USD842823S1 - Reaction tube - Google Patents

Reaction tube Download PDF

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Publication number
USD842823S1
USD842823S1 US29/635,262 US201829635262F USD842823S US D842823 S1 USD842823 S1 US D842823S1 US 201829635262 F US201829635262 F US 201829635262F US D842823 S USD842823 S US D842823S
Authority
US
United States
Prior art keywords
reaction tube
view
elevational view
ornamental design
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/635,262
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English (en)
Inventor
Yusaku OKAJIMA
Hidenari YOSHIDA
Shuhei SAIDO
Takafumi Sasaki
Hidetoshi Mimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SASAKI, TAKAFUMI, MIMURA, HIDETOSHI, OKAJIMA, YUSAKU, SAIDO, SHUHEI, YOSHIDA, HIDENARI
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
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Publication of USD842823S1 publication Critical patent/USD842823S1/en
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US29/635,262 2017-08-10 2018-01-30 Reaction tube Active USD842823S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2017-17353F JP1605461S (cs) 2017-08-10 2017-08-10
JP2017-017353 2017-08-10

Publications (1)

Publication Number Publication Date
USD842823S1 true USD842823S1 (en) 2019-03-12

Family

ID=62238961

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/635,262 Active USD842823S1 (en) 2017-08-10 2018-01-30 Reaction tube

Country Status (3)

Country Link
US (1) USD842823S1 (cs)
JP (1) JP1605461S (cs)
TW (1) TWD193434S (cs)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD886318S1 (en) * 2018-06-15 2020-06-02 Tenga Co., Ltd. Ejaculation promotion apparatus storage container
USD901406S1 (en) 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1053156S1 (en) * 2022-03-15 2024-12-03 Kokusai Electric Corporation Furnace for substrate processing apparatus
USD1070797S1 (en) * 2022-03-15 2025-04-15 Kokusai Electric Corporation Furnace for substrate processing apparatus

Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4950870A (en) * 1987-11-21 1990-08-21 Tel Sagami Limited Heat-treating apparatus
US5618349A (en) * 1993-07-24 1997-04-08 Yamaha Corporation Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity
USD404368S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
USD405429S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD405431S (en) * 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
US5948300A (en) * 1997-09-12 1999-09-07 Kokusai Bti Corporation Process tube with in-situ gas preheating
US5968593A (en) * 1995-03-20 1999-10-19 Kokusai Electric Co., Ltd. Semiconductor manufacturing apparatus
USD417438S (en) * 1997-01-31 1999-12-07 Tokyo Electron Limited Quartz outer tube
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
US6251189B1 (en) * 1999-02-18 2001-06-26 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
US6402849B2 (en) * 2000-03-17 2002-06-11 Samsung Electronics Co., Ltd. Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device
US20030221779A1 (en) * 2002-03-28 2003-12-04 Kazuyuki Okuda Substrate processing apparatus
USD521464S1 (en) * 2003-11-04 2006-05-23 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
USD521465S1 (en) * 2003-11-04 2006-05-23 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
US20070098605A1 (en) * 2005-10-03 2007-05-03 Tubemaster Inc. Device for loading chemical reactor tubes
US7311520B2 (en) * 2002-09-24 2007-12-25 Tokyo Electron Limited Heat treatment apparatus
US20080083372A1 (en) * 2006-08-04 2008-04-10 Hisashi Inoue Heat processing apparatus for semiconductor process
USD586768S1 (en) * 2006-10-12 2009-02-17 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20090194521A1 (en) * 2008-01-31 2009-08-06 Tokyo Electron Limited Thermal processing furnace
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20090250005A1 (en) * 2008-04-03 2009-10-08 Tokyo Electron Limited Reaction tube and heat processing apparatus for a semiconductor process
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD618638S1 (en) * 2008-05-09 2010-06-29 Hitachi Kokusai Electric, Inc. Reaction tube
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD800080S1 (en) * 2016-03-30 2017-10-17 Tokyo Electron Limited Reactor tube for semiconductor production devices

Patent Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4950870A (en) * 1987-11-21 1990-08-21 Tel Sagami Limited Heat-treating apparatus
US5618349A (en) * 1993-07-24 1997-04-08 Yamaha Corporation Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity
US5968593A (en) * 1995-03-20 1999-10-19 Kokusai Electric Co., Ltd. Semiconductor manufacturing apparatus
USD417438S (en) * 1997-01-31 1999-12-07 Tokyo Electron Limited Quartz outer tube
USD405429S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
USD405431S (en) * 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
USD404368S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
US5948300A (en) * 1997-09-12 1999-09-07 Kokusai Bti Corporation Process tube with in-situ gas preheating
US6251189B1 (en) * 1999-02-18 2001-06-26 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
US6402849B2 (en) * 2000-03-17 2002-06-11 Samsung Electronics Co., Ltd. Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device
US20030221779A1 (en) * 2002-03-28 2003-12-04 Kazuyuki Okuda Substrate processing apparatus
US7311520B2 (en) * 2002-09-24 2007-12-25 Tokyo Electron Limited Heat treatment apparatus
USD521464S1 (en) * 2003-11-04 2006-05-23 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
USD521465S1 (en) * 2003-11-04 2006-05-23 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
US20070098605A1 (en) * 2005-10-03 2007-05-03 Tubemaster Inc. Device for loading chemical reactor tubes
US20080083372A1 (en) * 2006-08-04 2008-04-10 Hisashi Inoue Heat processing apparatus for semiconductor process
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD586768S1 (en) * 2006-10-12 2009-02-17 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20090194521A1 (en) * 2008-01-31 2009-08-06 Tokyo Electron Limited Thermal processing furnace
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20090250005A1 (en) * 2008-04-03 2009-10-08 Tokyo Electron Limited Reaction tube and heat processing apparatus for a semiconductor process
USD618638S1 (en) * 2008-05-09 2010-06-29 Hitachi Kokusai Electric, Inc. Reaction tube
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD800080S1 (en) * 2016-03-30 2017-10-17 Tokyo Electron Limited Reactor tube for semiconductor production devices

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD886318S1 (en) * 2018-06-15 2020-06-02 Tenga Co., Ltd. Ejaculation promotion apparatus storage container
USD901406S1 (en) 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube
USD1053156S1 (en) * 2022-03-15 2024-12-03 Kokusai Electric Corporation Furnace for substrate processing apparatus
USD1070797S1 (en) * 2022-03-15 2025-04-15 Kokusai Electric Corporation Furnace for substrate processing apparatus
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment

Also Published As

Publication number Publication date
TWD193434S (zh) 2018-10-11
JP1605461S (cs) 2021-05-31

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