USD931240S1 - Substrate support pedestal - Google Patents

Substrate support pedestal Download PDF

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Publication number
USD931240S1
USD931240S1 US29/700,012 US201929700012F USD931240S US D931240 S1 USD931240 S1 US D931240S1 US 201929700012 F US201929700012 F US 201929700012F US D931240 S USD931240 S US D931240S
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United States
Prior art keywords
substrate support
support pedestal
pedestal
view
elevation view
Prior art date
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Active
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US29/700,012
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English (en)
Inventor
Changhun Lee
Michael D. Willwerth
Jeffrey Ludwig
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Applied Materials Inc
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Applied Materials Inc
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Priority to US29/700,012 priority Critical patent/USD931240S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, CHANGHUN, LUDWIG, Jeffrey, WILLWERTH, MICHAEL D.
Priority to TW109306863F priority patent/TWD211589S/zh
Priority to TW109300093F priority patent/TWD213398S/zh
Priority to JPD2020-1663F priority patent/JP1667763S/ja
Priority to JPD2020-1659F priority patent/JP1667762S/ja
Application granted granted Critical
Publication of USD931240S1 publication Critical patent/USD931240S1/en
Active legal-status Critical Current
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US29/700,012 2019-07-30 2019-07-30 Substrate support pedestal Active USD931240S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/700,012 USD931240S1 (en) 2019-07-30 2019-07-30 Substrate support pedestal
TW109306863F TWD211589S (zh) 2019-07-30 2020-01-08 基板支撐底座
TW109300093F TWD213398S (zh) 2019-07-30 2020-01-08 基板支撐底座
JPD2020-1663F JP1667763S (cg-RX-API-DMAC10.html) 2019-07-30 2020-01-30
JPD2020-1659F JP1667762S (cg-RX-API-DMAC10.html) 2019-07-30 2020-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/700,012 USD931240S1 (en) 2019-07-30 2019-07-30 Substrate support pedestal

Publications (1)

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USD931240S1 true USD931240S1 (en) 2021-09-21

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ID=72322262

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/700,012 Active USD931240S1 (en) 2019-07-30 2019-07-30 Substrate support pedestal

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US (1) USD931240S1 (cg-RX-API-DMAC10.html)
JP (2) JP1667762S (cg-RX-API-DMAC10.html)
TW (2) TWD213398S (cg-RX-API-DMAC10.html)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD956376S1 (en) * 2019-12-18 2022-06-28 Goldeep Ltd. Vacuum bag valve
USD969760S1 (en) * 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD990533S1 (en) * 2020-10-21 2023-06-27 Bryan Ross Schmitt Sanding table for attachment to a garbage can
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1057675S1 (en) * 2021-04-12 2025-01-14 Lam Research Corporation Pedestal for a substrate processing system
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1073758S1 (en) * 2022-10-13 2025-05-06 Lam Research Corporation Baffle for substrate processing system
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1092578S1 (en) * 2023-10-10 2025-09-09 Guangzhou Avison Trading Co., Ltd. Chuck set
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate

Citations (31)

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USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
KR20070017255A (ko) 2005-08-06 2007-02-09 삼성전자주식회사 플라즈마 장치의 반도체 기판 고정 장치
US20080190367A1 (en) 2007-02-12 2008-08-14 Samsung Electronics Co., Ltd. Chuck assembly and high density plasma equipment having the same
JP2008244079A (ja) 2007-03-27 2008-10-09 Ulvac Japan Ltd 成膜装置
USD621804S1 (en) * 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
US20110031111A1 (en) 2009-08-07 2011-02-10 Tokyo Electron Limited Substrate processing apparatus, positioning method and focus ring installation method
USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate
US20120329000A1 (en) 2010-03-23 2012-12-27 Osamu Hirakawa Substrate processing apparatus, substrate processing method, program and computer storage medium
US20140008349A1 (en) 2012-07-03 2014-01-09 Applied Materials, Inc. Substrate support for substrate backside contamination control
US20140011153A1 (en) * 2012-07-03 2014-01-09 Watlow Electric Manufacturing Company Pedestal construction with low coefficient of thermal expansion top
US20140144901A1 (en) 2012-11-26 2014-05-29 Applied Materials, Inc. Substrate support with wire mesh plasma containment
USD708651S1 (en) * 2011-11-22 2014-07-08 Applied Materials, Inc. Electrostatic chuck
US20140217665A1 (en) 2013-02-01 2014-08-07 Applied Materials, Inc. Substrate support with controlled sealing gap
TWD163540S (zh) 2013-03-28 2014-10-11 平田機工股份有限公司 晶圓載入／載出腔用蓋
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
US20160002778A1 (en) 2014-07-03 2016-01-07 Applied Materials, Inc. Substrate support with more uniform edge purge
JP1547357S (cg-RX-API-DMAC10.html) 2015-07-27 2016-04-11
TWD177006S (zh) 2014-12-25 2016-07-11 東京威力科創股份有限公司 半導體製造裝置用附設研磨部之清洗刷之部分
US9779971B2 (en) 2014-04-11 2017-10-03 Applied Materials, Inc. Methods and apparatus for rapidly cooling a substrate
US20180044783A1 (en) 2016-08-10 2018-02-15 Applied Materials, Inc. Thermally optimized rings
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD825505S1 (en) * 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD193203S (zh) 2016-12-12 2018-10-01 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US20190131163A1 (en) * 2017-05-25 2019-05-02 Ngk Insulators,Ltd. Wafer susceptor
TWD197827S (zh) 2017-12-19 2019-06-01 Ebara Corp 半導體晶圓研磨用彈性膜
US20190318944A1 (en) * 2018-04-12 2019-10-17 Disco Corporation Expanding method and expanding apparatus
US20200343120A1 (en) 2018-01-19 2020-10-29 Ulvac, Inc. Heater base and processing apparatus

Patent Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
USD406852S (en) 1997-11-14 1999-03-16 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
KR20070017255A (ko) 2005-08-06 2007-02-09 삼성전자주식회사 플라즈마 장치의 반도체 기판 고정 장치
US20080190367A1 (en) 2007-02-12 2008-08-14 Samsung Electronics Co., Ltd. Chuck assembly and high density plasma equipment having the same
JP2008244079A (ja) 2007-03-27 2008-10-09 Ulvac Japan Ltd 成膜装置
USD621804S1 (en) * 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
US20110031111A1 (en) 2009-08-07 2011-02-10 Tokyo Electron Limited Substrate processing apparatus, positioning method and focus ring installation method
US20120329000A1 (en) 2010-03-23 2012-12-27 Osamu Hirakawa Substrate processing apparatus, substrate processing method, program and computer storage medium
USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate
USD708651S1 (en) * 2011-11-22 2014-07-08 Applied Materials, Inc. Electrostatic chuck
US20140008349A1 (en) 2012-07-03 2014-01-09 Applied Materials, Inc. Substrate support for substrate backside contamination control
US20140011153A1 (en) * 2012-07-03 2014-01-09 Watlow Electric Manufacturing Company Pedestal construction with low coefficient of thermal expansion top
US9490150B2 (en) 2012-07-03 2016-11-08 Applied Materials, Inc. Substrate support for substrate backside contamination control
US20140144901A1 (en) 2012-11-26 2014-05-29 Applied Materials, Inc. Substrate support with wire mesh plasma containment
US20140217665A1 (en) 2013-02-01 2014-08-07 Applied Materials, Inc. Substrate support with controlled sealing gap
TWD163540S (zh) 2013-03-28 2014-10-11 平田機工股份有限公司 晶圓載入／載出腔用蓋
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
US9779971B2 (en) 2014-04-11 2017-10-03 Applied Materials, Inc. Methods and apparatus for rapidly cooling a substrate
US20160002778A1 (en) 2014-07-03 2016-01-07 Applied Materials, Inc. Substrate support with more uniform edge purge
TWD177006S (zh) 2014-12-25 2016-07-11 東京威力科創股份有限公司 半導體製造裝置用附設研磨部之清洗刷之部分
USD825505S1 (en) * 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1547357S (cg-RX-API-DMAC10.html) 2015-07-27 2016-04-11
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
US20180044783A1 (en) 2016-08-10 2018-02-15 Applied Materials, Inc. Thermally optimized rings
TWD193203S (zh) 2016-12-12 2018-10-01 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US20190131163A1 (en) * 2017-05-25 2019-05-02 Ngk Insulators,Ltd. Wafer susceptor
TWD197827S (zh) 2017-12-19 2019-06-01 Ebara Corp 半導體晶圓研磨用彈性膜
US20200343120A1 (en) 2018-01-19 2020-10-29 Ulvac, Inc. Heater base and processing apparatus
US20190318944A1 (en) * 2018-04-12 2019-10-17 Disco Corporation Expanding method and expanding apparatus

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
"AMAT MCA E-Chuck". Found online Sep. 29, 2020 at ebay.com. Reference dated May 30, 2017. Retrieved from https://www.ebay.com/itm/AMAT-0010-03774-HEATER-ASSY-300mm-AMAT-MCA-E-Chuck-ESC-/262005122022. (Year: 2017). *
"NTK Ceratec—Electrostatic Chuck". Found online Sep. 29, 2020 at dksh.com. Reference dated Aug. 7, 2017. Retrieved from https://tineye.com/search/3be6e76355441efd8d67fc67d0912dac27f2b87d?sort=crawl_date&order=asc&page=1. (Year: 2017). *
"SemiXicon Electrostatic Chuck". Found online Sep. 29, 2020 at semixicon.com. Reference dated Jun. 17, 2017. Retrieved from https://web.archive.org/web/20170617035614/http://www.semixicon.com/. (Year: 2017). *
International Search Report for PCT/US2020/042920, dated Nov. 6, 2020.
Search Report for Taiwan Design Application No. 109306863, dated Jan. 19, 2021.

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device
USD969760S1 (en) * 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD956376S1 (en) * 2019-12-18 2022-06-28 Goldeep Ltd. Vacuum bag valve
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1021832S1 (en) 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD990533S1 (en) * 2020-10-21 2023-06-27 Bryan Ross Schmitt Sanding table for attachment to a garbage can
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1057675S1 (en) * 2021-04-12 2025-01-14 Lam Research Corporation Pedestal for a substrate processing system
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1073758S1 (en) * 2022-10-13 2025-05-06 Lam Research Corporation Baffle for substrate processing system
USD1092578S1 (en) * 2023-10-10 2025-09-09 Guangzhou Avison Trading Co., Ltd. Chuck set

Also Published As

Publication number Publication date
TWD213398S (zh) 2021-08-21
TWD211589S (zh) 2021-05-11
JP1667763S (cg-RX-API-DMAC10.html) 2020-09-07
JP1667762S (cg-RX-API-DMAC10.html) 2020-09-07

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