USD797691S1 - Composite edge ring - Google Patents

Composite edge ring Download PDF

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Publication number
USD797691S1
USD797691S1 US29/561,163 US201629561163F USD797691S US D797691 S1 USD797691 S1 US D797691S1 US 201629561163 F US201629561163 F US 201629561163F US D797691 S USD797691 S US D797691S
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US
United States
Prior art keywords
edge ring
composite edge
view
composite
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/561,163
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English (en)
Inventor
Olivier Joubert
Jason A. Kenney
Sunil Srinivasan
James Rogers
Rajinder Dhindsa
Vedapuram S. Achutharaman
Olivier Luere
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Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/561,163 priority Critical patent/USD797691S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SRINIVASAN, SUNIL, LUERE, OLIVIER, ACHUTHARAMAN, VEDAPURAM S., DHINDSA, RAJINDER, JOUBERT, OLIVIER, KENNEY, Jason A., ROGERS, JAMES
Priority to TW105305534F priority patent/TWD187824S/zh
Priority to JPD2016-22122F priority patent/JP1575876S/ja
Application granted granted Critical
Publication of USD797691S1 publication Critical patent/USD797691S1/en
Active legal-status Critical Current
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US29/561,163 2016-04-14 2016-04-14 Composite edge ring Active USD797691S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/561,163 USD797691S1 (en) 2016-04-14 2016-04-14 Composite edge ring
TW105305534F TWD187824S (zh) 2016-04-14 2016-09-20 組合邊緣環
JPD2016-22122F JP1575876S (cs) 2016-04-14 2016-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/561,163 USD797691S1 (en) 2016-04-14 2016-04-14 Composite edge ring

Publications (1)

Publication Number Publication Date
USD797691S1 true USD797691S1 (en) 2017-09-19

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ID=58645867

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/561,163 Active USD797691S1 (en) 2016-04-14 2016-04-14 Composite edge ring

Country Status (3)

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US (1) USD797691S1 (cs)
JP (1) JP1575876S (cs)
TW (1) TWD187824S (cs)

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170256435A1 (en) * 2016-03-04 2017-09-07 Applied Materials, Inc. Universal process kit
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD847982S1 (en) * 2016-02-04 2019-05-07 Atos Medical Ab Heat exchanger base plate
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD889335S1 (en) * 2018-10-03 2020-07-07 Vaughn C Jewell Disc
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
TWD208176S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208177S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
TWD214021S (zh) 2020-07-27 2021-09-11 美商應用材料股份有限公司 邊緣環
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD1038049S1 (en) * 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD1047884S1 (en) * 2021-10-22 2024-10-22 Nuflare Technology, Inc. Susceptor cover
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1071887S1 (en) * 2023-01-31 2025-04-22 Valqua, Ltd. Composite seal for semiconductor manufacturing device
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD942516S1 (en) 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US6039836A (en) 1997-12-19 2000-03-21 Lam Research Corporation Focus rings
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
US7025862B2 (en) * 2002-10-22 2006-04-11 Applied Materials Plating uniformity control by contact ring shaping
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6039836A (en) 1997-12-19 2000-03-21 Lam Research Corporation Focus rings
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
US7025862B2 (en) * 2002-10-22 2006-04-11 Applied Materials Plating uniformity control by contact ring shaping
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring

Cited By (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD847982S1 (en) * 2016-02-04 2019-05-07 Atos Medical Ab Heat exchanger base plate
US11049760B2 (en) * 2016-03-04 2021-06-29 Applied Materials, Inc. Universal process kit
US20170256435A1 (en) * 2016-03-04 2017-09-07 Applied Materials, Inc. Universal process kit
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD208177S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
TWD208176S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
USD889335S1 (en) * 2018-10-03 2020-07-07 Vaughn C Jewell Disc
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1051867S1 (en) 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
TWD214021S (zh) 2020-07-27 2021-09-11 美商應用材料股份有限公司 邊緣環
USD1034491S1 (en) * 2020-07-27 2024-07-09 Applied Materials, Inc. Edge ring
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD1038049S1 (en) * 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1047884S1 (en) * 2021-10-22 2024-10-22 Nuflare Technology, Inc. Susceptor cover
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1071887S1 (en) * 2023-01-31 2025-04-22 Valqua, Ltd. Composite seal for semiconductor manufacturing device

Also Published As

Publication number Publication date
TWD187824S (zh) 2018-01-11
JP1575876S (cs) 2017-05-08

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