JPS5585668A - Adhering layer forming method - Google Patents

Adhering layer forming method

Info

Publication number
JPS5585668A
JPS5585668A JP15861478A JP15861478A JPS5585668A JP S5585668 A JPS5585668 A JP S5585668A JP 15861478 A JP15861478 A JP 15861478A JP 15861478 A JP15861478 A JP 15861478A JP S5585668 A JPS5585668 A JP S5585668A
Authority
JP
Japan
Prior art keywords
thin film
film
substrate
metal film
adhering layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15861478A
Other languages
Japanese (ja)
Other versions
JPS5817828B2 (en
Inventor
Tomio Kume
Yoshio Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP53158614A priority Critical patent/JPS5817828B2/en
Publication of JPS5585668A publication Critical patent/JPS5585668A/en
Publication of JPS5817828B2 publication Critical patent/JPS5817828B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Magnetic Heads (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To prevent exfoliation of a metal film from a substrate by forming an Al or Al alloy thin film on the substrate and forming the metal film on the thin film as an adhering layer to surely adhere the substrate and the metal film. CONSTITUTION:On a single crystal substrate of rock crystal or sapphire an Al or Al alloy thin film of 0.1mu or less in thickness is formed pref. by sputtering. On this film a metal film such as Permalloy or copper film is formed by sputtering, vacuum deposition or other method. A Ti thin film may pref. be formed on the Al thin film to provide an adhering layer of two-layer structure, so occurrence of surface unevenness due to recrystallization of Al is prevented in heat treatment. The Al thin film can be formed at a relatively low temp. and shows strong adhering force. This method can be applied esp. to manufacture of a thin film magnetic head.
JP53158614A 1978-12-25 1978-12-25 Adhesive layer formation method Expired JPS5817828B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53158614A JPS5817828B2 (en) 1978-12-25 1978-12-25 Adhesive layer formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53158614A JPS5817828B2 (en) 1978-12-25 1978-12-25 Adhesive layer formation method

Publications (2)

Publication Number Publication Date
JPS5585668A true JPS5585668A (en) 1980-06-27
JPS5817828B2 JPS5817828B2 (en) 1983-04-09

Family

ID=15675549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53158614A Expired JPS5817828B2 (en) 1978-12-25 1978-12-25 Adhesive layer formation method

Country Status (1)

Country Link
JP (1) JPS5817828B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104118A (en) * 1992-09-18 1994-04-15 Nec Corp Soft magnetic thin film and its production

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS476454U (en) * 1971-02-15 1972-09-21
JPS4826969A (en) * 1971-08-19 1973-04-09
JPS499260A (en) * 1972-05-16 1974-01-26
JPS4959046A (en) * 1972-10-12 1974-06-07
JPS5017336A (en) * 1973-06-19 1975-02-24
JPS5217338A (en) * 1975-08-01 1977-02-09 Suwa Seikosha Kk Method of attaching thin film of magnetic material
JPS5266835A (en) * 1975-12-02 1977-06-02 Mitsubishi Heavy Ind Ltd Surface treating method of metals

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS476454U (en) * 1971-02-15 1972-09-21
JPS4826969A (en) * 1971-08-19 1973-04-09
JPS499260A (en) * 1972-05-16 1974-01-26
JPS4959046A (en) * 1972-10-12 1974-06-07
JPS5017336A (en) * 1973-06-19 1975-02-24
JPS5217338A (en) * 1975-08-01 1977-02-09 Suwa Seikosha Kk Method of attaching thin film of magnetic material
JPS5266835A (en) * 1975-12-02 1977-06-02 Mitsubishi Heavy Ind Ltd Surface treating method of metals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104118A (en) * 1992-09-18 1994-04-15 Nec Corp Soft magnetic thin film and its production

Also Published As

Publication number Publication date
JPS5817828B2 (en) 1983-04-09

Similar Documents

Publication Publication Date Title
JPS57500292A (en)
GB1418278A (en) Integrated circuit devices
GB1514664A (en) Method of forming an electrically insulative coating
GB1513851A (en) Method of depositing a thin film of magnetic iron-silicon upon a substrate and product thereof
JPS5585668A (en) Adhering layer forming method
ES464859A1 (en) Laminated bearing material produced by thermokinetic plating
EP0405896A3 (en) Process for growing crystal
JPS5484932A (en) Forming method of multi-layer construction
JPS5567928A (en) Forming method for closely contacted layer of thin-film magnetic head
JPS5441681A (en) Manufacture for high frequency transistor
JPS6476736A (en) Manufacture of semiconductor device
JPS6486577A (en) Preparation of superconductive oxide film
GB1512029A (en) Formation of thin layer patterns on a substrate
JPS51126384A (en) A method of forming a thin film by sputtering
JPS57116773A (en) Production of metallic mask
JPS6421943A (en) Semiconductor device
JPS5792829A (en) Forming method for electrode
JPS56147449A (en) Pattern forming method
JPS6449224A (en) Manufacture of semiconductor device
JPS5625220A (en) Manufacture of thih-film magnetic head
JPS5750324A (en) Magnetic disc substrate
JPS5329109A (en) Magnetic substance forming method of thin film magnetic head
JPS57183055A (en) Semiconductor device
Werner et al. Influence of RF-Diode, RF-Magnetron and DC-Magnetron Mode on the Crystallographic and Magnetic Properties of Sputtered Co--Cr Films
JPS57164980A (en) Sputtering device