JP2007075949A - Polishing platen and polishing device - Google Patents

Polishing platen and polishing device Download PDF

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Publication number
JP2007075949A
JP2007075949A JP2005267155A JP2005267155A JP2007075949A JP 2007075949 A JP2007075949 A JP 2007075949A JP 2005267155 A JP2005267155 A JP 2005267155A JP 2005267155 A JP2005267155 A JP 2005267155A JP 2007075949 A JP2007075949 A JP 2007075949A
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Japan
Prior art keywords
polishing
platen
mirror
surface portion
polishing platen
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Pending
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JP2005267155A
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Japanese (ja)
Inventor
Takuji Kobayashi
卓二 小林
Hideo Aizawa
英夫 相澤
Masao Umemoto
正雄 梅本
Chuichi Sone
忠一 曽根
Hiroomi Torii
弘臣 鳥居
Nobuyuki Takahashi
信行 高橋
Takashi Tsuzuki
隆 都築
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Ebara Corp
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Ebara Corp
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Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2005267155A priority Critical patent/JP2007075949A/en
Priority to US11/990,848 priority patent/US20090247057A1/en
Priority to PCT/JP2006/318459 priority patent/WO2007032517A1/en
Priority to KR1020087008771A priority patent/KR20080046715A/en
Priority to CNA2006800334576A priority patent/CN101262982A/en
Priority to EP06798070A priority patent/EP1934017A1/en
Priority to TW095134036A priority patent/TW200714407A/en
Publication of JP2007075949A publication Critical patent/JP2007075949A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing platen, which is comparatively easily peeled without requiring a strong force to peel a polishing pad from the upper surface of the polishing platen, and also to provide a polishing device using the polishing platen. <P>SOLUTION: The polishing device is equipped with the polishing platen 12, presses a polished substrate to a polishing pad surface applied on the upper surface of the polishing platen 12, and polishes the polished substrate by a relative motion between the polishing platen and the polished substrate. The polishing device is composed of: a combination of a mirror surface part 21 having a mirror finished upper surface of the polishing platen 12, and a rough surface part 22 roughly finished, and the back surface of the polishing pad is applied on the upper surface of the polishing platen 12 with an adhesive (an adhesive tape). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、半導体ウエハ等の被研磨基板を研磨する研磨プラテン、及び該研磨プラテンを用いた研磨装置に関し、特に研磨プラテン上面に貼り付けた研磨パッドを容易に引き剥がすことが可能な研磨プラテン、及び該研磨プラテンを用いた研磨装置に関するものである。   The present invention relates to a polishing platen for polishing a substrate to be polished such as a semiconductor wafer, and a polishing apparatus using the polishing platen. In particular, a polishing platen capable of easily peeling a polishing pad attached to the upper surface of the polishing platen, And a polishing apparatus using the polishing platen.

半導体ウエハ等の被研磨基板を研磨する研磨装置として、ＣＭＰ装置（化学機械的研磨装置）がある。研磨装置１０は、図１及び図２に示すように回転軸１１を中心に回転する研磨プラテン１２と、回転軸１３を中心に回転する基板保持ヘッド１４を備えている。該研磨プラテン１２上面に粘着剤（接着テープ等）１５より研磨パッド１６を貼り付け、該研磨パッド１５の表面に基板保持ヘッド１４で保持する半導体ウエハ等の被研磨基板１８を押し当て、基板保持ヘッド１４の回転による被研磨基板１８の回転と研磨プラテン１２の回転による研磨パッド１６の回転の相対運動により、被研磨基板１８を研磨する。図示は省略するが研磨パッド１６の表面には、スラリー等の研磨剤が供給されるようになっている。なお、図１は研磨装置の側面図、図２はその研磨プラテンの一部を示す図である。   As a polishing apparatus for polishing a substrate to be polished such as a semiconductor wafer, there is a CMP apparatus (chemical mechanical polishing apparatus). As shown in FIGS. 1 and 2, the polishing apparatus 10 includes a polishing platen 12 that rotates about a rotation shaft 11 and a substrate holding head 14 that rotates about a rotation shaft 13. A polishing pad 16 is attached to the upper surface of the polishing platen 12 with an adhesive (adhesive tape or the like) 15, and a substrate 18 to be polished such as a semiconductor wafer held by the substrate holding head 14 is pressed against the surface of the polishing pad 15 to hold the substrate. The substrate 18 to be polished is polished by the relative movement of the rotation of the substrate 18 by the rotation of the head 14 and the rotation of the polishing pad 16 by the rotation of the polishing platen 12. Although not shown, an abrasive such as slurry is supplied to the surface of the polishing pad 16. 1 is a side view of the polishing apparatus, and FIG. 2 is a view showing a part of the polishing platen.

上記構成の研磨装置において、研磨パッド１６の交換の際等、研磨パッド１６を研磨プラテン１２上面から引き剥がすのに強大な引き剥がし力が必要になるという問題があった。これは鏡面仕上げした研磨プラテン１２上面に粘着剤（接着テープ等）１５により研磨パッド１６を貼り付けているためである。即ち、研磨パッド１６の裏面が粘着剤（接着テープ等）１５を介して鏡面に仕上げられた研磨プラテン１２上面に強力に密着しており、研磨パッド１６を端面から引き剥がし始めると、始めは比較的小さい引き剥がし力で済むが、徐々にこの引き剥がし力が増大し、強大な引き剥がし力が必要なる。そのため、研磨パッド１６の引き剥がしに多大な労力を必要とするという問題があった。その対策として、従来は特許文献１、２に示すような、特殊な剥離治具を用いて、研磨パッド１６の引き剥がしを行なっている。
特開平１０−２１７１４８号公報 特開平１０−２１７１４９号公報 In the polishing apparatus having the above configuration, there has been a problem that a strong peeling force is required to peel off the polishing pad 16 from the upper surface of the polishing platen 12 when the polishing pad 16 is replaced. This is because the polishing pad 16 is attached to the upper surface of the mirror-finished polishing platen 12 with an adhesive (adhesive tape or the like) 15. That is, the back surface of the polishing pad 16 is strongly adhered to the upper surface of the polishing platen 12 that is mirror-finished via an adhesive (adhesive tape or the like) 15, and when the polishing pad 16 starts to be peeled off from the end surface, comparison is initially made. However, the peeling force gradually increases, and a strong peeling force is required. Therefore, there has been a problem that much effort is required to peel off the polishing pad 16. Conventionally, as a countermeasure, the polishing pad 16 is peeled off using a special peeling jig as shown in Patent Documents 1 and 2.
Japanese Patent Laid-Open No. 10-217148 Japanese Patent Laid-Open No. 10-217149

本発明は上述の点に鑑みて成された物で、研磨プラテン上面から研磨パッドを引き剥がすのに、強大な力を必要とすることなく、比較的容易に引き剥がすことができる研磨プラテン、及び該研磨プラテンを用いた研磨装置を提供することを目的とする。   The present invention has been made in view of the above points, and a polishing platen that can be peeled off relatively easily without requiring a large force to peel off the polishing pad from the upper surface of the polishing platen, and An object of the present invention is to provide a polishing apparatus using the polishing platen.

上記課題を解決するため請求項１に記載の発明は、研磨パッドが貼り付けられる研磨プラテンにおいて、前記研磨プラテンの少なくとも研磨パッドの貼付領域の表面を第１の面及び該第１の面とは粗度の異なる第２の面との組合せで構成したことを特徴とする。   In order to solve the above-mentioned problem, the invention according to claim 1 is the polishing platen to which the polishing pad is attached. In the polishing platen, at least the surface of the polishing pad attachment region is defined as the first surface and the first surface. It is characterized by comprising a combination with a second surface having a different roughness.

請求項２に記載の発明は、研磨プラテンを備え、該研磨プラテン上面に貼り付けた研磨パッド表面に被研磨基板を押圧し、該研磨プラテンと被研磨基板の相対運動により被研磨基板を研磨する研磨装置において、前記研磨プラテン上面を第１の面及び該第１の面とは粗度の異なる第２の面との組合せで構成し、該研磨プラテン上面に前記研磨パッドの裏面を粘着剤で貼り付けたことを特徴とする。   The invention according to claim 2 includes a polishing platen, presses the substrate to be polished against the surface of the polishing pad attached to the upper surface of the polishing platen, and polishes the substrate to be polished by relative movement of the polishing platen and the substrate to be polished. In the polishing apparatus, the upper surface of the polishing platen is composed of a first surface and a second surface having a roughness different from that of the first surface, and the back surface of the polishing pad is bonded to the upper surface of the polishing platen with an adhesive. It is characterized by being pasted.

請求項３に記載の発明は、研磨プラテンを備え、該研磨プラテン上面に貼り付けた研磨パッド表面に被研磨基板を押圧し、該研磨プラテンと被研磨基板の相対運動により被研磨基板を研磨する研磨装置において、前記研磨プラテン上面を鏡面仕上げした鏡面部と粗面仕上げした粗面部の組合せで構成し、該研磨プラテン上面に前記研磨パッドの裏面を粘着剤で貼り付けたことを特徴とする。   The invention according to claim 3 includes a polishing platen, presses the substrate to be polished against the surface of the polishing pad attached to the upper surface of the polishing platen, and polishes the substrate to be polished by relative movement of the polishing platen and the substrate to be polished. In the polishing apparatus, the upper surface of the polishing platen is constituted by a combination of a mirror-finished mirror surface portion and a roughened rough surface portion, and the back surface of the polishing pad is attached to the upper surface of the polishing platen with an adhesive.

請求項４に記載の発明は、請求項３に記載の研磨装置において、前記研磨プラテン上面は円形状であり、前記粗面部は中央部に円形状に設け、前記鏡面部は該粗面部の外周に帯状に設けたことを特徴とする。   According to a fourth aspect of the present invention, in the polishing apparatus according to the third aspect, the upper surface of the polishing platen has a circular shape, the rough surface portion is provided in a circular shape at the center portion, and the mirror surface portion is an outer periphery of the rough surface portion. It is characterized by being provided in a strip shape.

請求項５に記載の発明は、請求項３に記載の研磨装置において、前記研磨プラテン上面は円形状であり、前記鏡面部及び粗面部は交互に同心円帯状に設けたことを特徴とする。   According to a fifth aspect of the present invention, in the polishing apparatus according to the third aspect, the upper surface of the polishing platen has a circular shape, and the mirror surface portion and the rough surface portion are alternately provided in a concentric circle shape.

請求項６に記載の発明は、請求項３に記載の研磨装置において、前記研磨プラテン上面は円形状であり、前記研磨プラテン上面を粗面仕上げした粗面部又は鏡面仕上げした鏡面部とし、該粗面部又は鏡面部内に鏡面仕上げした鏡面部又は粗面仕上げした粗面部を斑点状に設けたことを特徴とする。   According to a sixth aspect of the present invention, in the polishing apparatus according to the third aspect, the upper surface of the polishing platen is circular, and the upper surface of the polishing platen is a rough surface portion or a mirror surface portion that is mirror-finished. The surface portion or the mirror surface portion is provided with a mirror-finished mirror surface portion or a roughened rough surface portion in a spot shape.

請求項７に記載の発明は、請求項３に記載の研磨装置において、前記研磨プラテン上面は円形状であり、前記鏡面部又は粗面部は帯状であり前記研磨プラテン上面中心部を中心に放射状に複数本設け、該鏡面部と鏡面部の間に粗面部を設けるか又は該粗面部と粗面部の間に鏡面部を設けたことを特徴とする。   According to a seventh aspect of the present invention, in the polishing apparatus according to the third aspect, the upper surface of the polishing platen has a circular shape, the mirror surface portion or the rough surface portion has a strip shape, and is radially centered on the central portion of the upper surface of the polishing platen. A plurality of lines are provided, and a rough surface portion is provided between the mirror surface portion and the mirror surface portion, or a mirror surface portion is provided between the rough surface portion and the rough surface portion.

請求項８に記載の発明は、研磨プラテンを備え、該研磨プラテン上面に貼り付けた研磨パッド表面に被研磨基板を押圧し、該研磨プラテンと被研磨基板の相対運動により被研磨基板を研磨する研磨装置において、前記研磨プラテン上面を鏡面仕上げした鏡面部と粗面仕上げした粗面部の組合せた構成とし、前記研磨パッド裏面を前記鏡面部上面に粘着剤で貼り付けたことを特徴とする。   The invention according to claim 8 includes a polishing platen, presses the substrate to be polished against the surface of the polishing pad attached to the upper surface of the polishing platen, and polishes the substrate to be polished by relative movement of the polishing platen and the substrate to be polished. In the polishing apparatus, the upper surface of the polishing platen is a combination of a mirror surface portion having a mirror finish and a rough surface portion having a rough finish, and the back surface of the polishing pad is attached to the upper surface of the mirror surface portion with an adhesive.

請求項９に記載の発明は、研磨プラテンを備え、該研磨プラテン上面に貼り付けた研磨パッド表面に被研磨基板を押圧し、該研磨プラテンと被研磨基板の相対運動により被研磨基板を研磨する研磨装置において、前記研磨プラテン上面全面を鏡面仕上げした鏡面部とし、該鏡面部に前記研磨パッド裏面の一部を複数個所に分けてまたは連続的に粘着剤で貼り付けたことを特徴とする。   The invention described in claim 9 includes a polishing platen, presses the substrate to be polished against the surface of the polishing pad attached to the upper surface of the polishing platen, and polishes the substrate to be polished by relative movement of the polishing platen and the substrate to be polished. In the polishing apparatus, the entire upper surface of the polishing platen is mirror-finished, and a part of the back surface of the polishing pad is divided into a plurality of portions or continuously adhered to the mirror surface portion with an adhesive.

請求項１及び２に記載の発明によれば、研磨プラテン上面を第１の面及び該第１の面とは粗度の異なる第２の面との組合せで構成したので、研磨パッドを引き剥がすのに第１の面と第２の面では剥がし力が異なるので、研磨パッドを引き剥がす場合、研磨プラテン上面全部を粗度の同じ面、例えば鏡面仕上げした場合に比べて研磨パッドの引き剥がし力が変化し、比較的容易に引き剥がすことができる。   According to the first and second aspects of the present invention, since the upper surface of the polishing platen is composed of the first surface and the second surface having a roughness different from that of the first surface, the polishing pad is peeled off. However, since the peeling force differs between the first surface and the second surface, when the polishing pad is peeled off, the peeling force of the polishing pad is larger than when the entire upper surface of the polishing platen has the same roughness, for example, mirror finish. Changes and can be peeled off relatively easily.

請求項３乃至７に記載の発明によれば、研磨プラテン上面の研磨パッド貼り付け面を鏡面仕上げした鏡面部分と粗面仕上げした粗面部の組合せで構成したので、研磨プラテン上面全部を鏡面仕上げした場合に比べて研磨パッドを引き剥がすのに強大な引き剥がし力を必要とすることなく、比較的容易に引き剥がすことができる。   According to the third to seventh aspects of the present invention, the polishing pad attaching surface on the upper surface of the polishing platen is composed of a combination of a mirror-finished mirror surface portion and a roughened rough surface portion, so that the entire polishing platen upper surface is mirror-finished. As compared with the case, it is possible to peel off the polishing pad relatively easily without requiring a strong peeling force to peel off the polishing pad.

請求項８に記載の発明によれば、研磨プラテン上面を鏡面仕上げした鏡面部と粗面仕上げした粗面部の組合せで構成し、研磨パッド裏面を鏡面部上面に粘着剤で貼り付けたので、研磨パッド裏面の研磨プラテンの鏡面部に対応する部分が貼り付けられたことになり、鏡面仕上げした研磨プラテンの全面に研磨パッド裏面を貼り付けた場合に比べて研磨パッドを引き剥がすのに強大な引き剥がし力を必要とすることなく、容易に引き剥がすことができる。   According to the invention described in claim 8, since the upper surface of the polishing platen is constituted by a combination of a mirror surface portion having a mirror finish and a rough surface portion having a rough finish, and the polishing pad back surface is attached to the upper surface of the mirror surface portion with an adhesive, The part corresponding to the mirror surface part of the polishing platen on the back side of the pad is attached, and it is stronger than the case where the polishing pad back side is attached to the entire surface of the polished polishing platen. It can be easily peeled off without requiring a peeling force.

請求項９に記載の発明によれば、研磨プラテン上面全面を鏡面仕上げした鏡面部とし、該鏡面部に研磨パッド裏面の一部を複数個所に分けてまたは連続的に粘着剤で貼り付けたので、鏡面仕上げした研磨プラテンの全面に研磨パッド裏面を貼り付けた場合に比べて研磨パッドを引き剥がすのに強大な引き剥がし力を必要とすることなく、容易に引き剥がすことができる。   According to the ninth aspect of the present invention, the entire upper surface of the polishing platen is made into a mirror-finished mirror surface portion, and a part of the back surface of the polishing pad is divided into a plurality of locations or continuously adhered to the mirror surface portion with an adhesive. As compared with the case where the back surface of the polishing pad is attached to the entire surface of the mirror-finished polishing platen, it can be easily peeled off without requiring a strong peeling force to peel off the polishing pad.

以下、本発明の実施の形態例を図面に基づいて説明する。図３は本発明に係る研磨装置の研磨プラテン上面の構成例を示す平面図である。図示するように、研磨プラテン１２の上面は、中央部にしぼ加工により円形状の粗面に仕上げた粗面部２０とその外周に鏡面に仕上げた帯状の鏡面部２１を設けて構成されている。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 3 is a plan view showing a configuration example of the upper surface of the polishing platen of the polishing apparatus according to the present invention. As shown in the drawing, the upper surface of the polishing platen 12 is formed by providing a rough surface portion 20 finished in a circular rough surface by a boring process at the central portion and a belt-like mirror surface portion 21 finished as a mirror surface on the outer periphery thereof.

上記のように研磨プラテン１２の上面を円形状の粗面部２０とその外周に設けた帯状の鏡面部２１で構成することにより、研磨パッド１６の裏面を粘着剤（接着テープ）１５で接着した場合、粗面部２０の外周に設けた帯状の鏡面部２１は、密着力の大きい領域となるが、粗面部２０は密着力の小さい部分となる。従って、研磨パッド１６をその端部、即ち鏡面部２１の外周から引き剥がすと、始めは剥離力が小さく、徐々に大きくなるが、円周帯状の鏡面部２１を過ぎると剥離力の小さい粗面部２０に達するから、剥離力は小さくなり、容易に引き剥がすことができる。   When the upper surface of the polishing platen 12 is composed of the circular rough surface portion 20 and the belt-like mirror surface portion 21 provided on the outer periphery thereof as described above, the back surface of the polishing pad 16 is bonded with the adhesive (adhesive tape) 15. The belt-like mirror surface portion 21 provided on the outer periphery of the rough surface portion 20 is a region having a large adhesion force, but the rough surface portion 20 is a portion having a small adhesion force. Accordingly, when the polishing pad 16 is peeled off from the end, that is, the outer periphery of the mirror surface portion 21, the peeling force is initially small and gradually increases, but after passing the circumferential belt-like mirror surface portion 21, the rough surface portion having a small peeling force. Since it reaches 20, the peeling force becomes small and can be easily peeled off.

図４は本発明に係る研磨装置の研磨プラテン上面の他の構成例を平面図である。図示するように、研磨プラテン１２の上面は、中央部にしぼ加工により円形状の粗面に仕上げた粗面部２６とその外周に交互に同心円帯状に設けた鏡面に仕上げた鏡面部２５、しぼ加工による粗面仕上げした粗面部２４、鏡面に仕上げた鏡面部２３を設けている。   FIG. 4 is a plan view showing another configuration example of the upper surface of the polishing platen of the polishing apparatus according to the present invention. As shown in the drawing, the upper surface of the polishing platen 12 has a rough surface portion 26 that has been roughened into a circular rough surface at the center portion, a mirror surface portion 25 that has been finished in a mirror surface alternately provided in a concentric circle shape on the outer periphery thereof, Are provided with a rough surface portion 24 having a rough surface and a mirror surface portion 23 having a mirror surface.

このように粗面外周に鏡面部２５、２３及び粗面部２４を交互に同心円帯状に設けたことにより、研磨パッド１６をその端部、即ち鏡面部２３から引き剥がすと、始めは剥離力が小さく、徐々に大きくなるが、円周帯状の鏡面部２３を過ぎると剥離力の小さい粗面部２４に達し、続いて剥離力の大きい鏡面部２５に達し、更に剥離力の小さい粗面部２６に達するから、剥離力の強弱が続くことになり、研磨パッド１６を研磨プラテン１２から容易に引き剥がすことができる。   Thus, by providing the mirror surface portions 25 and 23 and the rough surface portion 24 alternately in a concentric circle shape on the outer periphery of the rough surface, when the polishing pad 16 is peeled off from the end portion, that is, the mirror surface portion 23, the peeling force is initially small. Although it gradually increases, when it passes through the mirror-like surface portion 23 of the circumferential band, it reaches the rough surface portion 24 with a small peel force, then reaches the mirror surface portion 25 with a large peel force, and further reaches the rough surface portion 26 with a small peel force. The strength of the peeling force continues, and the polishing pad 16 can be easily peeled off from the polishing platen 12.

図５は本発明に係る研磨装置の研磨プラテン上面の他の構成例を平面図である。図示するように、研磨プラテン１２の上面は、しぼ加工により粗面に仕上げた粗面部２７の中に円形状の鏡面に仕上げた鏡面部２８を斑点状に分布させたている。このようにしたも剥離力の小さい粗面部２７の中に剥離力の大きい鏡面部２８が点在することになるから、剥離力の強弱が分布するから、全面が鏡面仕上げの場合に比較し、研磨パッドを容易に引き剥がすことができる。なお、上記例では粗面部２７の中に鏡面部２８を分布させたが、反対に鏡面部の中に粗面部を斑点状に分布させてもよい。また、斑点の形状は円形に限定されるものでないことは当然である。   FIG. 5 is a plan view showing another configuration example of the upper surface of the polishing platen of the polishing apparatus according to the present invention. As shown in the drawing, the upper surface of the polishing platen 12 has a specular surface portion 28 that is finished into a circular mirror surface in a rough surface portion 27 that has been roughened by squeezing, and is distributed in spots. Even if it does in this way, since the mirror surface part 28 with a large peeling force is scattered in the rough surface part 27 with a small peeling force, since the strength of the peeling force is distributed, the entire surface is compared with the case of mirror finishing, The polishing pad can be easily peeled off. In the above example, the mirror surface portion 28 is distributed in the rough surface portion 27, but conversely, the rough surface portion may be distributed in a speckled shape in the mirror surface portion. Of course, the shape of the spots is not limited to a circle.

図６は本発明に係る研磨装置の研磨プラテン上面の他の構成例を平面図である。図示するように、研磨プラテン１２の上面は、しぼ加工により粗面に仕上げた粗面部２９の中に鏡面に仕上げた帯状の鏡面部３０を研磨プラテン１２上面の中心部を中心に放射状に複数本（図では８本）設けた構成である。このようにしても剥離力の大きい鏡面部３０の間に剥離力の小さい粗面部２９が位置することになるから、全面が鏡面仕上げの場合に比較し、研磨パッドを容易に引き剥がすことができる。なお、粗面部を放射状に設け、粗面部と粗面部の間に鏡面部が位置するように配置してもよい。   FIG. 6 is a plan view showing another configuration example of the upper surface of the polishing platen of the polishing apparatus according to the present invention. As shown in the drawing, the upper surface of the polishing platen 12 has a plurality of strip-like mirror surface portions 30 that are mirror-finished in a rough surface portion 29 that has been roughened by squeezing, and that are radially centered on the center portion of the upper surface of the polishing platen 12. This is a configuration provided (eight in the figure). Even in this case, since the rough surface portion 29 having a small peeling force is positioned between the mirror surface portions 30 having a large peeling force, the polishing pad can be easily peeled off as compared with the case where the entire surface is mirror-finished. . In addition, a rough surface part may be provided radially and it may arrange | position so that a mirror surface part may be located between a rough surface part and a rough surface part.

また、図７に示すように、研磨パッド１６の裏面１６ａに帯状に接着テープ（両面接着テープ）３１を図３の鏡面部２１に対応して貼り付け、該接着テープ３１を介して研磨パッド１６を研磨プラテン１２の上面の鏡面部２１に貼り付けてもよい。また、同様に図８に示すように、研磨パッド１６の裏面１６ａに帯状に接着テープ（両面接着テープ）３２、３３を図４の鏡面部２３、２５に対応して同心円状に貼り付け、該接着テープ３２，３３を介して研磨パッド１６を研磨プラテン１２の上面の鏡面部２１に貼り付けてもよい。   Further, as shown in FIG. 7, an adhesive tape (double-sided adhesive tape) 31 is attached to the back surface 16 a of the polishing pad 16 in a band shape corresponding to the mirror surface portion 21 of FIG. 3, and the polishing pad 16 is interposed via the adhesive tape 31. May be attached to the mirror surface portion 21 on the upper surface of the polishing platen 12. Similarly, as shown in FIG. 8, adhesive tapes (double-sided adhesive tape) 32, 33 are attached to the back surface 16a of the polishing pad 16 in a concentric manner corresponding to the mirror surface portions 23, 25 of FIG. The polishing pad 16 may be attached to the mirror surface portion 21 on the upper surface of the polishing platen 12 via the adhesive tapes 32 and 33.

また、同様に図９に示すように、研磨パッド１６の裏面１６ａに斑点状に接着テープ（両面接着テープ）３４を図５の斑点状の鏡面部２８に対応して貼り付け、該接着テープ３４を介して研磨パッド１６を研磨プラテン１２の上面の鏡面部２８に貼り付けてもよい。また、同様に図１０に示すように、研磨パッド１６の裏面１６ａに放射に接着テープ（両面接着テープ）３５を図６の放射状の鏡面部３０に対応して貼り付け、該接着テープ３５を介して研磨パッド１６を研磨プラテン１２の上面の鏡面部３０に貼り付けてもよい。   Similarly, as shown in FIG. 9, an adhesive tape (double-sided adhesive tape) 34 is attached to the back surface 16 a of the polishing pad 16 corresponding to the specular surface portion 28 of FIG. The polishing pad 16 may be affixed to the mirror surface portion 28 on the upper surface of the polishing platen 12. Similarly, as shown in FIG. 10, an adhesive tape (double-sided adhesive tape) 35 is attached to the back surface 16a of the polishing pad 16 corresponding to the radial mirror surface portion 30 of FIG. The polishing pad 16 may be attached to the mirror surface portion 30 on the upper surface of the polishing platen 12.

上記のように研磨パッド１６の裏面１６ａを接着テープを介して、研磨プラテン１２の上面の鏡面部に貼り付けた場合も、鏡面仕上げした研磨プラテン１２の上面全面に研磨パッド１６の裏面１６ａを貼り付けた場合に比べて研磨パッド１６を引き剥がすのに強大な引き剥がし力を必要としないから、研磨パッド１６の引き剥がしが容易となる。   As described above, even when the back surface 16a of the polishing pad 16 is attached to the mirror surface portion of the upper surface of the polishing platen 12 via the adhesive tape, the back surface 16a of the polishing pad 16 is applied to the entire upper surface of the polished polishing platen 12. Compared with the case of attaching, it does not require a strong peeling force to peel off the polishing pad 16, so that the polishing pad 16 can be easily peeled off.

また、研磨プラテン１２の上面全体を鏡面仕上げして鏡面部とし、該鏡面部に図７乃至図１０に示すように裏面１６ａに接着テープを貼り付けた研磨パッド１６を貼り付けてもよい。この場合も研磨パッド１６裏面１６ａの接着テープが貼り付けた部分のみが研磨プラテン１２の上面に貼り付けられることになり、鏡面仕上げした研磨プラテン１２の上面全面に研磨パッド１６裏面を貼り付けた場合に比べて研磨パッド１６を引き剥がすのに強大な引き剥がし力を必要としないから、研磨パッド１６の引き剥がしが容易となる。   Alternatively, the entire upper surface of the polishing platen 12 may be mirror finished to form a mirror surface portion, and a polishing pad 16 having an adhesive tape attached to the back surface 16a may be attached to the mirror surface portion as shown in FIGS. Also in this case, only the part of the back surface 16a of the polishing pad 16 to which the adhesive tape is applied is attached to the upper surface of the polishing platen 12, and the back surface of the polishing pad 16 is attached to the entire upper surface of the mirror-finished polishing platen 12. Compared to the above, since a strong peeling force is not required for peeling off the polishing pad 16, the polishing pad 16 can be easily peeled off.

次に、研磨プラテン１２の上面に鏡面部と粗面部を形成する方法について、その一例を説明する。先ず、研磨プラテン１２の上面全面を例えばラップ仕上げにより鏡面に仕上げる。その後、粗面部を形成する部分を開口したマスクで鏡面仕上げした研磨プラテン１２の上面を覆い、開口部に、例えばアルミナビーズ（フジランダムＡ８０）で、吹きつけ圧力０．５ＭＰａで開口部内を均一にブラスト加工して、鏡面部の中に図３乃至図６に示すような、所定形状の粗面部を形成する。なお、鏡面部は必ずしもラップ仕上で鏡面にする必要はなく、例えば研削仕上げ６．３Ｓ程度で仕上げ面粗度を細かにし、その中に上記のようなブラスト加工で面粗度の粗い粗面部を形成してもよい。要は研磨プラテン１２の上面を面粗度が細かく接着力の大きい部分となる第１の面と、面粗度が荒く接着力の小さくなる第２の面の組合せで構成し、研磨パッドの引き剥がしに際し、研磨パッドの引き剥がし力を軽減できればよい。   Next, an example of a method for forming the mirror surface portion and the rough surface portion on the upper surface of the polishing platen 12 will be described. First, the entire upper surface of the polishing platen 12 is finished to a mirror surface by lapping, for example. Then, the upper surface of the polishing platen 12 having a mirror-finished surface is covered with an opening mask at the portion where the rough surface portion is formed, and the inside of the opening portion is evenly applied to the opening portion with, for example, alumina beads (Fuji Random A80) at a blowing pressure of 0.5 MPa. A rough surface portion having a predetermined shape as shown in FIGS. 3 to 6 is formed in the mirror surface portion by blasting. The mirror surface portion does not necessarily have to be a mirror surface by lapping. For example, the finished surface roughness is made fine by grinding finish of about 6.3S, and the rough surface portion having a rough surface roughness is formed by blasting as described above. It may be formed. In short, the upper surface of the polishing platen 12 is composed of a combination of a first surface that has a fine surface roughness and a high adhesive strength, and a second surface that has a rough surface roughness and a low adhesive strength, and pulls the polishing pad. When peeling off, it is only necessary to reduce the peeling force of the polishing pad.

なお、上記実施形態例では研磨プラテン１２の平面形状を円形とし、研磨プラテン１２が回転軸１１を中心に回転する構成の研磨装置を例に示したが、研磨装置はこれに限定されるものではなく、研磨プラテン上面に貼り付けた研磨パッド表面に被研磨基板を押圧し、研磨プラテンと被研磨基板の相対運動により被研磨基板を研磨する構成の研磨装置であれば良い。   In the above embodiment, the polishing platen 12 has a circular planar shape and the polishing platen 12 rotates around the rotation shaft 11 as an example. However, the polishing apparatus is not limited to this. Alternatively, any polishing apparatus may be used as long as the substrate to be polished is pressed against the surface of the polishing pad attached to the upper surface of the polishing platen and the substrate to be polished is polished by the relative movement of the polishing platen and the substrate to be polished.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible.

研磨装置の概略構成例を示す側面図である。It is a side view which shows the schematic structural example of a grinding | polishing apparatus. 研磨装置の研磨プラテンの一部を示す側面図である。It is a side view which shows a part of grinding | polishing platen of a grinding | polishing apparatus. 本発明に係る研磨装置の研磨プラテン上面の構成例を示す平面図である。It is a top view which shows the structural example of the grinding | polishing platen upper surface of the grinding | polishing apparatus which concerns on this invention. 本発明に係る研磨装置の研磨プラテン上面の構成例を示す平面図である。It is a top view which shows the structural example of the grinding | polishing platen upper surface of the grinding | polishing apparatus which concerns on this invention. 本発明に係る研磨装置の研磨プラテン上面の構成例を示す平面図である。It is a top view which shows the structural example of the grinding | polishing platen upper surface of the grinding | polishing apparatus which concerns on this invention. 本発明に係る研磨装置の研磨プラテン上面の構成例を示す平面図である。It is a top view which shows the structural example of the grinding | polishing platen upper surface of the grinding | polishing apparatus which concerns on this invention. 本発明に係る研磨装置の研磨パッド裏面の構成例を示す平面図である。It is a top view which shows the structural example of the polishing pad back surface of the polishing apparatus which concerns on this invention. 本発明に係る研磨装置の研磨パッド裏面の構成例を示す図である。It is a figure which shows the structural example of the polishing pad back surface of the polishing apparatus which concerns on this invention. 本発明に係る研磨装置の研磨パッド裏面の構成例を示す図である。It is a figure which shows the structural example of the polishing pad back surface of the polishing apparatus which concerns on this invention. 本発明に係る研磨装置の研磨パッド裏面の構成例を示す図である。It is a figure which shows the structural example of the polishing pad back surface of the polishing apparatus which concerns on this invention.

符号の説明Explanation of symbols

１０ 研磨装置
１１ 回転軸
１２ 研磨プラテン
１３ 回転軸
１４ 基板保持ヘッド
１５ 粘着剤（接着テープ）
１６ 研磨パッド
１８ 被研磨基板
２１ 鏡面部
２２ 粗面部
２３ 鏡面部
２４ 粗面部
２５ 鏡面部
２６ 粗面部
２７ 粗面部
２８ 鏡面部
２９ 粗面部
３０ 鏡面部
３１ 接着テープ
３２ 接着テープ
３３ 接着テープ
３４ 接着テープ
３５ 接着テープ DESCRIPTION OF SYMBOLS 10 Polishing apparatus 11 Rotating shaft 12 Polishing platen 13 Rotating shaft 14 Substrate holding head 15 Adhesive (adhesive tape)
DESCRIPTION OF SYMBOLS 16 Polishing pad 18 Polished substrate 21 Mirror surface part 22 Rough surface part 23 Mirror surface part 24 Rough surface part 25 Mirror surface part 26 Rough surface part 27 Rough surface part 28 Mirror surface part 29 Rough surface part 30 Mirror surface part 31 Adhesive tape 32 Adhesive tape 33 Adhesive tape 35 Adhesive tape 35 Adhesive tape

Claims (9)

研磨パッドが貼り付けられる研磨プラテンにおいて、
前記研磨プラテンの少なくとも研磨パッドの貼付領域の表面を第１の面及び該第１の面とは粗度の異なる第２の面との組合せで構成したことを特徴とする研磨プラテン。 In the polishing platen to which the polishing pad is attached,
A polishing platen comprising a combination of a first surface and a second surface having a roughness different from that of the first surface, at least the surface of the polishing pad attachment region of the polishing platen. 研磨プラテンを備え、該研磨プラテン上面に貼り付けた研磨パッド表面に被研磨基板を押圧し、該研磨プラテンと被研磨基板の相対運動により被研磨基板を研磨する研磨装置において、
前記研磨プラテン上面を第１の面及び該第１の面とは粗度の異なる第２の面との組合せで構成し、該研磨プラテン上面に前記研磨パッドの裏面を粘着剤で貼り付けたことを特徴とする研磨装置。 In a polishing apparatus comprising a polishing platen, pressing a substrate to be polished against the surface of a polishing pad attached to the upper surface of the polishing platen, and polishing the substrate to be polished by relative movement of the polishing platen and the substrate to be polished.
The upper surface of the polishing platen is composed of a first surface and a second surface having a roughness different from that of the first surface, and the back surface of the polishing pad is attached to the upper surface of the polishing platen with an adhesive. A polishing apparatus characterized by. 研磨プラテンを備え、該研磨プラテン上面に貼り付けた研磨パッド表面に被研磨基板を押圧し、該研磨プラテンと被研磨基板の相対運動により被研磨基板を研磨する研磨装置において、
前記研磨プラテン上面を鏡面仕上げした鏡面部と粗面仕上げした粗面部の組合せで構成し、該研磨プラテン上面に前記研磨パッドの裏面を粘着剤で貼り付けたことを特徴とする研磨装置。 In a polishing apparatus comprising a polishing platen, pressing a substrate to be polished against the surface of a polishing pad attached to the upper surface of the polishing platen, and polishing the substrate to be polished by relative movement of the polishing platen and the substrate to be polished.
A polishing apparatus comprising a combination of a mirror-finished mirror surface portion and a roughened rough surface portion on the upper surface of the polishing platen, and a back surface of the polishing pad attached to the upper surface of the polishing platen with an adhesive. 請求項３に記載の研磨装置において、
前記研磨プラテン上面は円形状であり、
前記粗面部は中央部に円形状に設け、前記鏡面部は該粗面部の外周に帯状に設けたことを特徴とする研磨装置。 The polishing apparatus according to claim 3, wherein
The upper surface of the polishing platen is circular,
The polishing apparatus according to claim 1, wherein the rough surface portion is provided in a circular shape at a central portion, and the mirror surface portion is provided in a band shape on an outer periphery of the rough surface portion. 請求項３に記載の研磨装置において、
前記研磨プラテン上面は円形状であり、
前記鏡面部及び粗面部は交互に同心円帯状に設けたことを特徴とする研磨装置。 The polishing apparatus according to claim 3, wherein
The upper surface of the polishing platen is circular,
The polishing apparatus, wherein the mirror surface portion and the rough surface portion are alternately provided in a concentric circle shape. 請求項３に記載の研磨装置において、
前記研磨プラテン上面は円形状であり、
前記研磨プラテン上面を粗面仕上げした粗面部又は鏡面仕上げした鏡面部とし、該粗面部又は鏡面部内に鏡面仕上げした鏡面部又は粗面仕上げした粗面部を斑点状に設けたことを特徴とする研磨装置。 The polishing apparatus according to claim 3, wherein
The upper surface of the polishing platen is circular,
Polishing characterized in that the polishing platen upper surface is a roughened surface portion or a mirror-finished mirror surface portion, and a mirror-finished mirror surface portion or a rough surface-finished rough surface portion is provided in a spot shape in the rough surface portion or the mirror surface portion. apparatus. 請求項３に記載の研磨装置において、
前記研磨プラテン上面は円形状であり、
前記鏡面部又は粗面部は帯状であり前記研磨プラテン上面中心部を中心に放射状に複数本設け、該鏡面部と鏡面部の間に粗面部を設けるか又は該粗面部と粗面部の間に鏡面部を設けたことを特徴とする研磨装置。 The polishing apparatus according to claim 3, wherein
The upper surface of the polishing platen is circular,
The mirror surface portion or the rough surface portion is in a band shape, and a plurality of radial surfaces are provided centering on the center portion of the upper surface of the polishing platen, and a rough surface portion is provided between the mirror surface portion and the mirror surface portion, or a mirror surface between the rough surface portion and the rough surface portion. A polishing apparatus comprising a portion. 研磨プラテンを備え、該研磨プラテン上面に貼り付けた研磨パッド表面に被研磨基板を押圧し、該研磨プラテンと被研磨基板の相対運動により被研磨基板を研磨する研磨装置において、
前記研磨プラテン上面を鏡面仕上げした鏡面部と粗面仕上げした粗面部の組合せで構成し、前記研磨パッド裏面を前記鏡面部上面に粘着剤で貼り付けたことを特徴とする研磨装置。 In a polishing apparatus comprising a polishing platen, pressing a substrate to be polished against the surface of a polishing pad attached to the upper surface of the polishing platen, and polishing the substrate to be polished by relative movement of the polishing platen and the substrate to be polished.
A polishing apparatus comprising a combination of a mirror-finished mirror surface portion and a rough-finished rough surface portion on the polishing platen upper surface, and the polishing pad back surface being attached to the upper surface of the mirror surface portion with an adhesive. 研磨プラテンを備え、該研磨プラテン上面に貼り付けた研磨パッド表面に被研磨基板を押圧し、該研磨プラテンと被研磨基板の相対運動により被研磨基板を研磨する研磨装置において、
前記研磨プラテン上面全面を鏡面仕上げした鏡面部とし、該鏡面部に前記研磨パッド裏面の一部を複数個所に分けてまたは連続的に粘着剤で貼り付けたことを特徴とする研磨装置。 In a polishing apparatus comprising a polishing platen, pressing a substrate to be polished against the surface of a polishing pad attached to the upper surface of the polishing platen, and polishing the substrate to be polished by relative movement of the polishing platen and the substrate to be polished.
A polishing apparatus characterized in that the entire upper surface of the polishing platen is a mirror-finished mirror surface part, and a part of the back surface of the polishing pad is divided into a plurality of portions or continuously adhered to the mirror surface part with an adhesive.
JP2005267155A 2005-09-14 2005-09-14 Polishing platen and polishing device Pending JP2007075949A (en)

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PCT/JP2006/318459 WO2007032517A1 (en) 2005-09-14 2006-09-12 Polishing platen and polishing apparatus
KR1020087008771A KR20080046715A (en) 2005-09-14 2006-09-12 Polishing platen and polishing apparatus
CNA2006800334576A CN101262982A (en) 2005-09-14 2006-09-12 Polishing platen and polishing apparatus
EP06798070A EP1934017A1 (en) 2005-09-14 2006-09-12 Polishing platen and polishing apparatus
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