WO1991012109A1 - Procede et dispositif pour usiner une tole plaquee - Google Patents

Procede et dispositif pour usiner une tole plaquee Download PDF

Info

Publication number
WO1991012109A1
WO1991012109A1 PCT/JP1991/000141 JP9100141W WO9112109A1 WO 1991012109 A1 WO1991012109 A1 WO 1991012109A1 JP 9100141 W JP9100141 W JP 9100141W WO 9112109 A1 WO9112109 A1 WO 9112109A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal foil
reference hole
pin
hole
clad material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1991/000141
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Katsumi Hagiwara
Akihiro Tanaka
Kou Sasaki
Kiyohito Nagasawa
Shin Nemoto
Kazuhiro Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Proterial Ltd
Original Assignee
Citizen Watch Co Ltd
Sumitomo Special Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2025272A external-priority patent/JP2562505B2/ja
Priority claimed from JP2527190A external-priority patent/JPH0818148B2/ja
Priority claimed from JP2025273A external-priority patent/JP2562506B2/ja
Application filed by Citizen Watch Co Ltd, Sumitomo Special Metals Co Ltd filed Critical Citizen Watch Co Ltd
Priority to EP91903587A priority Critical patent/EP0466931B1/en
Priority to US07/768,278 priority patent/US5295296A/en
Priority to DE69128745T priority patent/DE69128745T2/de
Publication of WO1991012109A1 publication Critical patent/WO1991012109A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53348—Running-length work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
    • Y10T29/53396—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together by friction fit

Definitions

  • Japanese Patent Application Laid-Open No. 60-227456 proposes a lead frame in which an A1 foil is fixed on a lead frame material by spot welding and then formed into a clad.
  • No specific manufacturing method has been proposed for positioning metal foils with high precision at a predetermined pitch and for temporary temporary fixing, and has not yet been put to practical use.
  • it is possible to produce a spot-shaped partial clad material of a certain length by laminating a metal foil piece of a certain size on a predetermined position of a plate material of a certain length and by crimping and rolling.
  • crimping and rolling could not be born.
  • a clad is formed by using the reference holes so as to be able to perform press working with a mold continuously. It is intended to provide a method and an apparatus for press working of steel materials.
  • the upper electrode 1 5 17 together with the punch 1 5 1 3 descends further, and presses the metal foil piece S and the material W at the working position toward the rotary joints 1528 and 1529.
  • the metal foil piece S and the material W are sandwiched between the upper electrode 15 17 and the rotating electrodes 1528 and 1529, and the pressure applied to the cylinders 154 1 and 1542 and the upper electrode 1 Due to the balance of the pressing force with 5 17, a uniform pressure state is obtained.
  • a high voltage is applied between the rotating electrodes 1528 and 1529 while applying a constant pressing force, a current flows between the upper die 1517 and the rotating electrodes 1528 and 1529, and gold is applied.
  • the heat generated by the resistance is easily generated between the metal foil piece S and the material W, and as a result, the metal foil piece S is spot-welded on the material W.
  • the upper mold 2209 is lowered by a press (not shown) and moved to the lower mold 2210. Pressed.
  • a reference hole 4 (see No. 14) is formed in the clad material 1 by the hole punch 2218.
  • the positioning pin 2219 is inserted into the reference hole 4 previously drilled by the drilling punch 2218 to position the cladding material 1 when drilling the reference hole.
  • This operation is performed at a predetermined timing in accordance with the intermittent feed of the clad material 1 in the ⁇ direction by the air feeder 2208 (No. 9).
  • Has multiple reference holes 4 almost constant in a row --Open at intervals.
  • each of the molds 3801, 3802, 3811 is placed on a movable table 3017.
  • These movable tables 301 are capable of position adjustment in the direction A and the direction B-B in which the material is transported.
  • the target value of the pitch interval between the reference holes 4 is recorded in the data table in the control means 301 6 .
  • the reference hole pitch separation L32 of n inclination calculated as described above is As soon as possible, the deviation from the target value is calculated by comparing with the target value. And the resulting nluck gap Calculate the average of the quantities.
  • the data table in the control means 301 6 also describes allowable limit plants that indicate how much the pitch interval of the reference holes 4 may be reduced. Billion.
  • the pitch interval shift amount (average value) of the reference hole 4 calculated as described above is compared with the allowable limit plant.
  • FIG. 22 shows a preferred form of the press related to the press working device.
  • the press die is composed of an upper die 41010 that can move up and down, and a lower die 420 that forms a pair with the upper die.
  • the punch for punching 4101 for re-drilling the spare reference hole 4a into the circular reference hole 4 is projected and retracted from the upper die reference surface 4101a. It is provided.
  • the vertical movement of the upper die 410 and the emergence of the punch 410 from the reference surface 410a of the punch 410 are respectively performed by unillustrated means.
  • the diameter of the correction pin 4102 having a circular cross section is the same as that of the reference hole 4a. It can be used because it is not restricted by the sides (dimensions in the direction perpendicular to the direction of feed of the cladding material), and it is also possible to use the correction pin 4102 with a rectangular cross section.
  • the metal foil S and the reference hole 4 By repeating such press working, the metal foil S and the reference hole 4 The accumulated error of the pitch between the metal foil S and the base hole 4 can be absorbed within the same accuracy as the pitch accuracy of the metal foil S without performing the pitch measurement.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Lead Frames For Integrated Circuits (AREA)
PCT/JP1991/000141 1990-02-06 1991-02-06 Procede et dispositif pour usiner une tole plaquee Ceased WO1991012109A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP91903587A EP0466931B1 (en) 1990-02-06 1991-02-06 Method of for working clad plate
US07/768,278 US5295296A (en) 1990-02-06 1991-02-06 Method and apparatus for working a clad material
DE69128745T DE69128745T2 (de) 1990-02-06 1991-02-06 Verfahren zum bearbeiten eines beschichteten bleches

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2025272A JP2562505B2 (ja) 1990-02-06 1990-02-06 加工用基準穴位置調整方法
JP2527190A JPH0818148B2 (ja) 1990-02-06 1990-02-06 スポット状部分クラッド材の製造方法およびその装置
JP2025273A JP2562506B2 (ja) 1990-02-06 1990-02-06 帯材の加工方法
JP2/25273 1990-02-06
JP2/25271 1990-02-06
JP2/25272 1990-02-06

Publications (1)

Publication Number Publication Date
WO1991012109A1 true WO1991012109A1 (fr) 1991-08-22

Family

ID=27284964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1991/000141 Ceased WO1991012109A1 (fr) 1990-02-06 1991-02-06 Procede et dispositif pour usiner une tole plaquee

Country Status (5)

Country Link
US (1) US5295296A (https=)
EP (1) EP0466931B1 (https=)
KR (1) KR100219695B1 (https=)
DE (1) DE69128745T2 (https=)
WO (1) WO1991012109A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2135364C1 (ru) * 1998-05-13 1999-08-27 Ситников Игорь Викторович Способ изготовления слоистых металлических материалов

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1007866A3 (nl) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager.
US6088901A (en) * 1997-06-10 2000-07-18 Siemens Aktiengesellschaft Method for producing a carrier element for semiconductor chips
JP2000343144A (ja) * 1999-06-04 2000-12-12 Denso Corp プレス成形品の製造方法
AU2001282581A1 (en) * 2000-09-01 2002-03-13 Showa Denko K K Apparatus for producing capacitor element member
KR100465848B1 (ko) * 2003-05-07 2005-01-13 김병식 알루미늄 하니컴 복합 판넬의 연속적 제조 시스템
WO2004110665A1 (ja) * 2003-06-10 2004-12-23 Beac Co., Ltd. 穿孔装置、穿孔用金型、穿孔方法及び穿孔用金型の位置決め固定方法
CN102441602A (zh) * 2011-09-23 2012-05-09 铜陵三佳山田科技有限公司 一种大规模集成电路冲流道模具定位装置
US20200030901A1 (en) * 2015-06-12 2020-01-30 Makino Milling Machine Co., Ltd. Small-hole electric discharge machining machine
KR101905694B1 (ko) * 2018-03-15 2018-11-30 김완선 판재가공장치 및 판재가공방법
US11701736B2 (en) 2021-09-30 2023-07-18 Wiegel Tool Works, Inc. Systems and methods for making a composite thickness metal part

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176128U (https=) * 1981-04-30 1982-11-08
JPS59141389A (ja) * 1983-02-01 1984-08-14 Hitachi Cable Ltd 部分クラツド材の製造方法
JPS6087938A (ja) * 1983-10-19 1985-05-17 Rhythm Watch Co Ltd 薄板の加工方法
JPS61167248U (https=) * 1985-04-02 1986-10-17
JPS6371926U (https=) * 1986-10-30 1988-05-13
JPH01317633A (ja) * 1988-06-17 1989-12-22 Toshiba Corp プレス装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices
US3931922A (en) * 1972-01-29 1976-01-13 Ferranti, Limited Apparatus for mounting semiconductor devices
US3968563A (en) * 1975-03-27 1976-07-13 E. I. Du Pont De Nemours And Company Precision registration system for leads
JPS5530859A (en) * 1978-08-25 1980-03-04 Nitto Electric Ind Co Ltd Method of making carrier tape for ic
US4458413A (en) * 1981-01-26 1984-07-10 Olin Corporation Process for forming multi-gauge strip
JPS60227456A (ja) * 1984-04-26 1985-11-12 Nec Corp 半導体装置用リ−ドフレ−ム
JPS6120361A (ja) * 1984-07-09 1986-01-29 Shinko Electric Ind Co Ltd 半導体装置用リ−ドフレ−ムの製造方法
JPS60242632A (ja) * 1985-05-07 1985-12-02 Sanyo Electric Co Ltd 集積回路の多量製造方法
US4980219A (en) * 1988-04-06 1990-12-25 Casio Computer Co., Ltd. Carrier tape for bonding IC devices and method of using the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176128U (https=) * 1981-04-30 1982-11-08
JPS59141389A (ja) * 1983-02-01 1984-08-14 Hitachi Cable Ltd 部分クラツド材の製造方法
JPS6087938A (ja) * 1983-10-19 1985-05-17 Rhythm Watch Co Ltd 薄板の加工方法
JPS61167248U (https=) * 1985-04-02 1986-10-17
JPS6371926U (https=) * 1986-10-30 1988-05-13
JPH01317633A (ja) * 1988-06-17 1989-12-22 Toshiba Corp プレス装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2135364C1 (ru) * 1998-05-13 1999-08-27 Ситников Игорь Викторович Способ изготовления слоистых металлических материалов

Also Published As

Publication number Publication date
US5295296A (en) 1994-03-22
EP0466931A1 (en) 1992-01-22
DE69128745D1 (de) 1998-02-26
KR920700836A (ko) 1992-08-10
EP0466931B1 (en) 1998-01-21
EP0466931A4 (https=) 1994-01-19
KR100219695B1 (ko) 1999-09-01
DE69128745T2 (de) 1998-06-18

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