USD793971S1 - Wafer carrier with a 14-pocket configuration - Google Patents

Wafer carrier with a 14-pocket configuration Download PDF

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Publication number
USD793971S1
USD793971S1 US29/522,212 US201529522212F USD793971S US D793971 S1 USD793971 S1 US D793971S1 US 201529522212 F US201529522212 F US 201529522212F US D793971 S USD793971 S US D793971S
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US
United States
Prior art keywords
wafer carrier
pocket configuration
pocket
configuration
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/522,212
Inventor
Sandeep Krishnan
Raghu Moorkannaiah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
Original Assignee
Veeco Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Instruments Inc filed Critical Veeco Instruments Inc
Priority to US29/522,212 priority Critical patent/USD793971S1/en
Priority to TW104305352F priority patent/TWD181302S/en
Priority to TW105205252U priority patent/TWM531053U/en
Priority to DE202015006765.4U priority patent/DE202015006765U1/en
Priority to KR2020150006435U priority patent/KR20160003442U/en
Assigned to VEECO INSTRUMENTS INC. reassignment VEECO INSTRUMENTS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOORKANNAIAH, RAGHU CHIKKANAYAKANAHALLI, KRISHNAN, SANDEEP
Priority to US29/612,468 priority patent/USD852762S1/en
Application granted granted Critical
Publication of USD793971S1 publication Critical patent/USD793971S1/en
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: VEECO INSTRUMENTS INC.
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION reassignment HSBC BANK USA, NATIONAL ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VEECO INSTRUMENTS INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Description

FIG. 1 is a perspective view of a wafer carrier with a 14-pocket configuration showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side view thereof, with the left side view, front view, and rear view being identical;
FIG. 4 is a bottom view thereof; and,
FIG. 5 is an enlarged portion view taken from callout circle 5 in FIG. 1.
In each of the figures, portions or features that are shown in broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a wafer carrier with a 14-pocket configuration, as shown and described.
US29/522,212 2015-03-27 2015-03-27 Wafer carrier with a 14-pocket configuration Active USD793971S1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US29/522,212 USD793971S1 (en) 2015-03-27 2015-03-27 Wafer carrier with a 14-pocket configuration
TW105205252U TWM531053U (en) 2015-03-27 2015-09-25 Wafer carrier with arranged configuration of 14 accommodating areas
DE202015006765.4U DE202015006765U1 (en) 2015-03-27 2015-09-25 Wafer carrier with a configuration with 14 pockets
TW104305352F TWD181302S (en) 2015-03-27 2015-09-25 Wafer carrier
KR2020150006435U KR20160003442U (en) 2015-03-27 2015-09-30 Wafer carrier with a 14-pocket configuration
US29/612,468 USD852762S1 (en) 2015-03-27 2017-08-01 Wafer carrier with a 14-pocket configuration

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/522,212 USD793971S1 (en) 2015-03-27 2015-03-27 Wafer carrier with a 14-pocket configuration

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/612,468 Division USD852762S1 (en) 2015-03-27 2017-08-01 Wafer carrier with a 14-pocket configuration

Publications (1)

Publication Number Publication Date
USD793971S1 true USD793971S1 (en) 2017-08-08

Family

ID=55312603

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/522,212 Active USD793971S1 (en) 2015-03-27 2015-03-27 Wafer carrier with a 14-pocket configuration
US29/612,468 Active USD852762S1 (en) 2015-03-27 2017-08-01 Wafer carrier with a 14-pocket configuration

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/612,468 Active USD852762S1 (en) 2015-03-27 2017-08-01 Wafer carrier with a 14-pocket configuration

Country Status (4)

Country Link
US (2) USD793971S1 (en)
KR (1) KR20160003442U (en)
DE (1) DE202015006765U1 (en)
TW (2) TWM531053U (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD837479S1 (en) * 2017-07-26 2019-01-01 Coincard Llc Coin card device
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD874870S1 (en) * 2018-10-17 2020-02-11 Larry Parker Trivet
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD959032S1 (en) * 2020-07-03 2022-07-26 Hong Chen LED diving light
USD965829S1 (en) * 2020-08-31 2022-10-04 Shenzhen Xing Guo Peng Technology Co., Ltd. Diving light
USD1002915S1 (en) * 2022-05-18 2023-10-24 Chen Wu Lens
USD1026297S1 (en) * 2022-07-15 2024-05-07 Dandan Tan Set of lenses
USD1039784S1 (en) * 2021-06-22 2024-08-20 Provenance Ngc Llc Collectible coin holder
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
US12583084B2 (en) 2024-01-05 2026-03-24 Tiger Tool International Incorporated Drive plate systems, methods, and apparatus for a press tool

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1112412S1 (en) * 2023-09-29 2026-02-10 Carl Zeiss Vision International Gmbh Optical property demonstrator
CN121046944A (en) * 2025-11-06 2025-12-02 北京大学 A precursor carrier and apparatus for mass production of single-crystal boron nitride wafers

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