WO1993011564A1 - Carte a circuit integre comprenant des moyens de protection du circuit integre - Google Patents
Carte a circuit integre comprenant des moyens de protection du circuit integre Download PDFInfo
- Publication number
- WO1993011564A1 WO1993011564A1 PCT/FR1992/001091 FR9201091W WO9311564A1 WO 1993011564 A1 WO1993011564 A1 WO 1993011564A1 FR 9201091 W FR9201091 W FR 9201091W WO 9311564 A1 WO9311564 A1 WO 9311564A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- housing
- integrated circuit
- card
- card according
- cavity
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000001465 metallisation Methods 0.000 description 7
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 206010001488 Aggression Diseases 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000016571 aggressive behavior Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- AMWRITDGCCNYAT-UHFFFAOYSA-L manganese oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Definitions
- the present invention relates to integrated circuit cards, also known as "smart cards", which comprise an integrated circuit arranged in the thickness of the card and accessible from the outside by a standardized connector to allow filling. various functions. These cards are now well known and are used for many purposes, such as accessing public telephone boxes or distributing money at bank machines.
- the integrated circuit is generally bonded to a piece of printed circuit constituting a flexible package and comprising tracks to which it is joined by connection wires.
- the tracks of the printed circuit are etched so as to form the standardized connector intended to supply the chip electrically and to exchange with it the necessary signals.
- the assembly is integrated into the thickness of the card, which generally consists of a laminating of laminated plastic layers.
- the outer layer d on the connector side is cut so as to allow access to the tracks forming this connector.
- the protection of the chip is generally made by the material constituting the card, with, if necessary, interposition between the chip and the card of a layer of relatively soft material.
- This soft layer is put in place either during the manufacture of the card, or during the fixing of the chip on the printed circuit.
- This layer is formed for example of a drop of coating resin which is then polymerized.
- the integrated circuit is itself reinforced, for example by bonding a cobalt plate under the semiconductor substrate of the integrated circuit.
- This protection is further increased if the material constituting the printed circuit is replaced by a resin plate reinforced with glass fibers.
- this type of mechanical protection is still insufficient.
- a smart card is subjected during its lifetime, which can be very long, to multiple constraints, both outside its use and during its use. So it can be carried in a user's pocket and subjected to
- _- all kinds of external aggressions. Furthermore, when it is used, it is inserted into a card reader which exerts on it a pressure which is far from negligible and which is variable from one reader to another. Furthermore, during these operations of inserting and extracting the card in and out of the reader, it is frequently subjected to bending or twisting movements.
- the chip protection means used until now are not completely satisfactory, especially for a card intended to be used for a long period, as is the case for example of a card comprising individual data, a medical file for example.
- a housing is thus used to contain the integrated circuit and to serve as an element of rigidity. We then meet the constraints of electrical insulation, necessary to ensure the independence of the different metallizations, by making the ceramic case.
- the invention therefore provides an integrated circuit card, of the type comprising an integrated circuit disposed inside a card and connected to means of connection with the outside, and comprising a housing for maintaining this integrated circuit comprising a cavity opening on one of its faces and making it possible to receive the integrated circuit, this housing comprising on its other face said means for connecting the card to the outside, and these connection means being joined to the integrated circuit by conductive bushings connecting the contacts inside the cavity and to connection wires connected to the integrated circuit, characterized in that this holding box is made of a ceramic material to contribute to the protection of the circuit integrated.
- a section of a protective housing provided with a card chip and intended to be integrated into a smart card
- FIG. 3 a sectional view of part of a smart card comprising a housing according to the invention.
- FIG. 1 a sectional view of a ceramic housing 101 whose thickness is small enough that it can be integrated into the thickness of a smart card.
- the thickness is small enough that it can be integrated into the thickness of a smart card.
- This housing has a counterbore which forms a cavity 102 which opens onto one of the large faces of the housing.
- a chip 103 has been placed, that is to say an integrated circuit suitable for the intended uses of the card in which the housing will be integrated.
- This chip is fixed, for example by gluing, flat on the bottom of the cavity 102, so that its face comprising the diffusions and the metallizations forming the integrated circuit proper, is free and directed towards the opening of the case. .
- a set of contacts 104 has been placed intended to ensure the connections with the chip.
- These contacts are preferably standards, ISO in principle, commonly used in smart cards. They can be obtained by any technique for depositing a conductive layer on ceramic, for example vacuum spraying or screen printing.
- This ceramic case is made of a ceramic material which is both resistant to protect the chip, and has a sufficiently high breaking limit to withstand the stresses mentioned above without breaking.
- the techniques for manufacturing ceramics known in the art make it possible to obtain such a housing that meets these specifications. A preferred technique is described below.
- the exit points of the chip 103 are connected to the contacts 104 by means of flexible wires 105 fixed in a known manner, by ultrasonic welding for example, on one side to these exit points and on the other to conductive crossings 106 arranged across the thickness of the bottom of the housing, at the level of the contacts 104, and which connect these contacts inside the cavity 102.
- Such conductive crossings through a layer of ceramic are known in the art, and their manufacture is similar for example to that used to form conductive holes connecting the two faces of a printed circuit.
- the underside of the cavity 102 will preferably be arranged so as to obtain a boss 106, circular for example, making it possible to surround the chip 103 to obtain different results.
- This boss keeps a maximum thickness of the housing by limiting the depth of the cavity 102 at the locations strictly necessary to place the chip and to connect the wires 105 to the bushings 106, this in order to increase the solidity of the housing.
- the cavity 102 is not filled, except by the air from the manufacturing room, and the box is closed by a cover 105 fixed to the edges of this box, for example by gluing.
- the material from which this cover is made can be various, for example a ceramic of the same kind as that which forms the actual case. As the thickness is very small, we will however use preferably a more elastic material, possibly for example a metallic foil.
- FIG. 2 shows a housing which is completely identical to that of FIG. 1, but in which the cover 108 has been removed and used to protect the chip 103 and its connection wires 105 -a filling material 208, for example a polymerizable resin which is poured into the cavity 102 and which forms a layer whose lower face merges with the lower face of the housing 101.
- a filling material 208 for example a polymerizable resin which is poured into the cavity 102 and which forms a layer whose lower face merges with the lower face of the housing 101.
- FIG. 3 a partial sectional view of a smart card 301 in which there is integrated a housing 101 having a chip.
- the details of the housing are not shown because they are the same as those of FIG. 1 or FIG. 2.
- the connectors 104 of the housing are flush with the upper face of the card.
- the underside of this card is formed from a very thin film 302, the role of which is essentially to hold the housing 101 during the card manufacturing process and then prevent its expulsion by punching.
- a variant of the invention has been used in this example, a layer of a polymer 303 which fills the gap between the package and the card on the sides of this case and between the bottom and the underside of the card.
- This polymer a silicone resin for example, makes it possible to maintain the housing in the card, while largely absorbing the flexural and torsional deformations applied to the card and transmitted by the latter to the housing.
- FIG. 4 shows a variant of the invention, in which the housing 101 is placed in a card 401, in this example without the polymer layer of the preceding example, this card 401 being of the so-called "label" type. , allowing remote use without contact with the card and therefore with the integrated circuits contained in the housing 101.
- a connection wire 402 which extends folded in thickness of the card, so as to form an induction coil which allows the transmission of information by air between an external device of use and the card.
- the wire 402 comes into the housing 101 through the underside thereof, corresponding to the cavity where the chip is located, but any other variant can be used, for example a connection by 1'intermediate contacts 104.
- These contacts which nevertheless remain here on the upper face of the housing, and therefore of the card, allow different operations, for example programming and / or testing the chip located in the housing.
- a "label" thus produced can then ensure the identification of an object to which it is attached, even if this object is placed in an environment particularly severe.
- Figure 5 shows a preferred method of manufacturing a ceramic package.
- a compound of aluminum powder, mineral powder such as, for example, manganese or silicon oxides, and fine filling powders are mixed and milled to ensure cohesion.
- mineral powder such as, for example, manganese or silicon oxides
- fine filling powders are mixed and milled to ensure cohesion.
- a relatively compact and solid strip is produced by compression and slight heating.
- This strip is then cut into a set of elements each serving to constitute a housing.
- the elements can also be stacked one above the other to form a housing.
- a housing is formed by a flat base element 501, of dimensions for example 10mm by 10mm.
- This base is surmounted by a hollow flat element 502, of the same external dimensions as the base, but provided with a passage 503 of, for example, 5mm by 5mm, and intended to receive the integrated circuit.
- the thickness of the base is equal to the thickness authorized for the connection, for example 0.2mm.
- the thickness of the hollow element is for example 0.4mm.
- the base plate is provided, on the face intended for contact with smart card readers, with metallizations 504 which are preferably produced by a printing carried out with an ink based on tungsten. Holes 505 are provided at the location of the metallizations of this base.
- Metallizations 506 made in the same way as metallizations 504 can be made on the other side of the element 501. They will be used to connect the integrated circuit.
- the holes 505 are then filled with a tungsten paste.
- the two elements are stacked and pressed against each other by hot rolling. Then the case thus produced is cooked at high temperature, for example 1600 degrees for about 40 hours.
- the metallizations can be covered with a metallic contact layer, gold, copper, or silver as the case may be.
- the hollow element then forms a low wall which surrounds the integrated circuit and contributes usefully to its protection.
- the housing is produced with only the base, the integrated circuit being after connection to the base molded in polymerizable resin.
- the invention thus described therefore makes it possible to protect the chips of the cards as well during the manufacture of the chips, which improves the yield during the assembly of the chips in smart cards for large chips such as microprocessors, that throughout the life of the card, which can be greater than 10 years.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP93901766A EP0614574A1 (fr) | 1991-11-25 | 1992-11-24 | Carte a circuit integre comprenant des moyens de protection du circuit integre |
JP5509869A JPH07501758A (ja) | 1991-11-25 | 1992-11-24 | 集積回路保護手段を備えた集積回路カード |
US08/244,364 US5574309A (en) | 1991-11-25 | 1992-11-25 | Integrated circuit card comprising means for the protection of the integrated circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR91/14505 | 1991-11-25 | ||
FR9114505A FR2684235B1 (fr) | 1991-11-25 | 1991-11-25 | Carte a circuit integre comprenant des moyens de protection du circuit integre. |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1993011564A1 true WO1993011564A1 (fr) | 1993-06-10 |
Family
ID=9419283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1992/001091 WO1993011564A1 (fr) | 1991-11-25 | 1992-11-24 | Carte a circuit integre comprenant des moyens de protection du circuit integre |
Country Status (5)
Country | Link |
---|---|
US (1) | US5574309A (fr) |
EP (1) | EP0614574A1 (fr) |
JP (1) | JPH07501758A (fr) |
FR (1) | FR2684235B1 (fr) |
WO (1) | WO1993011564A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6132799A (en) * | 1995-02-15 | 2000-10-17 | Gemplus Card International | Method for the manufacture of electronic cards and cards obtained thereby |
Families Citing this family (105)
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KR0179834B1 (ko) * | 1995-07-28 | 1999-03-20 | 문정환 | 컬럼형 패키지 |
US5877561A (en) * | 1995-07-28 | 1999-03-02 | Lg Semicon Co., Ltd. | Plate and column type semiconductor package having heat sink |
US5963796A (en) | 1996-07-29 | 1999-10-05 | Lg Semicon Co., Ltd. | Fabrication method for semiconductor package substrate and semiconductor package |
JPH0964240A (ja) * | 1995-08-25 | 1997-03-07 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
FR2741191B1 (fr) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | Procede de fabrication d'un micromodule, notamment pour cartes a puces |
US5847445A (en) * | 1996-11-04 | 1998-12-08 | Micron Technology, Inc. | Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same |
EP0980096A4 (fr) * | 1997-04-30 | 2005-03-09 | Hitachi Chemical Co Ltd | Plaquette pour monter un element a semi-conducteur, procede permettant de la produire et dispositif a semi-conducteur |
EP0895287A3 (fr) * | 1997-07-31 | 2006-04-05 | Matsushita Electric Industrial Co., Ltd. | Dispositif semiconducteur et cadre conducteur pour celui-ci |
FR2778769B1 (fr) * | 1998-05-15 | 2001-11-02 | Gemplus Sca | Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte |
FR2797076B1 (fr) * | 1999-07-30 | 2003-11-28 | Gemplus Card Int | Procede de fabrication d4une carte a puce a contact |
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- 1992-11-24 EP EP93901766A patent/EP0614574A1/fr not_active Withdrawn
- 1992-11-24 WO PCT/FR1992/001091 patent/WO1993011564A1/fr not_active Application Discontinuation
- 1992-11-25 US US08/244,364 patent/US5574309A/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
EP0614574A1 (fr) | 1994-09-14 |
US5574309A (en) | 1996-11-12 |
FR2684235B1 (fr) | 1999-12-10 |
JPH07501758A (ja) | 1995-02-23 |
FR2684235A1 (fr) | 1993-05-28 |
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