USD793972S1 - Wafer carrier with a 31-pocket configuration - Google Patents
Wafer carrier with a 31-pocket configuration Download PDFInfo
- Publication number
- USD793972S1 USD793972S1 US29/522,214 US201529522214F USD793972S US D793972 S1 USD793972 S1 US D793972S1 US 201529522214 F US201529522214 F US 201529522214F US D793972 S USD793972 S US D793972S
- Authority
- US
- United States
- Prior art keywords
- wafer carrier
- pocket configuration
- view
- design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/522,214 USD793972S1 (en) | 2015-03-27 | 2015-03-27 | Wafer carrier with a 31-pocket configuration |
TW105205249U TWM531052U (zh) | 2015-03-27 | 2015-09-25 | 具有31個容置區的排列組態之晶圓載具 |
TW104305353F TWD181303S (zh) | 2015-03-27 | 2015-09-25 | 晶圓載具 |
DE202015006764.6U DE202015006764U1 (de) | 2015-03-27 | 2015-09-25 | Waferträger mit einer Konfiguration mit 31 Taschen |
JPD2015-21231F JP1545629S (de) | 2015-03-27 | 2015-09-28 | |
KR2020150006434U KR20160003441U (ko) | 2015-03-27 | 2015-09-30 | 31 포켓 구성을 갖는 웨이퍼 캐리어 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/522,214 USD793972S1 (en) | 2015-03-27 | 2015-03-27 | Wafer carrier with a 31-pocket configuration |
Publications (1)
Publication Number | Publication Date |
---|---|
USD793972S1 true USD793972S1 (en) | 2017-08-08 |
Family
ID=55312602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/522,214 Active USD793972S1 (en) | 2015-03-27 | 2015-03-27 | Wafer carrier with a 31-pocket configuration |
Country Status (5)
Country | Link |
---|---|
US (1) | USD793972S1 (de) |
JP (1) | JP1545629S (de) |
KR (1) | KR20160003441U (de) |
DE (1) | DE202015006764U1 (de) |
TW (2) | TWM531052U (de) |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD813228S1 (en) * | 2016-10-04 | 2018-03-20 | Amazon Technologies, Inc. | Electronic device |
USD820254S1 (en) * | 2017-03-03 | 2018-06-12 | Amazon Technologies, Inc. | Electronic device |
USD837479S1 (en) * | 2017-07-26 | 2019-01-01 | Coincard Llc | Coin card device |
USD852762S1 (en) | 2015-03-27 | 2019-07-02 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
USD854506S1 (en) * | 2018-03-26 | 2019-07-23 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD858469S1 (en) * | 2018-03-26 | 2019-09-03 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD860147S1 (en) * | 2018-03-26 | 2019-09-17 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD860146S1 (en) * | 2017-11-30 | 2019-09-17 | Veeco Instruments Inc. | Wafer carrier with a 33-pocket configuration |
USD863239S1 (en) * | 2018-03-26 | 2019-10-15 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD866491S1 (en) * | 2018-03-26 | 2019-11-12 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD877143S1 (en) | 2017-03-03 | 2020-03-03 | Amazon Technologies, Inc. | Electronic device |
USD881372S1 (en) * | 2018-02-02 | 2020-04-14 | Kohler Co. | Screen for an air intake system |
USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
USD893682S1 (en) * | 2018-05-31 | 2020-08-18 | Smith Industries Inc. | Floor drain grate |
USD910110S1 (en) * | 2019-07-01 | 2021-02-09 | Cardinal Percussion, Ltd. | Percussion drum head |
USD1002915S1 (en) * | 2022-05-18 | 2023-10-24 | Chen Wu | Lens |
USD1003407S1 (en) * | 2021-04-30 | 2023-10-31 | Vendura Industries, LLC | Drain |
USD1009098S1 (en) * | 2021-09-23 | 2023-12-26 | Ningbo Sincere Holding Group Co., Ltd. | Ice cube tray |
USD1010775S1 (en) * | 2021-04-05 | 2024-01-09 | Ebbe America, Lc | Drain cover |
USD1026297S1 (en) * | 2022-07-15 | 2024-05-07 | Dandan Tan | Set of lenses |
USD1039784S1 (en) * | 2021-06-22 | 2024-08-20 | Provenance Ngc Llc | Collectible coin holder |
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Also Published As
Publication number | Publication date |
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DE202015006764U1 (de) | 2016-01-22 |
TWM531052U (zh) | 2016-10-21 |
JP1545629S (de) | 2016-03-14 |
TWD181303S (zh) | 2017-02-11 |
KR20160003441U (ko) | 2016-10-06 |
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USD718522S1 (en) | Carrier band having pockets | |
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USD859283S1 (en) | Carrier | |
USD921752S1 (en) | Note tab | |
USD763505S1 (en) | Epilator | |
USD840704S1 (en) | Chair | |
USD868494S1 (en) | Chair | |
USD841976S1 (en) | Carrier for child | |
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USD841564S1 (en) | Cargo carrier | |
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USD752591S1 (en) | Dock for a keyboard | |
USD807587S1 (en) | Visor support | |
USD866955S1 (en) | Baby carrier |