WO1994005766A1 - Detergent pour le nettoyage de circuits imprimes et de composants electroniques, procede pour sa fabrication et son mode d'utilisation - Google Patents

Detergent pour le nettoyage de circuits imprimes et de composants electroniques, procede pour sa fabrication et son mode d'utilisation Download PDF

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Publication number
WO1994005766A1
WO1994005766A1 PCT/EP1993/000077 EP9300077W WO9405766A1 WO 1994005766 A1 WO1994005766 A1 WO 1994005766A1 EP 9300077 W EP9300077 W EP 9300077W WO 9405766 A1 WO9405766 A1 WO 9405766A1
Authority
WO
WIPO (PCT)
Prior art keywords
cleaning agent
agent according
water
cleaning
component
Prior art date
Application number
PCT/EP1993/000077
Other languages
German (de)
English (en)
Inventor
Wolf Bach
Heinz Stadelmann
Original Assignee
Circuit Chemical Products Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Chemical Products Gmbh filed Critical Circuit Chemical Products Gmbh
Priority to AU33501/93A priority Critical patent/AU3350193A/en
Publication of WO1994005766A1 publication Critical patent/WO1994005766A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3227—Ethers thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol

Definitions

  • the present invention relates to a cleaning agent for cleaning printed circuits and electronic components.
  • the standard cleaning agents are fluorocarbons (CFCs), which are dangerous attackers of the stratospheric spherical ozone layer and are therefore now prohibited.
  • CFCs fluorocarbons
  • glycol ethers in cleaning agents has been known for a long time.
  • US-A-4 060 496 describes the use of glycol ethers for cleaning steel surfaces.
  • EP-A-426 943 describes a cleaning agent which contains an optionally aqueous mixture of at least one glycol ether and at least one non-ionic surface-active agent.
  • the surface-active agents improve the flushability, they easily form films that can remain on the surface of the circuits or electronic components and later influence the surface resistance.
  • EP-A-351 810 and EP-A-416 763 describe cleaning agents which contain terpene hydrocarbons as an azeotropic mixture with water and / or other solvents.
  • a cleaning agent of the type mentioned at the outset which is characterized in that it contains a) at least one alkaline component, b) water and c) comprises at least one completely water-miscible organic solvent.
  • the present invention also relates to a method for producing the cleaning agent, which is characterized in that at least one alkaline component is mixed with water and at least one organic solvent which is completely miscible with water.
  • the cleaning agent according to the invention is particularly suitable for cleaning printed circuits and electronic components.
  • it can be used in printed circuits equipped and soldered with electronic components.
  • the cleaning agents according to the invention lead to a significant improvement in the electrochemical properties, such as an increase in the surface resistance to ranges of more than 10 ohms when a voltage of 10 to 400 V is applied in a climate room of 40 ° C. at 95% relative atmospheric humidity when using an IPC test coupon (IPC B 25), as well as to avoid electromigration.
  • cleaning agents according to the invention are their environmental friendliness, since no chlorinated or fluorinated hydrocarbons are used. Since the cleaning agents have a high boiling point, the required operating systems can be produced economically. The high flash point of the cleaning agents eliminates hazards such as fire and explosion.
  • the dirty Cleaning agents can be disposed of in an environmentally friendly manner and can be recycled by distillation. They are biodegradable. However, prior separation of the water from the organic solvent by reverse osmosis is recommended.
  • alkaline component a customary alkaline components known in this field can be used.
  • ammonia or a derivative thereof can be used.
  • the derivative of ammonia is preferably an amine or an ammonium hydroxide.
  • Suitable amines are aliphatic, aromatic or aliphatic-aromatic primary, secondary or tertiary amines or also polyamines. Examples of such amines are di- and trialkylamines, di- and triarylamines, which can be fully or partially alkylated or -arylated. Ethylamine, diethylamine, diphenylamine, ethylbutylamine, ethylphenylamine, ethylenediamine, triethylamine and triphenyla in are particularly preferred.
  • Aliphatic, aromatic or aliphatic-aromatic ammonium hydroxides can be used as ammonium hydroxide. Examples of these are tetraalkyl and arylammonium hydroxides. Tetramethylammonium hydroxide and tetraphenylammonium hydroxide are particularly preferred.
  • any organic solvent which is completely miscible or soluble in water for example an alkanol or a polyether, can be used as component c).
  • Lower alcohols in particular an alcohol having 2 to 5 carbon atoms, such as ethanol, n-propanol, isopropanol, n-butanol, sec-butanol, are suitable as alkanols, tert-butanol, isobutanol and pentanol are preferred.
  • Glycol ethers in particular are used as polyethers.
  • the glycol ether preferably has the general formula
  • R represents a hydrogen atom or an alkyl group with 1 to 5 carbon atoms
  • R 2 represents an alkyl group with 1 to 5 carbon atoms
  • R 3 represents a hydrogen atom or a methyl group and n represents an integer from 2 to 4.
  • Propylene glycol ethers are particularly preferred as alkylene glycol ethers since they have a high flash point and boiling point. Ethylene glycol ether and butylene glycol ether are also suitable.
  • Another component of the cleaning agent according to the invention is water as component b), which plays an essential role in the cleaning of printed circuits and electronic components.
  • the water serves as a phase transfer catalyst, since it changes the polarity of the solvent in such a way that the polar alkaline components, which due to their high affinity for printed circuit board surfaces, ad ad thereon as a monomolecular film be sorbed, migrate from the surface into the solvent.
  • the thermal treatment of the acidic activators present in the flux gives rise to oligomeric products which react with the alkaline component of the cleaning agent to form ammonium salts which are only to a limited extent in the organic solvent which is completely miscible with water Extent are soluble. Only the addition of water leads to the migration of the alkaline component into the solvent described above.
  • Component a) is preferably used in an amount of 0.01 to 20% by weight, particularly preferably in an amount of 0.5 to 3% by weight, based on the cleaning agent.
  • the amount of component b) is preferably 0.01 to 70% by weight, particularly preferably 10 to 50% by weight, based on the cleaning agent.
  • Component c) is preferably used in an amount of 30 to 99.98% by weight, particularly preferably in an amount of 50 to 93% by weight, based on the cleaning agent.
  • the cleaning agent according to the invention is applied by bringing it into contact with the surfaces of the printed circuits and electronic components to be cleaned, such as by dipping, flooding or spraying, preferably using ultrasound to assist is used. It is then usually rinsed with water and / or fully demineralized water and dried with warm air.
  • Alcohols with 2 to 5 carbon atoms can also be added to the rinsing water, or it can be rinsed with these alcohols themselves.
  • the cleaning with the cleaning agent according to the invention can be carried out at any temperature. Temperatures of 5 to 72 ° C. are usually used. An elevated temperature can shorten the treatment time.
  • the surface insulation resistance (S.I.R.) was measured as follows to determine the electrochemical properties:
  • a cleaning agent was prepared by mixing 17% by weight of water, 82% by weight of dipropylene glycol monomethyl ether and 1% by weight of tetramethylammonium hydroxide. After soldering a printed circuit with a flux and using the so-called hot air leveling method and subsequent rinsing with water, the printed circuit was washed with the above cleaning agent at room temperature. Washing was supported with ultrasound. The contact with the cleaning agent was approx. 3 min. It was then washed with water and deionized water and dried with warm air.
  • Test coupon IPC 750 ⁇ m; Test time: 144 hours.
  • Example 1 was repeated with the exception that a cleaning agent comprising 19.03% by weight of water, 80% by weight of dipropylene glycol ether, 0.67% by weight of ethanolamine and 1.3% by weight of tetramethylammonium hydroxide was used. The following test results were obtained:
  • a cleaning agent was prepared by mixing 19% by weight of water, 79% by weight of tripropylene glycol mono-n-methyl ether and 2% by weight of tetramethylammonium hydroxide.
  • An assembled, printed circuit was soldered with a low-solids, halogen-free flux according to DIN 8511, type F-SW 34. The circuit treated in this way was then cleaned in the cleaning agent mentioned above by immersion with ultrasound support. The immersion time was 2 minutes and the temperature of the cleaning agent was 40 ° C. After cleaning, the printed circuit was rinsed with water. This was followed by a double rinse with demineralized water and drying with warm air.
  • Example 3 was repeated with the exception that a cleaning agent consisting of 18% by weight of water, 80% by weight of dipropylene glycol ether, 1% by weight of ethanol in and 1% by weight of tetramethylammonium hydroxide was used.
  • a cleaning agent was produced by mixing 20% by weight of water, 79% by weight of dipropylene glycol monoethyl ether and 1% by weight of 25% ammonia.
  • the cleaning process was supported with ultrasound.
  • the temperature of the cleaning agent was at room temperature and the residence time was 3 min. After the cleaning process, it was rinsed twice with isopropanol and then dried with warm air.
  • Example 5 was repeated with the exception that a cleaning agent consisting of 20% by weight of water, 78% by weight of dipropylene glycol ether and 2% by weight of ethanolamine was used.

Abstract

La présente invention concerne un détergent pour le nettoyage de circuits imprimés et de composants électroniques comportant au moins un constituant alcalin, de l'eau et au moins un solvant organique complètement miscible dans l'eau.
PCT/EP1993/000077 1992-09-03 1993-01-14 Detergent pour le nettoyage de circuits imprimes et de composants electroniques, procede pour sa fabrication et son mode d'utilisation WO1994005766A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU33501/93A AU3350193A (en) 1992-09-03 1993-01-14 Agent for cleaning printed circuits and electronic components, method of producing the agent and its use

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP1992/002035 WO1994006265A1 (fr) 1992-09-03 1992-09-03 Melange de nettoyants pour nettoyer des circuits imprimes et procede a cet effet
DEPCT/EP92/02035 1992-09-03

Publications (1)

Publication Number Publication Date
WO1994005766A1 true WO1994005766A1 (fr) 1994-03-17

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Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/EP1992/002035 WO1994006265A1 (fr) 1992-09-03 1992-09-03 Melange de nettoyants pour nettoyer des circuits imprimes et procede a cet effet
PCT/EP1993/000077 WO1994005766A1 (fr) 1992-09-03 1993-01-14 Detergent pour le nettoyage de circuits imprimes et de composants electroniques, procede pour sa fabrication et son mode d'utilisation

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/EP1992/002035 WO1994006265A1 (fr) 1992-09-03 1992-09-03 Melange de nettoyants pour nettoyer des circuits imprimes et procede a cet effet

Country Status (2)

Country Link
AU (2) AU2494092A (fr)
WO (2) WO1994006265A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0662529A1 (fr) * 1994-01-11 1995-07-12 Mitsubishi Chemical Corporation Agent de dégraissage et procédé pour nettoyer en matériau couvert d'huile
US5610132A (en) * 1994-06-24 1997-03-11 Tokuyama Corporation Cleaning agent for removing fats and oils from metal surfaces
EP0690483A3 (fr) * 1994-06-23 1998-09-09 MALLINCKRODT BAKER, Inc. Procédé de nettoyage de la contamination métallique de substrats conservant la planéité desdits substrats
EP0875926A2 (fr) * 1997-04-11 1998-11-04 Mitsubishi Gas Chemical Company, Inc. Détergent pour circuits semiconducteurs et procédé de fabrication de circuits semiconducteurs utilisant ledit détergent
WO1999016855A1 (fr) * 1997-09-29 1999-04-08 Kyzen Corporation Compositions de nettoyage et procedes d'elimination des polymeres et resines utilisees dans la fabrication
DE19900242A1 (de) * 1999-01-07 2000-07-13 Basf Coatings Ag Wäßriges Reinigungsmittel und seine Verwendung
WO2003006598A1 (fr) * 2001-07-09 2003-01-23 Mallinckrodt Baker Inc. Compositions de nettoyage alcalines sans ammoniac presentant une meilleure compatibilite avec le substrat destinees a des elements micro-electroniques
US7247208B2 (en) 2001-07-09 2007-07-24 Mallinckrodt Baker, Inc. Microelectronic cleaning compositions containing ammonia-free fluoride salts
EP1837182A1 (fr) * 2006-03-22 2007-09-26 FUJIFILM Corporation Liquide de lavage d'encre et procédé de nettoyage
US7393819B2 (en) 2002-07-08 2008-07-01 Mallinckrodt Baker, Inc. Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility

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CA2231459A1 (fr) * 1995-07-18 1997-02-06 Unilever Plc Produit de nettoyage degraissant aqueux concentre
DE19545676A1 (de) * 1995-12-07 1997-06-12 Wack O K Chemie Gmbh Verfahren zum Aktivieren von Leiterplatinen

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5674827A (en) * 1994-01-11 1997-10-07 Mitsubishi Chemical Corporation Degreasing cleaner and method for cleaning oil-deposited material
EP0662529A1 (fr) * 1994-01-11 1995-07-12 Mitsubishi Chemical Corporation Agent de dégraissage et procédé pour nettoyer en matériau couvert d'huile
EP0690483A3 (fr) * 1994-06-23 1998-09-09 MALLINCKRODT BAKER, Inc. Procédé de nettoyage de la contamination métallique de substrats conservant la planéité desdits substrats
CN1044265C (zh) * 1994-06-24 1999-07-21 株式会社德山 包含复合组分的洗洁剂和利用这种洗洁剂的清洁方法
US5610132A (en) * 1994-06-24 1997-03-11 Tokuyama Corporation Cleaning agent for removing fats and oils from metal surfaces
SG80589A1 (en) * 1997-04-11 2001-05-22 Mitsubishi Gas Chemical Co Detergent for semiconductor circuit and method for manufacturing semiconductor circuit by use of same
EP0875926A2 (fr) * 1997-04-11 1998-11-04 Mitsubishi Gas Chemical Company, Inc. Détergent pour circuits semiconducteurs et procédé de fabrication de circuits semiconducteurs utilisant ledit détergent
EP0875926A3 (fr) * 1997-04-11 1999-03-10 Mitsubishi Gas Chemical Company, Inc. Détergent pour circuits semiconducteurs et procédé de fabrication de circuits semiconducteurs utilisant ledit détergent
US6017862A (en) * 1997-09-29 2000-01-25 Kyzen Corporation Cleaning compositions and methods for cleaning resin and polymeric materials used in manufacture
WO1999016855A1 (fr) * 1997-09-29 1999-04-08 Kyzen Corporation Compositions de nettoyage et procedes d'elimination des polymeres et resines utilisees dans la fabrication
US6060439A (en) * 1997-09-29 2000-05-09 Kyzen Corporation Cleaning compositions and methods for cleaning resin and polymeric materials used in manufacture
US5962383A (en) * 1997-09-29 1999-10-05 Kyzen Corporation Cleaning compositions and methods for cleaning resin and polymeric materials used in manufacture
DE19900242A1 (de) * 1999-01-07 2000-07-13 Basf Coatings Ag Wäßriges Reinigungsmittel und seine Verwendung
WO2003006598A1 (fr) * 2001-07-09 2003-01-23 Mallinckrodt Baker Inc. Compositions de nettoyage alcalines sans ammoniac presentant une meilleure compatibilite avec le substrat destinees a des elements micro-electroniques
US7247208B2 (en) 2001-07-09 2007-07-24 Mallinckrodt Baker, Inc. Microelectronic cleaning compositions containing ammonia-free fluoride salts
CN100410359C (zh) * 2001-07-09 2008-08-13 马林克罗特贝克公司 具有改进的基板相容性的无氨碱性微电子清洗组合物
US7718591B2 (en) 2001-07-09 2010-05-18 Mallinckrodt Baker, Inc. Microelectronic cleaning compositions containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
US7393819B2 (en) 2002-07-08 2008-07-01 Mallinckrodt Baker, Inc. Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility
EP1837182A1 (fr) * 2006-03-22 2007-09-26 FUJIFILM Corporation Liquide de lavage d'encre et procédé de nettoyage

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WO1994006265A1 (fr) 1994-03-17
AU2494092A (en) 1994-03-29

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