AU2494092A - Cleaning-agent mixture for cleaning printed circuits and a method of cleaning such circuits - Google Patents

Cleaning-agent mixture for cleaning printed circuits and a method of cleaning such circuits

Info

Publication number
AU2494092A
AU2494092A AU24940/92A AU2494092A AU2494092A AU 2494092 A AU2494092 A AU 2494092A AU 24940/92 A AU24940/92 A AU 24940/92A AU 2494092 A AU2494092 A AU 2494092A AU 2494092 A AU2494092 A AU 2494092A
Authority
AU
Australia
Prior art keywords
cleaning
circuits
agent mixture
printed circuits
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
AU24940/92A
Inventor
Wolf Bach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Chemical Products GmbH
Original Assignee
Circuit Chemical Products GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Chemical Products GmbH filed Critical Circuit Chemical Products GmbH
Publication of AU2494092A publication Critical patent/AU2494092A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3227—Ethers thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Detergent Compositions (AREA)
AU24940/92A 1992-09-03 1992-09-03 Cleaning-agent mixture for cleaning printed circuits and a method of cleaning such circuits Withdrawn AU2494092A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP1992/002035 WO1994006265A1 (en) 1992-09-03 1992-09-03 Cleaning-agent mixture for cleaning printed circuits and a method of cleaning such circuits

Publications (1)

Publication Number Publication Date
AU2494092A true AU2494092A (en) 1994-03-29

Family

ID=8165680

Family Applications (2)

Application Number Title Priority Date Filing Date
AU24940/92A Withdrawn AU2494092A (en) 1992-09-03 1992-09-03 Cleaning-agent mixture for cleaning printed circuits and a method of cleaning such circuits
AU33501/93A Abandoned AU3350193A (en) 1992-09-03 1993-01-14 Agent for cleaning printed circuits and electronic components, method of producing the agent and its use

Family Applications After (1)

Application Number Title Priority Date Filing Date
AU33501/93A Abandoned AU3350193A (en) 1992-09-03 1993-01-14 Agent for cleaning printed circuits and electronic components, method of producing the agent and its use

Country Status (2)

Country Link
AU (2) AU2494092A (en)
WO (2) WO1994006265A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW324029B (en) * 1994-01-11 1998-01-01 Mitsubishi Chem Corp De-oiling cleaner composition
US5498293A (en) * 1994-06-23 1996-03-12 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
JP3256630B2 (en) * 1994-06-24 2002-02-12 株式会社トクヤマ Cleaning method
BR9609495A (en) * 1995-07-18 1999-03-02 Unilever Nv Composition and processes for removing cooked fat on a metal surface and cleaning a parking area
DE19545676A1 (en) * 1995-12-07 1997-06-12 Wack O K Chemie Gmbh Activation of computer circuit boards prior to plasma soldering
JPH10289891A (en) * 1997-04-11 1998-10-27 Mitsubishi Gas Chem Co Inc Semiconductor circuit cleaning agent and manufacture of semiconductor circuit by use thereof
US6060439A (en) * 1997-09-29 2000-05-09 Kyzen Corporation Cleaning compositions and methods for cleaning resin and polymeric materials used in manufacture
DE19900242A1 (en) * 1999-01-07 2000-07-13 Basf Coatings Ag Aqueous detergent and its use
MY131912A (en) * 2001-07-09 2007-09-28 Avantor Performance Mat Inc Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility
MY143399A (en) 2001-07-09 2011-05-13 Avantor Performance Mat Inc Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
US7393819B2 (en) 2002-07-08 2008-07-01 Mallinckrodt Baker, Inc. Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility
EP1837182B1 (en) * 2006-03-22 2010-05-12 FUJIFILM Corporation Ink washing liquid and cleaning method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3839234A (en) * 1973-01-26 1974-10-01 C Roscoe Multi-purpose cleaning concentrate
GB1573208A (en) * 1975-11-26 1980-08-20 Tokyo Shibaura Electric Ltd Surface treating agent adapted for intermediate products of a semiconductor device
US4213873A (en) * 1978-03-10 1980-07-22 Leisure Products Corporation Water based window, glass and chrome cleaner composition
JPS57165834A (en) * 1981-04-06 1982-10-13 Hitachi Chem Co Ltd Peeling solution for cured film of photopolymerizing composition
US4769170A (en) * 1985-05-22 1988-09-06 Mitsubishi Yuka Fine Chemicals Co., Ltd. Washing solution for printing ink
DE3705896A1 (en) * 1986-02-24 1987-08-27 Tokyo Ohka Kogyo Co Ltd METHOD FOR PRODUCING A PHOTORESIST PATTERN ON A SUBSTRATE SURFACE AND A FOAM REMOVER SUITABLE FOR THIS
US4744834A (en) * 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
EP0301044A4 (en) * 1987-02-05 1989-03-29 Macdermid Inc Photoresist stripper composition.
JPH02292399A (en) * 1989-05-03 1990-12-03 Asahi Chem Res Lab Ltd Flux cleaning agent
JPH03149299A (en) * 1989-11-02 1991-06-25 Asahi Chem Res Lab Ltd Flux cleaning composition
ES2059890T3 (en) * 1989-11-08 1994-11-16 Arakawa Chem Ind AGENT AND METHOD FOR ELIMINATING ROSES BASED FOR TIN SOLDERING.
EP0496605B1 (en) * 1991-01-24 2001-08-01 Wako Pure Chemical Industries Ltd Surface treating solutions for semiconductors
JPH05125395A (en) * 1991-11-05 1993-05-21 Metsuku Kk Cleaner composition

Also Published As

Publication number Publication date
WO1994005766A1 (en) 1994-03-17
AU3350193A (en) 1994-03-29
WO1994006265A1 (en) 1994-03-17

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