USD891382S1 - Process shield for a substrate processing chamber - Google Patents

Process shield for a substrate processing chamber Download PDF

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Publication number
USD891382S1
USD891382S1 US29/679,738 US201929679738F USD891382S US D891382 S1 USD891382 S1 US D891382S1 US 201929679738 F US201929679738 F US 201929679738F US D891382 S USD891382 S US D891382S
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United States
Prior art keywords
processing chamber
substrate processing
process shield
shield
view
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US29/679,738
Inventor
Manjunatha P. Koppa
Aravind KAMATH
Cheng-Hsiung Matt Tsai
Manjunath H. Venkataswamappa
Steven V. Sansoni
David Or
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Applied Materials Inc
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Applied Materials Inc
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Priority to US29/679,738 priority Critical patent/USD891382S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAMATH, ARAVIND, TSAI, CHENG-HSIUNG MATT, H V, MANJUNATH, KOPPA, MANJUNATHA P., OR, DAVID, SANSONI, STEVEN V.
Priority to TW108304736F priority patent/TWD207742S/en
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Publication of USD891382S1 publication Critical patent/USD891382S1/en
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FIG. 1 is a top isometric view of a process shield for a substrate processing chamber, showing our new design;
FIG. 2 is a bottom isometric view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front elevation view thereof;
FIG. 6 is a back elevation view thereof;
FIG. 7 is a left side elevation view thereof;
FIG. 8 is a right side elevation view thereof; and,
FIG. 9 is an enlarged cross sectional view taken along line 9-9 in FIG. 3.
The dashed lines in FIGS. 1-9 represent unclaimed environment forming no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a process shield for a substrate processing chamber, as shown and described.
US29/679,738 2019-02-08 2019-02-08 Process shield for a substrate processing chamber Active USD891382S1 (en)

Priority Applications (2)

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US29/679,738 USD891382S1 (en) 2019-02-08 2019-02-08 Process shield for a substrate processing chamber
TW108304736F TWD207742S (en) 2019-02-08 2019-08-08 Process shield for a substrate processing chamber

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US29/679,738 USD891382S1 (en) 2019-02-08 2019-02-08 Process shield for a substrate processing chamber

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USD891382S1 true USD891382S1 (en) 2020-07-28

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TW (1) TWD207742S (en)

Cited By (48)

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USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD916038S1 (en) * 2019-03-19 2021-04-13 Hitachi High-Tech Corporation Grounded electrode for a plasma processing apparatus
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941787S1 (en) * 2020-03-03 2022-01-25 Applied Materials, Inc. Substrate transfer blade
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD946114S1 (en) * 2019-06-12 2022-03-15 Sanotech 360, Llc Handheld sprayer
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
USD968567S1 (en) * 2020-03-18 2022-11-01 Zhejiang Prulde Electric Appliance Co., Ltd. Spray gun
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
USD980950S1 (en) * 2021-05-18 2023-03-14 Kolektor Mobility d.o.o. Pressure washer
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1039657S1 (en) * 2020-09-25 2024-08-20 Turbonetics Holdings, Inc. Bead seal diaphragm
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1052546S1 (en) * 2020-12-10 2024-11-26 Nuflare Technology, Inc. Cover ring of top plate for semiconductor manufacturing apparatus
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1071887S1 (en) * 2023-01-31 2025-04-22 Valqua, Ltd. Composite seal for semiconductor manufacturing device
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
USD1073758S1 (en) * 2022-10-13 2025-05-06 Lam Research Corporation Baffle for substrate processing system
USD1100867S1 (en) * 2023-08-28 2025-11-04 Asm Ip Holding B.V. Vertical flow control ring
USD1109710S1 (en) * 2022-03-22 2026-01-20 Achilles Corporation Main body of a semiconductor wafer carrying container
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1115719S1 (en) * 2018-01-19 2026-03-03 Applied Materials, Inc. Lower edge ring of a process kit for semiconductor substrate processing

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12531210B2 (en) 2018-04-20 2026-01-20 Lam Research Corporation Edge exclusion control
CN115087758A (en) 2020-02-11 2022-09-20 朗姆研究公司 Carrier ring design for controlling deposition on wafer edge/wafer edge
USD984895S1 (en) 2020-12-22 2023-05-02 Applied Materials, Inc. Packaging insert for a process chamber component
US12100613B2 (en) 2020-12-22 2024-09-24 Applied Materials, Inc. Minimal contact packaging for process chamber components
TWD238347S (en) 2022-05-13 2025-05-21 美商蘭姆研究公司 (美國) Carrier ring

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4756810A (en) * 1986-12-04 1988-07-12 Machine Technology, Inc. Deposition and planarizing methods and apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20090050272A1 (en) * 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
US20160002788A1 (en) * 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US9593410B2 (en) 2013-03-05 2017-03-14 Applied Materials, Inc. Methods and apparatus for stable substrate processing with multiple RF power supplies
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD870314S1 (en) * 2017-08-31 2019-12-17 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4756810A (en) * 1986-12-04 1988-07-12 Machine Technology, Inc. Deposition and planarizing methods and apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20090050272A1 (en) * 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
US20160002788A1 (en) * 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
US9593410B2 (en) 2013-03-05 2017-03-14 Applied Materials, Inc. Methods and apparatus for stable substrate processing with multiple RF power supplies
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD870314S1 (en) * 2017-08-31 2019-12-17 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor

Cited By (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
USD1115720S1 (en) 2018-01-19 2026-03-03 Applied Materials, Inc. Lower edge ring of a process kit for semiconductor substrate processing
USD1115719S1 (en) * 2018-01-19 2026-03-03 Applied Materials, Inc. Lower edge ring of a process kit for semiconductor substrate processing
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD916038S1 (en) * 2019-03-19 2021-04-13 Hitachi High-Tech Corporation Grounded electrode for a plasma processing apparatus
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
USD946114S1 (en) * 2019-06-12 2022-03-15 Sanotech 360, Llc Handheld sprayer
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
USD941787S1 (en) * 2020-03-03 2022-01-25 Applied Materials, Inc. Substrate transfer blade
USD968567S1 (en) * 2020-03-18 2022-11-01 Zhejiang Prulde Electric Appliance Co., Ltd. Spray gun
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD1051867S1 (en) 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD1039657S1 (en) * 2020-09-25 2024-08-20 Turbonetics Holdings, Inc. Bead seal diaphragm
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1052546S1 (en) * 2020-12-10 2024-11-26 Nuflare Technology, Inc. Cover ring of top plate for semiconductor manufacturing apparatus
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980950S1 (en) * 2021-05-18 2023-03-14 Kolektor Mobility d.o.o. Pressure washer
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1109710S1 (en) * 2022-03-22 2026-01-20 Achilles Corporation Main body of a semiconductor wafer carrying container
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1073758S1 (en) * 2022-10-13 2025-05-06 Lam Research Corporation Baffle for substrate processing system
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1071887S1 (en) * 2023-01-31 2025-04-22 Valqua, Ltd. Composite seal for semiconductor manufacturing device
USD1100867S1 (en) * 2023-08-28 2025-11-04 Asm Ip Holding B.V. Vertical flow control ring

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