USD793972S1 - Wafer carrier with a 31-pocket configuration - Google Patents

Wafer carrier with a 31-pocket configuration Download PDF

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Publication number
USD793972S1
USD793972S1 US29/522,214 US201529522214F USD793972S US D793972 S1 USD793972 S1 US D793972S1 US 201529522214 F US201529522214 F US 201529522214F US D793972 S USD793972 S US D793972S
Authority
US
United States
Prior art keywords
wafer carrier
pocket configuration
pocket
view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/522,214
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English (en)
Inventor
Sandeep Krishnan
Keng Moy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
Original Assignee
Veeco Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Instruments Inc filed Critical Veeco Instruments Inc
Priority to US29/522,214 priority Critical patent/USD793972S1/en
Priority to DE202015006764.6U priority patent/DE202015006764U1/de
Priority to TW105205249U priority patent/TWM531052U/zh
Priority to TW104305353F priority patent/TWD181303S/zh
Priority to JPD2015-21231F priority patent/JP1545629S/ja
Priority to KR2020150006434U priority patent/KR20160003441U/ko
Assigned to VEECO INSTRUMENTS INC. reassignment VEECO INSTRUMENTS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KRISHNAN, SANDEEP
Application granted granted Critical
Publication of USD793972S1 publication Critical patent/USD793972S1/en
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: VEECO INSTRUMENTS INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
US29/522,214 2015-03-27 2015-03-27 Wafer carrier with a 31-pocket configuration Active USD793972S1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US29/522,214 USD793972S1 (en) 2015-03-27 2015-03-27 Wafer carrier with a 31-pocket configuration
TW105205249U TWM531052U (zh) 2015-03-27 2015-09-25 具有31個容置區的排列組態之晶圓載具
TW104305353F TWD181303S (zh) 2015-03-27 2015-09-25 晶圓載具
DE202015006764.6U DE202015006764U1 (de) 2015-03-27 2015-09-25 Waferträger mit einer Konfiguration mit 31 Taschen
JPD2015-21231F JP1545629S (de) 2015-03-27 2015-09-28
KR2020150006434U KR20160003441U (ko) 2015-03-27 2015-09-30 31 포켓 구성을 갖는 웨이퍼 캐리어

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/522,214 USD793972S1 (en) 2015-03-27 2015-03-27 Wafer carrier with a 31-pocket configuration

Publications (1)

Publication Number Publication Date
USD793972S1 true USD793972S1 (en) 2017-08-08

Family

ID=55312602

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/522,214 Active USD793972S1 (en) 2015-03-27 2015-03-27 Wafer carrier with a 31-pocket configuration

Country Status (5)

Country Link
US (1) USD793972S1 (de)
JP (1) JP1545629S (de)
KR (1) KR20160003441U (de)
DE (1) DE202015006764U1 (de)
TW (2) TWM531052U (de)

Cited By (21)

* Cited by examiner, † Cited by third party
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USD813228S1 (en) * 2016-10-04 2018-03-20 Amazon Technologies, Inc. Electronic device
USD820254S1 (en) * 2017-03-03 2018-06-12 Amazon Technologies, Inc. Electronic device
USD837479S1 (en) * 2017-07-26 2019-01-01 Coincard Llc Coin card device
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD877143S1 (en) 2017-03-03 2020-03-03 Amazon Technologies, Inc. Electronic device
USD881372S1 (en) * 2018-02-02 2020-04-14 Kohler Co. Screen for an air intake system
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD893682S1 (en) * 2018-05-31 2020-08-18 Smith Industries Inc. Floor drain grate
USD910110S1 (en) * 2019-07-01 2021-02-09 Cardinal Percussion, Ltd. Percussion drum head
USD1002915S1 (en) * 2022-05-18 2023-10-24 Chen Wu Lens
USD1003407S1 (en) * 2021-04-30 2023-10-31 Vendura Industries, LLC Drain
USD1009098S1 (en) * 2021-09-23 2023-12-26 Ningbo Sincere Holding Group Co., Ltd. Ice cube tray
USD1010775S1 (en) * 2021-04-05 2024-01-09 Ebbe America, Lc Drain cover
USD1026297S1 (en) * 2022-07-15 2024-05-07 Dandan Tan Set of lenses
USD1039784S1 (en) * 2021-06-22 2024-08-20 Provenance Ngc Llc Collectible coin holder

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