JPS6449224A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6449224A JPS6449224A JP20719687A JP20719687A JPS6449224A JP S6449224 A JPS6449224 A JP S6449224A JP 20719687 A JP20719687 A JP 20719687A JP 20719687 A JP20719687 A JP 20719687A JP S6449224 A JPS6449224 A JP S6449224A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- tape
- roller
- film
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To avoid crackings of a semiconductor wafer by a method wherein a roller with adhesiveness is pressed against the surface of the semiconductor wafer and rotated to peel off and remove an excessive metal layer except an electrode part. CONSTITUTION:When an adhesive tape 13 wound around a roller 11 touches a certain position A of a semiconductor wafer 14, an Al film at the position A adheres to the tape 13. The roller 11 is rotated counter-clockwise and the tape 13 leaves the wafer 14 at a position B. At that time, the Al film adheres to the tape 13 and is peeled and removed off the wafer 14. By this method, when the tape 13 leaves the wafer 14, almost no shearing force is applied to the wafer 14. Therefore, the Al film only can be peeled off and removed to form a required electrode part without breaking the wafer 14. With this constitution, crackings in the wafer 14 can be avoided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20719687A JPS6449224A (en) | 1987-08-19 | 1987-08-19 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20719687A JPS6449224A (en) | 1987-08-19 | 1987-08-19 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6449224A true JPS6449224A (en) | 1989-02-23 |
Family
ID=16535834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20719687A Pending JPS6449224A (en) | 1987-08-19 | 1987-08-19 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6449224A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011058859A1 (en) * | 2009-11-13 | 2011-05-19 | コニカミノルタホールディングス株式会社 | Method for forming electrode pattern and method for manufacturing thin film transistor |
US8318246B2 (en) | 2000-07-21 | 2012-11-27 | Zachary Gillman | Process for preparing compacted pigment granules, process for preparing encapsulated pigment granules, and process for dyeing landscaping and/or construction materials |
-
1987
- 1987-08-19 JP JP20719687A patent/JPS6449224A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8318246B2 (en) | 2000-07-21 | 2012-11-27 | Zachary Gillman | Process for preparing compacted pigment granules, process for preparing encapsulated pigment granules, and process for dyeing landscaping and/or construction materials |
WO2011058859A1 (en) * | 2009-11-13 | 2011-05-19 | コニカミノルタホールディングス株式会社 | Method for forming electrode pattern and method for manufacturing thin film transistor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE66085T1 (en) | PULLER AND ITS USE. | |
WO1996002450A3 (en) | Apparatus for applying adhesive tape | |
ES2177880T3 (en) | ADHESIVE TAPE. | |
KR850000297A (en) | Peeling method of protective film | |
MY122222A (en) | A dicing tape and a method of dicing a semiconductor wafer | |
EP0218873A3 (en) | Film peeling apparatus | |
CA2027067A1 (en) | Method for forming a continuous oxide superconductor layer having different thickness portions for superconductor device | |
JPS6449224A (en) | Manufacture of semiconductor device | |
EP0268290A3 (en) | Film peeling apparatus | |
ES2003544A6 (en) | Method for selectively removing adhesives from polyimide substrates. | |
JPS61280660A (en) | Manufacture of semiconductor device | |
JPS6412553A (en) | Manufacture of semiconductor device | |
JPH02293721A (en) | Method for sticking anisotropic conductive film | |
JPH043606B2 (en) | ||
JPS5742157A (en) | Formation of pattern for circuit substrate | |
JPS58169989A (en) | Method of isolating film protecting film | |
JPS57120672A (en) | Plasma etching method | |
JPS52124860A (en) | Electrode formation method for semiconductor devices | |
JPS56144553A (en) | Manufacture of semiconductor device | |
JPS5676543A (en) | Semiconductor element | |
JPS6331971A (en) | Method of applying adhesive tape on frame | |
JPS574116A (en) | Manufacture of semiconductor substrate | |
JPS57211776A (en) | Manufacture of compound semiconductor device | |
JPS5585668A (en) | Adhering layer forming method | |
JPS57197837A (en) | Manufacture of semiconductor device |