TWM531053U - Wafer carrier with a 14-pocket configuration - Google Patents

Wafer carrier with a 14-pocket configuration Download PDF

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Publication number
TWM531053U
TWM531053U TW105205252U TW105205252U TWM531053U TW M531053 U TWM531053 U TW M531053U TW 105205252 U TW105205252 U TW 105205252U TW 105205252 U TW105205252 U TW 105205252U TW M531053 U TWM531053 U TW M531053U
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wafer carrier
wafer
accommodating
top surface
regions
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TW105205252U
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山迪普 克里斯南
拉古 摩卡納
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維克儀器公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

A wafer carrier including fourteen pockets arranged on a top surface.

Description

具有14個容置區的排列組態之晶圓載具 Wafer carrier with arranged configuration of 14 accommodating areas

本創作係關於半導體製造技術，並且尤其是關於化學氣相沉積(CVD)製程及相關設備，用於在製程期間保持半導體晶圓。 This creation relates to semiconductor fabrication techniques, and more particularly to chemical vapor deposition (CVD) processes and related equipment for holding semiconductor wafers during processing.

在發光二極體(LED)和諸如鐳射二極體、光探測器和場效應電晶體的其它高性能器件的製造中，典型地使用化學氣相沉積(CVD)製程在藍寶石或矽基板之上使用諸如氮化鎵的材料生長薄膜堆疊結構。CVD工具包括一處理艙體，該處理艙體是密封環境以允許注入的氣體在基板(通常為晶圓的形式)上反應以生長薄膜層。這種製造設備的現行生產線的實例是由Plainview，New York的Veeco Instruments Inc.製造的TurboDisc®和MOCVD系統的EPIK系列。 In the fabrication of light-emitting diodes (LEDs) and other high-performance devices such as laser diodes, photodetectors, and field effect transistors, chemical vapor deposition (CVD) processes are typically used on top of sapphire or germanium substrates. The thin film stack structure is grown using a material such as gallium nitride. The CVD tool includes a processing chamber that is a sealed environment to allow the injected gas to react on the substrate (typically in the form of a wafer) to grow a thin film layer. An example of a current production line for such manufacturing equipment is the EPIK series of TurboDisc® and MOCVD systems manufactured by Veeco Instruments Inc. of Plainview, New York.

控制諸如溫度、壓強和氣體流速的一些製程參數以獲得所希望的晶體生長。使用不同的材料和製程參數來生長不同層。例如，典型地，由諸如III-V族半導體的化合物半導體形成的器件是藉由使用金屬有機化學氣相沉積(MOCVD)生長連續的該化合物半導體層而形成的。在此製程中，晶圓被暴露於氣體的組合中，典型地，該氣體包括作為III族金屬的源的金屬有機化合物，並且更包括當晶圓保持在升高的溫度下時在晶圓表面上流動的V族元素的源。通常，金屬有機化合物和V族源與明顯不參與反應的載氣組合，該載氣例如是氮氣。III-V族半導體的一個實例是氮化鎵，可以在晶圓具有適當晶格間隙的基板(例如藍寶石晶圓)上 藉由有機鎵化合物和氨氣的反應來形成氮化鎵。在沉積氮化鎵和相關化合物期間一般將該晶圓保持在大約1000-1100℃的溫度下。 Some process parameters such as temperature, pressure, and gas flow rate are controlled to achieve the desired crystal growth. Different materials and process parameters are used to grow different layers. For example, a device formed of a compound semiconductor such as a group III-V semiconductor is typically formed by growing a continuous semiconductor compound layer using metal organic chemical vapor deposition (MOCVD). In this process, the wafer is exposed to a combination of gases, typically including a metal organic compound as a source of a Group III metal, and more including a wafer surface while the wafer is maintained at an elevated temperature. The source of the flowing V group elements. Typically, the organometallic compound and the Group V source are combined with a carrier gas that is not significantly involved in the reaction, such as nitrogen. An example of a III-V semiconductor is gallium nitride, which can be on a substrate with a suitable lattice gap on the wafer (eg, a sapphire wafer). Gallium nitride is formed by the reaction of an organogallium compound and ammonia gas. The wafer is typically maintained at a temperature of between about 1000 and 1100 ° C during the deposition of gallium nitride and related compounds.

在藉由基板表面上的化學反應而發生晶體生長的MOCVD製程中，必須特別小心地控制製程參數以確保在所要求的條件下進行該化學反應。在製程條件中即使小的變化也可能不利地影響器件品質和生產良率。例如，如果沉積氮化鎵銦層(gallium and indium nitride layer)，晶圓表面溫度的變化將會引起沉積層的成分和帶隙的變化。因為銦具有相對高的蒸氣壓，在表面溫度較高的晶圓區域中該沉積層將會具有較低的銦比例和較大的帶隙。如果該沉積層為主動、LED結構的發光層，那麼由該晶圓形成的LED的輻射波長也將會變至不可接受的程度。 In an MOCVD process in which crystal growth occurs by chemical reaction on the surface of the substrate, process parameters must be carefully controlled to ensure that the chemical reaction is carried out under the desired conditions. Even small changes in process conditions can adversely affect device quality and production yield. For example, if a gallium and indium nitride layer is deposited, changes in the surface temperature of the wafer will cause variations in the composition and band gap of the deposited layer. Because indium has a relatively high vapor pressure, the deposited layer will have a lower indium ratio and a larger band gap in the region of the wafer where the surface temperature is higher. If the deposited layer is an active, LED structured light-emitting layer, the wavelength of the radiation formed by the wafer will also become unacceptable.

在MOCVD處理艙體中，在其上生長薄膜層的半導體晶圓設置於被稱作晶圓載具的快速旋轉的旋轉料架(carousel)上，以在反應艙體之內使它們的表面均勻暴露於氣體環境中，以沉積半導體材料。轉速是大約1000RPM。該晶圓載具典型地是由諸如石墨的高導熱材料機械加工出來的，並且經常塗覆有諸如碳化矽材料的保護層。每個晶圓載具具有一組圓形凹部(indentation)，或容置區(pocket)，在其頂表面中放置有單個的晶圓。典型地，晶圓被支撐為與每個容置區的底部表面成間隔關係以允許在該晶圓的邊緣周圍流動氣體。在U.S.專利申請公開No.2012/0040097、U.S.專利No.8092599、U.S.專利No.8021487、U.S.專利申請公開No.2007/0186853、U.S.專利No.6902623、U.S.專利No.6506252和U.S.專利No.6492625中描述了有關技術的一些實例，藉由引用將其公開內容合併於此。 In the MOCVD processing chamber, the semiconductor wafer on which the thin film layer is grown is placed on a rapidly rotating rotating carousel called a wafer carrier to uniformly expose their surfaces within the reaction chamber. In a gaseous environment, a semiconductor material is deposited. The speed is approximately 1000 RPM. The wafer carrier is typically machined from a highly thermally conductive material such as graphite and is often coated with a protective layer such as a tantalum carbide material. Each wafer carrier has a set of circular indentations, or pockets, with a single wafer placed in its top surface. Typically, the wafer is supported in spaced relationship with the bottom surface of each of the accommodating regions to allow gas to flow around the edges of the wafer. US Patent Application Publication No. 2012/0040097, US Patent No. 8092599, US Patent No. 8021487, US Patent Application Publication No. 2007/0186853, US Patent No. 6,902,623, US Patent No. 6,506,252, and US Patent No. 6,492,625 Some examples of related techniques are described herein, the disclosure of which is incorporated herein by reference.

晶圓載具被支撐於反應艙體中的轉軸(spindle)上，使得具有晶圓的暴露表面的晶圓載具的頂表面向上朝向氣體分配 裝置。當該轉軸旋轉時，該氣體被向下引導到該晶圓載具的頂表面上並且經過該頂表面流向該晶圓載具的外周。使用過的氣體透過設置在該晶圓載具下方的通口從反應艙體中排出。藉由加熱元件將該晶圓載具保持在期望的升高溫度，該加熱元件典型地是設置在該晶圓載具的底表面之下的電阻加熱元件。將這些加熱元件保持在比該晶圓表面的期望溫度還要高的溫度，然而典型地將該氣體分配裝置保持在遠低於期望反應溫度的溫度，以防止氣體過早反應。因而，熱量從該加熱元件向該晶圓載具的底表面傳輸並向上通過晶圓載具流向單個晶圓。 The wafer carrier is supported on a spindle in the reaction chamber such that the top surface of the wafer carrier having the exposed surface of the wafer is directed upward toward the gas distribution Device. As the shaft rotates, the gas is directed down onto the top surface of the wafer carrier and through the top surface to the periphery of the wafer carrier. The used gas is discharged from the reaction chamber through a port disposed under the wafer carrier. The wafer carrier is maintained at a desired elevated temperature by a heating element, typically a resistive heating element disposed beneath the bottom surface of the wafer carrier. These heating elements are maintained at a temperature higher than the desired temperature of the wafer surface, however the gas distribution device is typically maintained at a temperature well below the desired reaction temperature to prevent premature gas reaction. Thus, heat is transferred from the heating element to the bottom surface of the wafer carrier and flows upward through the wafer carrier to a single wafer.

在晶圓之上的氣流依賴於每個晶圓的徑向位置而變化，其中位於最外側的晶圓會具有較高流動率，此乃他們在轉動過程中較快的速度所導致。甚至在每個單個晶圓上都可能存在溫度非均勻性，即冷點和熱點。影響溫度非均勻性的形成的一個可變因素是晶圓載具內的容置區的形狀。通常，容置區形狀在該晶圓載具的表面中形成圓形。由於晶圓載具旋轉，因而該晶圓在其最外面的邊緣(即離旋轉軸最遠的邊緣)處受到實質性的向心力，導致晶圓擠靠該晶圓載具中各個容置區的內壁。在這種情況下，在晶圓的這些外部邊緣和容置區的邊緣之間存在緊密接觸。向晶圓的這些最外面部分的增加的熱傳導導致更大的溫度非均勻性，進一步使上述的問題惡化。既有的處理方式為藉由增加晶圓的邊緣和容置區的內壁之間的間隙來最小化溫度非均勻性，包括將晶圓設計為邊緣的一部分上是平的(即平邊晶圓)。晶圓的此平坦部分產生間隙並減小與該容置區的內壁的接觸點，由此緩和溫度非均勻性。其他影響晶圓載具所支撐晶圓各處的熱均勻性的因素包括晶圓載具的熱傳輸和發射特性，並結合晶圓容置區的佈局。 The airflow over the wafer varies depending on the radial position of each wafer, with the wafers on the outermost side having a higher flow rate due to their faster speed during rotation. There may be temperature non-uniformities, ie cold spots and hot spots, even on each individual wafer. One variable factor that affects the formation of temperature non-uniformities is the shape of the containment area within the wafer carrier. Typically, the shape of the receiving area forms a circle in the surface of the wafer carrier. As the wafer carrier rotates, the wafer is subjected to substantial centripetal force at its outermost edge (ie, the edge furthest from the axis of rotation), causing the wafer to be squeezed against the inner wall of each of the accommodating regions of the wafer carrier . In this case, there is close contact between these outer edges of the wafer and the edges of the accommodating area. The increased heat transfer to these outermost portions of the wafer results in greater temperature non-uniformities, further exacerbating the above problems. The existing treatment method is to minimize temperature non-uniformity by increasing the gap between the edge of the wafer and the inner wall of the accommodating area, including designing the wafer as a part of the edge is flat (ie, flat-sided crystal circle). This flat portion of the wafer creates a gap and reduces the point of contact with the inner wall of the accommodating area, thereby alleviating temperature non-uniformity. Other factors that affect the thermal uniformity across the wafer supported by the wafer carrier include the heat transfer and emission characteristics of the wafer carrier, combined with the layout of the wafer containment area.

與溫度均勻性需求相關的，對於晶圓載具的另一個 所希望的特性是增加CVD製程的生產量。在增加製程生產量中該晶圓載具的角色是保持大量的單個晶圓。提供具有更多晶圓的晶圓載具佈局影響熱模型。例如，由於來自晶圓載具邊緣的輻射熱損耗，靠近邊緣的晶圓載具的部分傾向處在比其他部分更低的溫度下。 Related to temperature uniformity requirements, another for wafer carriers The desired property is to increase the throughput of the CVD process. The role of the wafer carrier in increasing process throughput is to maintain a large number of individual wafers. Providing a wafer carrier layout with more wafers affects the thermal model. For example, due to radiant heat loss from the edge of the wafer carrier, portions of the wafer carrier near the edge tend to be at a lower temperature than other portions.

因此，需要在其中解決高密度佈局中的溫度均勻性和機械應力的用於晶圓載具的實用解決方案。 Therefore, there is a need for a practical solution for wafer carriers in which temperature uniformity and mechanical stress in a high density layout are addressed.

本創作提出一種晶圓載具，其包括新的容置區配置。本文所描述的配置係有助於熱傳輸，以及有助於達成圓晶圓生長之容置區的高填充密度(high packing density)。 This creation proposes a wafer carrier that includes a new accommodating zone configuration. The configuration described herein facilitates heat transfer and helps to achieve high packing density of the accommodating area for wafer growth.

142‧‧‧晶圓載具 142‧‧‧ wafer carrier

146‧‧‧本體 146‧‧‧ body

148‧‧‧頂表面 148‧‧‧ top surface

152‧‧‧底表面 152‧‧‧ bottom surface

162‧‧‧容置區 162‧‧‧Receiving area

164‧‧‧鎖定特徵部 164‧‧‧Locking feature

166‧‧‧側壁 166‧‧‧ side wall

168‧‧‧基板 168‧‧‧Substrate

R1、R2‧‧‧圓 R1, R2‧‧‧ round

在連同圖式考慮下列本創作各種實施例的詳細描述後，可以更完整地理解本創作，其中：圖1是根據一實施例的具有14個容置區配置的晶圓載具的立體圖。 The present invention can be more completely understood after considering the following detailed description of various embodiments of the present invention, in which: FIG. 1 is a perspective view of a wafer carrier having 14 accommodating zone configurations, in accordance with an embodiment.

圖2是根據一實施例的具有14個容置區配置的晶圓載具的俯視圖。 2 is a top plan view of a wafer carrier having 14 accommodating zone configurations, in accordance with an embodiment.

圖3是根據一實施例的具有14個容置區配置的晶圓載具的側視圖。 3 is a side view of a wafer carrier having 14 accommodating zone configurations, in accordance with an embodiment.

圖4是根據一實施例的具有14個容置區配置的晶圓載具的仰視圖。 4 is a bottom view of a wafer carrier having 14 accommodating zone configurations, in accordance with an embodiment.

圖5是根據一實施例的具有14個容置區配置的晶圓載具的部分細節圖，其顯示來自立體圖的單個容置區。 5 is a partial detail view of a wafer carrier having 14 accommodating zone configurations showing a single accommodating zone from a perspective view, in accordance with an embodiment.

圖1是根據一實施例的晶圓載具142的立體圖，該晶圓載具142係用於化學氣相沉積裝置中。圖2是同一晶圓載具142的俯視圖。晶圓載具142包括：具有頂表面148的本體146，和限定於其中的十四個容置區162。在圖1和圖2所示的實施例中，容置區162布置在兩個圓R1和R2中，每個圓與由本體146的外邊緣限定的圓是同心的。在徑向內圓R1中，四個容置區162在方位上均勻地間隔開。同樣地，在徑向外圓R2中，十個容置區162在方位上均勻地間隔開。每個容置區162是形成在本體146中的孔口，該孔口實質上延伸垂直於將頂表面148歸在內的平面。 1 is a perspective view of a wafer carrier 142 for use in a chemical vapor deposition apparatus, in accordance with an embodiment. 2 is a top plan view of the same wafer carrier 142. Wafer carrier 142 includes a body 146 having a top surface 148 and fourteen receiving regions 162 defined therein. In the embodiment illustrated in Figures 1 and 2, the receiving area 162 is disposed in two circles R1 and R2, each circle being concentric with a circle defined by the outer edge of the body 146. In the radially inner circle R1, the four accommodating regions 162 are evenly spaced apart in the azimuth. Similarly, in the radially outer circle R2, the ten accommodating regions 162 are evenly spaced apart in the azimuth. Each of the receiving regions 162 is an aperture formed in the body 146 that extends substantially perpendicular to a plane that centers the top surface 148.

在圖1和圖2中描繪的容置區的布置的優點在於：在頂表面148上保持相對高密度的容置區162的同時，其提供了期望水準的熱均勻性。而容置區162的尺寸可容納於此頂表面148的區域中。 An advantage of the arrangement of the accommodating regions depicted in Figures 1 and 2 is that while maintaining a relatively high density of accommodating regions 162 on the top surface 148, it provides a desired level of thermal uniformity. The receiving area 162 is sized to be received in the area of the top surface 148.

圖2更描繪了代表性的圓，容置區162布置在該圓的周圍。在圖2所示的實施例中，有兩個圓，R1和R2，每個圓具有不同的半徑，並且被布置為彼此同心以及與頂表面148的圓形輪廓同心。 Figure 2 further depicts a representative circle in which the accommodating area 162 is disposed. In the embodiment shown in Figure 2, there are two circles, R1 and R2, each having a different radius and arranged to be concentric with one another and concentric with the circular contour of the top surface 148.

圖3為一側視圖，其為圖1和圖2的晶圓載具142的側視圖。在圖3所示的視圖中，可以看出頂表面148和底表面152之間的尺寸上的相對差異。尤其是，頂表面更朝向如圖3中顯示的頁面的頂部和底部延伸，或者在圖1和圖2中顯示的圖中進一步向徑向延伸。先前在圖1和圖2中描繪的每個容置區162都從頂表面148朝向底表面152延伸。底表面152提供固態基底，在該固態基底上可以將晶圓生長在晶圓載具142中。 3 is a side elevational view of the wafer carrier 142 of FIGS. 1 and 2. In the view shown in Figure 3, the relative difference in size between the top surface 148 and the bottom surface 152 can be seen. In particular, the top surface extends further toward the top and bottom of the page as shown in Figure 3, or further radially in the figures shown in Figures 1 and 2. Each of the accommodating regions 162 previously depicted in FIGS. 1 and 2 extends from the top surface 148 toward the bottom surface 152. The bottom surface 152 provides a solid substrate on which wafers can be grown in the wafer carrier 142.

圖4是先前關於圖1至圖3所描述的晶圓載具142的仰視圖。如圖4中所示，晶圓載具142包括在底表面152的中心的鎖定 特徵部164。 4 is a bottom view of the wafer carrier 142 previously described with respect to FIGS. 1-3. As shown in FIG. 4, wafer carrier 142 includes a lock at the center of bottom surface 152. Feature portion 164.

圖5為顯示一個容置區162的部分立體圖。每個容置區162包括側壁166，其實質上是圓柱形的。由側壁166形成的圓柱的底部是基板168。 FIG. 5 is a partial perspective view showing an accommodation area 162. Each receiving area 162 includes a side wall 166 that is substantially cylindrical. The bottom of the cylinder formed by side wall 166 is substrate 168.

這些實施例是用作示例的目的而非限制。附加的實施例為在申請專利範圍內。另外，儘管已參考具體實施例來描述本創作的多個方面，但是所屬領域的技術人員將會認識到可以在不脫離由申請專利範圍所限定的本創作的範圍的情況下對形式和細節上作出改變。 These examples are for illustrative purposes and are not limiting. Additional embodiments are within the scope of the patent application. In addition, while the various aspects of the present invention have been described with reference to the specific embodiments, those skilled in the art will recognize that the form and details can be made without departing from the scope of the present invention as defined by the scope of the claims. Make a change.

142‧‧‧晶圓載具 142‧‧‧ wafer carrier

148‧‧‧頂表面 148‧‧‧ top surface

162‧‧‧容置區 162‧‧‧Receiving area

R1、R2‧‧‧圓 R1, R2‧‧‧ round

Claims (3)

一種晶圓載具，其係用於化學氣相沉積裝置中，該晶圓載具包括：本體，該本體具有彼此相對布置的頂表面和底表面；以及複數個容置區，該複數個容置區限定在該晶圓載具的該頂表面中；其中該晶圓載具包括由總共14個容置區組成的該複數個容置區，每個容置區沿著兩個圓中的一個圓而布置，其中該兩個圓係彼此同心並且係與由該頂表面的周邊所形成的圓形輪廓同心。 A wafer carrier for use in a chemical vapor deposition apparatus, the wafer carrier comprising: a body having a top surface and a bottom surface disposed opposite to each other; and a plurality of accommodating regions, the plurality of accommodating regions Included in the top surface of the wafer carrier; wherein the wafer carrier comprises the plurality of accommodating regions consisting of a total of 14 accommodating regions, each accommodating region being arranged along one of two circles Where the two circles are concentric with one another and are concentric with a circular contour formed by the perimeter of the top surface. 如請求項1所述之晶圓載具，其中：該複數個容置中的四個容置區係環繞該兩個圓中的第一個圓而布置；並且該複數個容置中的十個容置區係環繞該兩個圓中的第二個圓而布置。 The wafer carrier of claim 1, wherein: the four accommodating regions of the plurality of accommodities are arranged around a first one of the two circles; and ten of the plurality of accommodating The accommodating zone is arranged around a second of the two circles. 如請求項2所述之晶圓載具，其中該第一個圓被該第二個圓圍繞。 The wafer carrier of claim 2, wherein the first circle is surrounded by the second circle.
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Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD837479S1 (en) * 2017-07-26 2019-01-01 Coincard Llc Coin card device
JP1597807S (en) * 2017-08-21 2018-02-19
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD874870S1 (en) * 2018-10-17 2020-02-11 Larry Parker Trivet
USD959032S1 (en) * 2020-07-03 2022-07-26 Hong Chen LED diving light
USD965829S1 (en) * 2020-08-31 2022-10-04 Shenzhen Xing Guo Peng Technology Co., Ltd. Diving light
USD1039784S1 (en) * 2021-06-22 2024-08-20 Provenance Ngc Llc Collectible coin holder
USD1002915S1 (en) * 2022-05-18 2023-10-24 Chen Wu Lens
USD1026297S1 (en) * 2022-07-15 2024-05-07 Dandan Tan Set of lenses

Family Cites Families (267)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1448769A (en) 1922-02-10 1923-03-20 American Foundry & Mfg Company Floor drain
DE1427772A1 (en) 1965-11-23 1968-12-12 Telefunken Patent Method for cutting a semiconductor wafer into individual semiconductor chips
US3409138A (en) 1967-09-15 1968-11-05 Lawrence Robert Eaves-box strainer
US3731435A (en) 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3783822A (en) 1972-05-10 1974-01-08 J Wollam Apparatus for use in deposition of films from a vapor phase
US3845738A (en) * 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
IL56224A (en) 1978-01-16 1982-08-31 Veeco Instr Inc Substrate clamp for use in semiconductor fabrication
USD265069S (en) 1979-07-16 1982-06-22 Corning Glass Works Tray for flower pots or the like
USD280803S (en) 1982-09-20 1985-10-01 Peterson Robert T Dial face for electronic timepiece
USD296029S (en) 1985-08-27 1988-05-31 Mag-Nif Incorporated Coin bank
USD302204S (en) 1986-11-05 1989-07-11 Gatton James W Portable outdoor fireplace
USD310874S (en) 1988-09-14 1990-09-25 Utley Jr James E Solar powered roof vent fan
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
USD325934S (en) 1990-04-20 1992-05-05 Vinko Ramljak Holder for crayons, markers, pencils and the like
USD344788S (en) 1991-03-22 1994-03-01 Castro Marco G Combined ventilated toilet seat and cover
US5152842A (en) 1991-12-05 1992-10-06 Rohm Co., Ltd. Reactor for epitaxial growth
USD365541S (en) 1993-05-25 1995-12-26 Hirsch Jeffrey G Terracotta pot insert
JP2849533B2 (en) 1993-08-18 1999-01-20 長野電子工業株式会社 Wafer polishing method
JP2716653B2 (en) 1993-11-01 1998-02-18 不二越機械工業株式会社 Wafer polishing apparatus and polishing method
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
JPH0878347A (en) 1994-09-06 1996-03-22 Komatsu Electron Metals Co Ltd Susceptor for epitaxial growth apparatus
US5674107A (en) 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
USD388123S (en) 1995-04-28 1997-12-23 Copal Company Limited Light-emitting diode indicator
JPH0936049A (en) 1995-07-21 1997-02-07 Mitsubishi Electric Corp Vapor phase growth device and compound semiconductor device manufactured with said device
USD398997S (en) 1995-11-22 1998-09-29 Strix Limited Base part for a liquid heating vessel
JPH09201765A (en) 1996-01-25 1997-08-05 Shin Etsu Handotai Co Ltd Packing pad, and method of plishing semiconductor wafer
USD383377S (en) 1996-05-03 1997-09-09 Sellers Kathleen R Cushioned furniture protector
US5840124A (en) * 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US6080042A (en) 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
USD410408S (en) 1998-05-18 1999-06-01 Green Richard D Flower vase
JP3983387B2 (en) * 1998-09-29 2007-09-26 日本碍子株式会社 Electrostatic chuck
TW467802B (en) 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
USD428133S (en) 1999-12-14 2000-07-11 Shu-Chin Chen Ceiling fan motor housing
US6331136B1 (en) 2000-01-25 2001-12-18 Koninklijke Philips Electronics N.V. (Kpenv) CMP pad conditioner arrangement and method therefor
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
DE10023002B4 (en) 2000-05-11 2006-10-26 Siltronic Ag Set of carriers and its use
US6454635B1 (en) * 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6709981B2 (en) 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6492625B1 (en) 2000-09-27 2002-12-10 Emcore Corporation Apparatus and method for controlling temperature uniformity of substrates
US7204887B2 (en) 2000-10-16 2007-04-17 Nippon Steel Corporation Wafer holding, wafer support member, wafer boat and heat treatment furnace
USD466597S1 (en) 2000-11-10 2002-12-03 Bricmont, Inc. Roller hearth reheat furnace tire
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US6528124B1 (en) * 2000-12-01 2003-03-04 Komag, Inc. Disk carrier
US6506252B2 (en) 2001-02-07 2003-01-14 Emcore Corporation Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition
US6645049B2 (en) 2001-04-23 2003-11-11 Phuong Van Nguyen Polishing holder for silicon wafers and method of use thereof
US6666948B2 (en) 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6902623B2 (en) 2001-06-07 2005-06-07 Veeco Instruments Inc. Reactor having a movable shutter
USD464420S1 (en) 2002-01-03 2002-10-15 Rochelle Tolar Portable battery-powered neck fan
US7335578B2 (en) 2002-04-11 2008-02-26 Sekisui Chemical Co., Ltd. Method for manufacturing semiconductor chip
US6710611B2 (en) 2002-04-19 2004-03-23 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
US7067763B2 (en) 2002-05-17 2006-06-27 Gsi Group Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
USD475023S1 (en) 2002-06-06 2003-05-27 Caterpillar Inc Piezoelectric actuator device
USD490511S1 (en) 2002-06-29 2004-05-25 Hunter Fan Company Ceiling fan motor housing
JP2004207606A (en) 2002-12-26 2004-07-22 Disco Abrasive Syst Ltd Wafer support plate
USD486906S1 (en) 2003-01-29 2004-02-17 Delta Electronics Inc. Fan housing
USD485613S1 (en) 2003-01-29 2004-01-20 Delta Electronics Inc. Fan housing
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7052371B2 (en) 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
USD490183S1 (en) 2003-07-28 2004-05-18 Lusa Lighting, Inc. Lighting fixture
USD493246S1 (en) 2003-07-28 2004-07-20 Lusa Lighting, Inc. Lighting fixture
USD491098S1 (en) 2003-09-24 2004-06-08 Wilton Industries, Inc. Tiered floral centerpiece
US7235139B2 (en) * 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
USD502990S1 (en) 2003-12-09 2005-03-15 Ground Control Systems, Inc. Airflow screen
USD510988S1 (en) 2004-03-24 2005-10-25 Frank Blateri Heater fan
NO325853B1 (en) 2004-04-16 2008-08-04 Nor X Ind As Polymer compound
US7570368B2 (en) 2004-05-12 2009-08-04 Veeco Instruments Inc. Method and apparatus for measuring the curvature of reflective surfaces
USD512500S1 (en) 2004-05-20 2005-12-06 Lasko Holdings, Inc. Body of a horizontal blower fan
USD577159S1 (en) 2004-06-08 2008-09-16 Nicholas Steven Hasapoglou Seed catcher for birdfeeders
USD517073S1 (en) 2004-07-14 2006-03-14 Capital One Financial Corporation Data card
USD511827S1 (en) 2004-07-28 2005-11-22 Lasko Holdings, Inc. Body of a vertical blower fan
USD512501S1 (en) 2004-07-28 2005-12-06 Lasko Holdings, Inc. Body of a horizontal blower fan
USD504666S1 (en) 2004-08-26 2005-05-03 Emtelle (Uk) Limited Closure for conduits for cables
JP2006092722A (en) 2004-08-27 2006-04-06 Showa Denko Kk Magnetic disk substrate and production method of magnetic disk
USD523825S1 (en) 2004-10-14 2006-06-27 Toshiba Lighting & Technology Corporation Light emitting diode module
USD551923S1 (en) 2005-03-03 2007-10-02 Robert Bosch Gmbh Saw blade
US8083041B2 (en) 2005-08-11 2011-12-27 American Axle & Manufacturing, Inc. Electrohydraulic torque transfer device
USD544452S1 (en) 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
JP2007075949A (en) 2005-09-14 2007-03-29 Ebara Corp Polishing platen and polishing device
TWI327761B (en) 2005-10-07 2010-07-21 Rohm & Haas Elect Mat Method for making semiconductor wafer and wafer holding article
ITMN20060032A1 (en) 2006-04-21 2007-10-22 Luciano Pinotti SYSTEM AND EQUIPMENT FOR SELF-TANNING
USD570075S1 (en) 2006-06-08 2008-05-27 Gary Wood Coin display folder
CA117839S (en) 2006-10-11 2007-08-02 Beta Calco Inc Light fixture
US20080102199A1 (en) 2006-10-26 2008-05-01 Veeco Instruments Inc. Multi-wafer rotating disc reactor with wafer planetary motion induced by vibration
US8177993B2 (en) 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
DE102007023970A1 (en) 2007-05-23 2008-12-04 Aixtron Ag Apparatus for coating a plurality of densely packed substrates on a susceptor
USD571436S1 (en) 2007-06-14 2008-06-17 Alsons Corporation Showerhead
US8092599B2 (en) 2007-07-10 2012-01-10 Veeco Instruments Inc. Movable injectors in rotating disc gas reactors
USD591695S1 (en) 2007-07-11 2009-05-05 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode module
USD629547S1 (en) 2007-09-20 2010-12-21 Glp German Light Products Gmbh Lights
JP2009088088A (en) 2007-09-28 2009-04-23 Sharp Corp Substrate treating device and method
USD597639S1 (en) 2007-11-19 2009-08-04 Yeh Chen Lee Fan forced heater
US8021487B2 (en) 2007-12-12 2011-09-20 Veeco Instruments Inc. Wafer carrier with hub
US20110114022A1 (en) 2007-12-12 2011-05-19 Veeco Instruments Inc. Wafer carrier with hub
US20090194026A1 (en) 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
US8022372B2 (en) 2008-02-15 2011-09-20 Veeco Instruments Inc. Apparatus and method for batch non-contact material characterization
US8182315B2 (en) 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
US20090276333A1 (en) 2008-05-05 2009-11-05 Cortes Ricardo D Electronic submission and management of digital products for network-based distribution
JP2009283551A (en) 2008-05-20 2009-12-03 Showa Denko Kk Semiconductor light emitting element, method for manufacturing thereof, and lamp
USD610290S1 (en) 2008-05-26 2010-02-16 Toshiba Lighting & Technology Corporation Recessed lighting fixture
JP5596030B2 (en) 2008-06-26 2014-09-24 スリーエム イノベイティブ プロパティズ カンパニー Polishing pad having porous element and method for producing and using the same
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
TWD135511S1 (en) 2008-10-03 2010-06-21 日本碍子股份有限公司 Electrostatic chuck
US9000605B2 (en) 2008-10-15 2015-04-07 Altaeros Energies, Inc. Lighter-than-air craft for energy-producing turbines
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD606952S1 (en) 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
JP2010194704A (en) 2009-01-27 2010-09-09 Shinano Denki Seiren Kk Grinding wheel for correcting surface plate, polishing device for correcting surface plate, and method for correcting polishing surface plate
US8216379B2 (en) 2009-04-23 2012-07-10 Applied Materials, Inc. Non-circular substrate holders
USD611042S1 (en) 2009-06-24 2010-03-02 Research In Motion Limited Handheld electronic device skin
USD621804S1 (en) 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9581756B2 (en) 2009-10-05 2017-02-28 Lighting Science Group Corporation Light guide for low profile luminaire
KR20110006718U (en) 2009-12-29 2011-07-06 인택 김 PH test instrument
KR20110006716U (en) 2009-12-29 2011-07-06 이태호 .finger ring Holder
KR20110006715U (en) 2009-12-29 2011-07-06 이태호 fingerring Holder
USD618328S1 (en) 2010-01-20 2010-06-22 C.C. & L Company Limited Air cleaner
TWM392431U (en) 2010-02-04 2010-11-11 Epistar Corp Systems for epitaxial growth
EP2536974B1 (en) 2010-02-16 2015-01-21 Martin Professional ApS Illumination device with interlocked yoke shell parts
WO2011106064A1 (en) 2010-02-24 2011-09-01 Veeco Instruments Inc. Processing methods and apparatus with temperature distribution control
USD624692S1 (en) 2010-04-21 2010-09-28 Tri-Lite, Inc. LED dock light head
TWI398545B (en) 2010-04-29 2013-06-11 Chi Mei Lighting Tech Corp Metal-organic chemical vapor deposition apparatus
TWI390074B (en) 2010-04-29 2013-03-21 Chi Mei Lighting Tech Corp Metal-organic chemical vapor deposition apparatus
KR20110136583A (en) 2010-06-15 2011-12-21 삼성엘이디 주식회사 Susceptor and chemical vapor deposition apparatus comprising the same
USD668577S1 (en) 2010-06-18 2012-10-09 Blueink.com LLC Interactive artwork display
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
ES2455223T3 (en) 2010-07-28 2014-04-15 Corporació Sanitària Parc Taulí Lamp
US8460466B2 (en) 2010-08-02 2013-06-11 Veeco Instruments Inc. Exhaust for CVD reactor
US8414361B2 (en) 2010-08-13 2013-04-09 Phuong Van Nguyen Silicon carbide, sapphire, germanium, silicon and pattern wafer polishing templates holder
US8535445B2 (en) 2010-08-13 2013-09-17 Veeco Instruments Inc. Enhanced wafer carrier
TWM397030U (en) 2010-08-16 2011-01-21 Liang Meng Plastic Share Co Ltd LED packaging structure
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD668211S1 (en) 2010-09-10 2012-10-02 Novellus Systems, Inc. Segmented electroplating anode and anode segment
USD648289S1 (en) 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
CN201942749U (en) 2010-11-16 2011-08-24 璨圆光电股份有限公司 Carrying disc structure for vapor phase deposition equipment
US8562746B2 (en) 2010-12-15 2013-10-22 Veeco Instruments Inc. Sectional wafer carrier
USD675171S1 (en) 2010-12-16 2013-01-29 Tecella Llc Multi-electrode holder
US20120171377A1 (en) 2010-12-30 2012-07-05 Veeco Instruments Inc. Wafer carrier with selective control of emissivity
EP2489930B1 (en) 2011-02-21 2015-03-25 LG Innotek Co., Ltd. Lighting module and lighting device
USD677376S1 (en) 2011-03-02 2013-03-05 Gary Wolff Bird and large insect vent cap for exhaust pipes for high efficiency furnaces
USD681867S1 (en) 2011-03-11 2013-05-07 GE Lighting Solutions, LLC Suspended luminaire
TW201239124A (en) 2011-03-22 2012-10-01 Chi Mei Lighting Tech Corp Wafer susceptor and chemical vapor deposition apparatus
US20120272892A1 (en) 2011-04-07 2012-11-01 Veeco Instruments Inc. Metal-Organic Vapor Phase Epitaxy System and Process
US9653340B2 (en) 2011-05-31 2017-05-16 Veeco Instruments Inc. Heated wafer carrier profiling
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
TWM420823U (en) 2011-07-29 2012-01-11 Hermes Epitek Corp Multi-wafer susceptor
USD686354S1 (en) 2011-08-02 2013-07-16 Acolyte Technologies Corporation Lighting device
USD690841S1 (en) 2011-08-02 2013-10-01 Acolyte Technologies Corporation Lighting device
USD690840S1 (en) 2011-08-02 2013-10-01 Acolyte Technologies Corporation Lighting device
US20130043493A1 (en) 2011-08-18 2013-02-21 Richard Ta-Chung Wang Light-emitting diode structure
USD700987S1 (en) 2011-08-30 2014-03-11 Cooper Technologies Company Trapezoidal luminaire
JP1438745S (en) 2011-09-20 2015-04-06
USD699199S1 (en) 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD674961S1 (en) 2011-10-10 2013-01-22 Hella Kgaa Hueck & Co. LED approach light
JP5865916B2 (en) 2011-10-31 2016-02-17 京セラ株式会社 Gas nozzle, plasma apparatus using the same, and method for manufacturing gas nozzle
USD679446S1 (en) 2011-11-17 2013-04-02 Myotek Pacific Corp. LED spot lamp
USD720309S1 (en) 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD694926S1 (en) 2011-12-09 2013-12-03 Martin Professional A/S Lighting fixture
USD760180S1 (en) 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD748593S1 (en) 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
TWD151017S (en) 2012-01-20 2012-12-21 隆達電子股份有限公司 Light emitting diode module
JP5999807B2 (en) 2012-03-07 2016-09-28 東洋炭素株式会社 Susceptor
USD690671S1 (en) 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD695242S1 (en) 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD695241S1 (en) 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
US9816184B2 (en) 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
USD678294S1 (en) 2012-04-13 2013-03-19 3M Innovative Properties Company Case for a tablet electronic device
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
USD673113S1 (en) 2012-04-19 2012-12-25 Better Energy Systems Inc. Portable energy storage and power supply device
USD677422S1 (en) 2012-05-01 2013-03-05 Foxsemicon Integrated Technology, Inc. Lens cover for LED lamp
USD769432S1 (en) 2012-05-14 2016-10-18 Technologies Holdings Corp. Vapor compression dehumidifier
USD697581S1 (en) 2012-09-13 2014-01-14 Canada Pipeline Accessories, Co. Ltd. Flow conditioner
USD713492S1 (en) 2012-09-13 2014-09-16 Canada Pipeline Accessories, Co. Ltd. Flow conditioner with internal vanes
USD686713S1 (en) 2012-09-19 2013-07-23 Shizuoka Seiki Co., Ltd. Infrared oil heater
USD699201S1 (en) 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD722150S1 (en) 2012-10-11 2015-02-03 ResMed Humidification Technologies GmbH Passover humidifier
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD682028S1 (en) 2012-11-06 2013-05-14 Victor Preisler Gas burner
USD693782S1 (en) 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
CN102983093B (en) 2012-12-03 2016-04-20 安徽三安光电有限公司 A kind of graphite carrier for LED epitaxial wafer processing procedure
CN203007414U (en) 2012-12-26 2013-06-19 光达光电设备科技（嘉兴）有限公司 Chemical vapor deposition device and tray thereof
USD751999S1 (en) 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
US9388493B2 (en) 2013-01-08 2016-07-12 Veeco Instruments Inc. Self-cleaning shutter for CVD reactor
USD701939S1 (en) 2013-01-11 2014-04-01 Canada Pipeline Accessories, Co. Ltd Flow conditioner
USD708728S1 (en) 2013-02-13 2014-07-08 Lg Electronics Inc. Air cleaner
USD714488S1 (en) 2013-02-26 2014-09-30 Shanghai Sansi Electronics Engineering Co., Ltd. Chessboard shaped LED lamp
USD699691S1 (en) 2013-03-06 2014-02-18 Posco Led Company Ltd. Light emitting diode module for LED lighting
USD736941S1 (en) 2013-03-08 2015-08-18 Egerton Roy Nicholson Gel pack
US9273413B2 (en) 2013-03-14 2016-03-01 Veeco Instruments Inc. Wafer carrier with temperature distribution control
USD702357S1 (en) 2013-03-15 2014-04-08 Tesseract Sensors, LLC Electrode patch array
USD732647S1 (en) 2013-03-15 2015-06-23 Illinois Tool Works Inc. Air filtration device
US10167571B2 (en) 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
USD702356S1 (en) 2013-03-15 2014-04-08 Tesseract Sensors, LLC Electrode patch array
USD721417S1 (en) 2013-04-11 2015-01-20 Canada Pipeline Accessories, Co., Ltd. Flow conditioner
USD778423S1 (en) 2013-04-15 2017-02-07 Integrated Global Services, Inc. High surface area ash removal screen
US9328908B2 (en) 2013-04-16 2016-05-03 Checkers Industrial Products, Llc LED strobe light with integrated magnet and heat sink chimney
USD751773S1 (en) 2013-04-26 2016-03-15 Robert Gailen Feeding platter for pets
TWI609991B (en) 2013-06-05 2018-01-01 維克儀器公司 Improved wafer carrier having thermal uniformity-enhancing features
USD760883S1 (en) 2013-08-05 2016-07-05 Oransi, Llc Air purifier
USD752202S1 (en) 2013-08-08 2016-03-22 Homewerks Worldwide, LLC Fan grille
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD708346S1 (en) 2013-09-18 2014-07-01 Lmi Ip, Llc Laminar flow swim spa jet
US10015868B2 (en) 2014-11-03 2018-07-03 Osram Sylvania Inc. Solid-state lamps with electronically adjustable light beam distribution
USD723077S1 (en) 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
TWI650832B (en) 2013-12-26 2019-02-11 維克儀器公司 Wafer carrier having thermal cover for chemical vapor deposition systems
TW201526287A (en) 2013-12-30 2015-07-01 Lextar Electronics Corp Method of manufacturing semiconductor device
DE102014100024A1 (en) 2014-01-02 2015-07-02 Aixtron Se Device for the arrangement of substrates, in particular susceptor of a CVD reactor
USD742770S1 (en) 2014-01-06 2015-11-10 Greenwave Systems Pte. Ltd. Enclosure for electronic device
JP1518059S (en) 2014-01-09 2015-02-23
USD754785S1 (en) 2014-01-22 2016-04-26 Karen Theresa Gibson Musical steel pan with drum sticks
USD766850S1 (en) 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD717086S1 (en) 2014-04-28 2014-11-11 Pendleton Safe Company, Inc. Shelf
USD764424S1 (en) 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
US9500341B2 (en) 2014-05-16 2016-11-22 The Boeing Company Optical filtering system for solar cell testing
DE102014114947A1 (en) 2014-05-16 2015-11-19 Aixtron Se Device for depositing semiconductor layers and a susceptor for use in such a device
USD746437S1 (en) 2014-05-22 2015-12-29 3M Innovative Properties Company Respirator mask having a communication grille
USD785575S1 (en) 2014-05-28 2017-05-02 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD720313S1 (en) 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD731409S1 (en) 2014-06-26 2015-06-09 Water Technology Llc Surface ornamentation for a passive solar heating article
USD764957S1 (en) 2014-07-14 2016-08-30 Vivint, Inc. Mobile personal device
USD748429S1 (en) 2014-09-16 2016-02-02 Shaoxing Morocomo Baby Products Co., Ltd Drinking bottle lid
USD752199S1 (en) 2014-09-22 2016-03-22 Homewerks Worldwide, LLC Bath fan with speaker
JP1529977S (en) 2014-11-04 2015-07-27
USD778422S1 (en) 2014-12-10 2017-02-07 Minka Lighting, Inc. Combination ceiling fan and light fixture
USD779052S1 (en) 2014-12-10 2017-02-14 Minka Lighting, Inc. Ceiling fan housing with light fixture
US20160169503A1 (en) 2014-12-14 2016-06-16 Shih-Yun Chen Led lamp for ceiling fan and ceiling fan having the same
USD778416S1 (en) 2014-12-15 2017-02-07 Samsung Electronics Co., Ltd. Air conditioner
USD785678S1 (en) 2014-12-24 2017-05-02 Ngk Insulators, Ltd. Catalyst carrier for exhaust gas purification
USD753269S1 (en) 2015-01-09 2016-04-05 Asm Ip Holding B.V. Top plate
USD789924S1 (en) 2015-01-16 2017-06-20 Apple Inc. Electronic device
USD751381S1 (en) 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD751382S1 (en) 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD751384S1 (en) 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD751383S1 (en) 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD751380S1 (en) 2015-01-26 2016-03-15 G3 Enterprises, Inc. Carbonated beverage cap liner
USD765608S1 (en) 2015-02-03 2016-09-06 Lg Electronics Inc. Smart key for automobiles
USD778651S1 (en) 2015-02-16 2017-02-14 Home Depot Product Authority, Llc Magnetic drawer divider piece
USD758905S1 (en) 2015-03-11 2016-06-14 BleepBleeps Limited Motion alarm
USD774128S1 (en) 2015-03-12 2016-12-13 Matthew Pinner Young Metal tongue drum
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
AU362435S (en) 2015-03-26 2015-07-07 Tronac Pty Ltd Thermostat/hub for climate control and monitoring
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD779706S1 (en) 2015-04-07 2017-02-21 Flos S.P.A. Table lamp
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD768538S1 (en) 2015-05-12 2016-10-11 Viicii Llc Cufflink
US20160341400A1 (en) 2015-05-22 2016-11-24 Posco Led Company Ltd. Optical semiconductor lighting apparatus
USD780821S1 (en) 2015-06-02 2017-03-07 Transitions Optical, Inc. Lens holder
US20160370019A1 (en) 2015-06-18 2016-12-22 Technologies Holdings Corp. Heating and cooling system for hazardous environments
US10438795B2 (en) 2015-06-22 2019-10-08 Veeco Instruments, Inc. Self-centering wafer carrier system for chemical vapor deposition
KR101737364B1 (en) 2015-08-31 2017-05-18 엘지전자 주식회사 Air conditioner including the same
US20170076972A1 (en) 2015-09-15 2017-03-16 Veeco Instruments Inc. Planetary wafer carriers
USD771785S1 (en) 2015-09-22 2016-11-15 Hao-Yu Huang Essential oil diffuser
USD781165S1 (en) 2015-10-01 2017-03-14 Htc Corporation Weight scale
USD756907S1 (en) 2015-10-01 2016-05-24 Joe Secard Floating solar heating device
US10081295B2 (en) 2015-10-13 2018-09-25 Ford Global Technologies, Llc Illuminated badge for a vehicle
USD787357S1 (en) 2015-10-21 2017-05-23 Apple Inc. Security attachment
USD772334S1 (en) 2015-10-30 2016-11-22 Roland Corporation Electronic percussion instrument
US20170122506A1 (en) 2015-10-30 2017-05-04 Dale Collins Personal Safety Light
USD784429S1 (en) 2015-11-04 2017-04-18 Samsung Electronics Co., Ltd. Condenser for refrigerator
KR102419890B1 (en) 2015-11-05 2022-07-13 삼성전자주식회사 Light emitting apparatus and method of manufacturing the same

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