DE69128745D1 - Verfahren zum bearbeiten eines beschichteten bleches - Google Patents
Verfahren zum bearbeiten eines beschichteten blechesInfo
- Publication number
- DE69128745D1 DE69128745D1 DE69128745T DE69128745T DE69128745D1 DE 69128745 D1 DE69128745 D1 DE 69128745D1 DE 69128745 T DE69128745 T DE 69128745T DE 69128745 T DE69128745 T DE 69128745T DE 69128745 D1 DE69128745 D1 DE 69128745D1
- Authority
- DE
- Germany
- Prior art keywords
- processing
- coated sheet
- coated
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
- Y10T29/53348—Running-length work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
- Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
- Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
- Y10T29/53396—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together by friction fit
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2025272A JP2562505B2 (ja) | 1990-02-06 | 1990-02-06 | 加工用基準穴位置調整方法 |
JP2025273A JP2562506B2 (ja) | 1990-02-06 | 1990-02-06 | 帯材の加工方法 |
JP2527190A JPH0818148B2 (ja) | 1990-02-06 | 1990-02-06 | スポット状部分クラッド材の製造方法およびその装置 |
PCT/JP1991/000141 WO1991012109A1 (en) | 1990-02-06 | 1991-02-06 | Method of and device for working clad plate |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69128745D1 true DE69128745D1 (de) | 1998-02-26 |
DE69128745T2 DE69128745T2 (de) | 1998-06-18 |
Family
ID=27284964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69128745T Expired - Fee Related DE69128745T2 (de) | 1990-02-06 | 1991-02-06 | Verfahren zum bearbeiten eines beschichteten bleches |
Country Status (5)
Country | Link |
---|---|
US (1) | US5295296A (de) |
EP (1) | EP0466931B1 (de) |
KR (1) | KR100219695B1 (de) |
DE (1) | DE69128745T2 (de) |
WO (1) | WO1991012109A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1007866A3 (nl) * | 1993-12-10 | 1995-11-07 | Koninkl Philips Electronics Nv | Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager. |
US6088901A (en) * | 1997-06-10 | 2000-07-18 | Siemens Aktiengesellschaft | Method for producing a carrier element for semiconductor chips |
JP2000343144A (ja) * | 1999-06-04 | 2000-12-12 | Denso Corp | プレス成形品の製造方法 |
US7398593B2 (en) * | 2000-09-01 | 2008-07-15 | Showa Denko K.K. | Apparatus for producing capacitor element member |
KR100465848B1 (ko) * | 2003-05-07 | 2005-01-13 | 김병식 | 알루미늄 하니컴 복합 판넬의 연속적 제조 시스템 |
CN101028718A (zh) * | 2003-06-10 | 2007-09-05 | 倍科有限公司 | 穿孔装置 |
CN102441602A (zh) * | 2011-09-23 | 2012-05-09 | 铜陵三佳山田科技有限公司 | 一种大规模集成电路冲流道模具定位装置 |
WO2016199302A1 (ja) * | 2015-06-12 | 2016-12-15 | 株式会社牧野フライス製作所 | 細穴放電加工機 |
KR101905694B1 (ko) * | 2018-03-15 | 2018-11-30 | 김완선 | 판재가공장치 및 판재가공방법 |
US11701736B2 (en) | 2021-09-30 | 2023-07-18 | Wiegel Tool Works, Inc. | Systems and methods for making a composite thickness metal part |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3559285A (en) * | 1968-01-08 | 1971-02-02 | Jade Corp | Method of forming leads for attachment to semi-conductor devices |
US3931922A (en) * | 1972-01-29 | 1976-01-13 | Ferranti, Limited | Apparatus for mounting semiconductor devices |
US3968563A (en) * | 1975-03-27 | 1976-07-13 | E. I. Du Pont De Nemours And Company | Precision registration system for leads |
JPS5530859A (en) * | 1978-08-25 | 1980-03-04 | Nitto Electric Ind Co Ltd | Method of making carrier tape for ic |
US4458413A (en) * | 1981-01-26 | 1984-07-10 | Olin Corporation | Process for forming multi-gauge strip |
JPS57176128U (de) * | 1981-04-30 | 1982-11-08 | ||
JPS59141389A (ja) * | 1983-02-01 | 1984-08-14 | Hitachi Cable Ltd | 部分クラツド材の製造方法 |
JPS59174287A (ja) * | 1983-03-23 | 1984-10-02 | Hitachi Cable Ltd | 部分クラツド材の製造方法 |
JPS6087938A (ja) * | 1983-10-19 | 1985-05-17 | Rhythm Watch Co Ltd | 薄板の加工方法 |
JPS60227456A (ja) * | 1984-04-26 | 1985-11-12 | Nec Corp | 半導体装置用リ−ドフレ−ム |
JPS6120361A (ja) * | 1984-07-09 | 1986-01-29 | Shinko Electric Ind Co Ltd | 半導体装置用リ−ドフレ−ムの製造方法 |
JPS61167248U (de) * | 1985-04-02 | 1986-10-17 | ||
JPS60242632A (ja) * | 1985-05-07 | 1985-12-02 | Sanyo Electric Co Ltd | 集積回路の多量製造方法 |
JPS6371926U (de) * | 1986-10-30 | 1988-05-13 | ||
US4980219A (en) * | 1988-04-06 | 1990-12-25 | Casio Computer Co., Ltd. | Carrier tape for bonding IC devices and method of using the same |
JPH01317633A (ja) * | 1988-06-17 | 1989-12-22 | Toshiba Corp | プレス装置 |
JPH0651237B2 (ja) * | 1989-04-21 | 1994-07-06 | 住友特殊金属株式会社 | スポット状部分クラッド材の製造方法 |
JPH06102273B2 (ja) * | 1989-06-02 | 1994-12-14 | 住友特殊金属株式会社 | スポット状部分クラッド材の製造方法 |
-
1991
- 1991-02-06 WO PCT/JP1991/000141 patent/WO1991012109A1/ja active IP Right Grant
- 1991-02-06 US US07/768,278 patent/US5295296A/en not_active Expired - Fee Related
- 1991-02-06 DE DE69128745T patent/DE69128745T2/de not_active Expired - Fee Related
- 1991-02-06 EP EP91903587A patent/EP0466931B1/de not_active Expired - Lifetime
- 1991-10-05 KR KR1019910701258A patent/KR100219695B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0466931B1 (de) | 1998-01-21 |
US5295296A (en) | 1994-03-22 |
EP0466931A4 (de) | 1994-01-19 |
DE69128745T2 (de) | 1998-06-18 |
KR100219695B1 (ko) | 1999-09-01 |
EP0466931A1 (de) | 1992-01-22 |
KR920700836A (ko) | 1992-08-10 |
WO1991012109A1 (en) | 1991-08-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |