GB9305345D0 - A printed circuit board and method of manufacturing same - Google Patents

A printed circuit board and method of manufacturing same

Info

Publication number
GB9305345D0
GB9305345D0 GB939305345A GB9305345A GB9305345D0 GB 9305345 D0 GB9305345 D0 GB 9305345D0 GB 939305345 A GB939305345 A GB 939305345A GB 9305345 A GB9305345 A GB 9305345A GB 9305345 D0 GB9305345 D0 GB 9305345D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
manufacturing same
manufacturing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB939305345A
Other versions
GB2265760A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Publication of GB9305345D0 publication Critical patent/GB9305345D0/en
Publication of GB2265760A publication Critical patent/GB2265760A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
GB9305345A 1992-03-31 1993-03-16 Electromagnetically shielding printed circuit boards Withdrawn GB2265760A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10561592A JPH05283888A (en) 1992-03-31 1992-03-31 Printed wiring board and its manufacture

Publications (2)

Publication Number Publication Date
GB9305345D0 true GB9305345D0 (en) 1993-05-05
GB2265760A GB2265760A (en) 1993-10-06

Family

ID=14412410

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9305345A Withdrawn GB2265760A (en) 1992-03-31 1993-03-16 Electromagnetically shielding printed circuit boards

Country Status (2)

Country Link
JP (1) JPH05283888A (en)
GB (1) GB2265760A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4294303B2 (en) 2002-11-29 2009-07-08 株式会社日本自動車部品総合研究所 Printed circuit board and meter device
JP4463645B2 (en) * 2004-08-27 2010-05-19 日本メクトロン株式会社 Printed circuit board and inspection method thereof
JP2009290020A (en) * 2008-05-29 2009-12-10 Toshiba Corp Flexible printed wiring board, shielding method of wiring board and electronics
KR102637499B1 (en) * 2018-12-17 2024-02-15 엘지디스플레이 주식회사 Flexible printed circuit board and flexible display module and electronic device comprising the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3740678A (en) * 1971-03-19 1973-06-19 Ibm Strip transmission line structures
FR2212740B1 (en) * 1972-12-28 1977-02-25 Honeywell Bull
DE4113231A1 (en) * 1990-04-23 1991-10-24 Mitsubishi Gas Chemical Co METHOD FOR PRODUCING A PRINT BOARD

Also Published As

Publication number Publication date
GB2265760A (en) 1993-10-06
JPH05283888A (en) 1993-10-29

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)