USD317592S - Semiconductor element - Google Patents
Semiconductor element Download PDFInfo
- Publication number
- USD317592S USD317592S US07/069,579 US6957987F USD317592S US D317592 S USD317592 S US D317592S US 6957987 F US6957987 F US 6957987F US D317592 S USD317592 S US D317592S
- Authority
- US
- United States
- Prior art keywords
- semiconductor element
- elevational view
- ornamental design
- view
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front elevational view of a semiconductor element showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof; and
FIG. 5 is a left side elevational view thereof, the right side elevational view being the same.
Claims (1)
- The ornamental design for a semiconductor element, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-1597 | 1987-01-09 | ||
| JP159787 | 1987-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD317592S true USD317592S (en) | 1991-06-18 |
Family
ID=70455524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/069,579 Expired - Lifetime USD317592S (en) | 1987-01-19 | 1987-07-02 | Semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD317592S (en) |
Cited By (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| USD359028S (en) | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| US5557504A (en) | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
| US5570273A (en) | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
| USD394844S (en) | 1997-04-25 | 1998-06-02 | Micron Technology, Inc. | Temporary package for semiconductor dice |
| USD396211S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
| USD396213S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
| USD396212S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
| USD396450S (en) | 1996-12-24 | 1998-07-28 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| USD402273S (en) | 1996-12-26 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
| USD402274S (en) | 1997-04-01 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
| USD402638S (en) | 1997-04-25 | 1998-12-15 | Micron Technology, Inc. | Temporary package for semiconductor dice |
| USD407383S (en) | 1996-12-11 | 1999-03-30 | Sony Corporation | Connector for printed circuit boards |
| USD411512S (en) | 1996-12-11 | 1999-06-29 | Sony Corporation | Connector for printed circuit boards |
| USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421597S (en) * | 1998-04-24 | 2000-03-14 | Sony Corporation | Semiconductor element |
| USD421967S (en) * | 1997-08-06 | 2000-03-28 | Sony Corporation | Semiconductor element |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
| USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD459705S1 (en) | 2001-03-06 | 2002-07-02 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor package |
| USD466485S1 (en) | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
| USD558694S1 (en) * | 2005-10-11 | 2008-01-01 | Gem Services, Inc. | Quad-28JW surface mount package |
| USD560623S1 (en) * | 2005-10-11 | 2008-01-29 | Gem Services, Inc. | Quad-24JW surface mount package |
| USD769834S1 (en) * | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD810036S1 (en) * | 2016-11-08 | 2018-02-13 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD911987S1 (en) * | 2019-03-15 | 2021-03-02 | Tamura Corporation | Semiconductor element |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
| USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
| USD1073632S1 (en) * | 2021-04-23 | 2025-05-06 | Wolfspeed, Inc. | Power module |
| USD1095474S1 (en) * | 2022-12-02 | 2025-09-30 | Semiconductor Components Industries, Llc | Power module package |
| USD1107671S1 (en) * | 2022-05-12 | 2025-12-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833753A (en) | 1972-11-30 | 1974-09-03 | V Garboushian | Hermetically sealed mounting structure for miniature electronic circuitry |
| US3846734A (en) | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
| US4663833A (en) | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
| EP0235503A2 (en) | 1986-02-24 | 1987-09-09 | Hewlett-Packard Company | hermetic high frequency surface mount microelectronic package |
-
1987
- 1987-07-02 US US07/069,579 patent/USD317592S/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833753A (en) | 1972-11-30 | 1974-09-03 | V Garboushian | Hermetically sealed mounting structure for miniature electronic circuitry |
| US3846734A (en) | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
| US4663833A (en) | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
| EP0235503A2 (en) | 1986-02-24 | 1987-09-09 | Hewlett-Packard Company | hermetic high frequency surface mount microelectronic package |
Cited By (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5557504A (en) | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
| US5570273A (en) | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
| USD359028S (en) | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| USD396212S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
| USD396211S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
| USD396213S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
| USD407383S (en) | 1996-12-11 | 1999-03-30 | Sony Corporation | Connector for printed circuit boards |
| USD411512S (en) | 1996-12-11 | 1999-06-29 | Sony Corporation | Connector for printed circuit boards |
| USD396450S (en) | 1996-12-24 | 1998-07-28 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| USD402273S (en) | 1996-12-26 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
| USD402274S (en) | 1997-04-01 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
| USD402638S (en) | 1997-04-25 | 1998-12-15 | Micron Technology, Inc. | Temporary package for semiconductor dice |
| USD394844S (en) | 1997-04-25 | 1998-06-02 | Micron Technology, Inc. | Temporary package for semiconductor dice |
| USD421967S (en) * | 1997-08-06 | 2000-03-28 | Sony Corporation | Semiconductor element |
| USD432505S (en) * | 1997-08-06 | 2000-10-24 | Sony Corporation | Semiconductor element |
| USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| USD421597S (en) * | 1998-04-24 | 2000-03-14 | Sony Corporation | Semiconductor element |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
| USD459705S1 (en) | 2001-03-06 | 2002-07-02 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor package |
| USD466485S1 (en) | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
| USD558694S1 (en) * | 2005-10-11 | 2008-01-01 | Gem Services, Inc. | Quad-28JW surface mount package |
| USD560623S1 (en) * | 2005-10-11 | 2008-01-29 | Gem Services, Inc. | Quad-24JW surface mount package |
| USD769834S1 (en) * | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD810036S1 (en) * | 2016-11-08 | 2018-02-13 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD978809S1 (en) | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
| USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD911987S1 (en) * | 2019-03-15 | 2021-03-02 | Tamura Corporation | Semiconductor element |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
| USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
| USD1073632S1 (en) * | 2021-04-23 | 2025-05-06 | Wolfspeed, Inc. | Power module |
| USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
| USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1107671S1 (en) * | 2022-05-12 | 2025-12-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1095474S1 (en) * | 2022-12-02 | 2025-09-30 | Semiconductor Components Industries, Llc | Power module package |
| USD1098055S1 (en) * | 2022-12-02 | 2025-10-14 | Semiconductor Components Industries, Llc | Power module package |
| USD1113776S1 (en) * | 2022-12-02 | 2026-02-17 | Semiconductor Components Industries, Llc | Power module package |
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