JP1575876S - - Google Patents

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Publication number
JP1575876S
JP1575876S JPD2016-22122F JP2016022122F JP1575876S JP 1575876 S JP1575876 S JP 1575876S JP 2016022122 F JP2016022122 F JP 2016022122F JP 1575876 S JP1575876 S JP 1575876S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2016-22122F
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Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JP1575876S publication Critical patent/JP1575876S/ja
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Links

JPD2016-22122F 2016-04-14 2016-10-12 Active JP1575876S (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/561,163 USD797691S1 (en) 2016-04-14 2016-04-14 Composite edge ring

Publications (1)

Publication Number Publication Date
JP1575876S true JP1575876S (cs) 2017-05-08

Family

ID=58645867

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2016-22122F Active JP1575876S (cs) 2016-04-14 2016-10-12

Country Status (3)

Country Link
US (1) USD797691S1 (cs)
JP (1) JP1575876S (cs)
TW (1) TWD187824S (cs)

Cited By (2)

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USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber

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USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD847982S1 (en) * 2016-02-04 2019-05-07 Atos Medical Ab Heat exchanger base plate
JP3210105U (ja) * 2016-03-04 2017-04-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ユニバーサルプロセスキット
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1581911S (cs) * 2016-10-25 2017-07-24
JP1584241S (cs) * 2017-01-31 2017-08-21
JP1584906S (cs) * 2017-01-31 2017-08-28
JP1584784S (cs) * 2017-01-31 2017-08-28
JP1598997S (cs) * 2017-08-31 2018-03-05
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1642984S (cs) 2018-07-25 2019-10-07
JP1643124S (cs) 2018-07-25 2019-10-07
JP1642983S (cs) 2018-07-25 2019-10-07
JP1643123S (cs) 2018-07-25 2019-10-07
JP1643125S (cs) 2018-07-25 2019-10-07
USD889335S1 (en) * 2018-10-03 2020-07-07 Vaughn C Jewell Disc
JP1646505S (cs) * 2018-12-07 2019-11-25
US11961723B2 (en) * 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD943539S1 (en) 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD979524S1 (en) 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1034491S1 (en) 2020-07-27 2024-07-09 Applied Materials, Inc. Edge ring
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD1038049S1 (en) * 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1711120S (ja) * 2021-10-22 2022-03-29 サセプタカバー
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
JP1746769S (ja) * 2023-01-31 2023-06-20 複合シール材

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USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6039836A (en) 1997-12-19 2000-03-21 Lam Research Corporation Focus rings
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
US7025862B2 (en) * 2002-10-22 2006-04-11 Applied Materials Plating uniformity control by contact ring shaping
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
TWD121115S1 (zh) * 2005-03-30 2008-01-21 東京威力科創股份有限公司 遮護環
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber

Also Published As

Publication number Publication date
USD797691S1 (en) 2017-09-19
TWD187824S (zh) 2018-01-11

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