JPS5530859A - Method of making carrier tape for ic - Google Patents

Method of making carrier tape for ic

Info

Publication number
JPS5530859A
JPS5530859A JP10411778A JP10411778A JPS5530859A JP S5530859 A JPS5530859 A JP S5530859A JP 10411778 A JP10411778 A JP 10411778A JP 10411778 A JP10411778 A JP 10411778A JP S5530859 A JPS5530859 A JP S5530859A
Authority
JP
Japan
Prior art keywords
carrier tape
coated
tape
conductor foil
separator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10411778A
Other languages
Japanese (ja)
Inventor
Mitsumasa Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP10411778A priority Critical patent/JPS5530859A/en
Publication of JPS5530859A publication Critical patent/JPS5530859A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To provide a carrier tape for use in IC which is designed to lighten or decrease burdens and costs on the part of IC undertakers by providing in advance a bonding bupm at the tip of a finger of the carrier tape.
CONSTITUTION: Along each side of a tape 1, a row of splocket perforations is provided. The surface of the tape at its central part, i.e., excluding the perforation areas, is coated with a bonding agent, and a separator is adhered to the coated surface. Then device holes 6 and window holes 7 are provided at predetermined intervals. Thereupon, the separator is peeled off the surface and, in its place, a prepared tapelike piece of conductor foil 5 is adhered by lamination, followed by smoothening the foil surface. The smoothened surface of conductor foil 5 is coated with a photoresist, and the coated surface is exposed tolight, so that a low melting- point metal being material for bump formation is adsorbed on conductor foil 5 at a predetermined place. Then, the formation of finger patterns is carried out, to finally obtain the desired carrier tape for use in IC.
COPYRIGHT: (C)1980,JPO&Japio
JP10411778A 1978-08-25 1978-08-25 Method of making carrier tape for ic Pending JPS5530859A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10411778A JPS5530859A (en) 1978-08-25 1978-08-25 Method of making carrier tape for ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10411778A JPS5530859A (en) 1978-08-25 1978-08-25 Method of making carrier tape for ic

Publications (1)

Publication Number Publication Date
JPS5530859A true JPS5530859A (en) 1980-03-04

Family

ID=14372174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10411778A Pending JPS5530859A (en) 1978-08-25 1978-08-25 Method of making carrier tape for ic

Country Status (1)

Country Link
JP (1) JPS5530859A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224264A (en) * 1991-04-04 1993-07-06 Chisso Corporation Process for producing a film carrier having a superior lead strength
US5295296A (en) * 1990-02-06 1994-03-22 Citizen Watch Co., Ltd. Method and apparatus for working a clad material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5295296A (en) * 1990-02-06 1994-03-22 Citizen Watch Co., Ltd. Method and apparatus for working a clad material
US5224264A (en) * 1991-04-04 1993-07-06 Chisso Corporation Process for producing a film carrier having a superior lead strength

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