TWD187824S - 組合邊緣環 - Google Patents

組合邊緣環

Info

Publication number
TWD187824S
TWD187824S TW105305534F TW105305534F TWD187824S TW D187824 S TWD187824 S TW D187824S TW 105305534 F TW105305534 F TW 105305534F TW 105305534 F TW105305534 F TW 105305534F TW D187824 S TWD187824 S TW D187824S
Authority
TW
Taiwan
Prior art keywords
edge ring
composite edge
view
design
composite
Prior art date
Application number
TW105305534F
Other languages
English (en)
Inventor
奧利維爾 朱伯特
傑森Ａ 肯尼
蘇尼爾 斯里尼瓦桑
詹姆士 羅傑斯
拉吉德 汀德沙
芬達普拉曼Ｓ 亞秋沙拉門
奧黎維兒 魯爾
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TWD187824S publication Critical patent/TWD187824S/zh

Links

Abstract

【物品用途】;本設計所請求為組合邊緣環。;【設計說明】;左側視圖、右側視圖及後視圖皆與前視圖相同因而省略。

Description

組合邊緣環
本設計所請求為組合邊緣環。
左側視圖、右側視圖及後視圖皆與前視圖相同因而省略。
TW105305534F 2016-04-14 2016-09-20 組合邊緣環 TWD187824S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/561,163 USD797691S1 (en) 2016-04-14 2016-04-14 Composite edge ring
US29/561,163 2016-04-14

Publications (1)

Publication Number Publication Date
TWD187824S true TWD187824S (zh) 2018-01-11

Family

ID=58645867

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105305534F TWD187824S (zh) 2016-04-14 2016-09-20 組合邊緣環

Country Status (3)

Country Link
US (1) USD797691S1 (zh)
JP (1) JP1575876S (zh)
TW (1) TWD187824S (zh)

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TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208177S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
TWD208176S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD214021S (zh) 2020-07-27 2021-09-11 美商應用材料股份有限公司 邊緣環
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life

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USD942516S1 (en) 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1038049S1 (en) * 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1711120S (ja) * 2021-10-22 2022-03-29 サセプタカバー
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208177S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
TWD208176S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD214021S (zh) 2020-07-27 2021-09-11 美商應用材料股份有限公司 邊緣環
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
TWD217572S (zh) 2020-07-31 2022-03-11 美商應用材料股份有限公司 用於半導體處理腔室的沉積環
TWD217686S (zh) 2020-07-31 2022-03-11 美商應用材料股份有限公司 用於半導體處理腔室的沉積環
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life

Also Published As

Publication number Publication date
USD797691S1 (en) 2017-09-19
JP1575876S (zh) 2017-05-08

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