KR100219695B1 - 클래드재의 제조방법과 제조장치 - Google Patents

클래드재의 제조방법과 제조장치 Download PDF

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Publication number
KR100219695B1
KR100219695B1 KR1019910701258A KR910701258A KR100219695B1 KR 100219695 B1 KR100219695 B1 KR 100219695B1 KR 1019910701258 A KR1019910701258 A KR 1019910701258A KR 910701258 A KR910701258 A KR 910701258A KR 100219695 B1 KR100219695 B1 KR 100219695B1
Authority
KR
South Korea
Prior art keywords
metal foil
reference hole
hole
pin
punch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019910701258A
Other languages
English (en)
Korean (ko)
Other versions
KR920700836A (ko
Inventor
하기와라카쓰미
다나까아끼히로
사사끼고오
나가사와기요히토
네모또신
야마모또카즈히로
Original Assignee
하루타 히로시
시티즌도케이 가부시키가이샤
오카모토 유지
스미토모 도큐슈 긴조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2025272A external-priority patent/JP2562505B2/ja
Priority claimed from JP2527190A external-priority patent/JPH0818148B2/ja
Priority claimed from JP2025273A external-priority patent/JP2562506B2/ja
Application filed by 하루타 히로시, 시티즌도케이 가부시키가이샤, 오카모토 유지, 스미토모 도큐슈 긴조쿠 가부시키가이샤 filed Critical 하루타 히로시
Publication of KR920700836A publication Critical patent/KR920700836A/ko
Application granted granted Critical
Publication of KR100219695B1 publication Critical patent/KR100219695B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53348—Running-length work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
    • Y10T29/53396—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together by friction fit

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019910701258A 1990-02-06 1991-10-05 클래드재의 제조방법과 제조장치 Expired - Fee Related KR100219695B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2025272A JP2562505B2 (ja) 1990-02-06 1990-02-06 加工用基準穴位置調整方法
JP2527190A JPH0818148B2 (ja) 1990-02-06 1990-02-06 スポット状部分クラッド材の製造方法およびその装置
JP2-25272 1990-02-06
JP2-25271 1990-02-06
JP2-25273 1990-02-06
JP2025273A JP2562506B2 (ja) 1990-02-06 1990-02-06 帯材の加工方法

Publications (2)

Publication Number Publication Date
KR920700836A KR920700836A (ko) 1992-08-10
KR100219695B1 true KR100219695B1 (ko) 1999-09-01

Family

ID=27284964

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701258A Expired - Fee Related KR100219695B1 (ko) 1990-02-06 1991-10-05 클래드재의 제조방법과 제조장치

Country Status (5)

Country Link
US (1) US5295296A (https=)
EP (1) EP0466931B1 (https=)
KR (1) KR100219695B1 (https=)
DE (1) DE69128745T2 (https=)
WO (1) WO1991012109A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101905694B1 (ko) * 2018-03-15 2018-11-30 김완선 판재가공장치 및 판재가공방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1007866A3 (nl) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager.
US6088901A (en) * 1997-06-10 2000-07-18 Siemens Aktiengesellschaft Method for producing a carrier element for semiconductor chips
RU2135364C1 (ru) * 1998-05-13 1999-08-27 Ситников Игорь Викторович Способ изготовления слоистых металлических материалов
JP2000343144A (ja) * 1999-06-04 2000-12-12 Denso Corp プレス成形品の製造方法
AU2001282581A1 (en) * 2000-09-01 2002-03-13 Showa Denko K K Apparatus for producing capacitor element member
KR100465848B1 (ko) * 2003-05-07 2005-01-13 김병식 알루미늄 하니컴 복합 판넬의 연속적 제조 시스템
WO2004110665A1 (ja) * 2003-06-10 2004-12-23 Beac Co., Ltd. 穿孔装置、穿孔用金型、穿孔方法及び穿孔用金型の位置決め固定方法
CN102441602A (zh) * 2011-09-23 2012-05-09 铜陵三佳山田科技有限公司 一种大规模集成电路冲流道模具定位装置
US20200030901A1 (en) * 2015-06-12 2020-01-30 Makino Milling Machine Co., Ltd. Small-hole electric discharge machining machine
US11701736B2 (en) 2021-09-30 2023-07-18 Wiegel Tool Works, Inc. Systems and methods for making a composite thickness metal part

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices
US3931922A (en) * 1972-01-29 1976-01-13 Ferranti, Limited Apparatus for mounting semiconductor devices
US3968563A (en) * 1975-03-27 1976-07-13 E. I. Du Pont De Nemours And Company Precision registration system for leads
JPS5530859A (en) * 1978-08-25 1980-03-04 Nitto Electric Ind Co Ltd Method of making carrier tape for ic
US4458413A (en) * 1981-01-26 1984-07-10 Olin Corporation Process for forming multi-gauge strip
JPS57176128U (https=) * 1981-04-30 1982-11-08
JPS59141389A (ja) * 1983-02-01 1984-08-14 Hitachi Cable Ltd 部分クラツド材の製造方法
JPS6087938A (ja) * 1983-10-19 1985-05-17 Rhythm Watch Co Ltd 薄板の加工方法
JPS60227456A (ja) * 1984-04-26 1985-11-12 Nec Corp 半導体装置用リ−ドフレ−ム
JPS6120361A (ja) * 1984-07-09 1986-01-29 Shinko Electric Ind Co Ltd 半導体装置用リ−ドフレ−ムの製造方法
JPS61167248U (https=) * 1985-04-02 1986-10-17
JPS60242632A (ja) * 1985-05-07 1985-12-02 Sanyo Electric Co Ltd 集積回路の多量製造方法
JPS6371926U (https=) * 1986-10-30 1988-05-13
US4980219A (en) * 1988-04-06 1990-12-25 Casio Computer Co., Ltd. Carrier tape for bonding IC devices and method of using the same
JPH01317633A (ja) * 1988-06-17 1989-12-22 Toshiba Corp プレス装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101905694B1 (ko) * 2018-03-15 2018-11-30 김완선 판재가공장치 및 판재가공방법

Also Published As

Publication number Publication date
US5295296A (en) 1994-03-22
EP0466931A1 (en) 1992-01-22
DE69128745D1 (de) 1998-02-26
WO1991012109A1 (fr) 1991-08-22
KR920700836A (ko) 1992-08-10
EP0466931B1 (en) 1998-01-21
EP0466931A4 (https=) 1994-01-19
DE69128745T2 (de) 1998-06-18

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