhesive layer 10 so that the back surface of the micro-article 2 (that is, the surface fixed to the adherend) is positioned on the upper side.
  • a fixing adhesive layer 11 is formed on the entire surface of the holding surface of the jig thin film 4 and the small article 2.
  • the fixing adhesive layer 11 preferably has a stronger adhesive force than the pressure-sensitive adhesive layer 10. After that, release paper i2 is attached on the fixing adhesive layer 11 (see Fig. 12), and the fixing adhesive is aged.
  • the adhesive force of the pressure-sensitive adhesive layer 10 is further reduced.
  • the pressure-sensitive adhesive layer 10 is formed of a UV-curable pressure-sensitive adhesive.
  • ultraviolet rays are irradiated from the support base material 9 side, that is, from the side opposite to the holding side of the jig thin film 4 as shown in FIG. 13.
  • the adhesive force of the pressure-sensitive adhesive layer 10 is changed to an extremely weak adhesive force.
  • the support base material 9 is heated to further form a time-curable pressure-sensitive adhesive. Then, the adhesive force of the pressure-sensitive adhesive layer 10 is changed to an extremely weak adhesive force by giving a change over time.
  • the release paper 12 is removed, and the minute article 2 is fixed to the adherend 13. At this time, the following two methods can be adopted.
  • the jig thin film 4 is mounted on the adherend 13 together with the minute object 2 without peeling (FIG. 16). Then, as needed Accordingly, the supporting substrate 9 is separated and removed together with the pressure-sensitive adhesive layer 10 (FIG. 17), and only the minute article 2 is pressed to fix the minute article 2 on the adherend 13. At this time, since no pressure is applied to the jig thin film 4, the adhesive force between the jig thin film 4 and the adherend 13 is not large. Therefore, when the jig thin film 4 is separated and removed, the bonding adhesive layer on the jig thin film 4 can also be removed at the same time, and only the minute article 2 remains on the adherend 13 and the adhesion of the minute article 2 is reduced. ( Figure 18).
  • the second method for fixing a microarticle according to the present invention is particularly effective for an ultraviolet-transparent adherend.
  • the second method of fixing the micro-articles is the same as the first method up to the step shown in FIG. 10, except that the bonding adhesive layer 11 is formed on the adherend 13 side.
  • the bonding adhesive layer 11 is previously formed on the surface of the adherend 13 by a technique such as screen printing, pad printing, or the like, on a portion where the minute article is to be fixed.
  • the fixing adhesive layer 11 is not particularly limited, and may be formed of various conventionally known adhesives. However, as described later, when the adherend 13 is an ultraviolet-transmitting material, Is preferably formed with an ultraviolet-curable pressure-sensitive adhesive.
  • the fine article 2 is fixed to the surface of the adherend via the fixing adhesive layer 11 in the same manner as in the first method.
  • the jig thin film 4 Prior to the fixation of the micro-article 2, the jig thin film 4 is removed from the pressure-sensitive adhesive layer 10 of the support base 9, and the micro-article 2 is held while the micro-article 2 is held on the support base 9. It may adhere to the surface of the adherend, After the micro-article 2 is fixed to the surface of the adherend, the jig thin film 4 may be removed together with the support base 9.
  • the adherend 13 in the second method a material that transmits ultraviolet light, for example, glass, resin, ceramics, shellfish, or the like is preferably used.
  • the ultraviolet transmittance of such an ultraviolet-permeable adherend is preferably in the range of 30 to 80%, particularly preferably in the range of 50 to 80%.
  • the fixing adhesive layer 11 is preferably formed from the above-mentioned ultraviolet-curable pressure-sensitive adhesive.
  • ultraviolet rays are irradiated from the back surface of the adherend to cure the fixing adhesive layer, and the micro-article and the adherend are bonded to each other. It can be more firmly joined.
  • the ultraviolet-curing type pressure-sensitive adhesive can be hardened by ultraviolet irradiation, and can firmly join the micro-article and the adherend by the force of losing the pressure-sensitive adhesive force, so-called anchor effect.
  • preferred embodiments of the second method according to the present invention are as follows.
  • a jig thin film 4 having a micro-article accommodation portion 3 is formed (FIGS. 1 to 7), and the UV-curable pressure-sensitive adhesive layer 10 is provided on the pressure-sensitive adhesive layer of the support substrate 9.
  • the jig thin film 4 is transferred (FIGS. 8 and 9), and the separately prepared micro-article 2 is stored in the micro-article storage section 3 (FIG. 8).
  • An ultraviolet-curing adhesive layer 11 was formed on the ultraviolet-transparent adherend 13 at the portion where the small article is to be fixed (FIG. 19).
  • the supporting substrate 9 and the micro-article 2 are placed on the surface of the adherend, and The micro-article 2 is fixed to the surface of the adherend 13 via the adhesive layer 11 for fixing.
  • the fixing adhesive layer 11 is cured by irradiating ultraviolet rays from the back surface of the adherend 13, and the minute article 2 and the adherend 13 are firmly joined (FIG. 20).
  • ultraviolet rays are irradiated from the side of the support base material 9 to cure the UV-curable pressure-sensitive adhesive layer 10, the support base material 9 is removed, and if the jig thin film 4 remains, this is also applied. Remove it,
  • the small articles 2 such as loose letters can be fixed to the surface of the adherend 13 such as a clock face.
  • a guide electrodeposition having a guide hole used for positioning may be formed.
  • a guide thin film having a guide hole used for positioning may be formed at the same time as forming the jig thin film.
  • the present invention has been described in connection with an example of the manufacture of a clock face, the present invention is not limited to the manufacture of a clock face, but can be adopted, for example, for attaching a product name, a company name, etc. to a product. However, it can be applied to the production of various decorative items.
  • the invention's effect is not limited to the manufacture of a clock face, but can be adopted, for example, for attaching a product name, a company name, etc. to a product. However, it can be applied to the production of various decorative items. The invention's effect

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Adhesive Tapes (AREA)

Abstract

Procédé permettant de fixer de très petits articles tels que des chiffres sur un cadran d'horlogerie, etc., qui consiste (1) à creuser un petit trou à l'aide d'un photorésist et à former un film mince pour un gabarit qui possède une partie de logement pour un très petit article, (2) à placer un très petit article tel qu'un chiffre de cadran produit séparément dans la partie de logement, (3) à former une couche adhésive destinée à être fixée sur la face arrière du très petit article, ou à former une couche adhésive destinée à être fixée sur une partie de fixation de très petit article située sur un objet, et (4) à fixer le très petit article à l'objet par l'intermédiaire de la couche adhésive.
PCT/JP1998/003196 1997-07-22 1998-07-16 Procede de fixation de tres petits articles WO1999005233A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP50964699A JP4359791B2 (ja) 1997-07-22 1998-07-16 微小物品の固着方法
HK00101296A HK1022490A1 (en) 1997-07-22 2000-03-01 Method of fixing very small articles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19605297 1997-07-22
JP9/196052 1997-07-22

Publications (1)

Publication Number Publication Date
WO1999005233A1 true WO1999005233A1 (fr) 1999-02-04

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PCT/JP1998/003196 WO1999005233A1 (fr) 1997-07-22 1998-07-16 Procede de fixation de tres petits articles

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JP (1) JP4359791B2 (fr)
CN (1) CN1088735C (fr)
CH (1) CH693886A5 (fr)
HK (1) HK1022490A1 (fr)
TW (1) TW436429B (fr)
WO (1) WO1999005233A1 (fr)

Cited By (6)

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Publication number Priority date Publication date Assignee Title
EP1035453A1 (fr) * 1999-03-05 2000-09-13 Eta SA Fabriques d'Ebauches Cadran comportant des brillants, appliques ou autres éléments rapportés et procédé de fixation de ces éléments sur un tel cadran
WO2003107308A1 (fr) * 2002-06-13 2003-12-24 セイコーエプソン株式会社 Joint en forme de feuille et procede de liaison associe, cadran, procede de production de cadran, et compteur de temps
EP1544690A1 (fr) * 2003-12-16 2005-06-22 Seiko Epson Corporation Pièce décorative, procédé de fabrication d'une pièce décorative, et pièce d'horlogerie
JP2005274346A (ja) * 2004-03-24 2005-10-06 Kawaguchiko Seimitsu Co Ltd 指標及びその製造方法
WO2006106698A1 (fr) * 2005-03-30 2006-10-12 Citizen Holdings Co., Ltd. Panneau d’indication d’instruments et procede pour fabriquer un panneau d’indication d’instruments
CN108231651A (zh) * 2017-12-26 2018-06-29 厦门市三安光电科技有限公司 微元件转移装置和转移方法

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Publication number Priority date Publication date Assignee Title
TW538324B (en) * 2001-07-12 2003-06-21 Ebauchesfabrik Eta Ag Device for securing a dial in a watchcase
TWI634817B (zh) * 2016-08-30 2018-09-01 台虹科技股份有限公司 用於電路板沖壓製程的覆蓋膜

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JPS5898336A (ja) * 1981-12-07 1983-06-11 Seiko Epson Corp 時計用文字板の製造方法
JPS5898337A (ja) * 1981-12-07 1983-06-11 Seiko Epson Corp 時計用文字板の製造方法
JPH04343088A (ja) * 1991-05-20 1992-11-30 Seiko Epson Corp 時計用文字板の製造方法
JPH08109491A (ja) * 1994-10-13 1996-04-30 Tefuko Internatl Kk 電着画像の製造方法

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Publication number Priority date Publication date Assignee Title
JPS5898336A (ja) * 1981-12-07 1983-06-11 Seiko Epson Corp 時計用文字板の製造方法
JPS5898337A (ja) * 1981-12-07 1983-06-11 Seiko Epson Corp 時計用文字板の製造方法
JPH04343088A (ja) * 1991-05-20 1992-11-30 Seiko Epson Corp 時計用文字板の製造方法
JPH08109491A (ja) * 1994-10-13 1996-04-30 Tefuko Internatl Kk 電着画像の製造方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6404704B1 (en) 1999-03-05 2002-06-11 Eta Sa Fabriques D'ebauches Dial including brilliants, appliques or other applied elements and method for securing such elements thereto
EP1035453A1 (fr) * 1999-03-05 2000-09-13 Eta SA Fabriques d'Ebauches Cadran comportant des brillants, appliques ou autres éléments rapportés et procédé de fixation de ces éléments sur un tel cadran
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CN108231651B (zh) * 2017-12-26 2020-02-21 厦门市三安光电科技有限公司 微元件转移装置和转移方法

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TW436429B (en) 2001-05-28
CN1088735C (zh) 2002-08-07
HK1022490A1 (en) 2000-08-11
CH693886A5 (de) 2004-03-31
JP4359791B2 (ja) 2009-11-04
CN1234818A (zh) 1999-11-10

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