TW312018B - - Google Patents
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- Publication number
- TW312018B TW312018B TW085107151A TW85107151A TW312018B TW 312018 B TW312018 B TW 312018B TW 085107151 A TW085107151 A TW 085107151A TW 85107151 A TW85107151 A TW 85107151A TW 312018 B TW312018 B TW 312018B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive
- conductor
- patent application
- layer
- conductive layer
- Prior art date
Links
- 230000006698 induction Effects 0.000 claims description 35
- 239000004020 conductor Substances 0.000 claims description 25
- 238000000206 photolithography Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000859 α-Fe Inorganic materials 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19522043A DE19522043A1 (de) | 1995-06-17 | 1995-06-17 | Induktives Bauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW312018B true TW312018B (ja) | 1997-08-01 |
Family
ID=7764595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085107151A TW312018B (ja) | 1995-06-17 | 1996-06-14 |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE19522043A1 (ja) |
| TW (1) | TW312018B (ja) |
| WO (1) | WO1997000526A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103377795A (zh) * | 2012-04-24 | 2013-10-30 | 乾坤科技股份有限公司 | 电磁器件及其制作方法 |
| US9009951B2 (en) | 2012-04-24 | 2015-04-21 | Cyntec Co., Ltd. | Method of fabricating an electromagnetic component |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5831331A (en) * | 1996-11-22 | 1998-11-03 | Philips Electronics North America Corporation | Self-shielding inductor for multi-layer semiconductor integrated circuits |
| DE19739962C2 (de) * | 1997-09-11 | 2000-05-18 | Siemens Ag | Planare, gekoppelte Spulenanordnung |
| DE19818673A1 (de) * | 1998-04-27 | 1999-10-28 | Thomson Brandt Gmbh | Spule |
| KR100317116B1 (ko) * | 1998-12-17 | 2002-04-24 | 김춘호 | 적층형칩인덕터 |
| EP1318531A1 (de) * | 2001-12-06 | 2003-06-11 | D. Hans Ekkehard | Verfahren zur Herstellung von elektronischen Bauteilen sowie elektronisches Bauteil |
| DE102013013335A1 (de) * | 2013-08-06 | 2015-02-12 | Technische Universität Dortmund | Verfahren zur Herstellung von Werkzeugspulen und/oder Werkzeugen für die Magnetumformung insbesondere dünnwandiger Werkstücke aus elektrisch leitfähigen Werkstoffen sowie entsprechend hergestellte Werkzeugspule |
| US10395810B2 (en) * | 2015-05-19 | 2019-08-27 | Shinko Electric Industries Co., Ltd. | Inductor |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07118877B2 (ja) * | 1985-05-02 | 1995-12-18 | ソニー株式会社 | 回路パターン形成方法 |
| JPS62104112A (ja) * | 1985-10-31 | 1987-05-14 | Fuji Electric Co Ltd | トランスおよびその製造方法 |
| JPS63136609A (ja) * | 1986-11-28 | 1988-06-08 | Fujitsu Ltd | チツプ型トランスの製造方法 |
| EP0361967B1 (en) * | 1988-09-30 | 1995-12-20 | Kabushiki Kaisha Toshiba | Planar inductor |
| JPH033395A (ja) * | 1989-05-31 | 1991-01-09 | Taiyo Yuden Co Ltd | セラミック多層配線基板 |
| JPH0377360A (ja) * | 1989-08-18 | 1991-04-02 | Mitsubishi Electric Corp | 半導体装置 |
| JPH071821B2 (ja) * | 1989-12-11 | 1995-01-11 | サンケン電気株式会社 | 配線基板 |
| EP0491214A1 (de) * | 1990-12-19 | 1992-06-24 | Asea Brown Boveri Ag | Transformator, insbesondere Impulstransformator |
| JPH0555043A (ja) * | 1991-08-22 | 1993-03-05 | Fujitsu Ltd | 小型コイルとその製造方法，磁気ヘツドの製造方法及び磁気記憶装置 |
| JPH0677076A (ja) * | 1992-08-26 | 1994-03-18 | Tdk Corp | コイル部品の製造方法 |
| JPH06224556A (ja) * | 1993-01-27 | 1994-08-12 | Kyocera Corp | 低温焼成多層基板 |
-
1995
- 1995-06-17 DE DE19522043A patent/DE19522043A1/de not_active Withdrawn
-
1996
- 1996-06-11 WO PCT/DE1996/001014 patent/WO1997000526A1/de active Application Filing
- 1996-06-14 TW TW085107151A patent/TW312018B/zh active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103377795A (zh) * | 2012-04-24 | 2013-10-30 | 乾坤科技股份有限公司 | 电磁器件及其制作方法 |
| US9009951B2 (en) | 2012-04-24 | 2015-04-21 | Cyntec Co., Ltd. | Method of fabricating an electromagnetic component |
| TWI500053B (zh) * | 2012-04-24 | 2015-09-11 | Cyntec Co Ltd | 一種製作電磁元件的方法 |
| CN103377795B (zh) * | 2012-04-24 | 2016-01-27 | 乾坤科技股份有限公司 | 电磁器件及其制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19522043A1 (de) | 1996-12-19 |
| WO1997000526A1 (de) | 1997-01-03 |
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