JPS6449224A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6449224A
JPS6449224A JP20719687A JP20719687A JPS6449224A JP S6449224 A JPS6449224 A JP S6449224A JP 20719687 A JP20719687 A JP 20719687A JP 20719687 A JP20719687 A JP 20719687A JP S6449224 A JPS6449224 A JP S6449224A
Authority
JP
Japan
Prior art keywords
wafer
tape
roller
film
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20719687A
Other languages
Japanese (ja)
Inventor
Tatsuji Mino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP20719687A priority Critical patent/JPS6449224A/en
Publication of JPS6449224A publication Critical patent/JPS6449224A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To avoid crackings of a semiconductor wafer by a method wherein a roller with adhesiveness is pressed against the surface of the semiconductor wafer and rotated to peel off and remove an excessive metal layer except an electrode part. CONSTITUTION:When an adhesive tape 13 wound around a roller 11 touches a certain position A of a semiconductor wafer 14, an Al film at the position A adheres to the tape 13. The roller 11 is rotated counter-clockwise and the tape 13 leaves the wafer 14 at a position B. At that time, the Al film adheres to the tape 13 and is peeled and removed off the wafer 14. By this method, when the tape 13 leaves the wafer 14, almost no shearing force is applied to the wafer 14. Therefore, the Al film only can be peeled off and removed to form a required electrode part without breaking the wafer 14. With this constitution, crackings in the wafer 14 can be avoided.
JP20719687A 1987-08-19 1987-08-19 Manufacture of semiconductor device Pending JPS6449224A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20719687A JPS6449224A (en) 1987-08-19 1987-08-19 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20719687A JPS6449224A (en) 1987-08-19 1987-08-19 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6449224A true JPS6449224A (en) 1989-02-23

Family

ID=16535834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20719687A Pending JPS6449224A (en) 1987-08-19 1987-08-19 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6449224A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058859A1 (en) * 2009-11-13 2011-05-19 コニカミノルタホールディングス株式会社 Method for forming electrode pattern and method for manufacturing thin film transistor
US8318246B2 (en) 2000-07-21 2012-11-27 Zachary Gillman Process for preparing compacted pigment granules, process for preparing encapsulated pigment granules, and process for dyeing landscaping and/or construction materials

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8318246B2 (en) 2000-07-21 2012-11-27 Zachary Gillman Process for preparing compacted pigment granules, process for preparing encapsulated pigment granules, and process for dyeing landscaping and/or construction materials
WO2011058859A1 (en) * 2009-11-13 2011-05-19 コニカミノルタホールディングス株式会社 Method for forming electrode pattern and method for manufacturing thin film transistor

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