Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F17/00—Fixed inductances of the signal type 
  • H01F17/0006—Printed inductances
  • H01F17/0013—Printed inductances with stacked layers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
  • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors

Definitions

• the invention is based on an inductive component according to the preamble of the main claim.
• Inductive components are known in the form of coils, in which an electrically conductive wire is wound in several turns around a tubular body and finally the ends of the electrically conductive wire serve as connecting wires and are usually connected to contact elements which are fastened to the tubular body.
• Such coils are usually produced by means of manual winding or winding machines.
• the inductive component according to the invention with the characterizing features of the main claim has the advantage that the inductive component is particularly inexpensive and inexpensive to manufacture, since printing techniques or lithography techniques for
• inductive Component can also be produced in very small dimensions, which is usually only possible with great effort in the known inductive components.
• the inductive component can be produced together with other components at the same time on a printed circuit board, as a result of which the production costs are reduced again.
• the inductive component can be produced particularly precisely, since its geometry can be set very precisely, in particular by high-precision methods such as photolithography.
• the inductive component according to the invention can also be used as a coil with a core, in particular a transformer core.
• the inductive component is particularly space-saving and similar to a wound coil if one of the ends of the conductor loops is arranged approximately above or below the opening between the conductor loops.
• the structuring of the electrically conductive layers and / or the at least one insulating layer by means of a photolithographic process is a particularly inexpensive production process, since this process is already used for the mass production of electrical components and is therefore well controlled.
• conductive paste and / or insulating paste for the production of the inductive component offers the advantage that the shape of the conductor loops or the insulating layer can be determined and controlled as soon as the pastes are applied. Such pastes are also very inexpensive.
• the inductive component can be produced in a layered manner, with each layer having a particularly flat geometry. On the one hand, this simplifies the manufacturing process and on the other hand increases the accuracy with which the inductive component can be produced in relation to a desired inductance value. If the conductor loops are at least partially designed as spirals, the advantage can be achieved that fewer layers are required to obtain a given inductance. This enables very flat inductive components to be produced.
• Figure 1 is a perspective view of all conductive
• FIG. 2 shows a side view of an inductive component
• Figure 3 is a cut side view of an inductive
• Figure 4 is a perspective view of an inductive
• Figure 5 shows an embodiment with spiral
• a first electrically conductive layer 11 is provided, which is designed in the form of an approximately circular, open conductor loop. At one of the two ends, the first electrically conductive layer 11 has a connection element 12 in the form of a connection conductor track.
• a plurality of further electrically conductive layers 10 are provided in several levels above the first electrically conductive layer 11, all of which are likewise in the form of an approximately circular, open one Conductor loop are formed and all have approximately the same radius as the first electrically conductive layer 11 and all are arranged approximately concentrically to the first electrically conductive layer 11.
• the further electrically conductive layers 10 are arranged with respect to the point at which the conductor loop is opened, in each case rotated relative to one another by a small angle piece, in such a way that one of the two ends of two conductor loops lying one above the other overlap by a small amount.
• a connecting piece 13 is arranged between the two overlapping ends of each pair of conductor loops lying one above the other. This creates an approximately coil-shaped structure.
• the uppermost further electrically conductive layer 10 has at its still free, open end a further connecting element 14 in the form of a connecting conductor track.
• the electrically conductive structure described in this way serves as a coil, since it conducts electrical current in circular paths and rising in an approximately helical manner between the two connecting conductor tracks 12, 14, so that a magnetic field extending axially to the central axis of the conductor loops is produced.
• the inductive component shown in FIG. 1 is usually not produced as a free-floating structure, but rather as a layer package, insulating layers being provided between the individual electrically conductive layers 10, 11 in order to ensure proper functioning of the inductive component.
• Such an arrangement is shown in Figure 2.
• the first electrically conductive layer 11 with the connecting conductor track 12 is arranged on a carrier substrate 17.
• the further electrically conductive layers 10, the layers 10, 11 each being connected to one another with the connecting pieces 13 and the uppermost further electrically conductive layer 10 having the further connecting conductor 14.
• the recess in the opening 16 can then be realized both by etching and by mechanical removal, such as drilling or milling, but also by providing a stamp shape which is placed in the place of the opening 16 during the filling process of the insulating paste and is then pulled out .
• photolithographic processes and printing processes can also be used.
• the connecting piece 13 can be produced, for example, by filling the openings 16 with a conductive paste, but also, for example, by soldering or a photolithographic process.
• FIG. 4 shows an inductive component, analogous to FIG. 3, in which an opening 19 was additionally arranged through the interior of the conductor loops.
• This breakthrough can be produced by etching or drilling or some other method and is suitable for the implementation of, for example, a ferrite core for the inductive component.
• the inductive component has the two connecting conductor tracks 14, 12, which are guided from the conductor loops to the edge of the inductive component, where they can be connected to connecting contacts for supplying electrical current for the inductive component, which is not shown in the figure .
• the shape of the conductor loops of the inductive component is not limited to the circular shape, but can also include other geometries, such as an angular shape or an oval shape, but also any other open loop shapes.
• This component can be used in particular as an SMD (Surface Mounted Device) component, preferably for HF technology.
• the first electrically conductive layer 11, like the further electrically conductive layer 10, is designed in the form of a flat spiral, the interlocking turns of which are exemplarily rectangular in shape here.
• the electrically conductive layers 10, left are in turn connected by means of a connecting piece 13 and connecting conductor tracks 12, 14 to form a coil-shaped structure which serves as an inductive component.
• this structure will also be embedded in non-conductive material by producing the conductive parts by printing, photolithography, ie masking, etching, developing, coating, or other processes on or in plate-shaped insulating layers.
• One or more circuit boards can also be used as insulating layers.

Landscapes

• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Coils Or Transformers For Communication (AREA)
• Parts Printed On Printed Circuit Boards (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=7764595

Family Applications (1)

Country Status (3)

Cited By (3)

Families Citing this family (6)

Citations (11)

• 1995
  • 1995-06-17 DE DE19522043A patent/DE19522043A1/de not_active Withdrawn
• 1996
  • 1996-06-11 WO PCT/DE1996/001014 patent/WO1997000526A1/de active Application Filing
  • 1996-06-14 TW TW085107151A patent/TW312018B/zh active

Patent Citations (11)

Non-Patent Citations (8)

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